A tile transceiver assembly integrating sum and difference networks and power modules

Abstract

This invention discloses a tile-type transceiver assembly integrating a sum-difference network and a power supply module, relating to the field of active phased array antenna technology. It includes: a high-density phased array T / R assembly, an on-board high- and low-frequency vertical interconnect structure, a sum-difference network, and a power supply module. The high-density phased array T / R assembly is connected to the on-board high- and low-frequency vertical interconnect structure, which is connected to the sum-difference network and the power supply module. The high-density phased array T / R assembly is connected to an antenna, the sum-difference network is connected to a terminal unit, and the power supply module is connected to an external AC power source. This invention integrates the tile-type T / R assembly module, the sum-difference network module, and the power supply module into a single assembly, achieving small size and high integration, thus enabling miniaturization and low-cost application of phased array transceiver systems.

Description

Technical Field

[0001] This invention relates to the field of active phased array antenna technology, specifically to a tile-type transceiver assembly integrating a sum-difference network and a power supply module. Background Technology

[0002] The statements in this section are provided only as background information in connection with this disclosure and may not constitute prior art.

[0003] An active phased array transceiver (T / R) module is the core component of an active phased array antenna. Internally, it contains both transmit and receive links, with the transmit and receive channels integrated into a single module, sharing phase shifters, attenuators, RF switches, and transmit / receive feed networks. A power module supplies power to the active RF chips in each channel. In a typical phased array radar system, each antenna radiating element is followed by a solid-state phased array T / R module. Phased array T / R module technology utilizes computer-controlled state of each phase shifter to control the phase of the module reaching each antenna radiating element, thereby altering the radiated energy distribution of each radiating antenna element. This changes the phase distribution across the antenna aperture, enabling beam scanning in space. Adjusting the energy weighting of the radiating elements enhances the directivity of the array antenna, thus achieving the purpose of radiating and receiving electromagnetic waves within a designated area to obtain target locations and information about other electronic devices.

[0004] In existing technologies, phased array transceiver (T / R) modules employ a technique where the transceiver components, sum / difference networks, and power supply modules are designed and modularly packaged separately. There are two main implementation methods: First, the T / R module's RF channel is integrated and packaged on a small scale, and multiple such small-scale packaged components are then arranged side-by-side to form the module array required for the phased array antenna. When the module array operates in receiving mode, the received RF signal is amplified with low noise, phase-shifted, attenuated, and synthesized to obtain an amplified RF signal that is transmitted to the sum / difference network. The power supply module powers the chips in each receiving branch. When the module array operates in transmitting mode, the RF signal fed into each sum / difference network is power-distributed, attenuated, phase-shifted, and amplified to obtain an amplified RF signal that is transmitted to the antenna array. The power supply module powers the chips in each transmitting branch. Second, the T / R module's RF channel is integrated and packaged on a large scale, and this module is then cascaded with a radiating surface array to form a phased array transceiver antenna system. When the component array operates in receive mode, the received RF signal is amplified with low noise, phase-shifted, attenuated, and synthesized to obtain an amplified RF signal that is transmitted to the sum-difference network encapsulation module. The power module supplies power to the chips of each receiving branch. When the component array operates in transmit mode, the RF signal fed into each sum-difference network is power-distributed, attenuated, phase-shifted, and amplified to obtain an amplified RF signal that is transmitted to the sum-difference network. The power module supplies power to the chips of each transmitting branch. However, both methods involve module cascading between the phased array T / R components, sum-difference networks, and power modules. This requires modular design, separate packaging, and reserved high- and low-frequency interfaces between modules for each component. Such a design results in low module integration, cumbersome design, large size of the cascaded modules, high alignment requirements between high- and low-frequency interfaces, and fails to highlight advantages in weight and cost, which is a significant problem faced by phased array T / R components.

[0005] In summary, in the field of active phased array antennas, the T / R components, sum and difference networks and power supply modules need to be modularly designed and individually packaged. This results in low component integration and large size, which limits the miniaturization and low-cost application of phased array transceiver systems. Summary of the Invention

[0006] The purpose of this invention is to address the problems existing in the prior art by providing a tile-type transceiver module that integrates a sum-difference network and a power supply module. In the T / R module of a phased array transceiver system, the tile-type T / R module, the sum-difference network module, and the power supply module are directly integrated into one component, achieving small size and high integration, thereby enabling the miniaturization and low-cost application of the phased array transceiver system.

[0007] The technical solution of the present invention is as follows:

[0008] A tile-type transceiver assembly integrating a sum-difference network and a power supply module, comprising:

[0009] High-density phased array T / R components, on-board high and low frequency vertical interconnection structure, sum and difference network, power supply module;

[0010] The high-density phased array T / R assembly is connected to the on-board high- and low-frequency vertical interconnection structure, which is connected to the sum and difference network and the power supply module. The high-density phased array T / R assembly is connected to the antenna, the sum and difference network is connected to the terminal unit, and the power supply module is connected to an external AC source.

[0011] Furthermore, the operating modes of the tile-type transceiver component include: a transmit mode and a receive mode.

[0012] Furthermore, the high-density phased array T / R assembly includes:

[0013] Attenuators, phase shifters, power dividers, combiners, power amplifiers, and low-noise amplifiers.

[0014] Furthermore, the power amplifier and the low-noise amplifier are a single chip within the high-density phased array T / R assembly, which integrates the power amplifier, the low-noise amplifier, and the radio frequency switch. The radio frequency switch controls whether the chip operates in the transmit branch or the receive branch.

[0015] Furthermore, the high- and low-frequency vertical interconnection structure within the board consists of a strip transmission line, a strip-line coaxial line transition, an interlayer coaxial transmission line, a coaxial line-line transition, and a strip transmission line, all of which are connected in series.

[0016] Furthermore, the sum-difference network consists of four 90-degree stripline branch bridges.

[0017] Furthermore, the power supply module consists of eight functional circuits, including: lightning protection circuit, spike suppression circuit, input polarity reverse connection protection circuit, input filter circuit, DC / DC conversion circuit, output filter circuit, power-on control circuit, and enable control circuit.

[0018] Furthermore, in receive mode, the tile-type transceiver uses the signal transmitted from the antenna as the input signal of the high-density phased array T / R component. The high-density phased array T / R component performs vector modulation on the received signal and outputs an RF signal to the high- and low-frequency vertical interconnect structure on the board. The high- and low-frequency vertical interconnect structure on the board transitions the RF signal and outputs it to the sum and difference network as the input signal. The sum and difference network performs vector superposition on the signals and outputs the sum port and difference port signals, which are then transmitted to the terminal unit for use.

[0019] In transmit mode, the tile-type transceiver module vector synthesizes the sum and difference signals input from the terminal through a sum-difference network and outputs them to the on-board high- and low-frequency vertical interconnect structure. The on-board high- and low-frequency vertical interconnect structure transmits and transitions the RF signal before outputting it to the high-density phased array T / R module as an input signal. The high-density phased array T / R module then vector modulates the received signal and transmits it to the terminated antenna.

[0020] Furthermore, in the receiving mode, the tile-type transceiver module consists of 128 parallel RF circuits, each including a low-noise amplifier, a phase shifter, and an attenuator, which are connected in series. The RF signal s(t) transmitted from the antenna is amplified by the low-noise amplifier, and the resulting signal is then passed through the phase shifter and attenuator. Finally, the signal is combined by a combiner to output the signal x(t), which is then output to the high- and low-frequency vertical interconnect structure on the board.

[0021] In transmit mode, the tile-type transceiver module consists of 128 parallel RF circuits, each including a power amplifier, a phase shifter, and an attenuator, which are connected in series. The RF signal x(t) transmitted from the high- and low-frequency vertical interconnection structure on the board is distributed by the power divider circuit, and then passes through the phase shifter and attenuator. The signal is then amplified by the power amplifier and finally output as the output signal s(t), which is output to the antenna terminated by each channel.

[0022] Furthermore, after passing through the on-board high- and low-frequency vertical interconnection structure, the radio frequency signal can convert the radio frequency signal x(t) transmitted from the high-density phased array T / R component into a radio frequency signal y(t) for output to the sum and difference network, and can also convert the radio frequency signal y(t) transmitted from the sum and difference network into a radio frequency signal x(t) for output to the high-density phased array T / R component; at the same time, the on-board high- and low-frequency vertical interconnection structure converts the signal w(t) output by the power module into a signal v(t) for use by the various active chips inside the high-density phased array T / R component;

[0023] In receive mode, the tile-type transceiver unit uses a sum-difference network to vector synthesize each RF signal y(t) transmitted from the high- and low-frequency vertical interconnect structure on the board through a 90-degree stripline branch bridge, and outputs a sum port signal he(t), an azimuth difference port signal fw(t), an elevation difference port signal fy(t), and a double-difference port signal sc(t). The double-difference port signal sc(t) is terminated by a matched load for absorption, and the other three signals are used as the final output signals for the end unit.

[0024] In transmit mode, the tile-type transceiver unit uses a sum-difference network to vector synthesize the sum port signal he(t), azimuth difference port signal fw(t), and elevation difference port signal fy(t) transmitted from the terminal through a 90-degree stripline branch bridge to obtain multiple radio frequency signals y(t), which are then output to the high- and low-frequency vertical interconnect structure on the board.

[0025] In receive or transmit mode, the tile-type transceiver unit converts the externally input AC signal into a signal w(t) and outputs it to the high- and low-frequency vertical interconnect structure on the board.

[0026] Compared with existing technologies, the advantages of this invention are:

[0027] 1. This invention integrates high-density phased array transceiver components, sum and difference networks, and power modules onto a single printed circuit board through an in-board high- and low-frequency vertical interconnection structure. This achieves miniaturization and high integration of the components, avoiding the need for separate modular design and individual packaging of the T / R components, sum and difference networks, and power modules. This achieves the goal of miniaturization and low-cost application of the phased array transceiver system.

[0028] 2. This invention can be widely applied to miniaturized active phased array antennas. Attached Figure Description

[0029] Figure 1 This is a block diagram of the main structure of the tile-type transceiver component of the integrated sum-difference network and power supply module of the present invention.

[0030] Figure 2 This is a block diagram of the receiving state structure of the high-density phased array T / R component of the present invention;

[0031] Figure 3 This is a block diagram of the high-density phased array T / R component's emission state structure according to the present invention;

[0032] Figure 4 This is a block diagram of the in-board high and low frequency vertical interconnection structure of the present invention;

[0033] Figure 5 This is a block diagram of the sum and difference network structure of the present invention;

[0034] Figure 6 This is a block diagram of the power module structure of the present invention. Detailed Implementation

[0035] It should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0036] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0037] Example 1

[0038] Please see Figure 1 A tile-type transceiver assembly integrating a sum-difference network and a power supply module, specifically comprising the following:

[0039] High-density phased array T / R components, on-board high and low frequency vertical interconnection structure, sum and difference network, power supply module;

[0040] The high-density phased array T / R assembly is connected to the on-board high- and low-frequency vertical interconnection structure, which is connected to the sum and difference network and the power supply module. The high-density phased array T / R assembly is connected to the antenna, the sum and difference network is connected to the terminal unit, and the power supply module is connected to an external AC source.

[0041] The operating modes of the tile-type transceiver component include: transmit mode and receive mode.

[0042] In this embodiment, specifically, when the tile-type transceiver is in receive mode, it uses the signal transmitted from the antenna as the input signal of the high-density phased array T / R component. The high-density phased array T / R component performs vector modulation on the received signal and outputs an RF signal to the high- and low-frequency vertical interconnect structure on the board. The high- and low-frequency vertical interconnect structure on the board transitions the RF signal and outputs it to the sum and difference network as the input signal. The sum and difference network performs vector superposition on the signals and outputs the sum port and difference port signals, which are then transmitted to the terminal for use.

[0043] In transmit mode, the tile-type transceiver module vector synthesizes the sum and difference signals input from the terminal through a sum-difference network and outputs them to the on-board high- and low-frequency vertical interconnect structure. The on-board high- and low-frequency vertical interconnect structure transmits and transitions the RF signal before outputting it to the high-density phased array T / R module as an input signal. The high-density phased array T / R module then vector modulates the received signal and transmits it to the terminated antenna.

[0044] In this embodiment, specifically, the high-density phased array T / R component includes:

[0045] Attenuators, phase shifters, power dividers, combiners, power amplifiers, and low-noise amplifiers.

[0046] In this embodiment, specifically, the power amplifier and the low-noise amplifier are a single chip within the high-density phased array T / R assembly. The chip integrates the power amplifier, the low-noise amplifier, and the radio frequency switch, and controls whether the chip operates in the transmit branch or the receive branch through the radio frequency switch.

[0047] Please see Figure 2 In this embodiment, specifically, in the receiving mode, the high-density phased array T / R component of the tile-type transceiver assembly consists of 128 parallel radio frequency circuits, each including a low-noise amplifier, a phase shifter, and an attenuator, which are connected in series. The radio frequency signal s(t) transmitted from the antenna is amplified by the low-noise amplifier, and the resulting signal is then passed through the phase shifter and attenuator. Finally, the signal is combined by a combiner to output the signal x(t), which is then output to the high- and low-frequency vertical interconnect structure on the board.

[0048] Please see Figure 3 In transmit mode, the tile-type transceiver module consists of 128 parallel RF circuits, each including a power amplifier, a phase shifter, and an attenuator, which are connected in series. The RF signal x(t) transmitted from the high- and low-frequency vertical interconnection structure on the board is distributed by the power divider circuit, and then passes through the phase shifter and attenuator. The signal is then amplified by the power amplifier and finally output as the output signal s(t), which is output to the antenna terminated by each channel.

[0049] Please see Figure 4 In this embodiment, specifically, the in-board high and low frequency vertical interconnection structure consists of a strip transmission line, a strip coaxial line transition, an interlayer coaxial transmission line, a coaxial line strip line transition, and a strip transmission line, which are connected in series.

[0050] In this embodiment, specifically, after the radio frequency signal passes through the on-board high- and low-frequency vertical interconnection structure, it can convert the radio frequency signal x(t) transmitted from the high-density phased array T / R component into a radio frequency signal y(t) and output it to the sum and difference network. It can also convert the radio frequency signal y(t) transmitted from the sum and difference network into a radio frequency signal x(t) and output it to the high-density phased array T / R component. At the same time, the on-board high- and low-frequency vertical interconnection structure converts the signal w(t) output by the power module into a signal v(t) for use by the various active chips inside the high-density phased array T / R component.

[0051] Please see Figure 5 In this embodiment, specifically, the sum-difference network consists of four 90-degree stripline branch bridges.

[0052] In this embodiment, specifically, in the receiving mode, the sum-difference network performs vector synthesis on each RF signal y(t) transmitted from the high- and low-frequency vertical interconnect structure on the board through a 90-degree stripline branch bridge, and outputs the sum port signal he(t), azimuth difference port signal fw(t), pitch difference port signal fy(t), and double difference port signal sc(t). The double difference port signal sc(t) is terminated by a matched load absorption, and the other three signals are used as the final output signals for the terminal.

[0053] In transmit mode, the tile-type transceiver unit uses a sum-difference network to vector synthesize the sum port signal he(t), azimuth difference port signal fw(t), and elevation difference port signal fy(t) transmitted from the terminal through a 90-degree stripline branch bridge, resulting in multiple radio frequency signals y(t), which are then output to the high- and low-frequency vertical interconnect structure within the board.

[0054] Please see Figure 6 In this embodiment, specifically, the power supply module consists of 8 functional circuits, including: lightning protection circuit, spike suppression circuit, input polarity reverse connection protection circuit, input filter circuit, DC / DC conversion circuit, output filter circuit, power-on control circuit, and enable control circuit.

[0055] In this embodiment, specifically, the tile-type transceiver component converts the externally input AC signal into a signal w(t) and outputs it to the high- and low-frequency vertical interconnect structure inside the board when in receive or transmit mode.

[0056] Specifically, in this embodiment, a tile-type transceiver assembly integrating a sum-difference network and a wave controller, when operating in receive mode, transmits multiple combined receive voltages v(t) generated by the power module to the RF chip interface, providing low-frequency signals for the normal operation of each chip's receiver. The assembly vector-synthesizes the RF signal s(t) transmitted from each antenna through a low-noise amplifier, phase shifter, attenuator, and combiner, and outputs it to the high- and low-frequency vertical interconnect structure within the board. The x(t) RF signal passes through a stripline transmission line, a stripline-to-coaxial line transition, an interlayer coaxial transmission line, a coaxial-to-stripline transition, and a stripline transmission line to obtain the RF signal y(t), which is output to the sum-difference network. The eight y(t) RF signals pass through four 90-degree stripline branch bridges to obtain the output signals of four sum-difference network circuits, namely the sum port signal he(t), the azimuth difference port signal fw(t), the elevation difference port signal fy(t), and the double difference port signal sc(t). The dual-differential port signal sc(t) is a useless signal, which is absorbed by the matched load at the termination point. The other three useful signals are used as the final output signals and transmitted to the terminal unit.

[0057] Specifically, in this embodiment, a tile-type transceiver assembly integrating a sum-difference network and a wave controller, when operating in transmit mode, transmits multiple transmit combination voltages v(t) generated by the power module to the RF chip interface, providing low-frequency signals for the normal operation of each chip's transmission. The assembly takes the sum port signal he(t), azimuth difference port signal fw(t), and elevation difference port signal fy(t) transmitted from the terminal unit, passes them through four 90-degree stripline branch bridges to obtain eight y(t) RF signals, which are output to the high- and low-frequency vertical interconnect structure within the board. The y(t) RF signals pass through stripline transmission lines, coaxial-to-stripline transitions, interlayer coaxial transmission lines, stripline-to-coaxialline transitions, and stripline transmission lines to obtain RF signals x(t), which are output to the high-density phased array T / R assembly. The x(t) signals pass through a power divider, attenuator, phase shifter, and power amplifier sequentially to output RF signals s(t). Each s(t) signal serves as the final output signal and is transmitted to the antenna as an excitation source.

[0058] The embodiments described above merely illustrate specific implementation methods of this application, and while the descriptions are detailed and specific, they should not be construed as limiting the scope of protection of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the technical solution of this application, and these modifications and improvements all fall within the scope of protection of this application.

[0059] This background section is provided to generally present the context of the invention. The work of the currently named inventors, the work to the extent described in this background section, and aspects described in this section that did not constitute prior art at the time of application are neither expressly nor impliedly acknowledged as prior art to the invention.

Claims

1. A tile-type transceiver assembly integrating a sum-difference network and a power supply module, characterized in that, include: High-density phased array T / R components, on-board high and low frequency vertical interconnection structure, sum and difference network, power supply module; The high-density phased array T / R assembly is connected to the on-board high- and low-frequency vertical interconnection structure, which is connected to the sum and difference network and the power supply module. The high-density phased array T / R assembly is connected to the antenna, the sum and difference network is connected to the terminal unit, and the power supply module is connected to an external AC source. The high-density phased array T / R module includes: Attenuators, phase shifters, power dividers, combiners, power amplifiers, and low-noise amplifiers; The high- and low-frequency vertical interconnection structure within the board consists of a strip transmission line, a strip-line coaxial line transition, an interlayer coaxial transmission line, a coaxial line strip-line transition, and a strip transmission line, all of which are connected in series. The sum-difference network consists of four 90-degree stripline branch bridges; The power module consists of eight functional circuits, including: lightning protection circuit, spike suppression circuit, input polarity reverse connection protection circuit, input filter circuit, DC / DC conversion circuit, output filter circuit, power-on control circuit, and enable control circuit. After passing through the on-board high- and low-frequency vertical interconnection structure, the radio frequency (RF) signal can be converted from the RF signal x(t) transmitted from the high-density phased array T / R module into an RF signal y(t) for output to the sum and difference network. It can also convert the RF signal y(t) transmitted from the sum and difference network into an RF signal x(t) for output to the high-density phased array T / R module. At the same time, the on-board high- and low-frequency vertical interconnection structure converts the signal w(t) output from the power module into a signal v(t) for use by the various active chips inside the high-density phased array T / R module. In receive mode, the tile-type transceiver unit uses a sum-difference network to vector synthesize each RF signal y(t) transmitted from the high- and low-frequency vertical interconnect structure on the board through a 90-degree stripline branch bridge, and outputs a sum port signal he(t), an azimuth difference port signal fw(t), an elevation difference port signal fy(t), and a double-difference port signal sc(t). The double-difference port signal sc(t) is terminated by a matched load for absorption, and the other three signals are used as the final output signals for the end unit. In transmit mode, the tile-type transceiver unit uses a sum-difference network to vector synthesize the sum port signal he(t), azimuth difference port signal fw(t), and elevation difference port signal fy(t) transmitted from the terminal through a 90-degree stripline branch bridge to obtain multiple radio frequency signals y(t), which are then output to the high- and low-frequency vertical interconnect structure on the board. In receive or transmit mode, the tile-type transceiver unit converts the externally input AC signal into a signal w(t) and outputs it to the high- and low-frequency vertical interconnect structure on the board.

2. The tile-type transceiver assembly integrating a sum-difference network and a power supply module according to claim 1, characterized in that, The operating modes of the tile-type transceiver component include: transmit mode and receive mode.

3. A tile-type transceiver assembly integrating a sum-difference network and a power supply module according to claim 1, characterized in that, The power amplifier and low-noise amplifier are a single chip within the high-density phased array T / R assembly. The chip integrates the power amplifier, low-noise amplifier, and RF switch, and the RF switch controls whether the chip operates in the transmit or receive branch.

4. A tile-type transceiver assembly integrating a sum-difference network and a power supply module according to claim 1, characterized in that, In receive mode, the tile-type transceiver uses the signal transmitted from the antenna as the input signal of the high-density phased array T / R component. The high-density phased array T / R component vector modulates the received signal and outputs the radio frequency signal to the high- and low-frequency vertical interconnection structure on the board. The high- and low-frequency vertical interconnection structure on the board transitions the radio frequency signal and outputs it to the sum and difference network as the input signal. The sum and difference network vector superimposes the signals and outputs the sum port and difference port signals, which are then transmitted to the terminal. In transmit mode, the tile-type transceiver module vector synthesizes the sum and difference signals input from the terminal through a sum-difference network and outputs them to the on-board high- and low-frequency vertical interconnect structure. The on-board high- and low-frequency vertical interconnect structure transmits and transitions the RF signal before outputting it to the high-density phased array T / R module as an input signal. The high-density phased array T / R module then vector modulates the received signal and transmits it to the terminated antenna.

5. A tile-type transceiver assembly integrating a sum-difference network and a power supply module according to claim 4, characterized in that, In receive mode, the tile-type transceiver module consists of 128 parallel RF circuits, each including a low-noise amplifier, a phase shifter, and an attenuator, which are connected in series. The RF signal s(t) transmitted from the antenna is amplified by the low-noise amplifier, and the resulting signal is then passed through the phase shifter and attenuator. Finally, the signal is combined by a combiner to output the signal x(t), which is then output to the high- and low-frequency vertical interconnect structure on the board. In transmit mode, the tile-type transceiver module consists of 128 parallel RF circuits, each including a power amplifier, a phase shifter, and an attenuator, which are connected in series. The RF signal x(t) transmitted from the high- and low-frequency vertical interconnection structure on the board is distributed by the power divider circuit, and then passes through the phase shifter and attenuator. The signal is then amplified by the power amplifier and finally output as the output signal s(t), which is output to the antenna terminated by each channel.

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