Compositions for fiberboard with enhanced properties after rapid curing at low temperatures

CN119522157BActive Publication Date: 2026-06-30COVESTRO (NETHERLANDS) BV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
COVESTRO (NETHERLANDS) BV
Filing Date
2023-07-07
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing technologies struggle to rapidly cure fiberboard at low temperatures while simultaneously meeting requirements for an internal bond strength of at least 0.4 MPa, a modulus of rupture of at least 10 MPa, and an apparent modulus of elasticity of at least 1700 MPa. This results in fiberboard being brittle during use and limiting its applications.

Method used

Fiberboard is prepared by using a composition containing polylysine, XL and plant fiber components, and rapidly curing at 160°C (pressing time factor equal to 9 sec/mm) to ensure high strength and elasticity.

Benefits of technology

The fiberboard that can be rapidly cured at low temperatures has an internal bond strength of at least 0.4 MPa, a modulus of rupture of at least 10 MPa and an apparent modulus of elasticity of at least 1700 MPa, which improves the mechanical resistance and service life of the fiberboard.

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Abstract

This invention relates to compositions comprising component A (the compositions of this invention), said component A being composed of a polylysine component, an XL component, and a fiber component, said fiber component being composed of at least one fiber element comprising plant fibers, and said fiber element containing no fibers other than plant fibers, and said composition containing no fibers other than plant fibers of said fiber component. The invention further relates to methods of obtaining objects from the compositions of this invention. The invention further relates to objects obtained by said method (objects of this invention), such as sheets, strips, rods, tapes, films, fabrics, containers, boards, panels, beams, frames, slats, engineered wood, such as fiberboard. The invention further relates to articles (articles of this invention) comprising a) a component that is solid at 23°C and 1 atm; and one or both of b) and c), wherein b) is the composition of this invention, and c) is the object of this invention. The invention further relates to various uses of any or any combination of the compositions of this invention, the objects of this invention, and the articles of this invention.
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