Compositions for fiberboard with enhanced properties after rapid curing at low temperatures
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- COVESTRO (NETHERLANDS) BV
- Filing Date
- 2023-07-07
- Publication Date
- 2026-06-30
AI Technical Summary
Existing technologies struggle to rapidly cure fiberboard at low temperatures while simultaneously meeting requirements for an internal bond strength of at least 0.4 MPa, a modulus of rupture of at least 10 MPa, and an apparent modulus of elasticity of at least 1700 MPa. This results in fiberboard being brittle during use and limiting its applications.
Fiberboard is prepared by using a composition containing polylysine, XL and plant fiber components, and rapidly curing at 160°C (pressing time factor equal to 9 sec/mm) to ensure high strength and elasticity.
The fiberboard that can be rapidly cured at low temperatures has an internal bond strength of at least 0.4 MPa, a modulus of rupture of at least 10 MPa and an apparent modulus of elasticity of at least 1700 MPa, which improves the mechanical resistance and service life of the fiberboard.
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Figure CN119522157B_ABST