A pre-assembly press-fit jig and press-fit method

Abstract

The application discloses a pre-assembled compression fixture for automatic assembly of small parts and main boards, which comprises a lower mold and an upper mold matched with each other. The lower mold comprises a base plate, the upper surface of the base plate is provided with a second positioning mechanism and a plurality of first positioning mechanisms. The first positioning mechanism has a first relative height for bearing small parts relative to the base plate, the second positioning mechanism has a second relative height for bearing main boards relative to the base plate, so that the small parts and the main boards are staggered in height and are attached to the lower surface of the main boards. The upper mold comprises a pressing mechanism, which is located above the base plate and locally acts on the upper surface of the main board for compressing the small parts and the main boards. The problems of low assembly precision, high scrap rate and increased production cost in the existing 3C assembly are solved.

Description

Technical Field

[0001] This application relates to a positioning device, and more particularly to a pre-assembled pressing fixture and pressing method. Background Technology

[0002] In the manufacturing process of 3C devices (such as mobile phones, tablets, and laptops), multiple components need to be assembled. These components are small, making manual assembly difficult. During assembly, parts are prone to shifting, leading to low assembly accuracy and affecting post-assembly quality. Furthermore, the small size of the components makes manual assembly prone to damage, resulting in a high scrap rate and increased manufacturing costs. Summary of the Invention

[0003] This invention discloses a pre-assembled pressing fixture, which solves the problems of low precision, high scrap rate, and increased production costs in existing 3C assembly manual assembly.

[0004] A pre-assembled pressing fixture for automated assembly of small parts and motherboards, the pressing fixture comprising a lower fixture mold and an upper fixture mold that cooperate with each other; The lower mold of the fixture includes a base plate, the upper surface of which has a second positioning mechanism and a plurality of first positioning mechanisms; the first positioning mechanisms have a first relative height relative to the base plate for supporting small parts, and the second positioning mechanisms have a second relative height relative to the base plate for supporting the main board, so that the small parts and the main board are staggered in height and fit against the lower surface of the main board; and The upper mold of the fixture includes a pressing mechanism, which is located above the substrate and partially liftable, acting on the motherboard to press the small parts and the motherboard together.

[0005] In this application, a lower mold and an upper mold of a fixture are used in conjunction. The lower mold assists in positioning the small part and the main board respectively. A first positioning mechanism with a first relative height and a second positioning mechanism with a second relative height are set so that the small part and the main board can be staggered in height and positioned sequentially, thereby replacing the traditional manual positioning method. The upper mold of the fixture presses down to complete the connection between the two.

[0006] Several alternative methods are provided below, but they are not intended as additional limitations on the overall solution above. They are merely further additions or optimizations. Provided there are no technical or logical contradictions, each alternative method can be combined individually with respect to the overall solution above, or multiple alternative methods can be combined with each other.

[0007] Optionally, the pressing fixture includes a base with a translation mechanism, the upper mold of the fixture is connected to the base and located on the movement path of the translation mechanism, and the lower mold of the fixture is connected to the translation mechanism and moves with the translation mechanism.

[0008] Optionally, the first positioning mechanism includes a small part coarse positioning module, which has a loading end for placing and carrying the small part, and a positioning area adapted to the shape of the small part is provided on the loading end.

[0009] Optionally, the positioning area has a relative front-back direction and a left-right direction. The first positioning mechanism further includes a small part lateral positioning module and a small part centering module. The loading ends of the small part lateral positioning module and the small part coarse positioning module have a tendency to move closer to each other in the front-back direction. The small part centering module is located on both sides of the small part coarse positioning module and has a tendency to move closer to each other in the left-right direction, which is used to drive the small part to move in the front-back direction and the left-right direction to fit the positioning area.

[0010] Optionally, the positioning area has several vacuum ports for creating negative pressure.

[0011] Optionally, the upper mold of the fixture further includes a third positioning mechanism, which can be raised and lowered to act on the upper end of the small parts, and cooperates with the positioning area to keep the height of each small part at a first relative height.

[0012] Optionally, the motherboard has a relative front-back direction and a left-right direction within the second positioning mechanism. The second positioning mechanism includes a motherboard lateral positioning component and a motherboard lateral push positioning component that cooperate with each other for positioning the motherboard in the front-back direction; and a motherboard centering module for positioning the motherboard in the left-right direction.

[0013] Optionally, the motherboard lateral positioning component is located on one side of the motherboard in the front-rear direction, and the motherboard lateral push positioning component is located on the other side of the motherboard in the front-rear direction and pushes the motherboard toward the motherboard lateral positioning component to complete the positioning of the motherboard in the front-rear direction.

[0014] Optionally, the motherboard centering module includes a first pushing mechanism located on one side of the motherboard in the left-right direction, a second pushing mechanism located on the other side of the motherboard in the left-right direction, and a driving mechanism. The driving mechanism acts on the first pushing mechanism and the second pushing mechanism respectively, driving the first pushing mechanism and the second pushing mechanism to move synchronously toward the motherboard.

[0015] This application also discloses a pre-assembly pressing method for a workpiece, which includes using the above-mentioned pre-assembly pressing fixture to position and press the small part and the main board together.

[0016] The beneficial effects of this application are as follows: 1. In this application, the small part is positioned by a first positioning mechanism and the motherboard is positioned by a second positioning mechanism to achieve automated positioning, which can effectively improve the accuracy of the connection between the small part and the motherboard compared with manual positioning. 2. The first positioning mechanism in this application is equipped with a small part coarse positioning module for loading small parts, and a vacuum port with negative pressure is provided at the loading end for adsorbing small parts, so as to prevent small parts from falling off during the movement of the first positioning mechanism, which can further reduce the defect rate caused by material shortage. 3. This application also includes a third positioning mechanism, which unifies the height of each small component by raising and lowering it. This reduces labor costs and avoids interference between the motherboard and the small components during positioning, thus preventing damage to the small components. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 This is a schematic diagram of the structure of the upper surface of the lower mold of the fixture in this application; Figure 3 This is a schematic diagram of the structure of the lower surface of the fixture lower mold in this application; Figure 4 This is a partial structural diagram of the lower mold of the fixture in this application; Figure 5 This is a schematic diagram of the upper mold of the fixture in this application; Figure 6 This is a partial structural diagram of the upper mold of the fixture in this application; Figure 7 This is a partial structural diagram of the upper mold of the fixture in this application; Figure 8 This is a partial structural diagram of the upper mold of the fixture in this application; Figure 9 This is a schematic diagram of the structure of the small component in this application; Figure 10 This is a schematic diagram of the motherboard structure in this application.

[0018] The annotations in the figure are explained as follows: 1. Upper mold of the fixture; 11. Pressing mechanism; 12. Third positioning mechanism; 13. Upper mold base plate; 14. First movable seat; 15. Heating assembly; 16. Second movable seat; 2. Lower mold of fixture; 21. Base plate; 22. First positioning mechanism; 221. Small part coarse positioning module; 222. Positioning area; 223. Vacuum port; 224. Small part lateral positioning module; 225. Small part centering module; 23. Second positioning mechanism; 231. Main board side positioning assembly; 231a. Limiting post; 231b. Support post; 232. Main board side push positioning assembly; 233. Main board centering module; 234. First pushing mechanism; 234a. Sliding seat; 234b. Push block; 234c. Driving inclined surface; 235. Second pushing mechanism; 236. Driving mechanism; 236a. Driving seat; 236b. Driving component; 236c. Transmission rod; 3. Base; 4. Translation mechanism. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] It should be noted that when a component is said to be "connected" to another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] It should be noted that the following refers to small items such as... Figure 9 As shown, it has a first folded edge 51 and a second folded edge 52. The first folded edge 51 is used to connect with the motherboard, and there is a 90° angle between the first folded edge 51 and the second folded edge 52; the motherboard is as follows: Figure 10 As shown, four connection areas for connecting the first folded edge 51 are provided on the side where the motherboard connects to the component.

[0023] refer to Figure 1 , Figure 2 , Figure 5 A pre-assembly pressing fixture for automated assembly of small parts and motherboards, the fixture having a lower fixture mold 2 for pre-positioning the small parts and motherboards, and an upper fixture mold 1 for pressing the small parts and motherboards.

[0024] The lower mold 2 of the fixture includes a base plate 21. The upper surface of the base plate 21 has a second positioning mechanism 23 and several sets of first positioning mechanisms 22. The first positioning mechanisms 22 have a first relative height relative to the base plate 21 for supporting small parts, and the second positioning mechanisms 23 have a second relative height relative to the base plate 21 for supporting the main board. When the small part is at the first relative height and the second positioning mechanism 23 is at the second relative height, their horizontal projections coincide and they are staggered in the height direction, so that they will not collide when moving at their respective heights.

[0025] The upper mold 1 of the fixture includes a pressing mechanism 11, which is located above the substrate 21 and partially liftable and acts on the main board to bring the main board close to the small part and press the two together.

[0026] like Figure 1 As shown, the above-mentioned fixture also includes a base 3, on which a translation mechanism 4 is provided. The upper mold 1 of the fixture is connected to the base 3 and located on the movement path of the translation mechanism 4. The lower mold 2 of the fixture is connected to the translation mechanism 4. When the translation mechanism 4 moves, it can drive the lower mold 2 of the fixture to pass under the upper mold 1 of the fixture, thereby making the lower mold 2 of the fixture form a manual position away from the upper mold 1 of the fixture, which is convenient for manual loading and unloading. It also includes a pressing position located directly below the upper mold 1 of the fixture, which is used to press the main board and small parts.

[0027] For positioning small items, refer to Figure 2 The first positioning mechanism 22 includes a small part coarse positioning module 221, which has a loading end for placing and carrying the small part, and a positioning area 222 adapted to the shape of the small part is provided on the loading end.

[0028] refer to Figure 2 In some embodiments, to ensure that the first relative height and the second relative height are staggered, a recess is provided at the loading end to accommodate the first folded edge 51 on the small part. The positioning area 222 is located within this recess.

[0029] It can be understood that the bottom of the aforementioned recess is the first relative height, and the protrusions formed on both sides of the recess are the second relative height. At the same time, the local height of the second positioning mechanism 23 is consistent with the height of the protrusion.

[0030] Furthermore, the first positioning mechanism 22 also includes a small part lateral positioning module 224 and a small part centering module 225. The positioning area 222 and the small part have relative front-back and left-right directions. The loading ends of the small part lateral positioning module 224 and the small part coarse positioning module 221 have a tendency to move closer to each other in the front-back direction, which is used to push the second folded edge 52 to fit against the side of the positioning area 222. The side of the positioning area 222 has the same length as the second folded edge 52. The small part centering module 225 is located on both sides of the small part coarse positioning module 221 and has a tendency to move closer to each other in the left and right direction, which is used to drive the second folded edge 52 of the small part to align with the side of the positioning area 222.

[0031] Because 3C devices are typically small, a more compact fixture structure is needed to accommodate the smaller motherboards. Figure 2 and Figure 3The small part centering module 225 includes two independent components, located on both sides of the small part coarse positioning module 221 and approaching the small part, acting on both sides of the second folded edge 52. Therefore, the small part coarse positioning module 221 can be divided into an action end acting on the second folded edge 52 and a driving end. The driving end is located on the lower surface of the substrate 21, and the action end extends through the substrate 21 to the upper surface of the substrate 21, saving installation space.

[0032] Similarly, the small part lateral positioning module 224 also includes an action end and a drive end, with the drive end located on the lower surface of the substrate 21. For example... Figure 3 As shown in the figure, the positioning module 224 and the small part sorting module 225 correspond to the same group of first positioning mechanisms.

[0033] Furthermore, refer to Figure 2 In some embodiments, to prevent small parts from falling off during the positioning process, the positioning area 222 is equipped with several vacuum ports 223 for creating negative pressure, which adsorb the small parts by negative pressure.

[0034] Combination Figure 6 and Figure 7 In some embodiments, in order to ensure that all small parts are at the same height so that the first folded edge 51 of the small parts fits into the positioning area 222, a third positioning mechanism 12 is provided on the upper mold 1 of the fixture. When the lower mold 2 of the fixture moves to the pressing position, the third positioning mechanism 12 moves toward the lower mold 2 of the fixture and acts on the first folded edge 51, so that the first folded edge 51 is located in the above-mentioned recess, ensuring that the small parts are at the first relative height, thus eliminating the need for the step of manually pressing the first folded edge 51 to fit into the positioning area 222.

[0035] refer to Figure 4 In some embodiments, the second positioning mechanism 23 includes a motherboard lateral positioning component 231 and a motherboard lateral push positioning component 232 that cooperate with each other, as well as a motherboard centering module 233.

[0036] The motherboard has relative front-to-back and left-to-right directions within the second positioning mechanism 23. The motherboard lateral positioning component 231 and the motherboard lateral push positioning component 232 are used for positioning the motherboard in the front-to-back direction. The motherboard centering module 233 is used for positioning the motherboard in the left-to-right direction.

[0037] Furthermore, the motherboard lateral positioning component 231 is located on one side of the motherboard in the front-rear direction, and the motherboard lateral pushing positioning component 232 is located on the other side of the motherboard in the front-rear direction, pushing the motherboard toward the motherboard lateral positioning component 231 to complete the positioning of the motherboard in the front-rear direction. The motherboard lateral positioning component 231 includes a limiting post 231a; when the motherboard lateral pushing positioning component 232 pushes the motherboard until it contacts the limiting post 231a, the positioning in the front-rear direction is completed. The motherboard lateral positioning component 231 also includes a support post 231b, which supports the sliding of the motherboard and maintains the motherboard at the aforementioned second relative height.

[0038] Furthermore, the motherboard centering module 233 includes a first pushing mechanism 234 located on one side of the motherboard in the left-right direction, a second pushing mechanism 235 located on the other side of the motherboard in the left-right direction, and a driving mechanism 236. The driving mechanism 236 acts on the first pushing mechanism 234 and the second pushing mechanism 235 respectively, driving the first pushing mechanism 234 and the second pushing mechanism 235 to move synchronously toward the motherboard.

[0039] refer to Figure 4 The first pushing mechanism 234 is movably connected to the substrate 21 in the form of a slider and a guide rail. The first pushing mechanism 234 includes a sliding seat 234a with a movement direction towards the motherboard, and a push block 234b located on the sliding seat, acting on one side of the motherboard. The driving mechanism 236 includes a first driving assembly 236a and a driving component 236b disposed on the driving seat 236a. The driving component 236b acts on the side of the sliding seat 234a away from the motherboard. Correspondingly, a driving inclined surface 234c is provided on this side of the sliding seat 234a. During the translation of the driving component 236b driven by the driving seat 236a, the driving component 236b and the driving inclined surface 234c push against each other, forcing the sliding seat 234a to move as a whole towards the motherboard.

[0040] Furthermore, in order to reduce friction and make the pushing process between the drive component 236b and the drive inclined surface 234c smoother, the drive component 236b can adopt a circular structure such as a bearing or a wheel to convert sliding friction into rolling friction.

[0041] It should be noted that the first pushing mechanism 234 and the second pushing mechanism 235 have the same structure. The drive seat 236a of the first pushing mechanism 234 and the drive seat 236a of the second pushing mechanism 235 are respectively connected to the two ends of the transmission rod 236c, and the transmission rod 236c is driven by the cylinder to move synchronously.

[0042] refer to Figure 5In some embodiments, the upper mold 1 of the fixture has an upper mold base plate 13, and the pressing mechanism 11 and the third positioning mechanism 12 are slidably connected to the upper mold base plate 13. The pressing mechanism 11 can be raised and lowered to act on the main board to press the main board and the small part together; the upper mold base plate 13 can be raised and lowered to act on the small part to assist the small part in moving to the first relative height, and the two can be raised and lowered independently.

[0043] refer to Figure 6 and Figure 7 The upper mold base plate 13 has a first movable seat 14, which is used to connect and drive the pressing mechanism 11 and the third positioning mechanism 12 to move synchronously on the upper mold base plate 13.

[0044] refer to Figure 8 In some embodiments, the upper mold 1 of the fixture also includes a liftable heating assembly 15 and a second movable seat 16 for driving the heating assembly 15 to move on the upper mold base plate 13. The heating assembly 15 is used for the connection between the main board and the component. A bonding material, such as tin or heat-sensitive adhesive, is provided at the connection point between the main board and the component, which can be connected by heating with the heating assembly 15.

[0045] In one embodiment of this application, a pre-assembly pressing method for a workpiece is also disclosed, wherein the pre-assembly pressing fixture positions and presses the small part and the main board.

[0046] Specifically, this includes placing the small component into the first positioning mechanism 22 for positioning in conjunction with the third positioning mechanism 12; placing the motherboard into the second positioning mechanism 23 for positioning; and running the pressing mechanism 11 to press the motherboard and the small component together.

[0047] Optionally, the motion heating assembly 15 heats the mainboard and components with connecting material.

[0048] The technical features of the embodiments described above can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered to be within the scope of this specification. When technical features of different embodiments are embodied in the same drawing, it can be regarded as the drawing also disclosing examples of combinations of the various embodiments involved.

[0049] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A pre-assembled pressing fixture for automated assembly of a small part and a motherboard, wherein the small part has a first folded edge (51) and a second folded edge (52), the first folded edge (51) being used to connect with the motherboard, and a 90° angle between the first folded edge (51) and the second folded edge (52); and four connection areas for connecting the first folded edge (51) are provided on the side where the motherboard and the small part are connected. The fixture has a lower mold (2) for pre-positioning the small part and the motherboard, and an upper mold (1) for pressing the small part and the motherboard together, characterized in that... The pressing fixture includes a lower fixture mold (2) and an upper fixture mold (1) that cooperate with each other; The lower mold (2) of the fixture includes a base plate (21), the upper surface of which has a second positioning mechanism (23) and several sets of first positioning mechanisms (22); the first positioning mechanism (22) has a first relative height relative to the base plate (21) for carrying small parts, and the second positioning mechanism (23) has a second relative height relative to the base plate (21) for carrying the main board, so that the small parts and the main board are staggered in height and fit against the lower surface of the main board. The first positioning mechanism (22) includes a small part coarse positioning module (221), the small part coarse positioning module (221) has a loading end for placing and carrying the small parts, and a positioning area (222) adapted to the shape of the small parts is provided on the loading end; and The upper mold (1) of the fixture includes a pressing mechanism (11), which is located above the substrate (21) and partially acts on the upper part of the motherboard to press the small parts and the motherboard together.

2. The pre-assembled pressing fixture according to claim 1, characterized in that, The pressing fixture includes a base (3) with a translation mechanism (4). The upper mold (1) of the fixture is connected to the base (3) and located on the movement path of the translation mechanism (4). The lower mold (2) of the fixture is connected to the translation mechanism (4) and moves with the translation mechanism (4).

3. The pre-assembled pressing fixture according to claim 1, characterized in that, The positioning area (222) has a relative front-back direction and a left-right direction. The first positioning mechanism (22) also includes a small part lateral positioning module (224) and a small part centering module (225). The loading end of the small part lateral positioning module (224) and the small part coarse positioning module (221) has a tendency to move closer to each other in the front-back direction. The small part centering module (225) is located on both sides of the small part coarse positioning module (221) and has a tendency to move closer to each other in the left-right direction. It is used to drive the small part to move in the front-back direction and the left-right direction to fit the positioning area (222).

4. The pre-assembled pressing fixture according to claim 1, characterized in that, The positioning area (222) has several vacuum ports (223) for creating negative pressure.

5. A pre-assembled pressing fixture according to claim 1, characterized in that, The upper mold (1) of the fixture also includes a third positioning mechanism (12), which can be raised and lowered to act on the first folded edge (51) of the small part. The third positioning mechanism (12) cooperates with the positioning area (222) to keep the height of each small part at the first relative height.

6. A pre-assembled pressing fixture according to claim 2, characterized in that, The motherboard has a relative front-back direction and a left-right direction within the second positioning mechanism (23). The second positioning mechanism (23) includes a motherboard side positioning component (231) and a motherboard side pushing positioning component (232) that cooperate with each other for positioning the motherboard in the front-back direction; and a motherboard centering module (233) for positioning the motherboard in the left-right direction.

7. A pre-assembled pressing fixture according to claim 6, characterized in that, The motherboard lateral positioning component (231) is located on one side of the motherboard in the front-back direction, and the motherboard lateral push positioning component (232) is located on the other side of the motherboard in the front-back direction and pushes the motherboard toward the motherboard lateral positioning component (231) to complete the positioning of the motherboard in the front-back direction.

8. A pre-assembled pressing fixture according to claim 7, characterized in that, The motherboard centering module (233) includes a first pushing mechanism (234) located on one side of the motherboard in the left-right direction, a second pushing mechanism (235) located on the other side of the motherboard in the left-right direction, and a driving mechanism (236). The driving mechanism (236) acts on the first pushing mechanism (234) and the second pushing mechanism (235) respectively, driving the first pushing mechanism (234) and the second pushing mechanism (235) to move synchronously toward the motherboard.

9. A method for pre-assembling and pressing a workpiece, characterized in that, This includes using a pre-assembled pressing fixture as described in any one of claims 1 to 8 to position and press the small parts and the motherboard together.

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