An optical transceiver module and related apparatus

Abstract

Embodiments of the present application disclose an optical transceiver integrated assembly and related equipment, which are used for reducing the connection cost between the BOSA and the PCB in the case of signal bandwidth improvement. The optical transceiver integrated assembly provided by the embodiments of the present application comprises a first pin surface, a second pin surface and a plurality of pins extending from the first pin surface, and the first pin surface is not parallel to the second pin surface. The pins extending from the first pin surface and the pins extending from the second pin surface are used for communication with different optical paths in the BOSA. The plurality of pins comprises signal pins and ground pins, the signal pins are used for transmitting communication signals, and the ground pins are used for grounding. On the first pin surface, the distance between the signal pins and the ground pins is d1, d1 is the minimum pin spacing on the first pin surface, and the ground pins are used for providing a signal loop and suppressing electromagnetic resonance on the signal pins.

Description

Technical Field

[0001] This application relates to the field of optical communication, and more particularly to an integrated optical transceiver component and related equipment. Background Technology

[0002] In optical communication equipment, a bidirectional optical sub-assembly (BOSA) includes a receiver (RX) and a transmitter (TX) optical path. The BOSA is used to receive and transmit optical signals. The BOSA needs to be connected to a printed circuit board (PCB) to form a circuit loop between the BOSA and the PCB. This circuit loop is used to transmit electrical signals between the BOSA and the PCB. A common connection method is to use a flexible printed circuit board (FPC) or pins on the BOSA to connect the BOSA to the PCB.

[0003] With the development of optical communication technology, the bandwidth of signals transmitted in communication networks is increasing. While FPCs can support the transmission of high-bandwidth signals, their manufacturing process is complex and costly. Using FPCs to connect BOSAs and PCBs would also result in high costs. Pin fabrication is simple and inexpensive, but it is prone to electromagnetic resonance and cannot support the transmission of high-bandwidth signals.

[0004] If the BOSA is designed to enable high-bandwidth signal communication, an FPC must be used to connect the BOSA and the PCB to support the transmission of high-bandwidth signals between the BOSA and the PCB. The use of an FPC will increase the connection cost between the BOSA and the PCB. Summary of the Invention

[0005] This application provides an integrated optical transceiver component and related equipment to reduce the connection cost between BOSA and PCB while increasing signal bandwidth.

[0006] In a first aspect, embodiments of this application provide an optical transceiver assembly (BOSA). The BOSA includes a first pin surface, a second pin surface, and a plurality of pins extending from the first pin surface. The first pin surface and the second pin surface are not parallel. The pins extending from the first pin surface and the pins extending from the second pin surface are used for communication with different optical paths within the BOSA (the different optical paths in the BOSA include the receiving optical path and the transmitting optical path of the BOSA). The plurality of pins extending from the first pin surface includes signal pins and ground pins. The signal pins are used to transmit communication signals, and the ground pins are used for grounding. The distance between the signal pins and the ground pins is d1, where d1 is the smallest pin spacing among the plurality of pins. The ground pins are used to provide a signal loop and suppress electromagnetic resonance on the signal pins.

[0007] In this embodiment, since the ground pin is grounded, it can serve as a reference ground for the signal pin. The distance d1 between the signal pin and the ground pin is the smallest pin spacing among the multiple pins on the first pin surface. Therefore, the signal pin and the ground pin are relatively close, forming a communication signal loop between them. If the signal pin is left floating, the communication signal is transmitted on this signal loop, reducing the parasitic capacitance between the signal pin and other pins, making it less prone to electromagnetic resonance. Therefore, in the BOSA structure provided in this embodiment, the ground pin, being closer to the signal pin, can suppress electromagnetic resonance on the signal pin, thereby reducing the signal loss to the communication signal. This reduction in loss allows the signal pin to support the transmission of high-bandwidth signals. This eliminates the need for an FPC to connect the BOSA to the PCB, reducing the cost of connecting the BOSA to the PCB.

[0008] In one alternative implementation, both the pins extending from the first pin face and the pins extending from the second pin face are used to connect to the PCB, with the PCB parallel to the second pin face.

[0009] In this embodiment, the PCB is parallel to the second pin surface, while the first pin surface is not parallel to the second pin surface; therefore, the first pin surface is not parallel to the PCB. Multiple pins extending from the first pin surface (used to connect the BOSA and the PCB) are suspended between the non-parallel first pin surface and the PCB. Among these suspended pins, the ground pin with the closest distance (d1) to the signal pin can serve as the reference ground for the signal pin. A signal loop for the communication signal is formed between the signal pin and the ground pin, thereby preventing electromagnetic resonance of the communication signal on the suspended signal pin.

[0010] In one alternative implementation, the signal pin is the pin that is closest to the second pin surface among a plurality of pins extending from the first pin surface.

[0011] In this embodiment, the second pin face of the BOSA typically faces the PCB. Pins extending from the second pin face are used to establish the connection between the BOSA and the PCB. The closer the pins extending from the first pin face are to the second pin face, the closer they are to the PCB. Therefore, among the multiple pins extending from the first pin face, the signal pin closest to the second pin face is the pin closest to the PCB. Thus, among the multiple pins between the first pin face and the PCB, the signal pin is the shortest. Since the longer the pin through which the communication signal flows, the greater the signal loss, transmitting the communication signal through shorter signal pins can reduce the signal loss and improve the signal quality.

[0012] In one alternative implementation, pins extending from the first pin face are used for communication with the transmit optical path in the BOSA, and pins extending from the second pin face are used for communication with the receive optical path in the BOSA. The BOSA also includes an optical port and an optical transmitter chip; the optical port is used for connection to the optical fiber. Communication signals originate from the PCB. Signal pins are used to transmit communication signals from the PCB to the optical transmitter chip. The optical transmitter chip generates the target optical signal based on the communication signal and transmits the target optical signal to the optical fiber through the optical port.

[0013] In this embodiment, the BOSA's transmitting optical path includes the aforementioned optical emitting chip. Multiple pins extending from the first pin surface of the BOSA are used to enable communication between the transmitting optical path and the PCB. Correspondingly, multiple pins extending from the second pin surface are used to enable communication between the receiving optical path and the PCB. If the second pin surface (RX terminal) faces the PCB, the ground pin on the first pin surface (TX terminal) that is closer to the signal pin can suppress electromagnetic resonance on the TX terminal signal pin, thereby reducing the loss of the TX terminal communication signal.

[0014] In one alternative implementation, BOSA also includes a monitoring photodiode (MPD). The MPD is used to detect the optical signal emitted by the light-emitting chip. Multiple pins extending from the first pin face include MPD pins, which are used for communication with the MPD. The distance between the signal pin and the MPD pin is d2, where d2 ≥ d1. The MPD pin provides a signal loop and suppresses electromagnetic resonance on the signal pin.

[0015] In this embodiment, the MPD pin is also grounded and can serve as a reference ground for the signal pin. The distance d2 between the MPD pin and the signal pin is small, allowing a signal loop to be formed between them, making electromagnetic resonance less likely to occur on the signal pin. Therefore, the MPD pin can suppress electromagnetic resonance on the signal pin, further reducing signal loss due to the signal pin.

[0016] In one alternative implementation, the signal pin is an RF pin and the ground pin is a GND pin.

[0017] In one alternative implementation, pins extending from the first pin face are used for communication with the receiving optical path in the BOSA, and pins extending from the second pin face are used for communication with the transmitting optical path in the BOSA. The BOSA also includes an optical port and a photoelectric conversion chip. The optical port is used for connection to an optical fiber. The photoelectric conversion chip is used to convert the received optical signal from the optical port into a communication signal. Signal pins are used to transmit the communication signal from the photoelectric conversion chip to the PCB.

[0018] In this embodiment, the receiving optical path of the BOSA includes the aforementioned photoelectric conversion chip. Multiple pins extending from the first pin surface of the BOSA are used to realize communication between the receiving optical path and the PCB. Correspondingly, multiple pins extending from the second pin surface are used to realize communication between the transmitting optical path and the PCB. If the second pin surface (TX end) faces the PCB, the ground pin on the first pin surface (RX end) that is closer to the signal pin can suppress electromagnetic resonance on the RX end signal pin, thereby reducing the loss of the RX end communication signal.

[0019] In one alternative implementation, the photoelectric conversion chip includes a photodetector that converts received optical signals into communication signals. Both a signal pin and a ground pin communicate with the photodetector. Specifically, the signal pin is connected to the positive terminal of the photodetector, and the ground pin is connected to the negative terminal; alternatively, the signal pin is connected to the negative terminal of the photodetector, and the ground pin is connected to the positive terminal.

[0020] Optionally, the photodetector can be a photodiode, an avalanche photodiode, a multiplier photodiode, etc., and this application does not limit it.

[0021] In one alternative implementation, the signal pin is the VCC+ pin, and the ground pin is the PD+ pin.

[0022] In one alternative implementation, the signal pin is labeled PD+ and the ground pin is labeled PD-.

[0023] In this embodiment, to facilitate users in connecting the multiple pins extending from the first pin surface to the PCB, the RF pin on the first pin surface is labeled as PD+ pin, and the VCC pin on the first pin surface is labeled as PD- pin. Based on this labeling, users can quickly connect to the corresponding interfaces on the PCB, preventing connection errors.

[0024] In one alternative implementation, the communication signal may include analog or digital signals.

[0025] In this embodiment, the grounding pin can suppress electromagnetic resonance on the signal pin, thereby reducing losses caused by electromagnetic resonance at certain frequencies. Because these frequencies are reduced, the frequency range of the communication signals transmitted by the BOSA can include these frequencies. For example, the communication signals can be analog signals, 2.5Gbps digital signals, 5Gbps digital signals, 10Gbps digital signals, or higher-speed digital signals that are not currently supported by the BOSA.

[0026] Secondly, embodiments of this application provide a transceiver integrated on-board optical assembly (BOSA on board, BOB). The BOB includes a printed circuit board (PCB) and the BOSA described in the first aspect. The signal pins and ground pins of the BOSA are used for connection to the PCB.

[0027] Thirdly, embodiments of this application provide an optical communication device. This optical communication device includes the BOSA described in the first aspect.

[0028] The beneficial effects of the second and third aspects are described in the first aspect and will not be repeated here. Attached Figure Description

[0029] Figure 1 A schematic diagram of the structure of BOSA provided in this application;

[0030] Figure 2a A schematic diagram of the connection between BOSA and PCB provided in this application;

[0031] Figure 2b A schematic diagram of the connection between BOSA and PCB provided in this application;

[0032] Figure 2c A schematic diagram of the connection between BOSA and PCB provided in this application;

[0033] Figure 3 A schematic diagram of the structure of BOSA provided in an embodiment of this application;

[0034] Figure 4a A loss diagram of the BOSA provided for this application;

[0035] Figure 4b A loss diagram of BOSA provided for an embodiment of this application;

[0036] Figure 5 Another structural schematic diagram of BOSA provided in this application embodiment;

[0037] Figure 6 A schematic diagram showing the distribution of multiple pins extending from the first pin surface provided in an embodiment of this application;

[0038] Figure 7 This is another structural schematic diagram of BOSA provided in an embodiment of this application. Detailed Implementation

[0039] The embodiments of this application will now be described with reference to the accompanying drawings.

[0040] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of units is not necessarily limited to those units, but may include other units not explicitly listed or inherent to those processes, methods, products, or apparatuses. Additionally, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist, for example, A and / or B, which can represent: A alone, A and B simultaneously, or B alone. A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, at least one of a, b, or c can be expressed as: a, b, c, ab, ac, bc, or abc.

[0041] Optical transceiver assembly (BOSA) is a commonly used component in optical communication equipment. For example... Figure 1 As shown, the BOSA includes an optical port, an optical transmitter chip, a photoelectric conversion chip, a TX terminal, and an RX terminal. The optical port is used to connect to the optical fiber, the optical transmitter chip and the TX terminal are included in the BOSA's transmitting optical path, and the photoelectric conversion chip and the RX terminal are included in the BOSA's receiving optical path.

[0042] The optical transmitter chip converts the transmitted signal from the TX end into a BOSA transmitted optical signal and transmits it to the optical fiber via the optical port. The optical port is also used to receive the BOSA received optical signal via the optical fiber. The photoelectric conversion chip performs photoelectric conversion on the received optical signal from the optical port and outputs the converted received electrical signal through the RX end.

[0043] The TX and RX pins of the BOSA need to be connected to the printed circuit board (PCB) to transmit communication signals (including the aforementioned transmit and receive electrical signals) between the BOSA and the PCB. A common connection method is to use a flexible printed circuit (FPC) or pins on the BOSA to establish the connection between the BOSA and the PCB.

[0044] For example Figure 2a As shown, both the TX and RX terminals of the BOSA are connected to the PCB via an FPC. Alternatively, it can be done as follows: Figure 2b As shown, the TX pin of the BOSA connector connects to the PCB via a pin, while the RX pin connects to the PCB via an FPC. Alternatively, it can be configured as follows: Figure 2c As shown, both the TX and RX terminals of the BOSA are connected to the PCB via pins.

[0045] With the development of optical communication technology, the bandwidth of signals transmitted in communication networks is increasing. FPCs can support the transmission of high-bandwidth signals, but their fabrication process is complex and costly. If... Figure 2a and Figure 2b As shown, using FPC to connect BOSA and PCB will result in high costs. While pin fabrication is simple and inexpensive, it is prone to electromagnetic resonance. Figure 2c The connection structure shown cannot support the transmission of high-bandwidth signals.

[0046] If the BOSA is designed to implement high-bandwidth signal communication, an FPC must be used to connect the BOSA and the PCB to support the transmission of high-bandwidth signals between the BOSA and the PCB (e.g., FPC). Figure 2a or Figure 2b (As shown). The use of FPC will increase the connection cost between BOSA and PCB.

[0047] To reduce the connection cost between BOSA and PCB, it is necessary to consider how to replace FPC with pins to achieve high-bandwidth signal transmission. Therefore, the embodiments of this application address... Figure 2c The reasons why the structure shown cannot support high-bandwidth signal transmission are analyzed. In BOSA, due to structural limitations of the receiving and transmitting optical paths, the pins of the receiving optical path RX and the transmitting optical path TX are not on the same plane. For example... Figure 1As shown, the TX pins are located on the xOz plane, and the RX pins are located on the xOy plane, with the two planes perpendicular to each other. This causes some pins of the BOSA to not be directly aligned with the PCB, resulting in these pins being suspended between the BOSA and the PCB. For example... Figure 2c As shown, if the RX pin (located on the xOy plane) is directly facing the PCB, then the TX pin (located on the xOz plane), which is perpendicular to the RX pin, cannot be directly facing the PCB. The TX pin is suspended between the BOSA and the PCB, and the TX pin needs to be bent at 90° to achieve a connection with the PCB.

[0048] The BOSA casing and PCB surface can both serve as reference grounds for the circuitry within the BOSA. Because the TX pin is suspended between the BOSA and the PCB, the distance between the TX pin and the reference ground (e.g., the PCB) is relatively large, resulting in high impedance on the TX pin. This high-impedance TX pin acts like an antenna, generating electromagnetic resonance. Similarly, if the TX pin is directly facing the PCB, electromagnetic resonance will also occur on the RX pin.

[0049] Electromagnetic wave resonance will radiate signals at certain frequencies, causing a significant increase in loss at these frequencies in the BOSA (Board of Switches). If these high-loss frequencies fall within the designed communication band, and the loss at these frequencies exceeds the designed allowable loss value, it will lead to signal distortion within that band, affecting communication in that band. Because wide-bandwidth signals occupy a large frequency range, these high-loss frequencies are very likely to fall within the frequency range of wide-bandwidth signals, thus affecting the transmission quality of wide-bandwidth signals between the BOSA and the PCB.

[0050] In other words, if both the TX and RX pins of the BOSA are connected to the PCB via pins, electromagnetic resonance from the floating pins will cause distortion of high-bandwidth signals, making the BOSA unable to support the transmission of high-bandwidth signals. Avoiding electromagnetic resonance from the floating pins eliminates the need for an FPC between the BOSA and the PCB, thereby reducing the connection cost between the BOSA and the PCB.

[0051] To address the high cost of transmitting high-bandwidth signals between the BOSA and the PCB, this application provides an optical transceiver assembly (BOSA) and related equipment. In the BOSA provided in this application, the distance between the ground pin and the signal pin is relatively short. The ground pin can suppress electromagnetic resonance on the signal pin, thereby reducing signal loss and preventing signal distortion. This allows even floating pins to support the transmission of high-bandwidth signals, thus avoiding the use of an FPC between the BOSA and the PCB and reducing the cost of transmitting high-bandwidth signals between the BOSA and the PCB.

[0052] like Figure 3 As shown, the BOSA 3000 provided in this application embodiment includes: a first pin surface 3100, a second pin surface 3200, and a plurality of pins 3300 extending from the first pin surface 3100. The first pin surface 3100 and the second pin surface 3200 are not parallel.

[0053] In this embodiment, the pin surface (e.g., the first pin surface 3100 or the second pin surface 3200 described above) is a plane on the BOSA3000 used for arranging pins. Pins extending from the same pin surface are parallel to each other and communicate with the same optical path in the BOSA. Pins extending from different pin surfaces communicate with different optical paths in the BOSA.

[0054] For example, the first pin face 3100 can be the pin face of the TX terminal of the BOSA 3000. Then, the multiple pins 3300 extending from the first pin face 3100 can be used for communication with the transmit optical path of the BOSA 3000. Correspondingly, the pins extending from the second pin face 3200 are used for communication with the receive optical path of the BOSA 3000. Conversely, the multiple pins 3300 extending from the first pin face 3100 can communicate with the receive optical path, and the pins extending from the second pin face 3200 can communicate with the transmit optical path; this application does not limit this.

[0055] Among the plurality of pins 3300 extending from the first pin face 3100, there are signal pins 3310 and ground pins 3320. Signal pin 3310 is used to transmit BOSA 3000 communication signals, and ground pin 3320 is used for grounding.

[0056] On the first pin face 3100, the distance between the signal pin 3310 and the ground pin 3320 is d1. d1 is the minimum pin spacing on the first pin face 3100. The ground pin 3320 is used to provide a signal return path to suppress electromagnetic resonance on the signal pin.

[0057] In this embodiment, since the ground pin 3320 is grounded, it can serve as a reference ground for the signal pin 3310. The distance d1 between the signal pin 3310 and the ground pin 3320 is the minimum pin spacing on the first pin surface 3100. Therefore, the distance between the signal pin 3310 and the ground pin 3320 is relatively short, and a signal loop for communication signals can be formed between the ground pin 3320 and the signal pin 3310.

[0058] If the first pin face 3100 is not parallel to the PCB, then multiple pins 3300 extending from the first pin face 3100 are floating between the first pin face 3100 and the PCB. The floating signal pins 3310 have inconsistent impedances with the PCB (the floating signal pins 3310 have higher impedances), causing parasitic capacitances to form between the floating signal pins 3310 and other pins, the BOSA casing, and other signal lines on the PCB, resulting in a deterioration of signal amplitude and frequency response. This deterioration manifests as a deterioration in signal amplitude on the power-amplitude response curve, and the generation of electromagnetic resonances on the signal pins, respectively. Electromagnetic resonances cause energy to be radiated away at certain frequencies, resulting in high losses at those frequencies. For example… Figure 4a As shown, at frequency points 1, 2 and 3, the electromagnetic resonance of signal pin 3100 causes energy to be radiated out, resulting in high loss and low signal strength at these three frequency points.

[0059] In this embodiment, a ground pin 3320, which is close to the signal pin 3310, provides a return path for the communication signal. This return path reduces the parasitic capacitance between the signal pin 3310 and other pins, thereby suppressing electromagnetic resonance at the signal pin 3310. With electromagnetic resonance suppressed, signal energy is less likely to be radiated, thus reducing signal loss at the signal pin 3310. Figure 4b As shown, since the ground pin 3320 provides a signal loop for the signal pin 3310, it suppresses the electromagnetic resonance on the signal pin 3310. Therefore, the energy at frequency points 1, 2 and 3 is not radiated due to electromagnetic resonance, and the loss at these three frequency points is reduced.

[0060] In this embodiment, the ground pin 3320 can suppress electromagnetic resonance on the signal pin 3310, thereby reducing losses caused by electromagnetic resonance at certain frequencies. Because these losses are reduced, the frequency range of the communication signals transmitted by the BOSA 3000 can include these frequencies.

[0061] For example, the communication signal transmitted on signal pin 3310 is a wide-bandwidth analog signal that current BOSAs cannot support. Compared to digital signals, analog signals have a larger analog bandwidth (frequency range of the transmitted signal). Analog signals include frequency bands not included in digital signals. Current BOSAs that support digital signal transmission may be unable to support analog signal transmission because the high-loss frequency points of electromagnetic resonance at floating pins fall within a certain frequency band. This frequency band is outside the frequency band range of digital signals but within the frequency band range of analog signals. Using the BOSA 3000 provided in this application embodiment, it is possible to prevent these high-loss frequency points from causing electromagnetic resonance at signal pin 3310, thereby avoiding analog signal distortion and enabling BOSAs that currently only support digital signal transmission to support analog signal transmission.

[0062] In another alternative implementation, the communication signal transmitted on signal pin 3310 is a high-speed digital signal that the current BOSA cannot support, such as a 2.5Gbps, 5Gbps, 10Gbps, or even higher-speed digital signal. With the development of optical communication, the speed of digital signals increases, and the range of frequency bands used also expands. If the high-loss frequency point where electromagnetic resonance occurs on the floating pin falls within the expanded frequency band, it will cause signal distortion, making it impossible for the BOSA to support signal transmission in that expanded frequency band. The BOSA 3000 provided in this application embodiment can prevent these high-loss frequency points from causing electromagnetic resonance on signal pin 3310, thereby avoiding high-speed digital signal distortion and enabling the BOSA, which currently only supports low-speed digital signal transmission, to support high-speed digital signal transmission.

[0063] Optionally, the pins extending from the first pin surface 3100 and the pins extending from the second pin surface 3200 are both used for connection to the PCB, with the PCB parallel to the second pin surface 3200. Optionally, the first pin surface 3100 can be the pin surface of the BOSA 3000TX end or the pin surface of the RX end; this application does not limit this.

[0064] Optionally, if the first pin face 3100 is the TX pin face of the BOSA 3000, then the second pin face 3200 is the RX pin face of the BOSA 3000. The corresponding structure is as follows: Figure 5 As shown, the BOSA 3000 also includes an optical port 3400 and an optical transmitter chip 3500. The optical port 3400 is used for connection to the optical fiber. The communication signal originates from the PCB. Signal pin 3310 is used to transmit the communication signal from the PCB to the optical transmitter chip 3500. The optical transmitter chip 3500 generates the target optical signal based on the communication signal and transmits the target optical signal to the optical fiber through the optical port.

[0065] In this embodiment, the BOSA 3000's transmitting optical path includes an optical emitting chip 3500. Multiple pins extending from the first pin surface 3100 of the BOSA 3000 are used to realize communication between the transmitting optical path and the PCB. Correspondingly, multiple pins extending from the second pin surface 3200 are used to realize communication between the receiving optical path and the PCB. If the second pin surface 3200 (RX terminal) faces the PCB, the ground pin 3200 on the first pin surface 3100 (TX terminal), which is closer to the signal pin 3100, can suppress electromagnetic resonance on the TX terminal signal pin 3100, thereby reducing the loss of the TX terminal communication signal (the BOSA 3000's transmitting signal).

[0066] Optional, such as Figure 5 As shown, the BOSA 3000 also includes a monitoring photodiode MPD 3600. The MPD 3600 is used to detect the optical signal emitted by the optical emitting chip 3500. Multiple pins 3300 extending from the first pin face 3100 include MPD pins 3330, which are used to communicate with the MPD 3600. On the first pin face 3100, the distance between the signal pin 3310 and the MPD pin 3330 is d2, where d2 ≥ d1. The MPD pin 3330 provides a signal loop to suppress electromagnetic resonance on the signal pin 3310.

[0067] Optionally, the distribution of the multiple pins 3300 on the first pin face 3100 can be as follows: Figure 6 As shown in Figure a, two ground pins 3320, a signal pin 3310, and a bias pin extend from the first pin face 3100. The optical emitting chip 3500 includes a directly modulated laser, and the bias pin provides a bias current for the directly modulated laser. In Figure b, the distance d2 between the MPD pin 3330 and the signal pin 3310 is greater than the distance between the ground pin 3320 and the signal pin 3310. Figure c is symmetrical to Figure b. In Figure d, the distance d2 between the MPD pin 3330 and the signal pin 3310 is equal to the distance between the ground pin 3320 and the signal pin 3310.

[0068] Optionally, signal pin 3310 is an RF pin, and ground pin 3320 is a GND pin.

[0069] In this embodiment, MPD pin 3330 is also grounded and can serve as a reference ground for signal pin 3310. The distance d2 between MPD pin 3330 and signal pin 3310 is small, allowing a signal loop for communication signals to be formed between them. Therefore, MPD pin 3330 can also suppress electromagnetic resonance on signal pin 3310 (similar to the principle of grounded pin 3320), further reducing the loss of communication signals at signal pin 3310.

[0070] In this embodiment of the application, the loss of communication signals by the signal pin can also be reduced by decreasing the length of the signal pin 3310. For example... Figure 5 As shown, signal pin 3310 is the pin closest to the second pin surface 3200 among the multiple pins 3300 extending from the first pin surface 3100.

[0071] In this embodiment, the second pin face 3200 of the BOSA 3000 typically faces the PCB. Pins extending from the second pin face 3200 are used to establish the connection between the BOSA 3000 and the PCB. The closer the pins extending from the first pin face 3100 are to the second pin face 3200, the closer they are to the PCB. Therefore, among the multiple pins 3300 extending from the first pin face 3100, the signal pin 3310 closest to the second pin face 3200 is the pin closest to the PCB. Thus, among the multiple pins between the first pin face 3100 and the PCB, the signal pin 3310 is the shortest pin.

[0072] The losses caused by signal pin 3310 to the communication signal mainly include low-frequency dielectric loss and high-frequency skin effect. These losses are positively correlated with the transmission distance of the communication signal on the pin. That is, the longer the pin, the greater the loss to the communication signal. In this embodiment, signal pin 3310 is the pin closest to the second pin surface 3200 on the first pin surface 3100, and therefore has the shortest pin length. Thus, transmitting the communication signal through the shorter signal pin 3310 can reduce the loss caused by the signal pin 3310 and improve the signal quality of the communication signal.

[0073] Optionally, if the first pin face 3100 is the RX pin face of the BOSA 3000, then the second pin face 3200 is the TX pin face of the BOSA 3000. The corresponding structure is as follows: Figure 7As shown, the BOSA 3000 also includes an optical port 3400 and a photoelectric conversion chip 3700. The optical port 3400 is used for connection to optical fiber. The photoelectric conversion chip 3700 is used to convert the received optical signal from the optical port 3400 into a communication signal. Signal pin 3310 is used to transmit the communication signal from the photoelectric conversion chip 3700 to the PCB.

[0074] In this embodiment, the receiving optical path of the BOSA 3000 includes a photoelectric conversion chip 3700. Multiple pins 3300 extending from the first pin surface 3100 of the BOSA 3000 are used to realize communication between the receiving optical path and the PCB. Correspondingly, multiple pins extending from the second pin surface 3200 are used to realize communication between the transmitting optical path and the PCB. If the second pin surface 3200 (TX end) faces the PCB, the ground pin 3320 on the first pin surface 3100 (RX end), which is closer to the signal pin 3310, can suppress electromagnetic resonance on the RX end signal pin 3310, thereby reducing the loss of the RX end communication signal.

[0075] Optionally, the photoelectric conversion chip 3700 includes a photodetector, which converts the received optical signal into a communication signal. Both signal pin 3310 and ground pin 3320 communicate with the photodetector. Specifically, signal pin 3310 is connected to the positive terminal of the photodetector 3700, and ground pin 3320 is connected to the negative terminal of the photodetector 3700; or, signal pin 3310 is connected to the negative terminal of the photodetector 3700, and ground pin 3320 is connected to the positive terminal of the photodetector 3700.

[0076] Optionally, the positive terminal of the photodetector 3700 can be the PD+ pin among the multiple pins 3300, and the negative terminal of the photodetector 3700 can be the VCC pin among the multiple pins 3300.

[0077] Optionally, the photodetector 3700 can be a photodiode (PD), an avalanche photodiode (APD), a multiplier photodiode, etc., and this application does not limit it.

[0078] Optionally, signal pin 3310 is the VCC+ pin, and ground pin 3320 is the PD+ pin.

[0079] Optionally, to facilitate user connection of the multiple pins 3300 extending from the first pin face 3100 to the PCB, the RF pins on the first pin face are labeled as PD+ pins and used as signal pins 3310; the VCC pins on the first pin face are labeled as PD- pins and used as ground pins 3320. Users can quickly connect to the corresponding interfaces on the PCB based on this labeling, preventing connection errors.

[0080] It is worth noting that, Figure 6 Four pins extend from the first pin face 3100, which is only an example. The number of pins extending from the first pin face 3100 can be more or less, and this application does not limit this.

[0081] In this embodiment of the application, the loss of communication signals by the signal pin can also be reduced by decreasing the length of the signal pin 3310. For example... Figure 7 As shown, signal pin 3310 is the pin closest to the second pin surface 3200 among the multiple pins 3300 extending from the first pin surface 3100.

[0082] In this embodiment, the second pin face 3200 of the BOSA 3000 typically faces the PCB. Pins extending from the second pin face 3200 are used to establish the connection between the BOSA 3000 and the PCB. The closer the pins extending from the first pin face 3100 are to the second pin face 3200, the closer they are to the PCB. Therefore, among the multiple pins 3300 extending from the first pin face 3100, the signal pin 3310 closest to the second pin face 3200 is the pin closest to the PCB. Thus, among the multiple pins between the first pin face 3100 and the PCB, the signal pin 3310 is the shortest pin.

[0083] The losses caused by signal pin 3310 to the communication signal mainly include low-frequency dielectric loss and high-frequency skin effect. These losses are positively correlated with the transmission distance of the communication signal on the pin. That is, the longer the pin, the greater the loss to the communication signal. In this embodiment, signal pin 3310 is the pin closest to the second pin surface 3200 on the first pin surface 3100, and therefore has the shortest pin length. Thus, transmitting the communication signal through the shorter signal pin 3310 can reduce the loss caused by the signal pin 3310 and improve the signal quality of the communication signal.

[0084] This application also provides a transceiver integrated on-board optical assembly (BOSA on board, BOB). The BOB includes a printed circuit board (PCB) and... Figures 3 to 7The BOSA 3000 described in any embodiment. The signal pin 3310 and ground pin 3320 of the BOSA 3000 are used for connection to the PCB.

[0085] This application also provides an optical communication device. The optical communication device includes... Figures 3 to 7 The BOSA 3000 described in any embodiment.

[0086] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0087] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.

[0088] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0089] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0090] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A single optical transceiver unit (BOSA), characterized in that, include: A first pin face, a second pin face, and a plurality of pins extending from the first pin face, wherein the first pin face and the second pin face are not parallel, and the pins extending from the first pin face and the pins extending from the second pin face are used for communication with different optical paths in the BOSA. The plurality of pins includes signal pins and ground pins. The signal pins are used to transmit communication signals and are the pins closest to the second pin face among the plurality of pins. The ground pins are used for grounding. On the first pin surface, the distance between the signal pin and the ground pin is d1, where d1 is the minimum pin spacing on the first pin surface. The ground pin serves as the reference ground for the signal pin, forming a signal loop for communication signals between the ground pin and the signal pin, thereby suppressing electromagnetic resonance on the signal pin that is suspended between the first pin surface and the printed circuit board (PCB).

2. The BOSA according to claim 1, characterized in that, The pins extending from the first pin surface and the pins extending from the second pin surface are both used to connect to a printed circuit board (PCB), which is parallel to the second pin surface.

3. The BOSA according to claim 1 or 2, characterized in that, The pins extending from the first pin surface are used to communicate with the transmitting optical path in the BOSA, and the pins extending from the second pin surface are used to communicate with the receiving optical path in the BOSA. The BOSA also includes an optical port and an optical transmitting chip. The optical port is used to connect to an optical fiber, and the communication signal comes from the PCB. The signal pin is used to transmit the communication signal from the PCB to the optical emitting chip; The optical emitting chip is used to generate a target optical signal based on the communication signal and to transmit the target optical signal to the optical fiber through the optical port.

4. The BOSA according to claim 3, characterized in that, The BOSA also includes: a monitoring photodiode (MPD); The MPD is used to detect the optical signal emitted by the optical emitting chip; The plurality of pins extending from the first pin surface include MPD pins, the MPD pins being used to communicate with the MPD; On the first pin surface, the distance between the signal pin and the MPD pin is d2, d2≥d1. The MPD pin is used to provide a signal loop and suppress electromagnetic resonance on the signal pin.

5. The BOSA according to claim 1 or 2, characterized in that, The pins extending from the first pin surface are used to communicate with the receiving optical path in the BOSA, and the pins extending from the second pin surface are used to communicate with the transmitting optical path in the BOSA. The BOSA also includes an optical port and a photoelectric conversion chip, and the optical port is used to connect to an optical fiber. The photoelectric conversion chip is used to convert the received optical signal from the optical port into the communication signal; The signal pin is used to transmit the communication signal from the photoelectric conversion chip to the PCB.

6. The BOSA according to claim 5, characterized in that, The photoelectric conversion chip includes a photodetector, which is used to convert the received optical signal into the communication signal. The signal pin and the ground pin are both connected to the photodetector. The signal pin is used to connect to the positive terminal of the photodetector, and the ground pin is used to connect to the negative terminal of the photodetector; or, The signal pin is used to connect to the negative terminal of the photodetector, and the ground pin is used to connect to the positive terminal of the photodetector.

7. The BOSA according to claim 5 or 6, characterized in that: The signal pin is VCC+, and the ground pin is PD+; or, The signal pin is labeled PD+, and the ground pin is labeled PD-.

8. The BOSA according to any one of claims 1 to 7, characterized in that, The communication signals include analog signals or digital signals.

9. A transceiver integrated on-board optical module (BOB), characterized in that, Includes printed circuit boards (PCBs) and BOSA as described in any one of claims 1 to 8; The signal pins and ground pins of the BOSA are used to connect to the PCB.

10. An optical communication device, characterized in that, The BOSA includes any one of claims 1 to 8.

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