Temperature calculation method of three-dimensional microsystem considering heat capacity change of transient thermal analysis model

Abstract

The present invention discloses a method for calculating the temperature of a three-dimensional microsystem taking into account the change in heat capacity of a transient thermal analysis model, comprising: extracting the anisotropic equivalent thermal conductivity of a substrate of a TCV array embedded in a three-dimensional microsystem; wherein a plurality of chips are arranged on the substrate; obtaining a first anisotropic transient thermal analysis model corresponding to a single chip in the three-dimensional microsystem according to the anisotropic equivalent thermal conductivity; superimposing the first anisotropic transient thermal analysis models of the plurality of chips to obtain a second anisotropic transient thermal analysis model; successively updating the heat capacity value of the second anisotropic transient thermal analysis model in a plurality of consecutive time periods to obtain a final anisotropic transient thermal analysis model corresponding to the last time period, and obtaining the final transient temperature of the three-dimensional microsystem according to the final anisotropic transient thermal analysis model. The present invention realizes the calculation of the temperature of a three-dimensional microsystem, taking into account the relationship between the heat capacity value and the temperature of the chip, and has high accuracy and short calculation time.

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