Temperature-controlled chip package thermal curing apparatus
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 容泰半导体(江苏)有限公司
- Filing Date
- 2024-12-03
- Publication Date
- 2026-06-12
Smart Images
Figure CN119542156B8_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip packaging thermal curing, and in particular to a temperature-controlled chip packaging thermal curing device. Background Art
[0002] Chip packaging thermal curing equipment is one of the key equipment in semiconductor manufacturing and packaging processes. It is used to cure chip packaging materials to protect the chip and achieve its electrical connection. There are various existing chip thermal curing methods, including a thermal curing box. The thermal curing box uses its internal heat source to thermally cure the chips placed in groups.
[0003] The heat source of the existing heat curing box is located on the inner wall of its shell, which causes the temperature of the inner wall of the heat curing box to be higher than the temperature of the center position inside it. The chips are evenly placed in groups in the heat curing box, which causes the chips at different positions to be heated unevenly, resulting in a long time for heat curing of the middle chip, and even causing the chip temperature at the inner wall of the shell to be too high and deformed, thereby affecting the overall heat curing efficiency of the chip. Summary of the invention
[0004] In order to overcome the shortcomings pointed out in the above background technology, the present invention provides a temperature-controlled chip packaging thermal curing device.
[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: a temperature-controlled chip packaging thermal curing device, comprising a shell, the shell is rotatably connected to a rotating door, a plurality of heating elements are installed in the shell, two groups of clamping supports distributed in a linear array are arranged in the shell, the shell is fixedly connected to a circulation shell, the circulation shell is used to separate the two groups of clamping supports, symmetrically distributed chambers are arranged in the circulation shell, the shell is installed with symmetrically distributed circulation fans, the air outlet of the circulation fan is connected to the interior of the circulation shell, and the circulation fan is The air inlet is connected to the interior of the shell through a duct, and a baffle with a central symmetrical distribution is fixed to the interior of the circulation shell. Two groups of first holes with a symmetrical distribution are arranged in the circulation shell, and all the first holes are located between the baffles with a central symmetrical distribution. The first holes are connected to the adjacent chambers. The circulation shell is provided with several groups of second holes distributed in a rectangular array, and the shell is connected to the chamber through several groups of second holes distributed in a rectangular array. A fixed shaft is fixed in the circulation shell, and a blade fan is rotatably connected to the fixed shaft, and the fixed shaft is fixed to the shell.
[0006] More preferably, the diameters of the plurality of groups of the second holes decrease sequentially from the middle to the upper and lower sides, respectively, so as to increase the temperature of the middle chip in the housing during thermal curing.
[0007] More preferably, the number of groups of the second holes is the same as the number of the clamping supports, and the clamping supports are located in the middle of an adjacent group of the second holes.
[0008] More preferably, it also includes a thermal collecting box, which is fixedly connected to the outer shell, and the fixed axis of the circulation shell penetrates into the thermal collecting box and is fixedly connected thereto, the part of the fixed axis on the circulation shell located in the thermal collecting box is rotatably connected to a rotating frame, the rotating frame is made of a heat-conducting material, the fixed axis of the circulation shell is made of a heat-insulating material, the rotating frame is provided with a circumferentially uniformly distributed fan blade portion, the fan blade portion of the rotating frame is fixedly connected with a thermal collecting plate distributed in a linear array, the fixed axis of the circulation shell is fixedly connected to a thermal collecting frame, the thermal collecting frame passes through the thermal collecting box, the circulation shell and the outer shell in sequence, a part of the thermal collecting frame is located in the thermal collecting box and in contact with the rotating frame, and the other part of the thermal collecting frame is located in the circulation shell.
[0009] More preferably, a torsion spring is fixedly connected between the fixed shaft of the circulation housing and the blade fan, and the baffle is limitedly matched with the blade fan to enable the blade fan to maintain the same placement state each time after stopping rotation.
[0010] More preferably, the heat collecting plates are arranged obliquely, and the heat collecting plates distributed in different linear arrays on adjacent blade parts are symmetrically distributed.
[0011] More preferably, a rotating plate is fixedly connected to the side of the blade away from the rotating door, the rotating plate is made of heat-insulating material, the rotating plate is in contact with the heat collecting frame, a first channel is provided in the circulation shell near the rotating plate, the outer shell is provided with a second channel connected to the first channel, the outer shell is fixed with connecting pipes that are symmetrically distributed and both connected to the heat collecting box, a third channel is provided in the outer shell, the second channel and the third channel are respectively connected to adjacent connecting pipes, a fourth channel connected to the third channel is provided in the outer shell, and fifth channels that are symmetrically distributed and both connected to the fourth channel are provided in the circulation shell, the fifth channel is connected to the adjacent chamber, and a one-way valve is provided in the fifth channel.
[0012] More preferably, one of the baffles is fixedly connected to a first telescopic rod, a thermal expansion gas is arranged in the fixed part of the first telescopic rod, a sealing plate is fixedly connected to the telescopic end of the first telescopic rod, the first hole is sealed and cooperated with the sealing plate, two groups of through holes symmetrically distributed are arranged on the sealing plate, the through holes are communicated and cooperated with adjacent first holes, the circulating shell is rotatably connected to a rotating disk near the first channel, the rotating disk is provided with a fan-shaped hole communicated and cooperated with the first channel, the sealing plate and the rotating disk are driven by a rack and pinion, and the rotating plate is sealed and cooperated with the fan-shaped holes of the rotating disk.
[0013] More preferably, a cooling fan is further included, the cooling fan being installed at a position of the shell away from the rotating door, the cooling fan being connected to the interior of the shell and being used for cooling the interior of the shell through an air cooling cycle, a heat conducting rod being fixedly connected to the shell near the rotating door and being connected to the interior of the shell, a second telescopic rod being fixedly connected to the shell near the rotating door, a part of the heat conducting rod being inserted into a fixed part of the second telescopic rod, a thermal expansion gas being arranged in the second telescopic rod, a symmetrically distributed sliding plate being slidably connected to the shell near the second telescopic rod, the telescopic ends of the second telescopic rod being fixedly connected to adjacent sliding plates, elastic members being fixedly connected between the symmetrically distributed sliding plates, a pressure sensor being installed on the shell near the symmetrically distributed sliding plates, the pressure sensor being extrusion-fitted with adjacent sliding plates, and the pressure sensor being electrically connected to the cooling fan.
[0014] More preferably, the shell is slidably connected with an extrusion rod, the extrusion rod and the rotating shaft of the rotating door are transmitted through a gear rack, and the extrusion rod is extrusion-fitted with the adjacent sliding plate.
[0015] The beneficial effects achieved by the present invention using the above structure are as follows: 1. The present invention drives the hot air in the housing to circulate through the circulating fan, and allows the hot air to flow preferentially through the chip in the middle of the housing, thereby controlling the temperature in the housing and preventing the heat source in the housing from being close to the inner wall thereof, causing the temperature in the middle to be lower than the surrounding temperature, thereby avoiding a long time required for thermal curing of the chip in the middle, thereby improving the effect and rate of thermal curing of the chip; 2. The heat is temporarily stored in the heat collecting box through the heat collecting plate. When the shell does not need to be heat cured, the heat transfer between the heat collecting box and the shell is isolated. When the temperature inside the shell is low and heat curing is required, the shell is connected with the heat collecting box to quickly introduce the heat in the heat collecting box into the shell, reducing the preheating time inside the shell, thereby improving the efficiency of chip heat curing; 3. The cooling force of the cooling fan is adjusted by the temperature inside the shell, so as to perform staged adaptive cooling inside the shell to prevent the temperature from dropping suddenly when cooling inside the shell, causing excessive deformation of the chip, thereby affecting the quality of the chip after thermal curing. When the revolving door is opened, the air cooling circulation speed between the cooling fan and the shell is automatically increased to prevent the air flow from overflowing from the front side of the shell when the operator opens the revolving door, thereby avoiding the local hot air flow in the shell from overflowing and burning the human body. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the circulation shell of the present invention; Figure 3 It is a three-dimensional structural cross-sectional view of the outer shell and the circulation shell of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the heat collecting box of the present invention; Figure 5 It is a three-dimensional structural cross-sectional view of the outer shell, circulation shell and heat collecting box of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the rotating frame and the heat collecting plate of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the first channel, the second channel and the third channel of the present invention; Figure 8 is a schematic diagram of the three-dimensional structure of the fourth channel and the fifth channel of the present invention; Fig. 9 It is a schematic diagram of the three-dimensional structure of the blocking plate of the present invention; Fig.10 It is a schematic diagram of the three-dimensional structure of the heat collecting frame of the present invention; Fig.11 It is a schematic diagram of the three-dimensional structure of the cooling fan of the present invention; Fig.12 It is a schematic diagram of the three-dimensional structure of the heat conducting rod of the present invention; Fig.13 It is a schematic diagram of the three-dimensional structure of the extrusion rod of the present invention; Fig.14 It is a schematic diagram of the hot air flow direction in the housing of the present invention.
[0017] The markings of the components in the accompanying drawings are as follows: 1. outer shell, 2. rotating door, 3. heating element, 4. clamping support, 5. circulation shell, 501, chamber, 6. circulation fan, 7. baffle, 8. first hole, 9. second hole, 10. blade fan, 11. heat collecting box, 12. rotating frame, 13. heat collecting plate, 14. heat collecting frame, 15. rotating plate, 16. first channel, 17. second channel, 18. connecting pipe, 19. third channel, 20. fourth channel, 21. fifth channel, 22. first telescopic rod, 23. sealing plate, 24. rotating disk, 25. cooling fan, 26. heat conducting rod, 27. second telescopic rod, 28. sliding plate, 29. pressure sensor, 30. extrusion rod. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0019] The heat source of the existing heat curing box is located on the inner wall of its shell, which causes the temperature of the inner wall of the heat curing box to be higher than the temperature of the center position inside it. The chips are evenly placed in groups in the heat curing box, which causes the chips at different positions to be heated unevenly, resulting in a long time for heat curing of the middle chip, and even causing the chip temperature at the inner wall of the shell to be too high and deformed, thereby affecting the overall heat curing efficiency of the chip.
[0020] Embodiment 1: A temperature-controlled chip packaging thermal curing device, such as Figure 1-Figure 4 and Fig.14 As shown, it includes a shell 1, a control panel is installed on the right side of the shell 1, a rotating door 2 is rotatably connected to the front side of the shell 1, a plurality of heating elements 3 electrically connected to the control panel are installed in the shell 1, and the heating elements 3 are four and are respectively distributed on the upper side, the lower side, the left side and the right side of the shell 1. The shell 1 is provided with two groups of clamping supports 4 distributed in a linear array on the left and right sides. The clamping supports 4 are of an existing structure. The clamping supports 4 are composed of a support plate and spring clamps symmetrically distributed on the left and right sides. The shell 1 is fixedly connected to a circulation shell 5, and the circulation shell 5 is used to clamp the two groups of clamps The outer shell 1 is separated from the outer shell 1 by a tight support 4, and a symmetrically distributed chamber 501 is arranged in the circulation shell 5. The outer shell 1 is equipped with a circulation fan 6 symmetrically distributed up and down. The circulation fan 6 is electrically connected to the control panel. The air outlet of the circulation fan 6 is connected to the inside of the circulation shell 5. The air inlet of the circulation fan 6 is connected to the inside of the outer shell 1 through a duct. The inside of the circulation shell 5 is fixedly connected with a baffle 7 symmetrically distributed in the center. A gap is arranged between the left part of the upper baffle 7 and the circulation shell 5, and a gap is arranged between the right part of the lower baffle 7 and the circulation shell 5, which is used to guide the upper hot air to the upper side. To the left of the blade fan 10, and guide the lower hot air to the right of the blade fan 10, two groups of first holes 8 are arranged in the circulation shell 5, each group of first holes 8 is two symmetrically distributed front and back, all the first holes 8 are located between the baffles 7 symmetrically distributed in the center, the first holes 8 are connected with the adjacent chamber 501, the circulation shell 5 is provided with a plurality of groups of second holes 9 distributed in a rectangular array, the shell 1 is connected with the chamber 501 through a plurality of groups of second holes 9 distributed in a rectangular array, and the apertures of the plurality of groups of second holes 9 are respectively It decreases successively toward the upper and lower sides, and is used to increase the temperature of the middle chip in the outer shell 1 during thermal curing, thereby balancing the temperature at different positions in the outer shell 1. The number of groups of second holes 9 is the same as the number of clamping supports 4. The clamping supports 4 are located in the middle of an adjacent group of second holes 9, and are used to allow hot air to flow through the upper and lower layers of the clamping supports 4 at the same time, and to synchronously heat the upper and lower sides of the chip on the clamping supports 4, so that the chip is heated evenly. A fixed shaft is fixedly connected in the circulation shell 5, and the fixed shaft is rotatably connected to a blade fan 10, and the fixed shaft is fixed to the outer shell 1.
[0021] When the operator needs to use the device to thermally cure the chip, the operator manually opens the rotating door 2, places several groups of chip trays into the shell 1, and uses the clamping support 4 to clamp and support adjacent chip trays, then closes the rotating door 2 and turns on all the heating elements 3 and two circulating fans 6 through the control panel, the heating elements 3 heat and thermally cure the chips placed on the chip trays, the two circulating fans 6 simultaneously extract the hot air in the shell 1 through the duct, and then the two circulating fans 6 inject the hot air into the circulating shell 5 from the upper and lower sides respectively, the upper hot air is blocked by the upper baffle 7, and the lower hot air is blocked by the lower baffle 7, the upper hot air is guided to the left part of the blade fan 10, and the lower hot air is guided to the right part of the blade fan 10, and the hot air on the upper and lower sides jointly drives the blade fan 10 to rotate counterclockwise (the rotation direction here is Figure 1 as a reference to the front view).
[0022] During the counterclockwise rotation of the blade 10, the hot air passes through the first holes 8 on the left and right sides and enters the adjacent chambers 501 respectively. Taking the chamber 501 on the right side as an example, the hot air in the chamber 501 on the right side is first discharged from the second holes 9 distributed in the adjacent rectangular array in the middle, and then the hot air is discharged from the second holes 9 distributed in the rectangular arrays on the upper and lower sides of the right side. The hot air is discharged from the second holes 9 and flows to the adjacent clamping support 4 to perform thermal curing on the chip on the chip tray. The hot air flow direction is as follows: Fig.14 As shown in , the hot air in the housing 1 is continuously circulated, thereby ensuring the uniformity of the temperature distribution in the housing 1. At the same time, the hot air preferentially flows through the chip in the middle of the housing 1 to prevent the heat source in the housing 1 from approaching its inner wall, which would cause the middle temperature to be lower than the surrounding temperature, thereby avoiding the long time required for thermal curing of the middle chip, thereby improving the effect and rate of thermal curing treatment of the chip.
[0023] When the chip is thermally cured, the operator turns off all the heating elements 3 and the two circulating fans 6 through the control panel, and cools down the inside of the housing 1 through the external cooling device. After the temperature inside the housing 1 drops to a temperature close to the safe temperature (where the safe temperature is generally around 40°), the operator opens the rotating door 2, then takes out the chip tray clamped on the clamping support 4, collects the chip trays, and finally cleans the inside of the housing 1 for the next use.
[0024] Embodiment 2: Based on embodiment 1, Figure 3-Figure 6As shown, it also includes a heat collecting box 11, which is fixed to the rear side of the outer shell 1, and the rear part of the fixed axis on the circulation shell 5 penetrates into the heat collecting box 11 and is fixed thereto, and the rear part of the fixed axis on the circulation shell 5 is rotatably connected to a rotating frame 12, and the rotating frame 12 is made of heat-conducting material and is used to transfer the heat of the heat collecting frame 14 to all the heat collecting plates 13. The fixed axis of the circulation shell 5 is made of heat-insulating material and is used to prevent heat from being transferred through the fixed axis of the circulation shell 5. The rotating frame 12 is provided with a circumferentially uniformly distributed fan blade portion, and the fan blade portion of the rotating frame 12 is fixedly connected to the heat collecting plates 13 distributed in a linear array. The heat collecting plates 13 are arranged obliquely, and the heat collecting plates 13 distributed in different linear arrays on adjacent fan blade portions are symmetrically distributed. For example, a fan blade portion vertically on the upper side is taken as an example, and the following is Figure 6 From the front view, the heat collecting plate 13 gradually tilts downward from left to right, while the heat collecting plate 13 on the fan blade portion adjacent to the upper vertical fan blade portion is tilted in the opposite direction, which is used to increase the contact area between the airflow and the surface of the heat collecting plate 13 when the airflow passes from left to right. The fixed axis of the circulation shell 5 is fixedly connected with a heat collecting frame 14, which passes through the heat collecting box 11, the circulation shell 5 and the outer shell 1 in sequence. The rear part of the heat collecting frame 14 is located in the heat collecting box 11 and contacts with the rotating frame 12, and the front end of the heat collecting frame 14 is located in the circulation shell 5.
[0025] like Figure 4-Figure 8 As shown, a rotating plate 15 is fixedly connected to the rear side of the blade fan 10, and the rotating plate 15 is made of heat-insulating material. A torsion spring is fixedly connected between the fixed axis of the circulation shell 5 and the blade fan 10, and the baffle 7 is limited in cooperation with the blade fan 10, so that the blade fan 10 can maintain the same placement state each time it stops rotating. The rotating plate 15 is in contact with the heat collecting frame 14. When the rotating plate 15 stops rotating, the torsion spring of the blade fan 10 is reset and drives it to rotate and reset. The blade fan 10 drives the rotating plate 15 to rotate and reset, so that the blades on the left and right sides of the blade fan 10 always maintain the same horizontal height, thereby blocking the heat collecting frame 14. When the rotating plate 15 rotates and loses the blocking of the heat collecting frame 14, the heat in the circulation shell 5 is conducted to the rotating frame 12 through the heat collecting frame 14. A first A channel 16 is provided in the inner wall of the rear side of the shell 1. The second channel 17 connected to the first channel 16 is provided. The rear side of the shell 1 is fixed with connecting pipes 18 which are symmetrically distributed on the left and right and are both connected to the heat collecting box 11. A third channel 19 is provided in the inner wall of the rear side of the shell 1. The second channel 17 and the third channel 19 are respectively connected to the adjacent connecting pipes 18. A fourth channel 20 connected to the third channel 19 is provided in the shell 1. A fifth channel 21 which is symmetrically distributed on the left and right and is both connected to the fourth channel 20 is provided in the circulation shell 5. The fifth channel 21 is connected to the adjacent chamber 501. A one-way valve is provided in the fifth channel 21. When the airflow flows from the fifth channel 21 to the adjacent chamber 501, the one-way valve is opened. When the airflow flows from the chamber 501 to the adjacent fifth channel 21, the one-way valve is closed.
[0026] like Figure 5 , Fig. 9 and Fig.10 As shown, one of the baffles 7 is fixedly connected to the first telescopic rod 22, and a thermal expansion gas is arranged in the fixed part of the first telescopic rod 22. When the temperature in the shell 1 is the optimal temperature for thermal curing of the chip, the thermal expansion gas expands to the limit, so that the telescopic end of the first telescopic rod 22 extends to the limit state. When the temperature in the shell 1 is about 40°, the thermal expansion gas shrinks to the limit, so that the telescopic end of the first telescopic rod 22 shrinks to the limit state. The telescopic end of the first telescopic rod 22 is fixedly connected to a blocking plate 23, and the first hole 8 is blocked and matched with the blocking plate 23. The blocking plate 23 is provided with two groups of through holes symmetrically distributed on the left and right, and each group of through holes is Two, the through hole is connected and cooperated with the adjacent first hole 8. After the telescopic end of the first telescopic rod 22 is extended to the limit state and drives the blocking plate 23 to move, the first hole 8 is connected with the adjacent through hole. After the telescopic end of the first telescopic rod 22 is contracted to the limit state and drives the blocking plate 23 to move, the blocking plate 23 blocks the first hole 8. The rear side of the circulation shell 5 is rotatably connected with a rotating disk 24. The rotating disk 24 is provided with a fan-shaped hole connected and cooperated with the first channel 16. The blocking plate 23 and the rotating disk 24 are driven by a gear rack, and the rotating plate 15 and the fan-shaped hole of the rotating disk 24 are blocked and cooperated.
[0027] The blade fan 10 rotates and the torsion spring of the blade fan 10 twists and stores force. After the blade fan 10 rotates to contact the two baffles 7, the baffle 7 limits the blade fan 10, so that the blade fan 10 cannot continue to rotate at a larger angle, and the blade fan 10 drives the rotating plate 15 to rotate during the rotation process. The rotating plate 15 rotates until it loses contact with the heat collecting frame 14, and the heat collecting frame 14 contacts the hot air in the circulation shell 5. The heat collecting frame 14 conducts the heat in the circulation shell 5 to the rotating frame 12, and the rotating frame 12 conducts the heat to all the heat collecting plates 13, so that part of the heat is temporarily stored in the heat collecting box 11. When the heat curing of the chip is completed, the torsion spring of the blade fan 10 drives it to rotate and reset, and the blade fan 10 drives the rotating plate 15 to rotate and reset, so that the rotating plate 15 contacts and blocks the heat collecting frame 14 to prevent the heat collecting box 11 from exchanging heat with the outer shell 1, and then repeats the steps in the above embodiment to cool down the temperature in the outer shell 1.
[0028] After the temperature inside the housing 1 is lowered, the hot expanding gas in the first telescopic rod 22 cools and contracts (during the thermal curing process of the chip, the hot expanding gas in the first telescopic rod 22 expands due to the high temperature in the first telescopic rod 22), causing the telescopic end of the first telescopic rod 22 to contract, and the telescopic end of the first telescopic rod 22 drives the blocking plate 23 to move downward, and the blocking plate 23 drives all the through holes thereon to move downward, so that the through hole of the blocking plate 23 loses communication with the adjacent first hole 8, and the first hole 8 is blocked by the blocking plate 23, and the blocking plate 23 moves downward. During the movement, the sealing plate 23 drives the rotating disk 24 through the gear rack, and the rotating disk 24 drives the fan-shaped holes thereon to rotate 180°, so that the fan-shaped holes of the rotating disk 24 are aligned with the first channel 16. At this time, since the chip has been thermally cured, the torsion spring of the blade 10 has been reset and drives it to rotate and reset. The rotating plate 15 is reset and blocks the fan-shaped holes of the rotating disk 24, thereby preventing heat loss in the collector box 11. The operator takes out the thermally cured chips and places the next set of chip trays into the outer casing 1.
[0029] When the fan-shaped hole of the rotating disk 24 is aligned with the first channel 16, the operator turns on all the heating elements 3 and the two circulation fans 6 through the control panel. Since the first hole 8 is blocked by the blocking plate 23, the hot air blown out by the circulation fan 6 can only enter the first channel 16. At this time, the two circulation fans 6 are turned on to make the blade fan 10 rotate according to the above steps. The torsion spring of the blade fan 10 accumulates force, and the blade fan 10 drives the rotating plate 15 to rotate and loses the shielding of the fan-shaped hole of the rotating disk 24. The hot air enters the heat collecting box 11 through the first channel 16, the second channel 17 and the connecting pipe 18 on the left in turn. The hot air flows through the heat collecting plate 13 and enters the right side with the heat carried thereon. The hot air then passes through the right connecting pipe 18, the third channel 19 and the fourth channel 20 into the two fifth channels 21 in turn. At this time, the one-way valve of the fifth channel 21 is opened and circulated, so that the hot air passes through the fifth channel 21 and enters the adjacent chamber 501. The hot air carries the heat in the heat collecting box 11 into the chamber 501. Then, the hot air passes through the above steps and is discharged along all the second holes 9 to the vicinity of the chip support tray, quickly conducting the temporarily stored heat back to the outer shell 1, so that the heat in the heat collecting box 11 is quickly exchanged with the temperature in the outer shell 1, thereby reducing the preheating time inside the outer shell 1, thereby improving the efficiency of chip thermal curing.
[0030] When the temperature inside the housing 1 begins to rise, the hot expanding gas in the first telescopic rod 22 gradually expands and drives its telescopic end to extend, and the telescopic end of the first telescopic rod 22 drives the sealing plate 23 to rise, so that the through hole of the sealing plate 23 is aligned with the adjacent first hole 8, and the sealing plate 23 drives the rotating disk 24 through the gear rack, so that the fan-shaped holes of the rotating disk 24 are offset and blocked with the first channel 16, and the hot air of the circulating fan 6 repeats the above circulation steps again, and the hot air is discharged through all the first holes 8, the two chambers 501 and all the second holes 9 in turn and flows to the adjacent clamping support 4 to perform thermal curing treatment on the chip.
[0031] When the chip is thermally cured, the operator turns off all the heating elements 3 and the two circulating fans 6 through the control panel. The circulating fans 6 stop running so that the blade fan 10 is no longer affected by the hot air. The torsion spring of the blade fan 10 drives it to rotate and reset.
[0032] Embodiment 3: Based on embodiment 2, Figure 11-13 As shown, a cooling fan 25 electrically connected to the control panel is also included. The cooling fan 25 is installed at the lower part of the rear side of the housing 1. The cooling fan 25 is connected to the interior of the housing 1 and is used to cool the interior of the housing 1 through an air cooling cycle. A heat-conducting rod 26 connected to the interior of the housing 1 is fixedly connected to the upper side of the housing 1. A second telescopic rod 27 is fixedly connected to the upper side of the housing 1. The front part of the heat-conducting rod 26 penetrates into the fixed part of the second telescopic rod 27. Thermal expansion gas is arranged in the second telescopic rod 27. When the temperature of the heat-conducting rod 26 is consistent with the optimal temperature of the chip during thermal curing, the thermal expansion gas in the second telescopic rod 27 expands so that its telescopic end extends to the limit state. When the temperature of the heat-conducting rod 26 drops to 4 When the angle of the second telescopic rod 27 is about 0°, the thermally expanding gas in the second telescopic rod 27 contracts, and the rear sliding plate 28 squeezes the telescopic end of the second telescopic rod 27 to shrink to the limit state. The upper side of the shell 1 near the second telescopic rod 27 is slidably connected with the front and rear symmetrically distributed sliding plates 28, the telescopic end of the second telescopic rod 27 is fixedly connected to the adjacent sliding plates 28, and elastic members are fixedly connected between the symmetrically distributed sliding plates 28, wherein the elastic members are compression springs, and a pressure sensor 29 is installed on the upper side of the shell 1 near the symmetrically distributed sliding plates 28, the pressure sensor 29 is electrically connected to the control panel, the pressure sensor 29 is squeezed and matched with the adjacent sliding plates 28, and the pressure sensor 29 is electrically connected to the cooling fan 25.
[0033] like Fig.12 and Fig.13 As shown, the shell 1 is slidably connected with an extrusion rod 30, and the extrusion rod 30 and the rotating shaft of the rotating door 2 are transmitted through a gear rack. The extrusion rod 30 is extruded and matched with the adjacent sliding plate 28. During the rotation of the rotating door 2, the rotating door 2 drives the extrusion rod 30 to move forward through the gear rack and squeezes the sliding plate 28 on the rear side.
[0034] During the thermal curing of the chip, the heat-conducting rod 26 conducts the temperature in the shell 1 to the fixed part of the second telescopic rod 27. At this time, the temperature in the shell 1 is at the optimal temperature for thermal curing of the chip. The hot expanding gas in the fixed part of the second telescopic rod 27 expands due to the heat, causing the telescopic end of the second telescopic rod 27 to gradually extend and squeeze the adjacent rear sliding plate 28. The rear sliding plate 28 squeezes its elastic member, causing the front sliding plate 28 to increase the squeezing force of the pressure sensor 29. However, the cooling fan 25 is not turned on at this time. After the thermal curing of the chip is completed, the operator turns on the cooling fan 25 through the control panel. The cooling fan 25 extracts the hot air in the shell 1. The cooling fan 25 cools the extracted hot air and then transports it back to the shell 1. After the chip is thermally cured and the temperature inside the shell 1 begins to gradually decrease, the temperature conducted by the heat conducting rod 26 to the second telescopic rod 27 decreases, the thermally expanding gas cools and contracts, and the elastic member of the rear sliding plate 28 gradually resets and drives it to move and reset, so that the pressure of the front sliding plate 28 on the pressure sensor 29 gradually decreases. The pressure sensor 29 feeds back the command to the control panel, and the control panel controls the power of the cooling fan 25 to gradually increase, thereby enhancing the cooling force of the cooling fan 25 on the shell 1, thereby performing staged adaptive cooling in the shell 1 to adapt to the cooling force that the temperature chip at different stages can withstand, and preventing the temperature from dropping suddenly when cooling the shell 1, resulting in excessive deformation of the chip, thereby affecting the quality of the chip after thermal curing.
[0035] When the temperature inside the shell 1 drops to a safe temperature, the operator opens the revolving door 2, the revolving door 2 rotates and drives the extrusion rod 30 through the gear rack, the extrusion rod 30 moves backward and squeezes the front sliding plate 28, the front sliding plate 28 moves backward and squeezes the elastic member, so that the extrusion force of the front sliding plate 28 on the pressure sensor 29 is suddenly reduced, thereby increasing the power of the cooling fan 25 and enhancing the air cooling circulation speed between the cooling fan 25 and the shell 1, preventing the air flow from overflowing from the front side of the shell 1 when the operator opens the revolving door 2, thereby avoiding the local hot air flow in the shell 1 from overflowing and burning the human body.
[0036] When the thermal curing of the chip is completed, the operator turns off all the heating elements 3, the two circulation fans 6 and the cooling fan 25 through the control panel. After the operator opens the rotating door 2, the chip tray clamped on the clamping support 4 is taken out, and the chip tray is collected. Finally, the inside of the housing 1 is cleaned for the next use.
[0037] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A temperature-controlled chip packaging thermal curing device, comprising a housing (1), the housing (1) being rotatably connected to a rotating door (2), a plurality of heating elements (3) being installed in the housing (1), two groups of clamping support members (4) distributed in a linear array being arranged in the housing (1), the housing (1) being fixedly connected to a circulation housing (5), the circulation housing (5) being used to separate the two groups of the clamping support members (4), the circulation housing (5) being arranged with symmetrically distributed chambers (501), characterized in that: The invention also comprises symmetrically distributed circulation fans (6), wherein the symmetrically distributed circulation fans (6) are all mounted on the housing (1), wherein the air outlets of the circulation fans (6) are in communication with the interior of the circulation shell (5), and the air inlets of the circulation fans (6) are in communication with the interior of the housing (1) through a duct, wherein a baffle plate (7) distributed centrally and symmetrically is fixedly connected to the interior of the circulation shell (5), wherein two groups of first holes (8) distributed centrally and symmetrically are arranged in the circulation shell (5), wherein all the first holes (8) are located between the baffle plates (7) distributed centrally and symmetrically, wherein the first holes (8) are in communication with adjacent chambers (501), wherein the circulation shell (5) is provided with a plurality of groups of second holes (9) distributed in a rectangular array, wherein the housing (1) is in communication with the chambers (501) through the plurality of groups of second holes (9) distributed in a rectangular array, wherein a fixed shaft is fixedly connected in the circulation shell (5), wherein a blade fan (10) is rotatably connected to the fixed shaft, and wherein the fixed shaft is fixedly connected to the housing (1).
2. The temperature-controlled chip packaging thermal curing equipment according to claim 1, characterized in that: The diameters of the plurality of groups of the second holes (9) decrease sequentially from the middle to the upper and lower sides, respectively, and are used to increase the temperature of the middle chip in the housing (1) during thermal curing.
3. The temperature-controlled chip packaging thermal curing equipment according to claim 2, characterized in that: The number of groups of the second holes (9) is the same as the number of the clamping support members (4), and the clamping support members (4) are located in the middle of an adjacent group of the second holes (9).
4. The temperature-controlled chip packaging thermal curing equipment according to claim 1, characterized in that: It also includes a heat collecting box (11), the heat collecting box (11) is fixedly connected to the outer shell (1), the fixed shaft of the circulation shell (5) penetrates into the heat collecting box (11) and is fixedly connected thereto, the part of the fixed shaft on the circulation shell (5) located in the heat collecting box (11) is rotatably connected to a rotating frame (12), the rotating frame (12) is made of a heat-conducting material, the fixed shaft of the circulation shell (5) is made of a heat-insulating material, the rotating frame (12) is provided with a fan blade portion evenly distributed in the circumferential direction, the fan blade portion of the rotating frame (12) is fixedly connected to a heat collecting plate (13) distributed in a linear array, the fixed shaft of the circulation shell (5) is fixedly connected to a heat collecting frame (14), the heat collecting frame (14) passes through the heat collecting box (11), the circulation shell (5) and the outer shell (1) in sequence, a part of the heat collecting frame (14) is located in the heat collecting box (11) and contacts the rotating frame (12), and another part of the heat collecting frame (14) is located in the circulation shell (5).
5. The temperature-controlled chip packaging thermal curing equipment according to claim 1, characterized in that: A torsion spring is fixedly connected between the fixed shaft of the circulation housing (5) and the blade fan (10), and the baffle (7) is limitedly matched with the blade fan (10) so as to enable the blade fan (10) to maintain the same placement state each time after stopping rotation.
6. The temperature-controlled chip packaging thermal curing equipment according to claim 4, characterized in that: The heat collecting plates (13) are arranged obliquely, and the heat collecting plates (13) distributed in different linear arrays on adjacent blade portions are all distributed symmetrically.
7. The temperature-controlled chip packaging thermal curing equipment according to claim 4, characterized in that: A rotating plate (15) is fixedly connected to a side of the blade (10) away from the rotating door (2); the rotating plate (15) is made of a heat-insulating material; the rotating plate (15) is in contact with the heat collecting frame (14); a first channel (16) is provided at a position of the circulation shell (5) close to the rotating plate (15); the outer shell (1) is provided with a second channel (17) in communication with the first channel (16); the outer shell (1) is fixedly connected with symmetrically distributed connecting pipes (18) which are all in communication with the heat collecting box (11); A third channel (19) is provided in the housing (1); the second channel (17) and the third channel (19) are respectively connected to the adjacent connecting pipe (18); a fourth channel (20) connected to the third channel (19) is provided in the housing (1); fifth channels (21) symmetrically distributed and connected to the fourth channel (20) are provided in the circulation housing (5); the fifth channels (21) are connected to the adjacent chamber (501); and a one-way valve is provided in the fifth channel (21).
8. The temperature-controlled chip packaging thermal curing equipment according to claim 7, characterized in that: One of the baffles (7) is fixedly connected to a first telescopic rod (22), a thermal expansion gas is arranged in a fixed portion of the first telescopic rod (22), a sealing plate (23) is fixedly connected to the telescopic end of the first telescopic rod (22), the first hole (8) is sealed and matched with the sealing plate (23), the sealing plate (23) is provided with two groups of through holes distributed symmetrically, the through holes are communicated and matched with adjacent first holes (8), the circulation housing (5) is rotatably connected to a rotating disk (24) at a position close to the first channel (16), the rotating disk (24) is provided with a fan-shaped hole communicated and matched with the first channel (16), the sealing plate (23) and the rotating disk (24) are driven by a gear rack, and the rotating plate (15) is sealed and matched with the fan-shaped hole of the rotating disk (24).
9. The temperature-controlled chip packaging thermal curing equipment according to claim 7, characterized in that: The housing (1) further comprises a cooling fan (25), the cooling fan (25) being installed at a position of the housing (1) away from the rotating door (2), the cooling fan (25) being in communication with the interior of the housing (1) and being used to cool the interior of the housing (1) through an air cooling cycle, a heat conducting rod (26) being fixedly connected to the housing (1) at a position close to the rotating door (2) and being in communication with the interior of the housing (1), a second telescopic rod (27) being fixedly connected to the housing (1) at a position close to the rotating door (2), a portion of the heat conducting rod (26) being inserted into a fixed portion of the second telescopic rod (27), and the second telescopic rod (27) being fixedly connected to the housing (1) at a position close to the rotating door (2). Thermal expansion gas is arranged in the retractable rod (27); the housing (1) is slidably connected to a symmetrically distributed sliding plate (28) at a position close to the second telescopic rod (27); the telescopic end of the second telescopic rod (27) is fixedly connected to the adjacent sliding plate (28); elastic members are fixedly connected between the symmetrically distributed sliding plates (28); a pressure sensor (29) is installed at a position close to the symmetrically distributed sliding plates (28) of the housing (1); the pressure sensor (29) is pressed and matched with the adjacent sliding plates (28); and the pressure sensor (29) is electrically connected to the cooling fan (25).
10. The temperature-controlled chip packaging thermal curing equipment according to claim 9, characterized in that: The housing (1) is slidably connected to an extrusion rod (30), the extrusion rod (30) and the rotating shaft of the rotating door (2) are driven by a gear rack, and the extrusion rod (30) is extrusion-matched with the adjacent sliding plate (28).