Non-contact cooling assembly for cooling substrate
CN119542183APending Publication Date: 2025-02-28ASM IP HLDG BV
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Patent Information
- Application Number
- CN202411187775.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-31
- Filing Date
- 2024-08-28
- Publication Date
- 2025-02-28
AI Technical Summary
Technical Problem
During substrate processing, existing cooling equipment is difficult to effectively cool multiple substrates due to limitations in inlet and gaps, and the traditional forced air convection cooling efficiency is low.
Method used
A non-contact cooling assembly is designed, including a support beam and a plurality of cooling plates, which are attached to the support beam by horizontal stacking and achieve efficient cooling of the substrate through thermoelectric cooling effects or microchannel fluid cooling.
Benefits of technology
The cooling assembly can effectively cool multiple substrates, improves cooling efficiency, meets the needs of the back inlet and top side gap of the substrate, and is suitable for cooling of batch substrates.
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Smart Images
Figure CN119542183A_ABST
Abstract
A non-contact cooling assembly for batch cooling of substrates in an equipment front-end module is presented. The cooling assembly may include a support beam and a plurality of cooling plates, where the cooling plates are horizontally stacked and attached to the support beam, and where the support beam is configured to move horizontally to cool the substrate. Each cooling plate may be cooled using a thermoelectric cooling effect or a cooling fluid, and the cooling plates are first placed in a first position (distal position) and moved to a second position (proximal position) for more efficient substrate cooling.
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