Wafer turnover device

CN119542242AActive Publication Date: 2025-02-28SHENGJISHENG PRECISION EQUIP (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202411530919.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-30
Publication Date
2025-02-28
Estimated Expiration
2044-10-30

AI Technical Summary

Technical Problem

The existing wafer flip devices have a height gap during the flip process, which is difficult to meet high-precision requirements, lack of flexibility, complex structure and high maintenance costs, which affects production efficiency and product quality.

Method used

The electromagnetic locking device is used in combination with a magnetic spring. The electromagnetic locking device keeps the discharge suction cup and the discharge level fixture relatively fixed before and during the flip. After the flip is completed, the magnetic spring cancels gravity to make it suspended, and stable and accurate bearing is achieved through the wafer bearing column.

Benefits of technology

It solves the problem of height difference when connecting the next process after wafer flip, improves the accuracy and fault tolerance of the connection process, reduces the risk of wafer damage, simplifies operations, reduces maintenance costs, and adapts to wafers of different sizes and types.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a wafer turnover device. The wafer turnover device comprises a wafer fixing assembly. The wafer fixing assembly comprises a material placing assembly, a material taking assembly and a connecting frame, the material placing assembly comprises a material placing position fixing frame, a material placing suction cup, an electromagnetic locking device and a magnetic spring, and the material taking assembly comprises a material taking position fixing frame, a voice coil motor, a wafer bearing column support and a wafer bearing column. The electromagnetic locking device is used for enabling the discharging position fixing frame and the discharging suction cup to be relatively fixed before overturning and in the overturning process, and the magnetic spring is used for offsetting the sum of the gravity of the moving end of the magnetic spring, the gravity of the discharging suction cup and the gravity of the wafer adsorbed to the discharging suction cup after the wafer overturning action is completed so that the wafer can be in a suspended state. According to the invention, the electromagnetic locking device is matched with the magnetic spring to deal with the height difference occurring when the wafer is connected with the next process after being overturned, and stable and accurate bearing after the wafer overturning action is completed is realized through the up-and-down lifting of the wafer bearing column.
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Citation Information

Patent Citations

  • Wafer turnover mechanism

    CN117316861A

  • Turnover device for thin-film solar cell production

    CN213459771U

  • Wafer carrying and overturning device

    CN213905337U

  • Substrate treating apparatus

    JP2001060616A