Package laminated chip structure and radio frequency module chip structure
CN119542285APending Publication Date: 2025-02-28HENAN KEZHICHENG THIRD GENERATION SEMICON CARBON BASED CHIP CO LTD
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Patent Information
- Application Number
- CN202411620492.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-02-28
AI Technical Summary
Technical Problem
In the prior art, when the silicon substrate is packaged in the intermediate portion of the chip as an intermediate layer, the thermal conductivity is low, resulting in poor heat dissipation of the chip and poor thermal stability.
Method used
A layered substrate, diamond layer and copper layer are used as substrates, and the copper layer comes into contact with the chip to improve the heat dissipation efficiency of the chip.
Benefits of technology
The high thermal conductivity of diamond and the similar thermal expansion coefficient of silicon improve the reliability and heat dissipation performance of the package, ensuring that the chip has excellent thermal stability in high-performance computing and high-power devices.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN119542285A_ABST
Abstract
The invention belongs to the technical field of chip packaging, and provides a packaging laminated chip structure and a radio frequency module chip structure. The substrate, far away from the shell, in the second pre-packaging structure is arranged to be the substrate, the diamond layer and the copper layer which are arranged in a stacked mode, and the chip has the following advantages that 1, the heat conductivity of diamond is far higher than that of silicon, the heat dissipation efficiency of the chip can be improved, and the chip can be applied to high-performance computing and high-power devices; 2, the thermal expansion coefficients of silicon and diamond are similar, so that the thermal stress can be reduced to improve the reliability of packaging; and 3, the substrate with high resistivity is beneficial to keeping the stability of the device, and is not easy to break down in high-frequency and high-power devices. And 4, the density of the diamond is small, so that miniaturization and light weight are facilitated on the basis of realizing the same function. And 5, the substrate, the diamond layer and the copper layer which are stacked are used as the base plate, so that the base plate has extremely high mechanical strength, and the durability of the base plate is improved.
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