Heat conduction structure, electronic equipment and terminal

Abstract

The invention provides a heat conduction structure, electronic equipment and a terminal. The heat conduction structure comprises a heat conduction part and an insulating ring. The upper side and the lower side of the heat conduction part are at least partially exposed, and the heat conduction part can be in contact with the heating devices and the radiator on the two sides to conduct heat. The insulating ring can protect the heat conduction part on the periphery of the heat conduction part, and when the heat conduction structure is aged or damaged, the internal heat conduction part is not easy to scatter. Therefore, the heat conduction part can be made of a high-heat-conduction material, and particularly can be made of a conductive material, so that the heat conduction capability of the heat conduction structure is improved, and the risk of short circuit is not easy to cause. Specifically, when the heat conduction structure is arranged, the insulating ring is a closed ring, or the insulating ring is provided with an opening.

Description

Heat conducting structure, electronic equipment and terminal Technical Field

[0001] The present application relates to the technical field of heat dissipation structures, and in particular to a heat-conducting structure, an electronic device, and a terminal. Background Art

[0002] With the development of electronic technology, the computing power of chips has continued to increase, power consumption has also increased significantly, and chip size has also been miniaturized. As a result, the heat generated by chips has also increased, and the heat density has also increased, posing a greater challenge to the chip's heat dissipation capabilities.

[0003] In the prior art, heat sinks are typically used to dissipate heat from chips. To ensure efficient transfer of heat from the chip to the heat sink, a thermally conductive layer is required between the heat sink and the chip. The thermal conductivity of the thermally conductive layer significantly impacts the chip's heat dissipation capabilities. Furthermore, the structural reliability of the thermally conductive layer is also crucial. Therefore, it is crucial to ensure that the thermally conductive layer remains reliable and less susceptible to damage in situations such as vibrations in the electronic device.

[0004] Summary of the Invention

[0005] The present application provides a heat-conducting structure, an electronic device, and a terminal, so that an insulating ring protects a heat-conducting portion, and the heat-conducting portion can be prepared with a heat-conducting material to improve the heat-conducting efficiency of the heat-conducting structure.

[0006] In the first aspect, the present application provides a heat-conducting structure, which includes a heat-conducting part and an insulating ring. The above-mentioned heat-conducting part is located inside the insulating ring, and the upper and lower sides of the above-mentioned heat-conducting part are at least partially exposed. The heat-conducting part can contact the heating devices and radiators on both sides to conduct heat. The insulating ring can protect the heat-conducting part on the surrounding side of the heat-conducting part. If the heat-conducting structure is aged or damaged, it will mainly be concentrated on the insulating ring, and the internal heat-conducting part is not easy to scatter. Therefore, the heat-conducting part can be set as a heat-conducting part of a high thermal conductivity material, that is, a heat-conducting part that can be prepared from a conductive material, so that the thermal conductivity of the heat-conducting structure is improved and it is not easy to cause a short circuit risk. In a specific technical solution, the above-mentioned insulating ring is a closed ring, or the insulating ring has an opening. The above-mentioned insulating ring can be a closed ring, which is completely arranged around the heat-conducting part. The heat-conducting part in this solution is completely surrounded by the insulating ring, so that the heat-conducting part is not easy to leak out from the insulating ring, which is beneficial to improving the reliability of the heat-conducting structure. The insulating ring may also have an opening. When the heat-conducting structure is mounted on an electronic device, the opening of the insulating ring can absorb deformation, thereby preventing the insulating ring from wrinkling or pulling. Specifically, the number of the openings may be one or more.

[0007] When specifically configuring the thermally conductive structure, the thermally conductive structure includes a first side and a second side that are opposite to each other. On the first side of the thermally conductive structure, the surface of the thermally conductive portion and the surface of the insulating ring are coplanar. On the second side of the thermally conductive structure, the surface of the thermally conductive portion and the surface of the insulating ring are coplanar. In other words, the thickness of the thermally conductive portion is the same as that of the insulating ring, and both sides of the thermally conductive structure are planar. This solution is suitable for scenarios where one side of the radiator is planar and the side of the heating element is also planar.

[0008] In another technical solution, on the first side of the thermally conductive structure, the heat conducting portion and the surface of the insulating ring are coplanar. On the second side of the thermally conductive layer, the insulating ring protrudes from the surface of the heat conducting portion. This embodiment allows the thermally conductive structure to be adapted for use in situations where one side of the heating device is non-planar, or where one side of the heat sink is non-planar. Even if the structure on one side is non-planar, the insulating ring can still seal the heat conducting portion, protecting it and reducing the risk of short circuits.

[0009] In another technical solution, the insulating ring protrudes from the surface of the heat-conducting portion on the first side of the heat-conducting structure, and the insulating ring protrudes from the surface of the heat-conducting portion on the second side of the heat-conducting layer. This solution is primarily suitable for situations where one side of the heating device is non-planar and one side of the heat sink is also non-planar. This solution also ensures that the insulating ring seals the heat-conducting portion, protecting it and reducing the risk of short circuits.

[0010] When the insulating ring and the heat conducting portion are specifically arranged, the insulating ring and the heat conducting portion can be fixedly connected. In other words, the heat conducting portion and the insulating ring are manufactured separately and then fixed. In a specific technical solution, the insulating ring and the heat conducting portion can be fixedly bonded by bonding.

[0011] In another technical solution, the insulating ring and the heat conducting part are integrally formed. This solution can improve the connection reliability between the insulating ring and the heat conducting part, making the heat conducting part less susceptible to damage.

[0012] In another technical solution, a gap is provided between the insulating ring and the heat conducting portion. This solution can absorb deformation of the heat conducting portion and the insulating ring, or be adapted to the specific structure of the electronic device. Furthermore, the heat conducting portion and the insulating ring can be two separate components, manufactured, transported, and installed separately.

[0013] When preparing the insulating ring, the insulating ring can be made of at least one of foam, rubber or sealant, which is low in cost and easy to prepare.

[0014] Alternatively, the insulating ring may be made of a heat-conducting material, which is also an insulating material. This solution can increase the heat-conducting area of ​​the heat-conducting structure, which is beneficial to improving the heat-conducting efficiency and heat-conducting capacity of the heat-conducting structure.

[0015] When the insulating ring is made of a thermally conductive material, the material of the insulating ring may specifically include thermally conductive gel, thermally conductive insulating tape, thermally conductive adhesive, or thermally conductive insulating film. The thermal conductivity of the thermally conductive material may be lower than that of the heat conducting part, but still has a certain thermal conductivity.

[0016] Specifically, the thermal conductivity of the heat conducting portion is greater than or equal to 10 W / (m·K). Specifically, the thermal conductivity of the heat conducting portion can also be greater than or equal to 30 W / (m·K), thereby improving the thermal conductivity efficiency of the heat conducting structure.

[0017] Specific materials of the heat conducting part include carbon fiber or graphene.

[0018] Furthermore, the shapes of the heat conducting portion and the insulating ring are not limited. In a specific technical solution, the shape of the edge of the heat conducting portion can be the same as the shape of the inner edge of the insulating ring. This solution can improve the fit between the heat conducting portion and the insulating ring. Optionally, the above-mentioned shapes can be various possible shapes, such as triangle, square, polygon, circle, ellipse, and special shape.

[0019] In a second aspect, the present application further provides an electronic device comprising a heating device, a heat sink, and the heat-conducting structure of the first aspect. The heat-conducting structure is disposed between the heating device and the heat sink to transfer heat from the heating device to the heat sink. The heat-conducting structure in this solution has high thermal efficiency and good reliability, reducing the risk of short circuits.

[0020] When configuring the heat-conducting structure, one side of the insulating ring can be in contact with the heating element, while the other side can be in contact with the heat sink. This allows the heat-conducting portion to be enclosed between the heating element, the insulating ring, and the heat sink. This prevents the heat-conducting portion from aging or becoming damaged and from falling onto the electronic device's circuit area, thus reducing the risk of short circuits.

[0021] In another technical solution, if the heating element is mounted on a circuit board, one side of the insulating ring can be placed in contact with the circuit board, while the other side can be placed in contact with the heat sink. This solution allows the heat conduction portion to be enclosed between the circuit board, the insulating ring, and the heat sink, making it less likely for the heat conduction portion to fall into the electronic device's circuit area if it ages or becomes damaged, thereby reducing the risk of short circuits.

[0022] In the specific technical solution, the electronic device is an in-vehicle electronic device. Since the vehicle is prone to vibration during operation, the heat conduction structure in this solution is not likely to fall off in the presence of vibration, thus effectively improving the heat dissipation efficiency of the in-vehicle electronic device.

[0023] In a third aspect, the present application further provides a terminal, which includes the electronic device according to the second aspect. The terminal has a strong heat dissipation capability and is in good working condition. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic diagram of a top view of a heat conducting structure in an embodiment of the present application;

[0025] FIG2 is a schematic cross-sectional view of a heat conducting structure according to an embodiment of the present application;

[0026] FIG3 is another schematic top view of the heat conducting structure in an embodiment of the present application;

[0027] FIG4 is another schematic top view of the heat conducting structure in an embodiment of the present application;

[0028] FIG5 is another schematic top view of the heat conducting structure in an embodiment of the present application;

[0029] FIG6 is another schematic top view of the heat conducting structure in an embodiment of the present application;

[0030] FIG7 is another schematic diagram of a top view of the heat conducting structure in an embodiment of the present application;

[0031] FIG8 is another schematic top view of the heat conducting structure in an embodiment of the present application;

[0032] FIG9 is another schematic top view of the heat conducting structure in an embodiment of the present application;

[0033] FIG10 is another schematic top view of the heat conducting structure in an embodiment of the present application;

[0034] FIG11 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0035] FIG12 is another schematic cross-sectional view of the heat conducting structure in an embodiment of the present application;

[0036] FIG13 is another schematic structural diagram of an electronic device in an embodiment of the present application;

[0037] FIG14 is another schematic cross-sectional view of the heat conducting structure in an embodiment of the present application;

[0038] FIG15 is another structural diagram of the electronic device in an embodiment of the present application.

[0039] Reference numerals:

[0040] 1-heat conducting structure;

[0041] 11-heat conducting part;

[0042] 12-Insulation ring;

[0043] 121-opening;

[0044] 13-gap;

[0045] 14-first side;

[0046] 15- second side;

[0047] 2-Heating device;

[0048] 21- second bulge;

[0049] 3- Radiator;

[0050] 31- first protrusion;

[0051] 4- Circuit board. DETAILED DESCRIPTION

[0052] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the", and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0053] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0054] To facilitate understanding of the foldable terminal provided in the embodiments of this application, the following first introduces its application scenarios. With the advancement of electronic technology, the demand for heat dissipation of heat-generating components such as chips has become increasingly significant. In the prior art, heat dissipation of heat-generating components is typically achieved using a heat sink. To ensure effective heat dissipation, a thermally conductive structure is required between the heat-generating component and the heat sink. This thermally conductive structure has thermal conductivity, allowing it to transfer heat from the heat-generating component to the heat sink for dissipation. Furthermore, the thermally conductive structure typically has a certain degree of flexibility, ensuring more reliable contact between the heat-generating component and the heat sink, increasing the contact area and improving the heat dissipation efficiency of the heat-generating component. Thermally conductive structures can be made of insulating and conductive materials, with conductive materials generally having better thermal conductivity. Heat-generating components such as chips are often used in electrical structures such as circuit boards. Therefore, in some scenarios, if the thermally conductive structure is made of conductive materials, short circuits are likely to occur. In particular, under severe vibration and prolonged use, the thermally conductive structure is susceptible to damage. Damaged thermally conductive structures may partially detach, and the detached thermally conductive structure may fall onto circuit structures such as circuit boards, easily causing a short circuit. To this end, this application provides a thermally conductive structure and an electronic device.

[0055] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0056] Figure 1 is a schematic diagram of a top view of the heat-conducting structure in an embodiment of the present application, and Figure 2 is a schematic diagram of a cross-sectional structure of the heat-conducting structure in an embodiment of the present application. Please refer to Figures 1 and 2. The heat-conducting structure 1 in the embodiment of the present application includes a heat-conducting part 11 and an insulating ring 12, and the above-mentioned heat-conducting part 11 is located inside the insulating ring 12. In other words, the insulating ring 12 is arranged around the circumference of the heat-conducting part 11, and the upper and lower sides of the heat-conducting part 11 are at least partially exposed, so that the heat-conducting part 11 can contact the heating device and the radiator on both sides to conduct heat. The upper and lower sides of the above-mentioned heat-conducting part 11 refer to the side of the heat-conducting part 11 that contacts the heating device, and the side that contacts the radiator. In this embodiment, the circumference of the heat-conducting part 11 is protected by the insulating ring 12. Even if the heat-conducting structure 1 is aged or damaged, it is mainly concentrated on the insulating ring 12, and the internal heat-conducting part 11 is not easy to scatter. Therefore, the heat conducting portion 11 can be set as a heat conducting portion 11 made of a high thermal conductivity material, or can be made of a conductive material, so that the heat conducting capacity of the heat conducting structure 1 is improved and it is not easy to cause short circuit risk.

[0057] In a specific embodiment, the insulating ring 12 can be made more resistant to aging than the heat conducting portion 11. Thus, when the heat conducting portion 11 ages, the insulating ring 12 is also less susceptible to aging and is less likely to be damaged, thereby providing better protection for the heat conducting portion 11. Furthermore, the mechanical strength of the insulating ring 12 can be made greater than that of the heat conducting portion 11. This makes the insulating ring 12 less susceptible to damage during vibration, thus improving the vibration resistance of the heat conducting structure 1 in this embodiment.

[0058] In a specific embodiment, the insulating ring 12 may be made of at least one of foam, rubber, and sealant. These materials are flexible and easy to install, and are easy to manufacture and relatively inexpensive.

[0059] In another specific embodiment, the insulating ring 12 can also be made of a thermally conductive material. The thermally conductive material has a certain thermal conductivity. Of course, its thermal conductivity may be lower than the thermal conductivity of the heat-conducting part 11. Therefore, the insulating ring 12 can also conduct heat to increase the thermal conductivity area of ​​the heat-conducting structure 1 and improve the thermal conductivity effect of the heat-conducting structure 1. For example, the thermally conductive material can be a thermally conductive gel, a thermally conductive insulating tape, a thermally conductive glue or a thermally conductive insulating film. The thermally conductive glue can be formed by heating and curing or room temperature curing. That is, the thermally conductive glue can be a heat-curing thermally conductive glue or a room temperature curing thermally conductive glue. In addition, the insulating ring 12 can also be prepared using thermally conductive gel or the like.

[0060] The heat conducting portion 11 can be made of a conductive material to provide excellent thermal conductivity. For example, the thermal conductivity of the heat conducting portion 11 is greater than or equal to 10 W / (m·K). Thermal conductivity refers to the amount of heat transferred through a one-square-meter area over a given period of time under stable heat transfer conditions, given a one-meter-thick material with a one-degree (K or °C) temperature difference between its two surfaces. The unit of thermal conductivity is watt / meter degree (W / (m·K), where K can be replaced by °C. For example, the thermal conductivity of the above-mentioned heat-conducting portion 11 can be 11W / (m·K), 15W / (m·K), 18W / (m·K), 20W / (m·K), 22W / (m·K), 25W / (m·K), 26W / (m·K), 30W / (m·K), 35W / (m·K) or 40W / (m·K), etc., which are not listed here one by one. For example, the material of the above-mentioned heat-conducting portion 11 includes carbon fiber or graphene. The above two materials have strong thermal conductivity, which is conducive to improving the thermal conductivity of the heat-conducting structure 1.

[0061] Continuing with reference to Figure 1 , the insulating ring 12 can be a closed ring. That is, the insulating ring 12 lacks an opening 121 and completely surrounds the heat conducting portion 11. In this embodiment, the heat conducting portion 11 is completely surrounded by the insulating ring 12, making it less likely for the heat conducting portion 11 to leak out of the insulating ring 12, thereby improving the reliability of the heat conducting structure 1. Furthermore, the insulating ring 12, as a single unit, facilitates installation.

[0062] In a specific embodiment, the insulating ring 12 can be an integrally formed structure, that is, a closed ring can be formed by a one-step molding process. This embodiment is conducive to simplifying the manufacturing process of the insulating ring 12, and the overall strength of the insulating ring 12 is greater.

[0063] Alternatively, in another specific embodiment, the insulating ring 12 may be fixedly connected to form a closed ring by bonding or other methods. In short, the present application does not impose any restrictions on the method of forming the closed ring, as long as a closed ring can be formed.

[0064] FIG3 is a schematic top view of another embodiment of the heat-conducting structure of the present application. As shown in FIG3 , in another embodiment, the insulating ring 12 further has an opening 121. In this embodiment, when the heat-conducting structure 1 is installed in an electronic device, the opening of the insulating ring 12 can absorb deformation, thereby preventing the insulating ring 12 from wrinkling or pulling.

[0065] The size of the opening is not limited, for example, the width of the opening can be between 0 mm and 5 mm, that is, the width of the opening can be 0 mm to 5 mm. In one embodiment, the opening 121 is only a gap, or the insulating ring 12 is not connected to form a closed ring.

[0066] When specifically setting the above-mentioned opening 121, the edge shape of the above-mentioned opening 121 is not limited. As shown in Figure 3, the edge of the above-mentioned opening 121 can be straight. Alternatively, Figure 4 is a schematic diagram of another top view of the heat-conducting structure in an embodiment of the present application. As shown in Figure 4, in another embodiment, the edge of the above-mentioned opening 121 can also be serrated. This solution not only helps to reduce the risk of leakage of the internal heat-conducting part 11 while providing the opening 121, but also helps to improve the reliability of the heat-conducting structure 1. In addition, the edge of the above-mentioned opening 121 can also be curved or wavy, etc., which are not listed here one by one.

[0067] When the opening 121 is specifically provided, the specific location of the opening 121 is not limited. Taking the square shape of the heat-conducting structure 1 as an example, as shown in Figures 3 or 4, in one embodiment, the opening 121 can be provided at the edge of the heat-conducting structure 1; Figure 5 is a schematic diagram of another top view of the heat-conducting structure in an embodiment of the present application. As shown in Figure 5, in another embodiment, the opening 121 can also be provided at a corner of the heat-conducting structure 1.

[0068] In addition, in a specific embodiment, the number of openings 121 included in the insulating ring 12 is not limited. As shown in Figures 3 to 5, in one embodiment, the insulating ring 12 may include one opening 121. Figure 6 is another schematic top view of the heat-conducting structure in an embodiment of the present application. As shown in Figure 6, in another embodiment, the insulating ring 12 may further include two openings 121, and the two openings 121 may be provided on opposite sides. Of course, in other embodiments, the insulating ring 12 may further be provided with multiple openings 121, such as three, four, or more openings 121.

[0069] In specific embodiments, the specific shape of the thermally conductive structure 1 is not limited. In one embodiment, the shape of the edge of the thermally conductive portion 11, the inner edge of the insulating ring 12, and the outer edge of the insulating ring 12 are all the same, but the shape of each of the edges is not limited. In one embodiment, as shown in FIG6 , each of the edges is square; in another embodiment, as shown in FIG7 , each of the edges is round.

[0070] Alternatively, FIG8 is another schematic diagram of a top view of the heat-conducting structure in an embodiment of the present application. As shown in FIG8 , in another embodiment, only the shape of the edge of the heat-conducting portion 11 and the inner edge shape of the insulating ring 12 are the same, and the outer edge shape of the insulating ring 12 may be different from the above-mentioned shape. In the embodiment shown in FIG8 , the shape of the edge of the heat-conducting portion 11 and the inner edge shape of the insulating ring 12 are both circular, while the outer edge shape of the insulating ring 12 is square. In this embodiment, the heat-conducting portion 11 and the insulating ring 12 can be more reliably connected, and the insulating ring 12 is conducive to protecting the heat-conducting portion 11, making it difficult for the heat-conducting portion 11 to leak out of the insulating ring 12.

[0071] In a specific embodiment, the shapes of the heat conducting portion 11 and the insulating ring 12 can be designed according to the shape of the heating device and the installation position, which are not listed one by one in this application.

[0072] In a specific embodiment, as shown in Figures 1 to 8 , the insulating ring 12 of the heat-conducting structure 1 is fixedly connected to the heat-conducting portion 11 , for example, by gluing or interference fitting. This solution allows the heat-conducting structure 1 to be an integrated structure, thereby facilitating transportation and installation of the heat-conducting structure 1 .

[0073] Alternatively, in another embodiment, the insulating ring 12 and the heat conducting portion 11 may be integrally formed, that is, the heat conducting structure 1 may be formed using a single process. In this embodiment, the insulating ring 12 and the heat conducting portion 11 are more securely fixed to each other, thereby improving the reliability of the heat conducting structure 1 and preventing the heat conducting portion 11 from leaking through the insulation.

[0074] Figure 9 is a schematic top view of another embodiment of the heat-conducting structure of the present application. As shown in Figure 9, in another embodiment, a gap 13 is further provided between the heat-conducting portion 11 and the insulating ring 12. The specific width of the gap 13 is not limited and can be, for example, 0 to 5 mm. This solution can absorb deformation of the heat-conducting portion 11 and the insulating ring 12, or be used to adapt to the specific structure of the electronic device. In this embodiment, the heat-conducting portion 11 and the insulating ring 12 can be two independent components, which are manufactured, transported, and installed separately.

[0075] FIG10 is another schematic diagram of a top view of the heat-conducting structure in an embodiment of the present application. As shown in FIG10 , in an optional design, the above-mentioned gap 13 can be set to not completely surround the heat-conducting portion 11. For example, when the outer edge shape of the heat-conducting portion 11 is a quadrilateral, the above-mentioned gap 13 is set at the position of any one, any two or any three sides, and does not form a closed annular gap. For example, in the embodiment shown in FIG10 , the above-mentioned gap 13 is located at two opposite sides of the quadrilateral heat-conducting portion 11. In this solution, the above-mentioned gap 13 can be used to absorb the deformation of the heat-conducting portion 11 and the insulating ring 12, and the heat-conducting portion 11 and the insulating ring 12 can also be fixed to facilitate the installation and transportation of the heat-conducting structure.

[0076] Based on the same inventive concept, the present application also provides an electronic device. Specifically, Figure 11 is a structural schematic diagram of an electronic device in an embodiment of the present application. As shown in Figure 11, the electronic device includes a heating device 2, a radiator 3 and a heat-conducting structure 1 in any of the above embodiments. The heat-conducting structure 1 is arranged between the heating device 2 and the radiator 3. Specifically, the two sides of the heat-conducting portion 11 can be respectively in contact with the above-mentioned heating device 2 and the heat dissipation to transfer heat between the above-mentioned heating device 2 and the heat dissipation. The heat-conducting structure 1 in this embodiment has a strong thermal conductivity, so the heat dissipation capacity of the electronic device is strong. In addition, the heat-conducting structure 1 is not easy to cause a short circuit in the electronic device, which is conducive to improving the reliability of the electronic device.

[0077] In a specific embodiment, as shown in FIG11 , the insulating ring 12 is provided with one side in contact with the heating element 2 and the other side in contact with the heat sink 3. This solution seals the heat conducting portion 11 between the heating element 2, the heat sink 3, and the insulating ring 12, thereby effectively reducing the probability of the heat conducting portion 11 leaking to the outside and improving the structural reliability of the electronic device.

[0078] Please refer to Figures 2 and 11. In a specific embodiment, the heat-conducting structure 1 includes a first side 14 and a second side 15 opposite to each other. The above-mentioned heat-conducting structure 1 is specifically a sheet-like structure. Along the direction perpendicular to the surface of the heat-conducting part 11, the heat-conducting structure 1 includes the above-mentioned first side 14 and second side 15 opposite to each other. On the first side 14 of the above-mentioned heat-conducting structure 1, the surface of the above-mentioned heat-conducting part 11 and the surface of the insulating ring 12 are located in the same plane, and on the second side 15 of the above-mentioned heat-conducting layer, the surface of the above-mentioned heat-conducting part 11 and the surface of the insulating ring 12 are located in the same plane. The preparation process of the heat-conducting structure 1 in this scheme is relatively simple, which is conducive to simplifying the preparation process of the heat-conducting structure 1. In addition, it is also conducive to the storage and transportation of the above-mentioned heat-conducting structure 1. This scheme is mainly suitable for a case where one side of the heating device 2 is a planar structure, and one side of the radiator 3 is also a planar structure.

[0079] Figure 12 is another schematic cross-sectional view of the heat-conducting structure in an embodiment of the present application. As shown in Figure 12, in another embodiment, on the first side 14 of the heat-conducting structure 1, the surfaces of the heat-conducting portion 11 and the insulating ring 12 are located in the same plane, and on the second side 15 of the heat-conducting structure 1, the insulating ring 12 protrudes from the surface of the heat-conducting portion 11. In this embodiment, the heat-conducting structure 1 can be applied to the case where one side of the heating device 2 is non-planar, or the case where one side of the heat sink 3 is non-planar. This solution is mainly applicable to the case where one side of the heating device 2 is a planar structure, and one side of the heat sink 3 has a first protrusion 31; or, the case where one side of the heating device 2 has a second protrusion 21, and one side of the heat sink 3 is a planar structure; or, the case where the heating device 2 is arranged on the circuit board 4, the heating device 2 itself protrudes from the circuit board 4, and one side of the heat sink 3 is a planar structure.

[0080] FIG13 is another structural schematic diagram of an electronic device in an embodiment of the present application. As shown in FIG13 , in another embodiment, the heating device 2 is arranged on the circuit board 4, and the heating device 2 is protruded from the circuit board 4, and the heating device 2 is equivalent to the second protrusion 21. At this time, the heat-conducting structure 1 can be as shown in FIG12 , where the insulating ring 12 protrudes from the heat-conducting portion 11 on the second side 15 of the heat-conducting structure 1, so that the second side 15 of the heat-conducting structure 1 faces one side of the circuit board 4. Specifically, the heat-conducting portion 11 and the insulating ring 12 on the first side 14 of the heat-conducting structure 1 are both arranged in contact with the radiator 3; on the second side 15 of the heat-conducting structure 1, the heat-conducting portion 11 is arranged in contact with the heating device 2, and the insulating ring 12 is arranged in contact with the circuit board 4. This solution can also make the heat-conducting portion 11 enclosed between the radiator 3, the circuit board 4 and the insulating ring 12, so that the heat-conducting portion 11 is not easy to leak.

[0081] Of course, the heat-conducting structure 1 in the embodiment shown in FIG11 can also be applied to electronic devices as shown in FIG11. In this embodiment, the insulating ring 12 has a certain elasticity and is compressed when it is between the heating device 2 and the heat sink 3. This solution is conducive to improving the reliability of the insulating ring 12 in protecting the heat-conducting part 11.

[0082] FIG14 is another schematic cross-sectional view of the heat-conducting structure in an embodiment of the present application. As shown in FIG14 , in another embodiment, on the first side 14 of the heat-conducting structure 1, the insulating ring 12 protrudes from the surface of the heat-conducting portion 11, and on the second side 15 of the heat-conducting layer, the insulating ring 12 protrudes from the surface of the heat-conducting portion 11. In this embodiment, the heat-conducting structure 1 can be adapted to the shape of one side of the heating device 2 or the shape of one side of the heat sink 3. This solution is mainly applicable to the case where one side of the heating device 2 has a second protrusion 21 and one side of the heat sink 3 has a first protrusion 31; or, the heating device 2 is arranged on the circuit board 4, the heating device 2 itself protrudes from the circuit board 4, and one side of the heat sink 3 is a planar structure.

[0083] Figure 15 is another structural schematic diagram of an electronic device in an embodiment of the present application. As shown in Figure 15, in another embodiment, the above-mentioned heating device 2 is arranged on the circuit board 4, and the heating device 2 itself has a second protrusion 21. In addition, the radiator 3 has a first protrusion 31. The heat-conducting structure 1 in this embodiment is shown in Figure 14. When the above-mentioned heat-conducting structure 1 is arranged between the heating device 2 and the radiator 3, the first side 14 of the above-mentioned heat-conducting structure 1 faces one side of the radiator 3, the heat-conducting portion 11 is arranged in contact with the first protrusion 31 of the radiator 3, and the insulating ring 12 is arranged in contact with the position of the radiator 3 that does not have the first protrusion 31; the second side 15 of the above-mentioned heat-conducting structure 1 is arranged toward the heating device 2, the heat-conducting portion 11 is arranged in contact with the heating device 2, and the insulating ring 12 is arranged in contact with the circuit board 4. This solution can also make the heat-conducting portion 11 be enclosed between the radiator 3, the circuit board 4 and the insulating ring 12, so that the heat-conducting portion 11 is not easy to leak.

[0084] Of course, the heat-conducting structure 1 in the embodiment shown in FIG14 can also be applied to electronic devices as shown in FIG11. In this embodiment, the insulating ring 12 has a certain elasticity and is compressed when it is between the heating device 2 and the heat sink 3. This solution is conducive to improving the reliability of the insulating ring 12 in protecting the heat-conducting part 11.

[0085] It is worth noting that the term "contact arrangement" in the embodiments of this application can include direct contact or indirect contact, primarily referring to the absence of a gap between the two elements. For example, if A and B are in contact, then A and B may be in direct contact; alternatively, a transition piece C may be provided between A and B, meaning that A and C are in direct contact, and C is in direct contact with B, eliminating any gap between A and B.

[0086] In the embodiments shown in Figures 12 and 14 above, the thickness of the insulating ring 12 is greater than the thickness of the heat-conducting layer, so the insulating ring 12 is also stronger and has stronger shock and aging resistance. This solution is conducive to improving the service life and reliability of the heat-conducting structure 1.

[0087] In a specific embodiment, the heating element 2 may be a chip, and this application does not impose any specific restrictions on this. The electronic device may be an on-board electronic device. During operation, the vehicle is prone to vibration and other conditions. In this embodiment of the application, the insulating ring 12 can protect the heat conducting portion 11, thereby better adapting to vibration-prone scenarios, thereby improving the heat dissipation performance of the vehicle's on-board electronic devices, thereby improving the service life and performance of the on-board electronic devices.

[0088] This application also provides a terminal comprising the aforementioned electronic device. The specific type of the terminal is not limited and may, for example, be a communication terminal such as a server or storage device, a mobile terminal such as a laptop or tablet computer, or other terminals such as a vehicle or household appliance. The terminal has a strong heat dissipation capability, thereby providing better operational performance.

[0089] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat-conducting structure, characterized in that: It comprises a heat conducting part and an insulating ring, wherein the heat conducting part is located inside the insulating ring, and the insulating ring is a closed ring, or has an opening.

2. The heat conducting structure according to claim 1, wherein: The heat-conducting structure includes a first side and a second side opposite to each other. On the first side of the heat-conducting structure, the surface of the heat-conducting part and the surface of the insulating ring are located in the same plane; on the second side of the heat-conducting structure, the surface of the heat-conducting part and the surface of the insulating ring are located in the same plane.

3. The heat conducting structure according to claim 1, wherein: The heat conducting structure includes a first side and a second side opposite to each other. On the first side of the heat conducting structure, the surface of the heat conducting portion and the surface of the insulating ring are located in the same plane. On the second side of the heat conducting structure, the insulating ring protrudes from the heat conducting portion.

4. The heat conducting structure according to claim 1, wherein: The heat conducting structure includes a first side and a second side opposite to each other. On the first side of the heat conducting structure, the insulating ring protrudes from the heat conducting portion. On the second side of the heat conducting structure, the insulating ring protrudes from the heat conducting portion.

5. The heat conducting structure according to any one of claims 1 to 4, characterized in that: The insulating ring is fixedly connected to the heat conducting part.

6. The heat conducting structure according to any one of claims 1 to 4, characterized in that: The insulating ring and the heat conducting portion are an integrally formed structure.

7. The heat conducting structure according to any one of claims 1 to 4, characterized in that: A gap is formed between the insulating ring and the heat conducting portion.

8. The heat conducting structure according to any one of claims 1 to 7, wherein: The insulating ring is made of foam, rubber or sealant.

9. The heat conducting structure according to any one of claims 1 to 7, wherein: The insulating ring is made of heat-conducting material.

10. The heat conducting structure according to claim 9, wherein: The material of the insulating ring includes thermal conductive gel, thermal conductive insulating tape, thermal conductive glue or thermal conductive insulating film.

11. The heat conducting structure according to any one of claims 1 to 10, characterized in that: The thermal conductivity of the heat conducting portion is greater than or equal to 10 W / (m·K).

12. The heat conducting structure according to any one of claims 1 to 11, characterized in that: The material of the heat conducting part includes carbon fiber or graphene.

13. The heat conducting structure according to any one of claims 1 to 12, characterized in that: The shape of the edge of the heat conducting portion is the same as the shape of the inner edge of the insulating ring.

14. An electronic device, characterized in that: The heat conducting device comprises a heating device, a heat sink and the heat conducting structure according to any one of claims 1 to 13, wherein the heat conducting structure is arranged between the heating device and the heat sink.

15. The electronic device according to claim 14, wherein: One side of the insulating ring is in contact with the heating element, and the other side is in contact with the radiator.

16. The electronic device according to claim 14 or 15, characterized in that: The heating device is arranged on a circuit board, one side of the insulating ring is arranged in contact with the circuit board, and the other side is arranged in contact with the radiator.

17. The electronic device according to any one of claims 14 to 16, wherein: The electronic device is a vehicle-mounted electronic device.

18. A terminal, characterized in that: The terminal includes the electronic device according to any one of claims 14 to 17.

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