High frequency piezoelectric array and method of operation and noise measurement system

Abstract

The application belongs to the field of acoustic and vibration measurement, and provides a high-frequency piezoelectric array, a running method thereof and a noise measurement system, the high-frequency piezoelectric array comprising: a support tube, a signal line is arranged in the cavity of the support tube, a part of the signal line extends out of the cavity, and the signal line is used for transmitting different types of signals; a plurality of preamplifiers are arranged in the cavity of the support tube, the preamplifiers are used for receiving array element signals and amplifying the array element signals; a plurality of array element inner linings are distributed on the outer side of the support tube; each array element inner lining is prepared from insulating material, and each array element inner lining has a damping function; a plurality of array elements are installed on the array element inner linings and do not contact the outer side of the support tube; different array elements are electrically connected to different preamplifiers; and the array elements are used for generating array element signals. The high-frequency piezoelectric array realizes vibration isolation and electrical isolation of the array elements and the support tube, and reduces electromagnetic radiation interference and vibration conduction interference at the array connection end.

Description

Technical Field

[0001] This invention relates to the field of acoustics and vibration measurement, and more particularly to a high-frequency piezoelectric array, its operation method, and a noise measurement system. Background Technology

[0002] Underwater noise measurement technology captures underwater sound wave signals using specialized equipment such as hydrophone arrays and converts them into electrical signals for analysis. This technology can optimize ship design, reduce noise pollution, and protect the marine ecological environment, and has broad application prospects.

[0003] High-frequency piezoelectric arrays in sonar are devices that receive sound waves from 10kHz to 100kHz. They are characterized by a large number of array elements, small element spacing, and long element leads. Common high-frequency piezoelectric arrays include two types of array structures: oil-filled and solid-state.

[0004] In related technologies, high-frequency piezoelectric arrays employ a serial arrangement of array elements, with long-distance transmission of array element signal lines, followed by centralized amplification and acquisition processing. However, due to the small static capacitance of individual array elements, the array element leads have a significant impact on acoustic performance, easily leading to a reduction in the signal-to-noise ratio of the output signal, causing circuit noise, and reducing the array's measurement distance. In addition, since the signal transmission lines pass through the surface of the array elements, they obstruct the signal, and the array elements are also affected by electromagnetic radiation from the transmission lines, exacerbating crosstalk between array elements and reducing the array's measurement accuracy. Summary of the Invention

[0005] This invention provides a high-frequency piezoelectric array, its operation method, and a noise measurement system to address the shortcomings of existing high-frequency piezoelectric arrays, where the array element leads have a significant impact on acoustic performance, easily causing circuit noise, blocking signals, and exacerbating crosstalk between array elements, leading to reduced measurement distance and accuracy. This invention improves the measurement distance and accuracy of the high-frequency piezoelectric array.

[0006] This invention provides a high-frequency piezoelectric array, comprising: A support tube, wherein a signal line is provided inside the cavity of the support tube, and a portion of the signal line extends out of the cavity; the signal line is used to transmit different types of signals. Multiple preamplifiers are disposed within the cavity of the support tube. The multiple preamplifiers are used to receive array element signals and amplify the array element signals. Multiple array element liners are distributed on the outside of the support tube; each array element liner is made of insulating material and has a shock absorption function. Multiple array elements are mounted on an inner liner of the array elements and do not contact the outside of the support tube; different array elements are electrically connected to different preamplifiers; the multiple array elements are used to generate the array element signals.

[0007] According to a high-frequency piezoelectric array provided by the present invention, the support tube is provided with a plurality of openings, and the lead of each array element is electrically connected to the target preamplifier through one of the plurality of openings, and the leads of each array element are isolated from each other. The target preamplifier is the preamplifier with the smallest distance from the opening among the plurality of preamplifiers.

[0008] According to the present invention, a high-frequency piezoelectric array is provided in which multiple array elements are installed at equal intervals on multiple support array element liners, and the operating frequency band of each array element is between 5kHz and 35kHz.

[0009] According to a high-frequency piezoelectric array provided by the present invention, the high-frequency piezoelectric array further includes: A protective sleeve, made of polyurethane material, is applied to the outside of the support tube.

[0010] According to the present invention, the support tube of the high-frequency piezoelectric array is made of aluminum alloy.

[0011] The present invention also provides a noise measurement system, comprising: High-frequency piezoelectric array; An electrical signal processing device, wherein the high-frequency piezoelectric array is fixedly sealed to the electrical signal processing device via a metal flange; the electrical signal processing device is used to convert different types of signals transmitted by the high-frequency piezoelectric array into electrical signals, and to perform noise measurement based on the electrical signals.

[0012] The present invention also provides a method for operating a high-frequency piezoelectric array, comprising: Array element signals are generated by multiple array elements; wherein, the multiple array elements are installed on multiple array element liners and do not contact the outside of the support tube; the multiple array element liners are distributed on the outside of the support tube, and each array element liner has a shock absorption function. The array element signal is amplified by multiple preamplifiers to obtain an amplified signal, which is then transmitted through signal lines inside the cavity of the support tube. Different array elements are electrically connected to different preamplifiers. A portion of the signal lines extends outside the cavity. The multiple preamplifiers are located inside the cavity of the support tube.

[0013] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the operation method of the high-frequency piezoelectric array as described above.

[0014] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the operation method of the high-frequency piezoelectric array as described above.

[0015] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the operation method of the high-frequency piezoelectric array as described above.

[0016] The high-frequency piezoelectric array, its operation method, and noise measurement system provided by this invention achieve vibration isolation and electrical isolation between the array elements and the support tube by placing multiple preamplifiers inside the cavity of the support tube, distributing multiple array element liners on the outside of the support tube which has a vibration damping function, and setting multiple array elements on the array element liners without contacting the outside of the support tube. This reduces electromagnetic radiation interference and vibration transmission interference at the array connection end. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is one of the structural schematic diagrams of the high-frequency piezoelectric array provided by the present invention.

[0019] Figure 2 This is a schematic diagram of the preamplifier provided by the present invention.

[0020] Figure 3 This is a schematic diagram of the structure of the array element liner provided by the present invention.

[0021] Figure 4 This is the second schematic diagram of the high-frequency piezoelectric array provided by the present invention.

[0022] Figure 5 This is a schematic diagram of the support tube provided by the present invention.

[0023] Figure 6 This is a schematic diagram of the protective sleeve provided by the present invention being potted on the outside of the support tube.

[0024] Figure 7This is a schematic diagram of the noise measurement system provided by the present invention.

[0025] Figure 8 This is a flowchart illustrating the operation method of the high-frequency piezoelectric array provided by the present invention.

[0026] Figure 9 This is a schematic diagram of the structure of the electronic device provided by the present invention.

[0027] Figure label: 100: High-frequency piezoelectric array; 110: Support tube; 120: Preamplifier; 130: Array element lining; 140: Array element; 150: Protective cover; 710: Electrical signal processing equipment. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0029] The following is combined Figures 1-8 The present invention describes a high-frequency piezoelectric array, its operation method, and a noise measurement system thereof. Figure 1 This is a schematic diagram of the high-frequency piezoelectric array provided by the present invention, as shown below. Figure 1 As shown, the high-frequency piezoelectric array 100 includes: a support tube 110, multiple preamplifiers 120, multiple array element liners 130, and multiple array elements 140.

[0030] The cavity of the support tube 110 is equipped with a signal line, a portion of which extends out of the cavity. The signal line is used to transmit different types of signals.

[0031] In this embodiment, the support tube 110 is made of aluminum alloy, which can reduce the weight of the high-frequency piezoelectric array and improve the array's strength and corrosion resistance.

[0032] In this embodiment, the support tube 110 can also be made of materials such as stainless steel, carbon fiber and titanium alloy to adapt to a variety of different application scenarios and needs.

[0033] In this embodiment, the signal lines inside the support tube 110 can be connected in a bundled or split manner to the signal transmitting device of the array element 140 and the external electronic device, respectively, for transmitting the amplified signal to the external electronic device, or transmitting other signals sent by the external electronic device to the signal transmitting device of the array element 140 for corresponding processing.

[0034] In this embodiment, the preamplifier 120 inside the support tube 110 is electrically connected to an external electronic device via a signal line, so that the signal transmission is led out from inside the array and the signal reception of the array element 140 is unobstructed.

[0035] In this embodiment, different types of signals include, but are not limited to, electromagnetic waves, sound waves, and seismic shock waves. In different application fields, the high-frequency piezoelectric array sends different types of signals to external electronic devices through signal lines, which are related to specific application scenarios and requirements.

[0036] For example, for underwater noise measurement signals, the signal line can transmit one or more of the following signals: acoustic signals, synchronization signals, control signals, calibration signals, data transmission signals, power signals, and communication signals.

[0037] Multiple preamplifiers 120 are disposed in the cavity of the support tube 110. The multiple preamplifiers 120 are used to receive the signal of the array element 140 and amplify the signal of the array element 140.

[0038] In this embodiment, the preamplifier includes functions such as signal amplification, impedance matching, noise reduction, signal shaping, sensor protection, and signal-to-noise ratio improvement. In this embodiment, different preamplifiers 120 can process the signals of one or more array elements 140.

[0039] In this embodiment, a preamplifier 120 can process the array element 140 signal generated by only one array element 140, or it can process the array element 140 signals generated by multiple different array elements 140 simultaneously.

[0040] exist Figure 2 In the embodiment shown, each preamplifier is designed to be 26mm long and 9mm wide. Multiple components are mounted on the preamplifier base plate, and the material of the preamplifier can be set according to user requirements.

[0041] Multiple array element liners 130 are distributed on the outside of the support tube 110; each array element liner 130 is made of insulating material and each array element liner 130 has a shock absorption function.

[0042] In this embodiment, one side of the array element 140 is attached to the outer wall of the support tube 110, and the other side is in contact with the protective layer of the support tube 110. An array element 140 can be embedded between every two array elements 140, and the array element 140 does not directly contact the outer side of the support tube 110.

[0043] For example, in Figure 3 In the embodiment shown, the array element liner is a composite body that encloses two circular tubes A and an inner circular tube B with different diameters, wherein the height h of the circular tube B is... B The height h of the circular tube A is less than A The inner diameter r of the bottom circle of the circular tube B B The outer diameter r of the base circle of the circular tube A is equal to A The circular tube B is fitted onto the outside of the circular tube A, meaning the inner wall of the circular tube B is in close contact with the outer wall of the circular tube A; specifically, h B =16mm (millimeters), the distance between the top of the round tube A and the top of the inner round tube B is 5mm, the outer diameter of the round tube B is 39mm, and the inner diameter of the round tube A is 27.5mm.

[0044] In this embodiment, the array element liner can be made of insulating material and has vibration damping function, which electrically isolates the array element from the support tube and suppresses electromagnetic radiation interference and vibration transmission interference from the support tube.

[0045] Multiple array elements 140 are mounted on multiple array element liners 130 and do not contact the outside of the support tube 110; different array elements 140 are electrically connected to different preamplifiers 120; multiple array elements 140 are used to generate array element 140 signals.

[0046] exist Figure 4 In the illustrated embodiment, an array element can be embedded between the inner linings of two adjacent array elements, and the array element does not contact the outside of the support tube.

[0047] In this embodiment, a preamplifier 120 is connected to only one array element 140 and is used to process the array element 140 signal emitted by the array element 140.

[0048] In this embodiment, each array element 140 is used to generate an array element 140 signal of a certain type and transmit the array element 140 signal to a pre-processor electrically connected to the array element 140 for method processing.

[0049] The high-frequency piezoelectric array provided by this invention achieves vibration isolation and electrical isolation between the array elements and the support tube by placing multiple preamplifiers inside the cavity of the support tube, distributing multiple array element liners on the outside of the support tube which has a shock-absorbing function, and placing multiple array elements on the array element liners without contacting the outside of the support tube. This reduces electromagnetic radiation interference and vibration transmission interference at the array connection end.

[0050] Furthermore, the support tube is provided with multiple openings, and the lead of each array element is electrically connected to the target preamplifier through one of the multiple openings, and the leads of each array element are isolated from each other; wherein, the target preamplifier is the preamplifier with the smallest distance from one of the multiple preamplifiers to one of the openings.

[0051] exist Figure 4 In the illustrated embodiment, the preamplifier (corresponding to the preamplifier board) is installed inside the support tube, and the array element leads are introduced into the tube nearby. The signal leads of each array element are isolated from each other. The array element leads are connected to the preamplifier board nearby through the liner and the opening of the support tube, which maximizes the reduction of the length of the array element leads, reduces the interference of spatial electromagnetic interference on the leads and the crosstalk between array element leads. After the array element signals are amplified, the output resistance of the amplifier circuit is small, the long-distance signal transmission is less affected by interference, and the crosstalk between array elements is suppressed. Moreover, the amplified signal transmission line is led out from inside the support tube, eliminating the obstruction of array element signals by the cable.

[0052] exist Figure 5 In the embodiment shown, the outer wall of the support tube (without a protective sleeve on the outside) has a plurality of evenly distributed openings.

[0053] Furthermore, multiple array elements are installed at equal intervals on multiple sub-array elements, with each array element operating in the frequency band between 5kHz and 35kHz.

[0054] In this embodiment, the number of array elements on the array element liner can be set according to user requirements. For example, the number of array elements can be a multiple of 2, or it can be 2. n The multiple, where n is a positive integer greater than 0.

[0055] In this embodiment, the signal conditioning method of amplifying the signal generated by the small-pitch array elements locally can reduce the impact of the array element leads on the acoustic performance.

[0056] exist Figure 1 In the embodiment shown, the high-frequency piezoelectric array 100 further includes a protective sleeve 150, which is made of polyurethane material and is encapsulated on the outside of the support tube 110.

[0057] Figure 6 In the illustrated embodiment, the protective sleeve, array elements, and array element liners are integrally potted, which results in high sealing performance and high corrosion resistance, thereby improving the service life of the high-frequency piezoelectric array.

[0058] The noise measurement system provided by the present invention is described below. The noise measurement system described below can be referred to in correspondence with the high-frequency piezoelectric array described above.

[0059] Figure 7 This is a schematic diagram of the noise measurement system provided by the present invention, as shown below. Figure 7 As shown, the noise measurement system includes a high-frequency piezoelectric array 100 and an electrical signal processing device 710. The high-frequency piezoelectric array is fixedly sealed to the electrical signal processing device via a metal flange. The electrical signal processing device is used to convert different types of signals transmitted by the high-frequency piezoelectric array into electrical signals and to perform noise measurement based on the electrical signals.

[0060] In this embodiment, the high-frequency piezoelectric array 100 includes: a support tube 110, a plurality of preamplifiers 120, a plurality of array element liners 130, a plurality of array elements 140, and a protective sleeve 150.

[0061] In this embodiment, the connection relationships and functions between the support tube 110, the plurality of preamplifiers 120, the plurality of array element liners 130, the plurality of array elements 140, and the protective sleeve 150 are as described above. Figures 1-6 As shown in the corresponding embodiments, this implementation will not be described in detail.

[0062] In this embodiment, the electrical signal processing device 710 may be a signal conditioning device, a data acquisition and storage device, data processing software, or other similar devices.

[0063] In this embodiment, in the noise measurement system, the array element signal is transmitted to the trunk platform via a signal line. The trunk platform is mainly used for signal conditioning, signal acquisition, data processing, and time synchronization. The trunk platform includes signal conditioning devices, data acquisition and storage devices, data processing software, time synchronization devices, synchronous ranging signal transmitting devices, and working cabins, etc. These devices work together to ensure accurate signal processing and analysis.

[0064] The noise measurement system provided by this invention sets up a high-frequency piezoelectric array by placing multiple preamplifiers inside the cavity of a support tube, distributing multiple array element liners on the outside of the support tube which has a vibration damping function, and placing multiple array elements on the array element liners without contacting the outside of the support tube. This achieves vibration isolation and electrical isolation between the array elements and the support tube, reduces electromagnetic radiation interference and vibration conduction interference at the array connection end, and improves the measurement accuracy and efficiency of the noise measurement system.

[0065] The noise measurement system provided by the present invention is described below. The noise measurement system described below can be referred to in correspondence with the high-frequency piezoelectric array described above.

[0066] Figure 8 This is a flowchart illustrating the operation method of the high-frequency piezoelectric array provided by the present invention, as shown below. Figure 8 As shown, the operation method of this high-frequency piezoelectric array includes the following steps: Step 810: Generate array element signals through multiple array elements; wherein, multiple array elements are installed on multiple array element liners and do not contact the outside of the support tube; multiple array element liners are distributed on the outside of the support tube, and each array element liner has a shock absorption function.

[0067] Multiple array element liners are distributed on the outside of the support tube; each array element liner is made of insulating material and each array element liner has a shock absorption function.

[0068] In this embodiment, one side of the array element is attached to the outer wall of the support tube, and the other side is in contact with the protective layer of the support tube. An array element can be embedded between every two array elements, and the array elements do not directly contact the outer side of the support tube.

[0069] In this embodiment, the array element liner can be made of insulating material and has vibration damping function, which electrically isolates the array element from the support tube and suppresses electromagnetic radiation interference and vibration transmission interference from the support tube.

[0070] Step 820: The array element signal is amplified by multiple preamplifiers to obtain an amplified signal, and the amplified signal is transmitted through the signal line inside the cavity of the support tube; wherein, different array elements are electrically connected to different preamplifiers; part of the signal line extends out of the cavity; multiple preamplifiers are located inside the cavity of the support tube.

[0071] In this step, a signal line is installed inside the cavity of the support tube, with a portion of the signal line extending outside the cavity. The signal line is used to transmit different types of signals.

[0072] In this embodiment, the support tube is made of aluminum alloy, which can reduce the weight of the high-frequency piezoelectric array and improve the array's strength and corrosion resistance.

[0073] In this embodiment, the support tube can also be made of materials such as stainless steel, carbon fiber, and titanium alloy to adapt to a variety of different application scenarios and needs.

[0074] In this embodiment, the signal lines inside the support tube can be connected in a bundled or split manner to be electrically connected to the array element signal transmitting device and the external electronic device, respectively, for transmitting the amplified signal to the external electronic device, or transmitting other signals sent by the external electronic device to the array element signal transmitting device for corresponding processing.

[0075] In this embodiment, the preamplifier inside the support tube is electrically connected to an external electronic device via a signal line, so that signal transmission is led out from inside the array, and the array element signal reception is unobstructed.

[0076] In this embodiment, for underwater noise measurement signals, the signal line can transmit one or more of the following signals: acoustic signals, synchronization signals, control signals, calibration signals, data transmission signals, power signals, and communication signals.

[0077] Multiple preamplifiers are housed within the cavity of the support tube. These preamplifiers are used to receive array element signals and amplify them.

[0078] Multiple array elements are mounted on multiple array element liners and do not contact the outside of the support tube; different array elements are electrically connected to different preamplifiers; multiple array elements are used to generate array element signals.

[0079] In this embodiment, a preamplifier is connected to only one array element and is used to process the array element signal emitted by that array element.

[0080] In this embodiment, each array element is used to generate an array element signal of a certain type and transmit the array element signal to a pre-processor electrically connected to the array element for method processing.

[0081] In this embodiment, the support tube is provided with multiple openings, and the lead of each array element is electrically connected to the target preamplifier through one of the multiple openings, and the leads of each array element are isolated from each other; wherein, the target preamplifier is the preamplifier with the smallest distance between it and one of the multiple preamplifiers, which maximizes the reduction of the length of the array element lead, reduces the interference of spatial electromagnetic interference on the lead and the crosstalk between the leads of the array elements.

[0082] Furthermore, multiple array elements are installed at equal intervals on multiple sub-array elements, with each array element operating in the frequency band between 5kHz and 35kHz.

[0083] In this embodiment, the number of array elements on the array element liner can be set according to user requirements. For example, the number of array elements can be a multiple of 2, or it can be 2. n The multiple, where n is a positive integer greater than 0.

[0084] In this embodiment, the signal conditioning method of amplifying the signal generated by the small-pitch array elements locally can reduce the impact of the array element leads on the acoustic performance.

[0085] In this embodiment, the high-frequency piezoelectric array further includes a protective sleeve made of polyurethane material. The protective sleeve is encapsulated on the outside of the support tube, resulting in high sealing performance and high corrosion resistance, thereby improving the service life of the high-frequency piezoelectric array. The high-frequency piezoelectric array operation method provided by this invention generates array element signals through multiple array elements; wherein, multiple array elements are installed on array element liners with shock absorption function and do not contact the outside of the support tube; the array element signals are amplified by multiple preamplifiers to obtain amplified signals, and the amplified signals are transmitted through signal lines inside the cavity of the support tube; vibration isolation and electrical isolation between the array elements and the support tube are achieved, reducing electromagnetic radiation interference and vibration transmission interference at the array connection end.

[0086] Figure 9 This is a schematic diagram of the structure of the electronic device provided by the present invention, such as... Figure 9 As shown, the electronic device may include: a processor 910, a communication interface 920, a memory 930, and a communication bus 940, wherein the processor 910, the communication interface 920, and the memory 930 communicate with each other through the communication bus 940. The processor 910 can call logic instructions in the memory 930 to execute a method for operating a high-frequency piezoelectric array. This method includes: generating array element signals through multiple array elements; wherein the multiple array elements are mounted on multiple array element liners and do not contact the outside of the support tube; the multiple array element liners are distributed on the outside of the support tube, and each array element liner has a shock absorption function; amplifying the array element signals through multiple preamplifiers to obtain amplified signals, and transmitting the amplified signals through signal lines inside the cavity of the support tube; wherein different array elements are electrically connected to different preamplifiers; a portion of the signal line extends outside the cavity; and the multiple preamplifiers are located inside the cavity of the support tube.

[0087] Furthermore, the logical instructions in the aforementioned memory 930 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0088] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the high-frequency piezoelectric array operation method provided by the above methods. The method includes: generating array element signals through multiple array elements; wherein the multiple array elements are mounted on multiple array element liners and do not contact the outside of the support tube; the multiple array element liners are distributed on the outside of the support tube, and each array element liner has a shock absorption function; amplifying the array element signals through multiple preamplifiers to obtain amplified signals, and transmitting the amplified signals through signal lines inside the cavity of the support tube; wherein different array elements are electrically connected to different preamplifiers; a portion of the signal line extends out of the cavity; and the multiple preamplifiers are disposed inside the cavity of the support tube.

[0089] In another aspect, the present invention also provides a non-transitory computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements a method for operating a high-frequency piezoelectric array provided by the methods described above. This method includes: generating array element signals through multiple array elements; wherein the multiple array elements are mounted on multiple array element liners and do not contact the outside of a support tube; the multiple array element liners are distributed on the outside of the support tube, and each array element liner has a shock-absorbing function; amplifying the array element signals through multiple preamplifiers to obtain amplified signals, and transmitting the amplified signals through signal lines within the cavity of the support tube; wherein different array elements are electrically connected to different preamplifiers; a portion of the signal lines extends outside the cavity; and the multiple preamplifiers are disposed within the cavity of the support tube.

[0090] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0091] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-frequency piezoelectric array, characterized in that, include: A support tube, wherein a signal line is provided inside the cavity of the support tube, and a portion of the signal line extends out of the cavity; the signal line is used to transmit different types of signals. Multiple preamplifiers are disposed within the cavity of the support tube. The multiple preamplifiers are used to receive array element signals and amplify the array element signals. Multiple array element liners are distributed on the outside of the support tube; each array element liner is made of insulating material and has a shock absorption function. Multiple array elements are mounted on an inner liner of the array elements and do not contact the outside of the support tube; different array elements are electrically connected to different preamplifiers; the multiple array elements are used to generate the array element signals.

2. The high-frequency piezoelectric array according to claim 1, characterized in that, The support tube is provided with multiple openings, and the lead of each array element is electrically connected to the target preamplifier through one of the multiple openings, and the leads of each array element are isolated from each other. The target preamplifier is the preamplifier with the smallest distance from the opening among the plurality of preamplifiers.

3. The high-frequency piezoelectric array according to claim 1, characterized in that, The multiple array elements are installed at equal intervals on the multiple array element liners, and the operating frequency band of each array element is between 5kHz and 35kHz.

4. The high-frequency piezoelectric array according to claim 1, characterized in that, The high-frequency piezoelectric array also includes: A protective sleeve, made of polyurethane material, is applied to the outside of the support tube.

5. The high-frequency piezoelectric array according to claim 1, characterized in that, The support tube is made of aluminum alloy.

6. A noise measurement system, characterized in that, include: The high-frequency piezoelectric array as described in any one of claims 1-5; An electrical signal processing device, wherein the high-frequency piezoelectric array is fixedly sealed to the electrical signal processing device via a metal flange; the electrical signal processing device is used to convert different types of signals transmitted by the high-frequency piezoelectric array into electrical signals, and to perform noise measurement based on the electrical signals.

7. A method for operating a high-frequency piezoelectric array, characterized in that, include: Array element signals are generated by multiple array elements; wherein, the multiple array elements are installed on multiple array element liners and do not contact the outside of the support tube; the multiple array element liners are distributed on the outside of the support tube, and each array element liner has a shock absorption function. The array element signal is amplified by multiple preamplifiers to obtain an amplified signal, which is then transmitted through signal lines inside the cavity of the support tube. Different array elements are electrically connected to different preamplifiers. A portion of the signal lines extends outside the cavity. The multiple preamplifiers are located inside the cavity of the support tube.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the operation method of the high-frequency piezoelectric array as described in claim 7.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the operation method of the high-frequency piezoelectric array as described in claim 7.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the operation method of the high-frequency piezoelectric array as described in claim 7.

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