Image generation device and head-up display

Abstract

The embodiment of the present application provides an image generating device and a head-up display. The image generating device comprises: an image processing module, comprising a heat dissipation module and an image modulation module, the image modulation module is tightly connected with the heat dissipation module; a main body part, the image processing module is located on one side of the main body part, the main body part is formed with a first limiting part, the heat dissipation module is formed with a second limiting part, the first limiting part and the second limiting part cooperate to form a limited space between the heat dissipation module and the main body part, and at least part of the image modulation module is located in the limited space.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to an image generating device and a head-up display. Background Technology

[0002] HUD, as an advanced in-vehicle vision assistance system, is mainly composed of three major components: image generator (PGU), freeform surface mirror system, and windshield.

[0003] The image generating device is assembled from a series of optical structural parts. However, during the complex assembly process, the machining accuracy deviations of each part and the positioning errors during assembly accumulate, forming a significant tolerance chain. This cumulative effect directly has a significant impact on the optical performance of the PGU.

[0004] In view of this, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a new technology solution for an image generating device and a head-up display.

[0006] In a first aspect, this application provides an image generating apparatus. The image generating apparatus includes:

[0007] An image processing module includes a heat dissipation module and an image modulation module, wherein the image modulation module is fastened to the heat dissipation module;

[0008] The main body has an image processing module located on one side of it. The main body has a first limiting component and a heat dissipation module has a second limiting component. The first limiting component and the second limiting component cooperate to form a defined space between the heat dissipation module and the main body. At least a portion of the image modulation module is located within the defined space.

[0009] Optionally, the first limiting portion includes an extension portion extending from the main body portion toward the heat dissipation module, and a limiting groove is formed on the surface of the extension portion opposite to the heat dissipation module;

[0010] The second limiting part is a protrusion extending from the heat dissipation module toward the main body, and the protrusion is embedded in the limiting groove.

[0011] Optionally, the image modulation module includes a circuit board located within the defined space, and the circuit board is connected to the heat dissipation module via fasteners;

[0012] At least a portion of the end of the circuit board is recessed to form a clearance portion, and at least a portion of the extension is located within the clearance portion.

[0013] Optionally, the image modulation module includes a circuit board located within the defined space, the circuit board being connected to the heat dissipation module via fasteners, and an elastic component being provided between the circuit board and the heat dissipation module.

[0014] Optionally, the heat dissipation module has a receiving hole formed on the surface facing the circuit board, and at least a portion of the elastic member is located within the receiving hole; the circuit board abuts against the elastic member.

[0015] Optionally, the image modulation module further includes an image processing chip, at least a portion of which is located within the defined space, and the image processing chip is disposed on the circuit board and electrically connected to the circuit board;

[0016] The circuit board has through holes, and at least a portion of the image processing chip corresponds to the through holes; the image modulation module also includes a heat-conducting component, one side of which contacts the image processing chip corresponding to the through holes, and the other side of which contacts the heat dissipation module.

[0017] Optionally, the heat dissipation module has a thermally conductive protrusion formed on the surface facing the circuit board, at least a portion of the thermally conductive protrusion is located within the through hole, and the other side of the thermally conductive component is in contact with the thermally conductive protrusion.

[0018] Optionally, the image modulation module further includes a first elastic sealing portion, which is sleeved on the heat-conducting protrusion, and at least a portion of the circuit board abuts against the first elastic sealing portion.

[0019] Optionally, the image modulation module further includes a second elastic sealing portion located between the circuit board and the image processing chip.

[0020] Optionally, the image generating device further includes an illumination module, which includes at least one illumination module;

[0021] The lighting module includes a fixed bracket, and a light source, a collimating lens group, and a beam splitter mirror arranged sequentially along the light transmission direction;

[0022] The light source, the collimating lens group, and the beam-splitting reflector are all mounted on the fixed bracket.

[0023] Optionally, the fixing bracket includes:

[0024] Mounting panel, wherein the light source is disposed on the mounting panel;

[0025] Two mounting brackets are spaced apart along a first direction and both are connected to the mounting panel. Each mounting bracket has a stepped surface, and the collimating lens group is disposed on the stepped surface.

[0026] Each of the mounting brackets has a bearing ramp, and the beam-splitting reflector is disposed on the bearing ramp; the first direction is a direction perpendicular to the light transmission direction.

[0027] Optionally, the lighting module includes at least two lighting modules, the at least two lighting modules are arranged along the first direction, and the mounting panels of the at least two lighting modules are on the same plane.

[0028] Secondly, embodiments of this application also provide a head-up display. The head-up display includes the image generating apparatus as described in the first aspect.

[0029] According to an embodiment of this application, limiting components are formed on the heat dissipation module and the main body. The cooperation of the two limiting components defines a fixed area of ​​space. When assembling other components of the image generating device (especially the image modulation module), the other components of the image generating device are all limited within the limited space. This can restrict the movement or deflection of other components (especially the image modulation module) during the installation process, improve installation accuracy, reduce cumulative errors, and improve the display quality of the image generating device.

[0030] Other features and advantages of this specification will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of this specification and, together with their description, serve to explain the principles of this specification.

[0032] Figure 1 The diagram shown is a structural diagram of the image generating apparatus provided in an embodiment of this application.

[0033] Figure 2 The diagram shows an exploded view of a portion of the structure in the image generating apparatus provided in this embodiment. Figure 1 .

[0034] Figure 3 The diagram shown is a schematic diagram of the connection structure between the heat dissipation module and the main body provided in an embodiment of this application.

[0035] Figure 4 The diagram shows a partial breakdown of the structure of the image generating apparatus provided in this application example. Figure 2 .

[0036] Figure 5The diagram shown is a structural diagram of the lighting module provided in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Image processing module; 11. Heat dissipation module; 111. Thermally conductive protrusion; 112. Receiving hole; 113. Second limiting component; 12. Image modulation module; 121. Circuit board; 1210. Through hole; 122. Image processing chip; 13. Elastic component; 14. Thermally conductive component; 15. First elastic sealing part; 16. Second elastic sealing part;

[0039] 2. Main body; 21. First limiting component;

[0040] 3. Lighting module; 31. Lighting unit; 311. Light source; 312. Collimating lens group; 313. Beam splitter; 30. Mounting bracket; 301. Mounting panel; 302. Mounting bracket;

[0041] 4. Projection lens;

[0042] 5. Lighting modulation module. Detailed Implementation

[0043] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0044] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0045] Technologies and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such technologies and equipment should be considered part of the specification.

[0046] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0047] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0048] This application provides an image generating apparatus. The image generating apparatus can employ one of the following methods: DLP, LCOS, or LBS. Taking a DLP image generating apparatus as an example, refer to... Figure 1The image generating device mainly consists of an illumination module 3, an illumination modulation module 5 (including a light-diffusing element, a reflective element, a lens group, and a color-combining prism), a DLP image processing module 1, a projection lens 4, and a main body 2. The illumination modulation module 5 is located within the main body 2. The light-diffusing element, reflective element, lens group, and color-combining prism are used to uniformly light and combine colors in the collimated light emitted from the illumination module 3. The DLP image processing module 1 receives the color-combined light for display. The projection lens 4 projects the light emitted from the DLP image processing module 1 onto the display surface to form a projected image.

[0049] For example, the light-diffusing element can be a compound eye lens or a light bar.

[0050] For example, the prism can be an RTIR / TIR prism, and the image generation device uses a DLP solution. Alternatively, the prism can be a PBS prism, and the image generation device uses an LCOS solution.

[0051] In existing DLP image generator structures, the various components of the DLP image processing module are assembled together using only screws and other fasteners, failing to mitigate the cumulative errors in the manufacturing and installation of each component. This can lead to problems such as misaligned DMD installation or poor contact.

[0052] To address the aforementioned technical issues, this application provides an image generating apparatus. The heat dissipation module 11 in the image processing module 1 and the main body 2 of the image generating apparatus are mounted together via a limiting structure. In this way, the heat dissipation module 11 and the main body 2 cooperate through the limiting structure to jointly construct a defined space. Within this defined space, all components of the image generating apparatus are constrained. This layout not only optimizes dimensional chain management during installation but also effectively reduces installation errors, thereby significantly improving the overall installation accuracy and stability of the image generating apparatus.

[0053] Reference Figure 2 and Figure 3 The image generating apparatus includes an image processing module 1 and a main body 2. The image processing module 1 includes a heat dissipation module 11 and an image modulation module 12, the image modulation module 12 being securely connected to the heat dissipation module 11. The image processing module 1 is located on one side of the main body 2. The main body 2 has a first limiting member 21, and the heat dissipation module 11 has a second limiting member 113. The first limiting member 21 and the second limiting member 113 cooperate to form a defined space between the heat dissipation module 11 and the main body 2, and at least a portion of the image modulation module 12 is located within the defined space.

[0054] In the embodiments of this application, reference is made to Figure 2The image generating device includes an image processing module 1, which comprises a heat dissipation module 11 and an image modulation module 12, with the image modulation module 12 securely connected to the heat dissipation module 11. The main function of the heat dissipation module 11 is to ensure effective heat dissipation during image processing, preventing overheating from damaging the device's performance. The image modulation module 12 is responsible for modulating corresponding image signals based on the processed image data for subsequent display. Based on the function of the image modulation module 12, this embodiment specifically emphasizes that during the installation of the image generating device, the image modulation module 12 needs to be confined within this defined space to ensure its installation accuracy.

[0055] For example, the image modulation module 12 and the heat dissipation module 11 can be connected by fasteners. For example, the fasteners can be screws.

[0056] Reference Figure 1 The image processing module 1 is located on one side of the main body 2 to receive the color-combined light for display. Exemplarily, the illumination modulation module 5 (including a light-diffusing element, a reflective element, a lens group, and a color-combining prism) can be disposed inside the main body 2. The illumination modulation module 5 receives the collimated light emitted from the illumination module 3 and modulates the collimated light. The location of the illumination modulation module 5 inside the main body 2 and the location of the image processing module 1 on one side of the main body 2 facilitate the image processing module 1's reception of light.

[0057] In the embodiments of this application, reference is made to Figure 3 To ensure the precise installation of all components within the image generating device, particularly the accurate assembly of the image modulation module 12 in the image processing module 1, a first limiting component 21 is designed on the main body 2, and a second limiting component 113 is correspondingly configured on the heat dissipation module 11. These two sets of limiting components work together to define a fixed, defined space between the heat dissipation module 11 and the main body 2. When other key components of the image generating device (excluding the heat dissipation module 11 itself) are securely connected to the heat dissipation module 11 using fasteners, these components, especially at least a portion of the image modulation module 12, will be constrained within this fixed, defined space, thereby ensuring the high-precision assembly and stable operation of the entire device.

[0058] Specifically, the defined space provides a clear installation position and range for the image modulation module 12, restricting its movement and deflection during installation. The limiting component design ensures that the image modulation module 12 can be quickly and accurately positioned at the predetermined location during installation, reducing errors caused by installation or adjustment.

[0059] During the complex assembly process, installation errors of each component can accumulate, leading to a decrease in the overall accuracy of the final device. When other key components of the image generating device (excluding the heat dissipation module 11 itself) are all confined within a limited space, the cumulative errors caused by improper installation can be effectively reduced, thereby improving the accuracy and stability of the entire image generating device.

[0060] In a specific example of installing the image generating device, a pre-tightening step is first taken to initially fix the various components within the device together. Subsequently, using two limiting components—the first limiting component 21 and the second limiting component 113—between the heat dissipation module 11 and the main body 2, the heat dissipation module 11 and the main body 2 are assembled together, thereby creating a precisely defined space. Within this defined space, all key components of the image generating device, except for the heat dissipation module 11, are securely contained and constrained.

[0061] Next, fasteners are used to further enhance the stability of the entire device, firmly securing all components together. This step not only strengthens the overall structural integrity of the device but also significantly reduces cumulative errors that may occur during installation through the dual constraint of the fasteners and the defined space. This design not only improves installation accuracy but also ensures the stability and reliability of the image generation device during long-term use.

[0062] Therefore, in this embodiment, limiting components are formed on the heat dissipation module 11 and the main body 2. The cooperation of the two limiting components defines a fixed area. When assembling other components of the image generating device (especially the image modulation module 12), the other components of the image generating device are all limited within this limited space. This can restrict the movement or deflection of other components (especially the image modulation module 12) during the installation process, improve installation accuracy, reduce cumulative errors, and improve the display quality of the image generating device.

[0063] In one specific embodiment, refer to Figure 3 The first limiting part includes an extension of the main body 2 extending toward the heat dissipation module 11, and a limiting groove is formed on the surface of the extension opposite to the heat dissipation module 11; the second limiting part is a protrusion of the heat dissipation module 11 extending toward the main body 2, and the protrusion is embedded in the limiting groove.

[0064] In this embodiment, when the heat dissipation module 11 is assembled with the main body 2, the protrusion naturally slides into the limiting groove, forming a tight and stable connection. This connection not only ensures the relative positional accuracy between the heat dissipation module 11 and the main body 2, but also effectively prevents loosening or displacement that may occur during use.

[0065] In a specific example of installing the image generating device, the various components of the device are first initially secured with fasteners to ensure their relative positions are initially stable. Then, the main body 2 is moved toward the heat dissipation module 11. During this process, the extension designed on the main body 2 gradually approaches the heat dissipation module 11 until its limiting groove perfectly matches the protruding part on the heat dissipation module 11, i.e., the protruding part is embedded in the limiting groove.

[0066] At this point, the main body 2 and the heat dissipation module 11 are installed in place and together form a structure with a defined space. Within this defined space, other key components of the image generating device (except for the heat dissipation module 11) are accommodated and fixed.

[0067] Finally, we used fasteners again to secure the various components of the image generation device, ensuring that the connections between them were both strong and stable.

[0068] It should be noted that the structures of the first limiting component 21 and the second limiting component 113 include, but are not limited to, the structures defined above. Those skilled in the art can adjust the structures of the first limiting component 21 and the second limiting component 113 according to the specific structure and setting position of the heat dissipation module 11 and the main body 2.

[0069] In one embodiment, refer to Figure 1 and Figure 2 The image modulation module 12 includes a circuit board 121, which is located within the defined space and is connected to the heat dissipation module 11 by fasteners.

[0070] At least a portion of the end of the circuit board 121 is recessed to form a clearance portion, and at least a portion of the extension is located within the clearance portion.

[0071] In this embodiment, the image modulation module 12 includes a circuit board 121, and the circuit board 121 and the heat dissipation module 11 are connected together by fasteners. For example, the fasteners can be screws or the like.

[0072] In the assembly of the image generating device, the circuit board 121 is located within the limited space defined by the heat dissipation module 11 and the main body 2. This not only optimizes the internal layout of the device, but also effectively controls and limits the processing error of the circuit board 121, ensuring its reliability during the assembly process.

[0073] Furthermore, to ensure smooth engagement between the main body 2 and the two limiting components on the heat dissipation module 11, at least a portion of the end of the circuit board 121 is designed to be recessed, forming a clearance portion. This allows at least a portion of the extension to be embedded within the clearance portion, thereby ensuring both the fitting accuracy of the limiting components and avoiding interference between the circuit board 121 and the limiting components, thus ensuring the compactness of the entire image generating device structure and the reliability of its function.

[0074] In one embodiment, refer to Figure 1 and Figure 2 The image modulation module 12 includes a circuit board 121 located within the defined space. The circuit board 121 is connected to the heat dissipation module 11 by fasteners, and an elastic component 13 is provided between the circuit board 121 and the heat dissipation module 11.

[0075] In this embodiment, the circuit board 121 is not only tightly connected to the heat dissipation module 11 by fasteners, but also has an elastic component 13 between them. This utilizes the buffering effect of the elastic component 13 to effectively reduce installation errors, thereby ensuring the installation stability and operational reliability of the image modulation module 12.

[0076] Specifically, during installation, due to various factors (such as machining accuracy and assembly process), there may be certain installation errors or stress concentrations between the circuit board 121 and the heat dissipation module 11. The elastic component 13 can effectively buffer and absorb these stresses, thereby reducing installation errors caused by stress concentration.

[0077] Furthermore, the circuit board 121 is confined within a fixed area, and the elastic member 13 is also confined within this confined space. For example, the compression of the elastic member 13 can press the circuit board 121 tightly, reducing problems such as poor display of the image generating device.

[0078] For example, the elastic component 13 includes, but is not limited to, a spring, an elastic rubber block, or a metal spring.

[0079] In one specific embodiment, refer to Figure 2 The heat dissipation module 11 has a receiving hole 112 formed on the surface facing the circuit board 121, and at least a portion of the elastic member 13 is located in the receiving hole 112; the circuit board 121 abuts against the elastic member 13.

[0080] In this embodiment, the heat dissipation module 11 has receiving holes 112 on its surface facing the circuit board 121. These receiving holes 112 can be countersunk holes. The shape and size of these receiving holes 112 match the elastic member 13 to ensure that the receiving holes 112 and the elastic member 13 can cooperate. In actual installation, at least a portion of the elastic member 13 is embedded in the receiving hole 112, forming a stable and somewhat elastic connection structure. Exemplarily, one end of the elastic member 13 can be fixed within the receiving hole 112.

[0081] During the assembly process of circuit board 121, circuit board 121 is tightly abutted against these elastic components 13. Through the buffering effect of elastic components 13, the installation error of circuit board 121 can be adjusted, effectively reducing installation error and improving the display effect of image generating device.

[0082] In a further embodiment, refer to Figure 2 The image modulation module 12 further includes an image processing chip 122, at least a portion of which is located within the defined space. The image processing chip 122 is disposed on the circuit board 121 and electrically connected to the circuit board 121.

[0083] The circuit board 121 has a through hole 1210, and at least a portion of the image processing chip 122 corresponds to the through hole 1210. The image modulation module 12 also includes a heat-conducting component 14, one side of which contacts the image processing chip 122 corresponding to the through hole 1210, and the other side of which contacts the heat dissipation module 11.

[0084] In this embodiment, the image modulation module 12 not only includes the circuit board 121, but also integrates an image processing chip 122. The image processing chip 122 is disposed on the circuit board 121 and electrically connected to the circuit board 121, thereby enabling efficient processing of image data.

[0085] To further optimize the thermal management performance of the image modulation module 12, vias 1210 are specially provided on the circuit board 121. The positions of these vias 1210 correspond to certain areas of the image processing chip 122, facilitating subsequent heat dissipation design.

[0086] In addition, a heat-conducting component 14 is introduced. One side of the heat-conducting component 14 is in close contact with the portions of the image processing chip 122 that correspond to the through holes 1210, ensuring efficient heat conduction. The other side forms a stable contact with the heat dissipation module 11, rapidly dissipating the heat generated by the image processing chip 122.

[0087] In this embodiment, not only is the heat conduction efficiency of the image modulation module 12 significantly improved, but the operating temperature of the image processing chip 122 is also effectively reduced, thereby extending its service life and improving the overall image processing performance and stability.

[0088] For example, the thermally conductive component 14 is thermally conductive silicone. The thermally conductive silicone serves as a connection bridge between the image processing chip 122 and the heat dissipation module 11, and the thermally conductive silicone is also confined within a defined space. In this way, the image processing chip 122 can press the thermally conductive silicone tightly, which can improve the heat conduction efficiency while reducing the installation error between the image modulation module 12 and the heat dissipation module 11.

[0089] For example, refer to Figure 3 At least a portion of the image processing chip 122 is located within a defined space. A clearance hole is provided at a position corresponding to the image processing chip 122 in the main body. Another portion of the image processing chip 122 is located within the clearance hole. This reduces installation errors and avoids stress concentration on the image processing chip 122 that could damage the chip. Furthermore, the fact that a portion of the image processing chip 122 is located within the clearance hole facilitates the transmission of light from the image processing chip 122 to the projection lens 4.

[0090] In another specific embodiment, refer to Figure 2 In order to facilitate contact between the other side of the heat-conducting component 14 and the heat dissipation module 11, a heat-conducting protrusion 111 is formed on the surface of the heat dissipation module 11 facing the circuit board 121. At least a portion of the heat-conducting protrusion 111 is located in the through hole 1210, and the other side of the heat-conducting component 14 contacts the heat-conducting protrusion 111.

[0091] In this embodiment, the heat conduction path of the image modulation module 12 is further optimized. To ensure that the other side of the heat-conducting component 14 can make closer and more effective contact with the heat dissipation module 11, a heat-conducting protrusion 111 is provided on the surface of the heat dissipation module 11 facing the circuit board 121.

[0092] For example, the shape and size of the thermally conductive protrusion 111 match the through-hole 1210 of the circuit board 121 to ensure that the thermally conductive protrusion 111 can be embedded in the corresponding through-hole 1210 on the circuit board 121. In addition, the material of the thermally conductive protrusion 111 can also be a material with high thermal conductivity, thereby maximizing the heat conduction efficiency.

[0093] During actual installation, one side of the heat-conducting component 14 is in close contact with the image processing chip 122, while the other side forms a stable contact with the heat-conducting protrusion 111 on the heat dissipation module 11. This design not only ensures that heat can be quickly transferred from the image processing chip 122 to the heat dissipation module 11 through the heat-conducting component 14, but also, through the guidance of the heat-conducting protrusion 111, allows the heat to be distributed more evenly on the surface of the heat dissipation module 11, thereby improving the overall heat dissipation effect.

[0094] Furthermore, during the installation of the image modulation module 12, the heat-conducting protrusion 111 is embedded in the through hole 1210, which to a certain extent ensures the installation accuracy of both the image modulation module 12 and the heat dissipation module 11, reducing installation errors. In addition, the heat-conducting protrusion 111 embedded in the through hole 1210 increases the structural stability of the image modulation module 12 to a certain extent, reducing the risk of loosening or damage to the connection due to factors such as vibration or impact.

[0095] In one embodiment, refer to Figure 2 The image modulation module 12 further includes a first elastic sealing part 15, which is sleeved on the heat-conducting protrusion 111, and at least a portion of the circuit board 121 abuts against the first elastic sealing part 15.

[0096] In this embodiment, the first elastic sealing part 15 is sleeved outside the heat-conducting protrusion 111 and located between the heat dissipation module 11 and the circuit board 121, thereby sealing the heat dissipation module 11 and the circuit board 121. For example, the first elastic sealing part 15 is a sealing foam.

[0097] During the installation of the image generating device, both the circuit board 121 and the first elastic sealing part 15 are placed within the defined space formed by the heat dissipation module 11 and the main body 2. This not only ensures that the circuit board 121 can fit tightly against and moderately compress the first elastic sealing part 15, but also utilizes the compression and rebound characteristics of the first elastic sealing part 15 to effectively compensate for and optimize any possible installation deviations and processing accuracy errors between the circuit board 121 and the heat dissipation module 11.

[0098] In one embodiment, refer to Figure 2 The image modulation module 12 further includes a second elastic sealing part 16, which is located between the circuit board 121 and the image processing chip 122.

[0099] In this embodiment, a second elastic sealing portion 16 is provided between the circuit board 121 and the image processing chip 122, which seals the circuit board 121 and the image processing chip 122. Exemplarily, the second elastic sealing portion 16 is a sealing foam.

[0100] During the installation of the image generating device, both the circuit board 121 and the image processing chip 122 are placed within the defined space formed by the heat dissipation module 11 and the main body 2. This not only ensures that the image processing chip 122 can fit tightly against and moderately compress the second elastic sealing part 16, but also utilizes the compression and rebound characteristics of the second elastic sealing part 16 to effectively compensate for and optimize any possible installation deviations and processing accuracy errors between the circuit board 121 and the image processing chip 122.

[0101] In one embodiment, refer to Figure 4 and Figure 5 The image generating device further includes an illumination module 3, which includes at least one illumination module 31;

[0102] The lighting module 31 includes a fixed bracket 30, and a light source 311, a collimating lens group 312 and a beam splitter 313 arranged sequentially along the light transmission direction;

[0103] The light source 311, the collimating lens group 312, and the beam splitter 313 are all mounted on the fixed bracket 30.

[0104] In this embodiment, the image generating device includes at least one illumination module 3. For example, the image generating device may include one illumination module 31, two illumination modules 31, or three illumination modules 31. The illumination modules 31 in the image generating device are all separate modules.

[0105] Each lighting module 31 integrates three main components: a light source 311, a collimating lens group 312, and a beam splitter 313. All these components are mounted on the same fixed bracket 30. Specifically, by controlling the machining precision of this fixed bracket 30, we can achieve precise positioning of the light source 311, collimating lens group 312, and beam splitter 313 on the same bracket, ensuring their coaxial arrangement. This not only improves assembly convenience but also effectively reduces the potential tolerance accumulation problems between multiple independent components by unifying them under a single fixed bracket 30, thereby optimizing overall optical performance and assembly precision.

[0106] Furthermore, by controlling the machining precision of the single fixed bracket 30, the light source 311, collimating lens group 312, and beam splitter 313 are integrated onto this bracket, achieving a coaxial arrangement of the three components. This ensures that the light emitted by the lighting module 3 can enter the light homogenizing system with maximum efficiency, thereby significantly improving the light homogenizing effect and optimizing the distribution and uniformity of the light.

[0107] For example, the light source 311 can be a red light source 311, a blue light source 311, or a green light source 311.

[0108] For example, the light source 311 can be an LED light source 311 or an LCD light source 311.

[0109] For example, the collimating lens group 312 includes a first collimating lens and a second collimating lens.

[0110] In one embodiment, refer to Figure 5 The fixed bracket 30 includes: a mounting panel 301, on which the light source 311 is disposed; two mounting brackets 302, which are spaced apart along a first direction and connected to the mounting panel 301, each mounting bracket 302 having a stepped surface, on which the collimating lens group 312 is disposed; each mounting bracket 302 having a bearing inclined surface, on which the beam-splitting reflector 313 is disposed; the first direction is perpendicular to the light transmission direction.

[0111] In this embodiment, the mounting bracket 30 mainly consists of a mounting panel 301 and two mounting brackets 302. The mounting panel 301 is used to securely mount the light source 311, ensuring that the light source 311 can be stably mounted and emit light. The two mounting brackets 302 are spaced apart along a first direction perpendicular to the light transmission direction, and both are reliably connected to the mounting panel 301. This not only ensures the stability of the structure but also facilitates the installation and positioning of subsequent components.

[0112] Each mounting bracket 302 is designed with a stepped surface. This stepped surface is specifically designed for mounting the collimating lens assembly 312, ensuring that the collimating lens assembly 312 can be accurately placed in the predetermined position, thereby achieving effective collimation of light.

[0113] In addition, each mounting bracket 302 is provided with a support ramp. This support ramp is specifically designed for mounting the beam splitter 313. The beam splitter 313 can be stably placed on the support ramp and its angle can be adjusted as needed to achieve the functions of light reflection and beam splitting.

[0114] This structural design ensures that the light source 311, collimating lens group 312, and beam splitter 313 can be stably and accurately mounted on the fixed bracket 30, and their relative positional relationship is effectively controlled, avoiding problems such as insufficient brightness and vignetting in the image projected by the image generating device.

[0115] In one embodiment, refer to Figure 5The lighting module 3 includes at least two lighting modules 31, which are arranged along the first direction, and the mounting panels 301 of the at least two lighting modules 31 are on the same plane.

[0116] In this embodiment, each lighting module 31 includes a mounting panel 301, and all the mounting panels 301 of all the lighting modules 31 are on the same plane. This ensures that the light emitted by each lighting module 31 can be superimposed and mixed on the same horizontal plane, thereby further improving the lighting effect and light uniformity of the entire lighting module 3.

[0117] This application also provides a head-up display (HUD). The HUD includes the image generating device as described above. The image generating device provided in this application is used in a HUD, which can improve the installation accuracy of the HUD and ensure the image quality of the projected image.

[0118] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0119] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. An image generating apparatus, characterized in that, include: An image processing module (1) includes a heat dissipation module (11) and an image modulation module (12). The image modulation module (12) includes a circuit board (121). The circuit board (121) is connected to the heat dissipation module (11) by fasteners, and an elastic member (13) is provided between the circuit board (121) and the heat dissipation module (11). The heat dissipation module (11) has a receiving hole (112) formed on its surface facing the circuit board (121). At least a portion of the elastic member (13) is located in the receiving hole (112), and the elastic member (13) is a spring. The main body (2) has an image processing module (1) located on one side of the main body (2). The main body (2) has a first limiting member (21) and a heat dissipation module (11) has a second limiting member (113). The first limiting member (21) and the second limiting member (113) cooperate to form a defined space between the heat dissipation module (11) and the main body (2). The circuit board (121) is located within the defined space. The main body (2) and the heat dissipation module (11) are also connected by fasteners, wherein the specific installation method of the image generating device is as follows: The main body (2) and the heat dissipation module (11) are pre-connected by fasteners; then, the first limiting component (21) and the second limiting component (113) cooperate together to define the defined space, the circuit board (12) and the elastic component (13) are defined within the defined space, the circuit board (12) abuts against the elastic component (13), and the installation error of the circuit board (121) is adjusted by the buffering effect of the elastic component (13). Finally, the main body (2) and the heat dissipation module (11) are fastened together by the fasteners. The first limiting component (21) includes an extension portion extending from the main body portion (2) toward the heat dissipation module (11), and a limiting groove is formed on the surface of the extension portion opposite to the heat dissipation module (11); The second limiting component (113) is a protrusion extending from the heat dissipation module (11) toward the main body (2), and the protrusion is embedded in the limiting groove; At least a portion of the end of the circuit board (121) is recessed to form a clearance portion, and at least a portion of the extension is located within the clearance portion.

2. The image generating apparatus according to claim 1, characterized in that, The image modulation module (12) further includes an image processing chip (122), at least a portion of which is located within the defined space. The image processing chip (122) is disposed on the circuit board (121) and electrically connected to the circuit board (121). The circuit board (121) has a through hole (1210), and at least a portion of the image processing chip (122) corresponds to the through hole (1210). The image modulation module (12) also includes a heat-conducting component (14), one side of which contacts the image processing chip (122) corresponding to the through hole (1210), and the other side of which contacts the heat dissipation module (11).

3. The image generating apparatus according to claim 2, characterized in that, The heat dissipation module (11) has a heat-conducting protrusion (111) formed on the surface facing the circuit board (121). At least a portion of the heat-conducting protrusion (111) is located in the through hole (1210), and the other side of the heat-conducting component (14) is in contact with the heat-conducting protrusion (111).

4. The image generating apparatus according to claim 3, characterized in that, The image modulation module (12) further includes a first elastic sealing part (15), which is sleeved on the heat-conducting protrusion (111), and at least a portion of the circuit board (121) abuts against the first elastic sealing part (15).

5. The image generating apparatus according to claim 3, characterized in that, The image modulation module (12) further includes a second elastic sealing part (16), which is located between the circuit board (121) and the image processing chip (122).

6. The image generating apparatus according to any one of claims 1-5, characterized in that, The image generating device further includes an illumination module (3), which includes at least one illumination module (31). The lighting module (31) includes a fixed bracket (30), and a light source (311), a collimating lens group (312), and a beam splitter (313) arranged sequentially along the light transmission direction. The light source (311), the collimating lens group (312), and the beam splitter (313) are all mounted on the fixed bracket (30).

7. The image generating apparatus according to claim 6, characterized in that, The fixed bracket (30) includes: Mounting panel (301), the light source (311) is disposed on the mounting panel (301). Two mounting brackets (302) are spaced apart along a first direction and are both connected to the mounting panel (301). Each mounting bracket (302) has a stepped surface, and the collimating lens group (312) is disposed on the stepped surface. Each of the mounting brackets (302) is formed with a bearing slope, and the beam splitter (313) is disposed on the bearing slope; the first direction is a direction perpendicular to the light transmission direction.

8. The image generating apparatus according to claim 7, characterized in that, The lighting module (3) includes at least two lighting modules (31), which are arranged along the first direction, and the mounting panels (301) of the at least two lighting modules (31) are on the same plane.

9. A heads-up display, characterized in that, The head-up display includes an image generating device as claimed in any one of claims 1-8.

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