A heat dissipation system, a chip module and an electronic device

Abstract

The embodiment of the present application provides a heat dissipation system, a chip module and electronic equipment, the heat dissipation system comprises: a heat spreading layer, the heat spreading layer is in contact with a chip, the heat spreading layer comprises a medium phase change structure, and the medium phase change structure is filled with circulating flowing phase change heat conducting medium;The phase change of the phase change heat conducting medium is used for diffusing the heat of the chip;The interlayer is connected with the heat spreading layer and the heat exchange layer, and the heat absorbed by the phase change heat conducting medium is conducted to the heat exchange layer;The heat exchange layer is used for heat exchange with cooling medium to take away heat.The heat dissipation system provided by the embodiment of the present application can improve the heat dissipation effect of the chip and improve the operation performance of the chip.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, specifically to a heat dissipation system, a chip module, and an electronic device. Background Technology

[0002] During chip operation, a heat dissipation system can dissipate the heat generated by the chip. However, with the increasing integration and power consumption of chips, the heat dissipation requirements are also constantly increasing. Therefore, how to provide a heat dissipation system to improve the heat dissipation effect and enhance the chip's operating performance has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0003] In view of this, embodiments of this application provide a heat dissipation system, a chip module, and an electronic device to improve the heat dissipation effect of the chip and enhance its operating performance.

[0004] To achieve the above objectives, the embodiments of this application provide the following technical solutions.

[0005] In a first aspect, embodiments of this application provide a heat dissipation system, including:

[0006] A heat dissipation layer is in contact with the chip. The heat dissipation layer includes a dielectric phase change structure, which is filled with a circulating phase change thermally conductive medium. The phase change of the phase change thermally conductive medium is used to dissipate the heat of the chip.

[0007] The intermediate layer connects the heat expansion layer and the heat exchange layer, and conducts the heat absorbed by the phase change thermal medium from the chip to the heat exchange layer;

[0008] The heat exchange layer removes heat by exchanging heat with the cooling medium.

[0009] Optionally, the phase change structure includes at least an evaporation zone, a condensation zone, and a transfer zone between the evaporation zone and the condensation zone; the evaporation zone is used to conduct heat from the chip, changing the phase change heat transfer medium from a liquid state to a gaseous state; the transfer zone is used to transfer the gaseous phase change heat transfer medium from the evaporation zone to the condensation zone; the temperature of the condensation zone is lower than the temperature of the evaporation zone, and it is used to change the gaseous phase change heat transfer medium into a liquid state.

[0010] The heat expansion layer also includes a reflux zone, which is used to reflux the liquid phase change heat transfer medium from the condensation zone to the evaporation zone.

[0011] Optionally, the heat expansion layer further includes a support structure, which is supported between the evaporation zone and the condensation zone.

[0012] Optionally, the number of support structures is multiple, and the reflux zone is disposed in at least a portion of the multiple support structures. The reflux zone includes a first capillary structure, the first capillary structure includes a first surface layer structure in the reflux zone, and a plurality of through holes disposed in the first surface layer structure.

[0013] Optionally, the plurality of support structures include a first support structure and a second support structure; wherein the sidewall of the first support structure is provided with the first capillary structure, and the sidewall of the second support structure is not provided with the first capillary structure.

[0014] Optionally, the first support structure and the second support structure are arranged at intervals according to a set number.

[0015] Optionally, the evaporation zone is provided with a second capillary structure, the second capillary structure including a second surface layer structure in the evaporation zone, and a plurality of through holes provided in the second surface layer structure;

[0016] The condensation zone is provided with a third capillary structure, which includes a third surface layer structure in the condensation zone and a plurality of through holes disposed in the third surface layer structure.

[0017] The number of through-holes in the third capillary structure, the first capillary structure, and the second capillary structure increases sequentially.

[0018] Optionally, the second capillary structure provided in the evaporation zone includes: a first capillary structure and a second capillary structure, wherein the second capillary structure is located above the first capillary structure; the number of through holes in the second capillary structure is greater than the number of through holes in the first capillary structure, and the thickness of the second capillary structure is less than the thickness of the first capillary structure.

[0019] Optionally, the height of the support structure is determined based on the heat transfer efficiency of the medium phase change structure, wherein the heat transfer efficiency is negatively correlated with the height of the support structure.

[0020] Optionally, the intermediate layer includes an intermediate layer body, the first surface of which is the condensation zone of the heat expansion layer, and the second surface of which is the heat exchange layer for heat exchange.

[0021] Optionally, the heat expansion layer has a base plate in contact with the chip; the intermediary layer further includes: an intermediary layer support pillar, which is connected to both ends of the base plate to form a space surrounded by the intermediary layer and the base plate; the dielectric phase change structure is disposed on the base plate and is located in the space surrounded by the intermediary layer and the base plate.

[0022] Optionally, the heat exchange layer includes:

[0023] A heat sink, which is used to exchange heat with a cooling medium to remove the heat conducted by the interlayer;

[0024] Cooling medium inlet and outlet pipelines include the cooling medium inlet pipeline and the cooling medium outlet pipeline.

[0025] Optionally, the heat exchange layer further includes a cover plate, which includes a cover plate surface and a cover plate support column; the cover plate support column is connected to the end of the second surface of the intermediate layer body to form a sealed cavity surrounded by the cover plate surface, the cover plate support column and the second surface of the intermediate layer body, and the heat sink is placed in the sealed cavity.

[0026] The inlet pipe and the outlet pipe are located on the cover plate; the cooling medium is driven by an external water pump, enters the sealed cavity through the inlet pipe, flows through the heat sink and then flows out through the outlet pipe.

[0027] Secondly, embodiments of this application provide a chip module, including at least one chip and a heat dissipation system as described in the first aspect above.

[0028] Thirdly, embodiments of this application provide an electronic device, which includes the chip module as described in the second aspect above.

[0029] The heat dissipation system provided in this application includes: a heat expansion layer that contacts the chip, the heat expansion layer including a dielectric phase change structure filled with a circulating phase change thermally conductive medium; the phase change of the phase change thermally conductive medium is used to diffuse the heat of the chip; an intermediate layer connecting the heat expansion layer and the heat exchange layer, conducting the heat absorbed by the phase change thermally conductive medium from the chip to the heat exchange layer; and a heat exchange layer that removes heat by exchanging heat with a cooling medium.

[0030] As can be seen, in the heat dissipation system provided in this application embodiment, the heat expansion layer is in contact with the chip and can conduct the heat generated by the chip. At the same time, the heat expansion layer is provided with a medium phase change structure, which is filled with a circulating phase change thermally conductive medium. The phase change thermally conductive medium can absorb the heat from the chip conducted by the heat expansion layer and change from liquid to gas. The phase change process of the phase change thermally conductive medium from liquid to gas can absorb the heat from the chip, thereby helping to diffuse and transfer the heat of the chip in a short time and avoid the chip temperature from rising. After the phase change thermally conductive medium absorbs heat and vaporizes, it is condensed back to liquid under the synergistic effect of the intermediate layer and the heat exchange layer. The intermediate layer, as a bridge connecting the heat expansion layer and the heat exchange layer, can conduct the heat released during the process of the phase change thermally conductive medium changing from gas to liquid to the heat exchange layer, thereby avoiding heat retention in the heat expansion layer and making the heat distribution in the heat dissipation system more uniform. Furthermore, after receiving heat, the heat exchange layer exchanges heat with the cooling medium, which can carry away the heat and dissipate the heat of the chip to the outside. Through the layer-by-layer heat conduction and the circulation of the phase change heat transfer medium, the heat dissipation system provided in this application embodiment can improve the heat exchange efficiency at each level of the heat expansion layer, the intermediate layer, and the heat exchange layer, quickly dissipate the heat generated by the chip to the outside, effectively reduce the chip temperature, thereby improving the heat dissipation effect of the chip and enhancing the stability and operating performance of the chip. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0032] Figure 1 This is a structural example diagram of a water-cooled plate;

[0033] Figure 2 This is a structural example diagram of the chip heat dissipation system provided in the embodiments of this application;

[0034] Figure 3 This is an example diagram of a combined structure of a heat-expanding layer and an interlayer;

[0035] Figure 4 This is a magnified example of a medium phase transition structure.

[0036] Figure 5 This is an example diagram of the supporting structure;

[0037] Figure 6 This is an example diagram of the capillary structure in the evaporation zone;

[0038] Figure 7 This is a structural example diagram of the intermediary layer;

[0039] Figure 8 This is an example diagram of a combined structure of an intermediary layer and a heat sink;

[0040] Figure 9 This is a structural example diagram of the heat exchange layer;

[0041] Figure 10 This is an example diagram of another optional structure of the chip heat dissipation system provided in the embodiments of this application;

[0042] Figure 11 This is an example diagram of an optional structure of the chip module provided in the embodiments of this application. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] With the development of electronic technology, the integration of chips is getting higher and higher, and the number of transistors contained in a unit area of ​​the chip is increasing, which in turn leads to higher and higher power consumption of the chip. If the heat generated by the chip cannot be dissipated in time, it will seriously affect the performance of the chip. Therefore, a heat dissipation system can be set up for the chip to dissipate the heat generated by the chip during operation.

[0045] A heat dissipation system capable of cooling a chip can be a water-cooling system, that is, a heat dissipation system that uses water or other coolants as the cooling medium. A water-cooling system can be, for example, a water-cooled plate. The water-cooled plate dissipates heat generated by the chip by the flow of coolant (e.g., water) inside the plate. Specifically, Figure 1 This is a structural example diagram of a water-cooled plate, please refer to it. Figure 1 The water-cooled plate includes a base plate 101, a heat sink 102, and coolant inlet / outlet pipes 103. The base plate 101 is in direct contact with the chip, and the heat from the chip can be transferred to the heat sink 102 through the base plate 101. The coolant flowing into the coolant inlet / outlet pipes 103 can exchange heat with the heat sink 102, thereby removing the heat from the chip. Furthermore, the water-cooled plate can be driven by an external water pump to circulate the coolant, thereby continuously dissipating heat from the chip through the circulation of the coolant.

[0046] While the aforementioned water-cooled plate-type heat dissipation system can achieve chip cooling, the relatively thick base of the water-cooled plate makes it less suitable for chips with high heat flux densities (e.g., heat flux densities exceeding 150 W / cm²). 2The water-cooled plate cannot dissipate the heat from the chip in time, resulting in poor heat dissipation and affecting the chip's operating performance.

[0047] In view of this, embodiments of this application provide a heat dissipation system that can improve heat exchange efficiency, thereby improving the heat dissipation effect of the chip and improving the chip's operating performance.

[0048] Figure 2 This is a structural example diagram of the chip heat dissipation system provided in the embodiments of this application, referring to... Figure 2 The heat dissipation system includes the following components.

[0049] A heat-expanding layer 100 is in contact with the chip 101. The heat-expanding layer includes a dielectric phase change structure 110, which is filled with a circulating phase change thermally conductive medium. The phase change of the thermally conductive medium is used to diffuse the heat of the chip. Specifically, when the thermally conductive medium changes from a liquid state to a gaseous state, it absorbs the heat of the chip, and when it changes from a gaseous state to a liquid state, it releases the heat.

[0050] Intermediate layer 200 connects heat expansion layer 100 and heat exchange layer 300, and conducts the heat absorbed by the phase change thermal medium from the chip to heat exchange layer 300.

[0051] The heat exchange layer 300 removes heat by exchanging heat with the cooling medium.

[0052] In this embodiment, the heat dissipation system consists of a three-layer structure: a heat expansion layer, an intermediary layer, and a heat exchange layer. The heat expansion layer, which is in contact with the chip, includes a dielectric phase change structure filled with a circulating phase change thermally conductive medium. This phase change thermally conductive medium has good thermal conductivity, and its phase change and circulation help the chip quickly dissipate heat. Furthermore, through the intermediary layer connecting the heat expansion layer and the heat exchange layer, the heat from the chip diffused by the phase change thermally conductive medium can be conducted to the heat exchange layer, where it exchanges heat with the cooling medium to dissipate the chip's heat outward. This improves the heat exchange efficiency between the chip and the cooling medium, enhances the chip's heat dissipation effect, and improves the chip's operating performance.

[0053] Specifically, the heat expansion layer contacts the chip and conducts the heat generated by the chip. Simultaneously, the heat expansion layer incorporates a phase change structure filled with a circulating phase change thermally conductive medium. This medium absorbs the heat from the chip conducted by the heat expansion layer, changing from a liquid to a gaseous state. This phase change process helps to diffuse and transfer the chip's heat quickly, preventing the chip temperature from rising. After absorbing heat and vaporizing, the phase change thermally conductive medium is condensed back into a liquid state under the synergistic effect of the intermediate layer and the heat exchange layer. The intermediate layer, acting as a bridge between the heat expansion layer and the heat exchange layer, conducts the heat released during the phase change process to the heat exchange layer, preventing heat from remaining in the heat expansion layer and resulting in a more uniform heat distribution within the cooling system. Finally, after receiving heat, the heat exchange layer exchanges heat with the cooling medium, carrying away the heat and dissipating it outwards from the chip. Through the layer-by-layer heat conduction and the circulation of the phase change heat transfer medium, the heat dissipation system provided in this application embodiment can improve the heat exchange efficiency at each level of the heat expansion layer, the intermediate layer, and the heat exchange layer, quickly dissipate the heat generated by the chip to the outside, effectively reduce the chip temperature, thereby improving the heat dissipation effect of the chip and enhancing the stability and operating performance of the chip.

[0054] During the chip heat dissipation process in this application embodiment, the phase change thermal conductive medium can absorb the heat of the chip, change from liquid to gas, thereby dissipating the heat of the chip, and then change from gas to liquid under the synergistic effect of the intermediate layer and the heat exchange layer, releasing the heat; furthermore, this application embodiment supports the circulation of the phase change thermal conductive medium through structural design, thereby reducing energy consumption.

[0055] In an optional example, the phase change heat transfer medium may include one of pure water, ethylene glycol solution, fluorinated liquid, and Freon.

[0056] Figure 3 This is an example diagram of a combined structure of a heat-expanding layer and an intermediate layer. Figure 4 This is a magnified example of a dielectric phase transition structure. The following is a combination of... Figures 2 to 4 The heat-expanding layer in the embodiments of this application will be described in detail.

[0057] The heat expansion layer 100 has a base plate 120 that is in direct contact with the chip 101, and a dielectric phase change structure 110 disposed on the base plate 120; the intermediate layer 200 includes an intermediate layer body 210 and an intermediate layer support pillar 220, the intermediate layer support pillar 220 being connected to both ends of the base plate 120 to form a space surrounded by the intermediate layer 200 and the base plate 120, and the dielectric phase change structure 110 being located in the space surrounded by the intermediate layer and the base plate.

[0058] In this embodiment, the heat-diffusing layer in contact with the chip adopts a dielectric phase change structure design. The heat of the chip is diffused and transferred through the phase change of the phase change heat-conducting medium filled in the dielectric phase change structure, which can effectively improve the heat exchange efficiency of the chip.

[0059] Specifically, refer to Figure 4 The medium phase change structure includes at least an evaporation zone 111, a condensation zone 113, and a transfer zone 112 between the evaporation zone and the condensation zone.

[0060] The evaporation zone 111 is used to conduct heat from the chip, changing the phase change heat transfer medium from a liquid state to a gaseous state; that is, the phase change heat transfer medium can absorb heat from the chip in the evaporation zone and change from a liquid state to a gaseous state.

[0061] Specifically, the transfer zone 112 is used to transfer the gaseous phase change heat transfer medium from the evaporation zone 111 to the condensation zone 113; the temperature of the condensation zone 113 is lower than the temperature of the evaporation zone 111, and it is used to change the gaseous phase change heat transfer medium into a liquid state; that is, because the temperature of the condensation zone is lower than the temperature of the evaporation zone, the phase change heat transfer medium will undergo a liquefaction reaction in the condensation zone, changing from a gaseous state to a liquid state, thereby releasing heat and realizing the diffusion and transfer of chip heat.

[0062] Furthermore, continue to refer to Figure 4 The heat expansion layer also includes a reflux zone 114. The phase change structure allows the phase change heat conduction medium within the structure to undergo a phase change, for example, the phase change heat conduction medium changes from liquid to gas to absorb heat from the chip, and then changes from gas to liquid to release heat, thereby achieving heat diffusion and transfer. The reflux zone 114 is used to convert the phase change heat conduction medium that has changed during the heat exchange process back to its original state used for heat exchange, for example, transferring the phase change heat conduction medium whose position has changed to the area originally used to absorb heat from the chip, thereby realizing the recycling of the phase change heat conduction medium and saving energy consumption.

[0063] In an optional implementation, the phase change heat transfer medium becomes liquid in the condensation zone. After completing the heat transfer of the chip, it can flow back from the condensation zone 113 to the evaporation zone 111 through the reflux zone 114, forming a circulating flow of the phase change heat transfer medium, realizing recycling, and thus improving the heat exchange efficiency of the chip.

[0064] Furthermore, continue to refer to Figure 4 The heat expansion layer further includes a support structure 115, which is supported between the evaporation zone 111 and the condensation zone 113.

[0065] In this embodiment, the support structure 115 can strengthen and fix the dielectric phase change structure; when the dielectric phase change structure is subjected to external mechanical pressure or pressure generated by the phase change of the internal phase change heat conduction medium, it can protect the dielectric phase change structure and avoid bulging, deformation, etc., thereby maintaining the flatness of the contact area between the heat expansion layer base plate and the chip.

[0066] In the optional implementation, refer to Figure 5 , Figure 5 This is an example diagram of a support structure. The number of support structures 115 can be multiple. The reflux zone 114 is disposed in at least a portion of the multiple support structures. The reflux zone 114 includes a first capillary structure 116. The first capillary structure includes a first surface layer structure in the reflux zone and multiple through holes disposed in the first surface layer structure.

[0067] In this embodiment of the application, in order to realize the circulating flow of the phase change heat transfer medium, a reflux zone is required for the liquid phase change heat transfer medium to return from the condensation zone to the evaporation zone. The reflux zone can be set in at least part of the multiple support structures, and the reflux zone includes a first capillary structure. That is, the reflux zone is located between the condensation zone and the evaporation zone, so that the phase change heat transfer medium can be refluxed from the condensation zone to the evaporation zone through the reflux zone.

[0068] In an optional implementation, some of the multiple support structures have the first capillary structure on their sidewalls; the multiple support structures may include a first support structure and a second support structure; wherein, the sidewall of the first support structure has the first capillary structure 116, and the sidewall of the second support structure does not have the first capillary structure.

[0069] The number of the first support structure and the number of the second support structure can be the same; in the space between the evaporation zone and the condensation zone, the first support structure and the second support structure are arranged at intervals according to a set number.

[0070] In an optional example, the first and second support structures can be arranged at equal intervals, for example, referring to... Figure 5 The first and second support structures can be arranged in pairs at intervals, which can precisely control the distribution of capillary traction force in the reflux zone, thereby controlling the flow path and speed of the liquid phase change heat transfer medium.

[0071] Furthermore, continue to refer to Figure 4 and Figure 5 Furthermore, referring to Figure 4The open area between the evaporation zone 111 and the condensation zone 113 supported by the support structure 115 is the transfer zone 112, which serves as the gas evaporation zone between the evaporation zone and the condensation zone. In other words, after the phase change heat transfer medium changes from liquid to gas in the evaporation zone, it evaporates to the condensation zone through the transfer zone between the evaporation zone and the condensation zone. A certain distance is generated between the evaporation zone and the condensation zone by the support structure. This distance is the transfer distance of the gaseous phase change heat transfer medium from the evaporation zone to the condensation zone.

[0072] The height of the support structure 115 can be determined based on the heat transfer efficiency of the medium phase change structure. The heat transfer efficiency is negatively correlated with the height of the support structure. That is, in this embodiment, the height of the support structure can be adjusted according to the heat transfer efficiency of the medium phase change structure. For example, if the heat transfer efficiency of the medium phase change structure is low, the height of the support structure can be reduced, thereby shortening the distance from the evaporation zone to the condensation zone for heat transfer of the phase change heat transfer medium, thereby improving the heat transfer efficiency of the medium phase change structure.

[0073] In one optional example, the height of the support column can range from 0.5mm to 1.5mm.

[0074] Furthermore, in this embodiment, both the evaporation zone 111 and the condensation zone 113 are provided with capillary structures, which can then be used to transfer heat and recycle the phase change heat transfer medium.

[0075] Specifically, continue to refer to Figure 4 and Figure 5 The evaporation zone 111 is provided with a second capillary structure 117, and the condensation zone 113 is provided with a third capillary structure 118. The second capillary structure includes a second surface layer structure in the evaporation zone and a plurality of through holes disposed in the second surface layer structure. The third capillary structure includes a third surface layer structure in the condensation zone and a plurality of through holes disposed in the third surface layer structure. Optionally, the third surface layer structure is disposed, for example, on the surface of the intermediate layer 200.

[0076] In an optional example, the through hole can be an aperture with a thickness and a predetermined shape (including but not limited to a square shape), which can fill the aperture of the evaporation zone 111 with phase change thermal conductive medium. The heat of the chip is transferred to the evaporation zone, and then the phase change thermal conductive medium in the evaporation zone absorbs heat and changes from liquid to gas, and evaporates from the aperture of the evaporation zone to the condensation zone; wherein, the gaseous phase change thermal conductive medium releases heat in the condensation zone and changes from gas to liquid, filling the entire condensation zone, thereby realizing the diffusion and transfer of chip heat.

[0077] Optionally, Figure 6This is an example diagram of the capillary structure of the evaporation zone, for reference. Figure 6 The second capillary structure 117 provided in the evaporation zone 111 may include: a first capillary structure 1171 and a second capillary structure 1172, wherein the second capillary structure 1172 is located above the first capillary structure 1171.

[0078] The number of through holes in the second capillary structure 1172 can be greater than the number of through holes in the first capillary structure 1171, and the thickness of the second capillary structure is less than the thickness of the first capillary structure.

[0079] In this embodiment, the evaporation zone can be configured with two capillary layers. When the phase change heat transfer medium undergoes a phase change in the evaporation zone, since the thickness of the first (lower) capillary layer is greater than the thickness of the second (upper) capillary layer, the phase change heat transfer medium that has not completely vaporized (not fully turned into a gaseous state) will be intercepted in the first capillary layer until it is completely vaporized. The phase change heat transfer medium that has completely turned into a gaseous state can overflow from the second capillary layer and evaporate to the condensation zone through the transfer zone. The number of through holes in the second capillary layer is greater than the number of through holes in the first capillary layer. At the same time, the size of each through hole in the second capillary layer is smaller than the size of each through hole in the first capillary layer. Thus, the second capillary layer can further improve the filtration effect on the gaseous phase change heat transfer medium.

[0080] In an optional example, the thickness of the first capillary layer 1171 can range from 0.1 mm to 0.15 mm, and the number of through holes per unit area can range from 100 to 150 (e.g., 100 through holes per square centimeter). The thickness of the second capillary layer 1172 can range from 0.05 mm to 0.075 mm, and the number of through holes per unit area can range from 200 to 300 (e.g., 200 through holes per square centimeter).

[0081] To ensure that the liquid phase change heat transfer medium can flow back from the condensation zone to the evaporation zone, the number of through holes in the capillary structure from the condensation zone, the reflux zone to the evaporation zone needs to be set appropriately.

[0082] In an optional implementation, the number of through holes in the capillary structure of the condensation zone, reflux zone, and evaporation zone increases sequentially, that is, the number of multiple through holes in the third capillary structure, the first capillary structure, and the second capillary structure increases sequentially, and the capillary traction force generated by the condensation zone, reflux zone, and evaporation zone increases sequentially, resulting in the circulation of the phase change heat transfer medium in the evaporation zone, reflux zone, and condensation zone.

[0083] In other words, from the condensation zone 113 and reflux zone 114 to the evaporation zone 111, the number of through-holes in the capillary structure increases sequentially. Consequently, the capillary traction force generated in the condensation zone 113, reflux zone, and evaporation zone 113 increases sequentially, causing the liquid phase change heat transfer medium to return from the condensation zone to the evaporation zone under the influence of the capillary traction force. Assuming the capillary traction force generated by the phase change heat transfer medium in the condensation zone is F1, in the reflux zone is F2, and in the evaporation zone is F3, then the magnitude relationship of the capillary traction forces in the three regions is F1. <F2<F3。

[0084] Furthermore, in this embodiment, by setting the medium phase change structure and the reflux zone, the phase change heat transfer medium can form a circulating flow of heating evaporation, condensation and reflux within the heat expansion layer, thereby achieving heat dissipation while saving energy consumption and improving heat exchange efficiency.

[0085] Figure 7 This is a structural example diagram of the intermediary layer. Figure 8 This is an example diagram of a combined structure of an interposer and a heatsink. The following is a combination of... Figure 7 and Figure 8 The intermediary layer in the embodiments of this application will be described in detail.

[0086] In this embodiment, the intermediate layer connects the heat expansion layer and the heat exchange layer, integrating the structures of two different heat dissipation methods into a whole, which can quickly conduct heat from the heat expansion layer to the heat exchange layer and improve heat exchange efficiency.

[0087] Specifically, the intermediate layer 200 includes an intermediate layer body 210 and an intermediate layer support column 220. The first surface of the intermediate layer body is the surface where the condensation zone 113 of the heat expansion layer is located, and the second surface of the intermediate layer body is the surface where the heat exchange layer performs heat exchange. The heat exchange layer may include a heat sink 310 for heat exchange. The intermediate layer connects the condensation zone 113 in the heat expansion layer and the heat sink 310 in the heat exchange layer, so that the heat released by the phase change heat transfer medium in the condensation zone can be quickly conducted to the heat sink for heat exchange.

[0088] In other words, in the embodiments of this application, when setting the condensation zone 113 and the heat sink 310, they share a single structure of the intermediary layer, which can shorten the distance from the heat source (i.e., the chip) to the heat sink and improve the heat exchange efficiency of the entire heat dissipation system.

[0089] In this embodiment, the material of the intermediary layer can be copper; in other embodiments, the material of the intermediary layer can also be other materials with good thermal conductivity.

[0090] Figure 9 This is a structural example diagram of the heat exchange layer, combined with... Figure 2 and Figure 9The heat exchange layer in the embodiments of this application will be described in detail below.

[0091] The heat exchange layer 300 may include: a heat sink 310 for exchanging heat with the cooling medium to remove the heat conducted by the intermediate layer; and a cooling medium inlet and outlet pipe 320, including an inlet pipe for the cooling medium and an outlet pipe for the cooling medium.

[0092] In the embodiments of this application, using a heat sink as a heat exchange structure can increase the surface area of ​​the heat exchange structure in contact with the cooling medium, promote heat exchange between the heat sink and the cooling medium, and improve heat exchange efficiency.

[0093] In an optional example, the heat sink 310 can be regular or irregular in shape, the thickness of the heat sink 310 can be in the range of 0.1mm to 0.3mm, and the spacing of the heat sink can be in the range of 0.1mm to 0.3mm. The size and spacing of the heat sink can be reasonably set according to the heat exchange efficiency requirements to improve the heat exchange efficiency.

[0094] Furthermore, the heat exchange layer 300 also includes a cover plate, which includes a cover plate surface 331 and a cover plate support column 332; the cover plate support column 332 is connected to the end of the second surface of the intermediate layer body to form a sealed cavity surrounded by the cover plate surface, the cover plate support column and the second surface of the intermediate layer body, and the heat sink 310 is placed in the sealed cavity.

[0095] Figure 10 This is an example diagram of another optional structure of the chip heat dissipation system provided in the embodiments of this application, combined with Figure 9 and Figure 10 The cooling medium inlet and outlet pipe 320 includes an inlet pipe and an outlet pipe. The inlet pipe and the outlet pipe are located on the cover plate. An external water pump (not shown in the figure) drives the cooling medium to enter the sealed cavity through the inlet pipe, flow through the heat sink, and flow out through the outlet pipe to the external heat exchanger (not shown in the figure) to remove heat.

[0096] In other words, the cover plate of the heat exchange layer and the surface of the intermediate layer where heat sinks are set form a sealed cavity that can be filled with cooling medium. Driven by an external water pump, the cooling medium passes through the inlet pipe of the cover plate, through the flow channel designed in the sealed cavity, through the heat sinks, and out through the outlet pipe of the cover plate, transferring heat to the external heat exchanger, thereby completing the heat exchange process.

[0097] Continue to refer to Figure 10In this embodiment, the heat dissipation system can set the shape of the contact surface between the dielectric phase change structure and the chip according to the surface morphology of the chip 101. For example, the shape of the contact surface between the dielectric phase change structure and the chip should match the surface morphology of the chip. In an optional example, the heat dissipation system can set the size of the portion of the dielectric phase change structure in contact with the chip 101 in the heat expansion layer according to the size of the chip 101, ensuring that the chip and the portion of the dielectric phase change structure are in complete contact, while avoiding the portion of the dielectric phase change structure that is not in contact with the chip occupying space and wasting space resources.

[0098] As an optional implementation, the operation of the heat dissipation system provided in this application embodiment can be as follows.

[0099] When the chip generates heat during operation, the heat amplification layer conducts the heat from the chip to the phase change thermally conductive medium in the evaporation zone within the phase change structure. After absorbing heat, the phase change thermally conductive medium changes from a liquid state to a gaseous state, absorbing a large amount of heat from the chip through this phase change process. At the same time, in order to support efficient heat absorption and smooth flow of the gaseous phase change thermally conductive medium, a capillary structure is set in the evaporation zone. The capillary structure is arranged with multiple densely packed, small-diameter through-holes, thereby generating a strong capillary traction force during the heat absorption process of the liquid phase change thermally conductive medium, guiding the liquid phase change thermally conductive medium to continuously absorb heat and quickly change into a gaseous state.

[0100] The gaseous phase change heat transfer medium moves from the evaporation zone to the transfer zone, achieving the initial diffusion of heat.

[0101] When the gaseous phase change heat transfer medium reaches the condensation zone with a lower temperature, it begins to condense back into a liquid state. This phase change process releases the heat absorbed by the gaseous phase change heat transfer medium. The number of through holes in the capillary structure in the condensation zone is relatively low, and the capillary traction force is weak, but it can still guide the condensed liquid phase change heat transfer medium to accumulate in the condensation zone and gradually flow towards the reflux zone.

[0102] After condensation, the liquid phase change heat transfer medium gradually accumulates in the condensation zone and returns to the evaporation zone through a reflux zone with capillary structures on the support structure. The number of through holes in the capillary structures in the reflux zone is smaller than that in the evaporation zone but larger than that in the condensation zone, thereby generating capillary traction force. This effectively guides the liquid phase change heat transfer medium to flow back to the evaporation zone along the capillary structures. Guided by the capillary traction force, the liquid phase change heat transfer medium can flow in a directional manner, realizing the continuous circulation of the phase change heat transfer medium in the heat dissipation system and preparing for the next heat dissipation cycle.

[0103] Meanwhile, the heat released from the condensation zone is conducted to the intermediary layer, which then transfers the heat to the heat exchange layer. The heat exchange layer then exchanges heat with the cooling medium to remove the heat from the chip. In other words, the heat exchange layer's heat sink exchanges heat with the cooling medium (such as coolant). As the cooling medium passes through the heat sink, it carries away the heat conducted to the heat sink and flows out of the heat dissipation system through the cooling medium inlet and outlet pipes, transferring the heat to an external heat exchanger to complete the heat dissipation cycle.

[0104] As can be seen, in the heat dissipation system provided in this application embodiment, the heat expansion layer is in contact with the chip and can conduct the heat generated by the chip. At the same time, the heat expansion layer is provided with a medium phase change structure, which is filled with a circulating phase change thermally conductive medium. The phase change thermally conductive medium can absorb the heat from the chip conducted by the heat expansion layer and change from liquid to gas. The phase change process of the phase change thermally conductive medium from liquid to gas can absorb the heat from the chip, thereby helping to diffuse and transfer the heat of the chip in a short time and avoid the chip temperature from rising. After the phase change thermally conductive medium absorbs heat and vaporizes, it is condensed back to liquid under the synergistic effect of the intermediate layer and the heat exchange layer. The intermediate layer, as a bridge connecting the heat expansion layer and the heat exchange layer, can conduct the heat released during the process of the phase change thermally conductive medium changing from gas to liquid to the heat exchange layer, thereby avoiding heat retention in the heat expansion layer and making the heat distribution in the heat dissipation system more uniform. Furthermore, after receiving heat, the heat exchange layer exchanges heat with the cooling medium, which can carry away the heat and dissipate the heat of the chip to the outside. Through the layer-by-layer heat conduction and the circulation of the phase change heat transfer medium, the heat dissipation system provided in this application embodiment can improve the heat exchange efficiency at each level of the heat expansion layer, the intermediate layer, and the heat exchange layer, quickly dissipate the heat generated by the chip to the outside, effectively reduce the chip temperature, thereby improving the heat dissipation effect of the chip and enhancing the stability and operating performance of the chip.

[0105] This application also provides a chip module, including at least one chip and a heat dissipation system as described in the foregoing embodiments.

[0106] In an optional example, Figure 11 This is an example diagram of an optional structure of the chip module provided in the embodiments of this application, wherein, Figure 11 The heat dissipation system uses a series connection between the two chips, combined with... Figure 10 and Figure 11 , Figure 11 This is a top view of the chip module structure.

[0107] Reference Figure 11Multiple chips may include chip 1201 and chip 1202, inlet pipe 1203 and outlet pipe 1204. When cooling two chips, the cooling medium can flow in from the inlet pipe of the cooling system of one of the chips, such as the inlet pipe 1203 of the cooling system of chip 1201, pass through chip 1201, then flow into chip 1202, and finally flow out from the outlet pipe 1204 of the cooling system of chip 1202 to complete the cooling.

[0108] It should be noted that, Figure 11 This is just one example. In other examples, the cooling medium can also flow in from the inlet pipe of the heat dissipation system of chip 1202, pass through chip 1202, then flow into chip 1201, and finally flow out from the outlet pipe of the heat dissipation system of chip 1201 to complete the heat dissipation.

[0109] In other alternative examples, the plurality of chips may include four chips, and the cooling medium may flow in from one of the inlet pipes, and then into the heat dissipation system of the four chips through four separate pipes to dissipate heat from the chips. Finally, the medium flows out from the four pipes to one outlet pipe to complete the heat dissipation.

[0110] This application also provides an electronic device, such as a terminal device or a server device, which includes the chip module as described in the foregoing embodiments.

[0111] The foregoing describes multiple embodiment schemes provided by the embodiments of this application. The optional methods described in each embodiment scheme can be combined and cross-referenced with each other without conflict, thereby extending to a variety of possible embodiment schemes. These can all be considered as the embodiment schemes disclosed and published by the embodiments of this application.

[0112] While the embodiments disclosed above are described in this application, this application is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this application; therefore, the scope of protection of this application should be determined by the scope defined in the claims.

Claims

1. A heat dissipation system, characterized in that, include: A heat-expanding layer, which is in contact with the chip, includes a dielectric phase change structure filled with a circulating phase change thermally conductive medium. The phase change of the phase change thermally conductive medium is used to diffuse the heat of the chip; The medium phase change structure includes at least an evaporation zone, a condensation zone, and a transfer zone between the evaporation zone and the condensation zone; The heat expansion layer further includes: a support structure between the evaporation zone and the condensation zone, and a reflux zone disposed in part of the support structure; the reflux zone includes a first capillary structure, the evaporation zone is provided with a second capillary structure, and the condensation zone is provided with a third capillary structure, wherein the number of multiple through holes in the third capillary structure, the first capillary structure, and the second capillary structure increases sequentially. The intermediate layer connects the heat expansion layer and the heat exchange layer, and conducts the heat absorbed by the phase change thermal medium from the chip to the heat exchange layer; The heat exchange layer removes heat by exchanging heat with the cooling medium.

2. The heat dissipation system according to claim 1, characterized in that, The evaporation zone is used to conduct heat from the chip, changing the phase change heat transfer medium from a liquid state to a gaseous state; the transfer zone is used to transfer the gaseous phase change heat transfer medium from the evaporation zone to the condensation zone; the temperature of the condensation zone is lower than that of the evaporation zone, and it is used to change the gaseous phase change heat transfer medium into a liquid state. The reflux zone is used to reflux the liquid phase change heat transfer medium from the condensation zone to the evaporation zone.

3. The heat dissipation system according to claim 2, characterized in that, The number of support structures is multiple, and the reflux zone is disposed in at least a portion of the multiple support structures. The first capillary structure includes a first surface layer structure in the reflux zone and multiple through holes disposed in the first surface layer structure.

4. The heat dissipation system according to claim 3, characterized in that, The plurality of support structures include a first support structure and a second support structure; wherein, the sidewall of the first support structure is provided with the first capillary structure, and the sidewall of the second support structure is not provided with the first capillary structure.

5. The heat dissipation system according to claim 4, characterized in that, The first support structure and the second support structure are arranged at intervals according to a set number.

6. The heat dissipation system according to any one of claims 3-5, characterized in that, The second capillary structure includes a second surface layer structure in the evaporation zone, and a plurality of through holes disposed in the second surface layer structure; The third capillary structure includes a third surface layer structure in the condensation zone, and a plurality of through holes disposed in the third surface layer structure.

7. The heat dissipation system according to claim 6, characterized in that, The second capillary structure provided in the evaporation zone includes: a first capillary structure and a second capillary structure, wherein the second capillary structure is located above the first capillary structure; the number of through holes in the second capillary structure is greater than the number of through holes in the first capillary structure, and the thickness of the second capillary structure is less than the thickness of the first capillary structure.

8. The heat dissipation system according to any one of claims 3-5, characterized in that, The height of the support structure is determined based on the heat transfer efficiency of the medium phase change structure, wherein the heat transfer efficiency is negatively correlated with the height of the support structure.

9. The heat dissipation system according to any one of claims 2-5, characterized in that, The intermediate layer includes an intermediate layer body, the first surface of which is the condensation zone of the heat expansion layer, and the second surface of which is the heat exchange layer for heat exchange.

10. The heat dissipation system according to claim 9, characterized in that, The heat expansion layer has a base plate that contacts the chip; the intermediary layer further includes: an intermediary layer support pillar, which is connected to both ends of the base plate to form a space surrounded by the intermediary layer and the base plate; the dielectric phase change structure is disposed on the base plate and is located in the space surrounded by the intermediary layer and the base plate.

11. The heat dissipation system according to claim 9, characterized in that, The heat exchange layer includes: A heat sink, which is used to exchange heat with a cooling medium to remove the heat conducted by the interlayer; Cooling medium inlet and outlet pipelines include the cooling medium inlet pipeline and the cooling medium outlet pipeline.

12. The heat dissipation system according to claim 11, characterized in that, The heat exchange layer further includes a cover plate, which includes a cover plate surface and a cover plate support column; the cover plate support column is connected to the end of the second surface of the intermediate layer body to form a closed cavity surrounded by the cover plate surface, the cover plate support column and the second surface of the intermediate layer body, and the heat sink is placed in the closed cavity. The inlet pipe and the outlet pipe are located on the cover plate; the cooling medium is driven by an external water pump, enters the sealed cavity through the inlet pipe, flows through the heat sink and then flows out through the outlet pipe.

13. A chip module, characterized in that, It includes at least one chip and a heat dissipation system as described in any one of claims 1-12.

14. An electronic device, characterized in that, Includes the chip module as described in claim 13.

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