An electronic device
Patent Information
- Application Number
- CN202411695355.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2044-11-25
AI Technical Summary
[0005]本申请公开了一种电子设备,以解决或者至少部分解决现有技术中存在的,激光灯和摄像头镜片之间的距离变化较大,影响电子设备激光对焦性能的问题
[0008] The electronic device disclosed in this application includes a laser focusing component and a camera decorative ring. The laser focusing component and the camera decorative ring are spaced apart. At least one first latch is provided on the side of the laser focusing component near the camera decorative ring, and at least one second latch is provided on the side of the camera decorative ring near the laser focusing component. Each second latch is engaged with one first latch. The distance between the laser focusing component and the camera decorative ring is limited by the second latches and the first latches to ensure that the distance between the laser focusing component and the camera decorative ring is within a reasonable range, thereby improving the laser focusing performance of the electronic device.
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Figure CN119562155B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic equipment technology, specifically to an electronic device. Background Technology
[0002] To improve the image quality of electronic devices, laser autofocus components can be installed inside. These components detect the distance between the device's camera and the subject, enabling the camera to focus accurately and produce higher-quality photos.
[0003] The laser autofocus component includes a laser light. The laser light emits a beam of light, which passes through the emission hole on the camera lens, reaches the object being photographed, is reflected by the object, and then passes through the receiving hole of the camera lens to reach the receiving end of the laser light.
[0004] However, in existing electronic devices, the laser light is typically connected to the motherboard bracket, while the camera lens is connected to the battery cover assembly. This results in significant variations in the distance between the laser light and the camera lens, affecting the laser autofocus performance of the electronic device. Summary of the Invention
[0005] This application discloses an electronic device to solve, or at least partially solve, the problem in the prior art where the large variation in the distance between the laser light and the camera lens affects the laser focusing performance of the electronic device.
[0006] To solve the above-mentioned technical problems, this application is implemented as follows:
[0007] This application discloses an electronic device, which includes a laser focusing component and a camera decorative ring arranged at intervals. The laser focusing component has at least one first buckle on the side near the camera decorative ring, and the camera decorative ring has at least one second buckle on the side near the laser focusing component. Each second buckle is engaged with one of the first buckles.
[0008] The electronic device disclosed in this application includes a laser focusing component and a camera decorative ring. The laser focusing component and the camera decorative ring are spaced apart. At least one first latch is provided on the side of the laser focusing component near the camera decorative ring, and at least one second latch is provided on the side of the camera decorative ring near the laser focusing component. Each second latch is engaged with one first latch. The distance between the laser focusing component and the camera decorative ring is limited by the second latches and the first latches to ensure that the distance between the laser focusing component and the camera decorative ring is within a reasonable range, thereby improving the laser focusing performance of the electronic device.
[0009] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0010] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0011] Figure 1 This indicates an explosion of the electronic device described in the embodiments of this application. Figure 1 ;
[0012] Figure 2 This represents a rear view of the electronic device described in an embodiment of this application;
[0013] Figure 3 express Figure 2 Cross-sectional view of the electronic equipment at point AA;
[0014] Figure 4 express Figure 3 Enlarged view of point B in the middle;
[0015] Figure 5 This indicates an explosion of the electronic device described in the embodiments of this application. Figure 2 ;
[0016] Figure 6 This is a schematic diagram of the structure of the first bracket in an embodiment of this application;
[0017] Figure 7 This is a top view of the first bracket in the embodiment of this application;
[0018] Figure 8 This is a front view of the first bracket in an embodiment of this application;
[0019] Figure 9 This is a side view of the first bracket in an embodiment of this application;
[0020] Figure 10 express Figure 5 A magnified view of the electronic device at point C;
[0021] Figure 11 This is a partial structural diagram of the electronic device described in an embodiment of this application;
[0022] Figure 12 express Figure 10 A magnified view of the electronic device at point F;
[0023] Figure 13 express Figure 10 A cross-sectional view of the electronic device at DD;
[0024] Figure 14 express Figure 10 A cross-sectional view of the electronic device at EE;
[0025] Figure 15 A schematic diagram showing a partial structure of the electronic device before the battery cover is removed;
[0026] Figure 16 This is a schematic diagram showing a partial structure of the electronic device after the battery cover has been removed.
[0027] Figure label:
[0028] 10: Laser focusing assembly; 11: First bracket; 111: First buckle; 111a: First chamfer; 112: First groove; 113: Positioning post; 12: Laser light assembly; 121: First positioning hole; 122: Flexible circuit board; 123: Laser light; 124: Flexible circuit board reinforcement; 125: Reinforcing double-sided adhesive; 126: First adhesive layer;
[0029] 20: Camera decorative ring; 21: Second buckle; 211: Second chamfer; 22: Second positioning hole; 23: Camera lens; 231: Transmitting hole; 232: Receiving hole;
[0030] 30: Motherboard bracket; 31: Second groove; 32: Third clip; 33: Recess;
[0031] 40: Battery cover;
[0032] 50: Frame;
[0033] L1: First gap; L2: Second gap; L3: First distance; L4: Second distance. Detailed Implementation
[0034] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0035] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0037] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0038] like Figures 1 to 16 As shown in the figure, this application discloses an electronic device, which includes a laser focusing component 10 and a camera decorative ring 20 arranged at intervals. The laser focusing component 10 is provided with at least one first buckle 111 on the side near the camera decorative ring 20, and the camera decorative ring 20 is provided with at least one second buckle 21 on the side near the laser focusing component 10. Each second buckle 21 is fastened to a first buckle 111.
[0039] This application discloses an electronic device, which can be a mobile phone, a tablet computer, or other electronic devices. In this application, no specific restrictions are placed on the type of electronic device; any electronic device with a camera function is acceptable.
[0040] The following explanation will use a mobile phone as an example to illustrate this application.
[0041] like Figures 1 to 16 As shown, the electronic device disclosed in this application includes a laser focusing assembly 10 and a camera decorative ring 20, which are spaced apart. Exemplarily, the laser focusing assembly 10 and the camera decorative ring 20 are spaced apart along the thickness direction of the electronic device.
[0042] It should be noted that the laser focusing assembly 10 in this embodiment includes a laser lamp 123, and the camera decorative ring 20 includes a camera lens 23. It is understood that the laser lamp 123 and the camera lens 23 are spaced apart along the thickness direction of the electronic device. The laser lamp 123 has a transmitting end and a receiving end, which are spaced apart on the laser focusing assembly 10. The camera lens 23 is provided with a transmitting hole 231 and a receiving hole 232, with the transmitting hole 231 and the transmitting end facing each other, and the receiving hole 232 and the receiving end facing each other. The light beam emitted from the transmitting end can pass through the transmitting hole 231, reach the surface of the object being photographed, be reflected by the object, and then pass through the receiving hole 232 to reach the receiving end.
[0043] In this embodiment, at least one first latch 111 is provided on the side of the laser focusing assembly 10 near the camera decorative ring 20, and at least one second latch 21 is provided on the side of the camera decorative ring 20 near the laser focusing assembly 10. Each second latch 21 is fastened to one first latch 111. The gap between the laser focusing assembly 10 and the camera decorative ring 20 is limited by the first latch 111 and the second latch 21, ensuring the size of the gap between the laser focusing assembly 10 and the camera decorative ring 20, thereby improving the laser focusing performance of the electronic device.
[0044] For example, the gap between the transmitter and the transmitter hole 231, and the gap between the receiver and the receiver hole 232, can be limited by the first latch 111 and the second latch 21, such that the gap between the transmitter and the transmitter hole 231 and the gap between the receiver and the receiver hole 232 are greater than or equal to 0.2 mm and less than or equal to 0.6 mm. For example, the gap between the transmitter and the transmitter hole 231 is 0.3 mm, and the gap between the receiver and the receiver hole 232 is 0.3 mm.
[0045] It should be noted that, in this embodiment of the application, there is no limitation on the number of the first buckle 111 and the second buckle 21. In practical applications, technicians can set the number of the first buckle 111 and the second buckle 21 as needed.
[0046] For example, the first buckle 111 may include two, with the two first buckles 111 being spaced apart on the side of the laser focusing assembly 10 near the camera decorative ring 20. The second buckle 21 also includes two, with the two second buckles 21 being spaced apart on the side of the camera decorative ring 20 near the laser focusing assembly 10. Each second buckle 21 is correspondingly set to one first buckle 111 so that each second buckle 21 is fastened to one first buckle 111.
[0047] When the electronic device is a mobile phone, the camera decorative ring 20 is installed on the battery cover 40 of the mobile phone. During the installation of the electronic device, the battery cover 40 can be pressed down to make the second clip 21 engage with the corresponding first clip 111, thereby connecting the camera decorative ring 20 to the laser focusing assembly 10, and the distance between the camera decorative ring 20 and the laser focusing assembly 10 can be limited by the second clip 21 and the first clip 111.
[0048] The electronic device disclosed in this application includes a laser focusing component 10 and a camera decorative ring 20. The laser focusing component 10 and the camera decorative ring 20 are spaced apart. At least one first latch 111 is provided on the side of the laser focusing component 10 near the camera decorative ring 20, and at least one second latch 21 is provided on the side of the camera decorative ring 20 near the laser focusing component 10. Each second latch 21 is fastened to one first latch 111. The distance between the laser focusing component 10 and the camera decorative ring 20 is limited by the second latch 21 and the first latch 111 to ensure that the distance between the laser focusing component 10 and the camera decorative ring 20 is within a reasonable range, thereby improving the laser focusing performance of the electronic device.
[0049] Optionally, such as Figures 5 to 9 As shown, the laser focusing assembly 10 in this embodiment includes a first bracket 11 and a laser light assembly 12. The first bracket 11 is provided with a first groove 112, and the laser light assembly 12 is embedded in the first groove 112. A first buckle 111 is provided on the side of the first bracket 11 near the camera decorative ring 20.
[0050] like Figures 5 to 9 As shown, the laser focusing assembly 10 in this embodiment includes a first bracket 11 and a laser lamp assembly 12. The first bracket 11, also referred to as a laser lamp bracket, is used to support the laser lamp assembly 12. A first groove 112 is provided on the first bracket 11, and the laser lamp assembly 12 is embedded in the first groove 112.
[0051] For example, the laser light assembly 12 in this embodiment may include a flexible circuit board 122 and a laser light 123. A flexible circuit board reinforcement 124 is connected to the bottom of the flexible circuit board 122 to enhance its strength. The flexible circuit board reinforcement 124 is bonded to the first groove 112 of the first bracket 11 using reinforcing double-sided adhesive 125 to fix the flexible circuit board 122 to the first bracket 11, which in turn supports the flexible circuit board 122. The laser light 123 is connected to the top of the flexible circuit board 122, meaning it is located on the side of the flexible circuit board 122 away from the first bracket 11, placing it closer to the camera decorative ring 20.
[0052] It should be noted that the first support 11 in this embodiment can be made of plastic or other materials. In this embodiment, no particular restrictions are placed on the specific material of the first support 11. In practical applications, those skilled in the art can choose according to their needs.
[0053] The laser focusing assembly 10 in this embodiment includes a first bracket 11 and a laser light assembly 12. A first groove 112 is provided in the first bracket 11, and the laser light assembly 12 is embedded in the first groove 112 so as to fix and support the laser light assembly 12 through the first bracket 11.
[0054] Furthermore, in this embodiment, a first buckle 111 is provided on the side of the first bracket 11 near the camera decorative ring 20, and the first buckle 111 is engaged with the second buckle 21. The distance between the laser light assembly 12 and the camera decorative ring 20 is limited by the second buckle 21 and the first buckle 111 to ensure that the distance between the laser light assembly 12 and the camera decorative ring 20 is within a reasonable range, thereby improving the laser focusing performance of the electronic device.
[0055] Optionally, such as Figures 5 to 14 As shown, in this embodiment of the application, the first bracket 11 is provided with at least one positioning post 113, the laser light assembly 12 is provided with at least one first positioning hole 121, and the camera decorative ring 20 is provided with at least one second positioning hole 22; the positioning post 113 passes through the first positioning hole 121 and at least partially passes through the second positioning hole 22.
[0056] like Figures 5 to 14 As shown in this embodiment, at least one positioning post 113 is provided on the first bracket 11, at least one first positioning hole 121 is provided on the laser light assembly 12, and at least one second positioning hole 22 is provided on the camera decorative ring 20. Furthermore, one positioning post 113 is correspondingly provided with one first positioning hole 121 and one second positioning hole 22. A positioning post 113 is inserted into the corresponding first positioning hole 121 and at least partially inserted into the corresponding second positioning hole 22. The positioning post 113, the first positioning hole 121, and the second positioning hole 22 are used to fix the relative positions of the first bracket 11, the laser light assembly 12, and the camera decorative ring 20, so that the first buckle 111 can be fastened to the second buckle 21.
[0057] For example, two positioning posts 113 can be provided on the side of the first bracket 11 near the camera decorative ring 20, with the two positioning posts 113 spaced apart. Two first positioning holes 121 are provided on the laser light assembly 12, with each first positioning hole 121 corresponding to one positioning post 113. Two second positioning holes 22 are provided on the camera decorative ring 20, with each second positioning hole 22 corresponding to one first positioning hole 121. This allows each positioning post 113 to pass through the corresponding first positioning hole 121 and the corresponding second positioning hole 22.
[0058] It should be noted that, in this embodiment, the specific number of positioning posts 113, the first positioning hole 121, and the second positioning hole 22 is not limited. In practical applications, technicians can set the specific number of positioning posts 113, the first positioning hole 121, and the second positioning hole 22 as needed.
[0059] Optionally, the positioning post 113, the first buckle 111, and the first bracket 11 in this embodiment are integrally formed. Integrating the positioning post 113, the first buckle 111, and the first bracket 11 into one piece helps improve the reliability of the first bracket 11. Furthermore, the above arrangement simplifies the production process of the first bracket 11 and reduces its production cost.
[0060] It should be noted that the positioning post 113, the first buckle 111, and the first bracket 11 in this embodiment can be integrally molded by injection molding. Of course, other methods can also be used to integrally mold the positioning post 113, the first buckle 111, and the first bracket 11. This application does not impose specific limitations on this. In practical applications, those skilled in the art can choose according to their needs.
[0061] Optionally, in this embodiment of the application, the first buckle 111 includes a plurality of first buckles 111, which are spaced apart around the first groove 112; the second buckle 21 also includes a plurality of second buckles 21, each of which is disposed opposite to a first buckle 111.
[0062] In this embodiment, multiple first buckles 111 can be spaced around the first groove 112. For example, the first groove 112 can be a square groove, and four first buckles 111 can be provided, each positioned near the first groove 112. The number of second buckles 21 is the same as the number of first buckles 111, so that each first buckle 111 can be engaged with one second buckle 21. The distance between the laser focusing assembly 10 and the camera decorative ring 20 is limited by the multiple second buckles 21 and the multiple first buckles 111, ensuring that the distance between the laser focusing assembly 10 and the camera decorative ring 20 is within a reasonable range, thereby improving the laser focusing performance of the electronic device.
[0063] Optionally, the laser light assembly 12 in this embodiment includes a flexible circuit board 122 and a laser light 123. The flexible circuit board 122 is at least partially embedded in the first groove 112, and the laser light 123 is connected to the side of the flexible circuit board 122 near the camera decorative ring 20.
[0064] The laser light assembly 12 in this embodiment includes a flexible circuit board 122 and a laser light 123. The flexible circuit board 122 is embedded in the first groove 112 of the first bracket 11, and the laser light 123 is connected to the side of the flexible circuit board 122 near the camera decorative ring 20, so as to fix the flexible circuit board 122 and the laser light 123 through the first bracket 11.
[0065] It should be noted that, as Figure 12 As shown, in this embodiment of the application, the first positioning hole 121 is disposed on the flexible circuit board 122, and the first positioning hole 121 and the laser lamp 123 are misaligned to avoid the positioning post 113 interfering with the laser lamp 123 after passing through the first positioning hole 121.
[0066] Optionally, in this embodiment of the application, the first buckle 111 is provided with a first chamfer 111a, and the second buckle 21 is provided with a second chamfer 211, the second chamfer 211 engaging with the first chamfer 111a.
[0067] In this embodiment of the application, a first chamfer 111a is provided on the first buckle 111, and a second chamfer 211 is provided on the second buckle 21. The second chamfer 211 and the first chamfer 111a are engaged. The provision of the second chamfer 211 and the first chamfer 111a facilitates the assembly and disassembly of the first buckle 111 and the second buckle 21.
[0068] It should be noted that the first chamfer 111a in this embodiment can be a rounded chamfer or other types of chamfers. Similarly, the second chamfer 211 in this embodiment can be a rounded chamfer or other types of chamfers. In this embodiment, no restrictions are placed on the specific types of the first chamfer 111a and the second chamfer 211. In practical applications, those skilled in the art can set them as needed.
[0069] Optionally, such as Figure 5 and Figure 10 As shown, the electronic device disclosed in this application embodiment also includes a motherboard bracket 30, wherein a second groove 31 is provided on the motherboard bracket 30, and a first bracket 11 is embedded in the second groove 31.
[0070] like Figure 5 and Figure 10As shown, the electronic device disclosed in this application embodiment also includes a motherboard bracket 30, which is installed inside and connected to the frame 50 of the electronic device. Along the thickness direction of the electronic device, the motherboard bracket 30, the laser focusing assembly 10, and the camera decorative ring 20 are arranged sequentially. A second groove 31 is provided on the side of the motherboard bracket 30 near the laser focusing assembly 10, and the first bracket 11 of the laser focusing assembly 10 is embedded in the second groove 31 to position and fix the first bracket 11 of the laser focusing assembly 10 through the motherboard bracket 10.
[0071] For example, in this embodiment of the application, the first bracket 11 can be bonded to the bottom wall of the second groove 31 using double-sided adhesive.
[0072] Of course, the above are only individual embodiments of the first bracket 11 of the laser focusing assembly 10 being connected to the second groove 31, and are not intended to limit the embodiments of this application. In practical applications, those skilled in the art can also configure the specific manner in which the first bracket 11 of the laser focusing assembly 10 is connected to the second groove 31 as needed.
[0073] Optionally, the electronic device disclosed in this application embodiment further includes a first adhesive layer 126, which is bonded between the second groove 31 and the first bracket 11, wherein the adhesive force of the first adhesive layer 126 bonded to the side of the second groove 31 is less than the adhesive force of the first adhesive layer 126 bonded to the side of the first bracket 11.
[0074] In this embodiment, the first adhesive layer 126 has a first surface and a second surface disposed opposite to each other. The first adhesive layer 126 is bonded to the second groove 31 and the first bracket 11. Specifically, the first surface of the first adhesive layer 126 is bonded to the second groove 31, and the second surface of the first adhesive layer 126 is bonded to the first bracket 11.
[0075] In this embodiment, the first adhesive layer 126 is a strong-weak double-sided adhesive, where the adhesive strength of the first surface is less than that of the second surface. That is, the second surface with stronger adhesive strength adheres to the first bracket 11, while the first surface with weaker adhesive strength adheres to the second groove 31. This design allows the first buckle 111 to overcome the adhesive force of the first adhesive layer 126 and smoothly engage with the second buckle 21. Furthermore, this design ensures that opening the battery cover 40 during the disassembly and assembly of the electronic device will not remove the laser focusing assembly 10, facilitating the disassembly and assembly of the electronic device. Optionally, as... Figures 14 to 16 As shown in this embodiment, at least one third buckle 32 is provided on the motherboard bracket 30 near the second groove 31. The third buckle 32 is located on the side of the motherboard bracket 30 near the camera decorative ring 20 and is used to engage with the laser focusing assembly 10.
[0076] like Figures 14 to 16 As shown in this embodiment, at least one third latch 32 is provided on the side of the motherboard bracket 30 near the laser focusing assembly 10, and the third latch 32 is located near the second groove 31. The third latch 32 is engaged with the laser focusing assembly 10 to prevent damage to the flexible circuit board 122 during disassembly of the electronic device. Furthermore, this arrangement also helps to reduce the length of the flexible circuit board 122 and minimize the space occupied by the laser focusing assembly 10.
[0077] like Figure 15 As shown, before the electronic device is disassembled, since the camera decorative ring 20 is connected to the battery cover 40 of the electronic device, the laser focusing assembly 10 is fastened to the second buckle 21 of the camera decorative ring 20 by the first buckle 111.
[0078] like Figure 16 As shown, during the disassembly of the electronic device, when the camera decorative ring 20 is lifted, the distance between the laser focusing assembly 10 and the third clip 32 decreases because the first clip 111 is engaged with the second clip 21. When this distance is zero, that is, when the third clip 32 can lock the laser focusing assembly 10, it is convenient to separate the first clip 111 and the second clip 21.
[0079] Furthermore, during disassembly, since the third clip 32 can hold the laser focusing component 10, the laser focusing component 10 can still be embedded in the second groove 31 of the motherboard bracket 30, which helps to keep the flexible circuit board 122 unchanged, so as not to increase the length of the flexible circuit board 122 and avoid damage to the flexible circuit board 122 during disassembly.
[0080] It should be noted that in this embodiment of the application, there are no restrictions on the specific number of the third buckle 32. In actual applications, technicians can set the specific number of the third buckle 32 as needed.
[0081] For example, two third buckles 32 can be provided, with the two third buckles 32 spaced apart on the side of the motherboard bracket 30 near the camera decorative ring 20, and both third buckles 32 are provided on the motherboard bracket 30 near the second groove 31.
[0082] Optionally, such as Figure 11 As shown in the embodiment of this application, a blocking part 33 is also provided on the motherboard bracket 30 near the second groove 31. The blocking part 33 and the third buckle 32 are located on the same side of the motherboard bracket 30.
[0083] like Figure 11As shown in this embodiment, a blocking part 33 is provided on the side of the motherboard bracket 30 near the camera decorative ring 20, and the blocking part 33 is located on the motherboard bracket 30 near the second groove 31. That is, the blocking part 33 and the third buckle 32 are located on the same side of the motherboard bracket 30.
[0084] In this embodiment, a stop portion 33 is provided on the motherboard bracket 30 near the second groove 31, and the first bracket 11 is limited by the stop portion 33 so that the first bracket 11 can be embedded in the second groove 31.
[0085] It should be noted that the blocking portion 33 in the embodiments of this application may include multiple segments, and the multiple blocking portions 33 are arranged at intervals and are all arranged on the motherboard bracket 30 near the second groove 31.
[0086] Of course, in this embodiment, there are no excessive restrictions on the specific structure and number of the blocking parts 33. In practical applications, those skilled in the art can configure them as needed.
[0087] The assembly process of the electronic device disclosed in the embodiments of this application will be briefly described below.
[0088] During the assembly of electronic devices, the camera lens 23 can first be glued to the camera decorative ring using double-sided adhesive to form the camera decorative ring 20. Then, the camera decorative ring 20 can be glued to the battery cover 40 using double-sided adhesive to form the battery cover assembly.
[0089] Secondly, the laser light assembly 12 is bonded to the first groove 112 of the first bracket 11 using double-sided adhesive, so that the laser light assembly 12 is embedded in the first groove 112.
[0090] Next, the main circuit board is assembled into the frame 50, the motherboard bracket 30 is installed into the frame 50, and the laser lamp board-to-board connector and the corresponding board-to-board connector on the main circuit board are connected. The main circuit board and the motherboard bracket 30 are then tightened with screws to secure them both within the frame 50.
[0091] Finally, the battery cover assembly is placed on the frame 50, so that the first buckle 111 is engaged with the second buckle 21.
[0092] This application discloses an electronic device, which includes a laser focusing component and a camera decorative ring arranged at intervals. The laser focusing component has at least one first buckle on the side near the camera decorative ring, and the camera decorative ring has at least one second buckle on the side near the laser focusing component. Each second buckle is engaged with one of the first buckles.
[0093] The electronic device disclosed in this application includes a laser focusing component and a camera decorative ring. The laser focusing component and the camera decorative ring are spaced apart. At least one first latch is provided on the side of the laser focusing component near the camera decorative ring, and at least one second latch is provided on the side of the camera decorative ring near the laser focusing component. Each second latch is engaged with one first latch. The distance between the laser focusing component and the camera decorative ring is limited by the second latches and the first latches to ensure that the distance between the laser focusing component and the camera decorative ring is within a reasonable range, thereby improving the laser focusing performance of the electronic device.
[0094] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0095] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims
1. An electronic device, characterized in that, Includes a laser focusing assembly (10) spaced apart and a camera decorative ring (20), wherein, The laser focusing assembly (10) includes a first bracket (11), on the side of the first bracket (11) near the camera decorative ring (20) having at least one first buckle (111), and on the side of the camera decorative ring (20) near the laser focusing assembly (10) having at least one second buckle (21), each second buckle (21) being fastened to one of the first buckles (111); the distance between the camera decorative ring (20) and the laser focusing assembly (10) is limited by the second buckles (21) and the first buckles (111).
2. The electronic device according to claim 1, characterized in that, The laser focusing assembly (10) includes a laser lamp assembly (12), wherein, The first bracket (11) is provided with a first groove (112), and the laser lamp assembly (12) is embedded in the first groove (112).
3. The electronic device according to claim 2, characterized in that, The first bracket (11) is provided with at least one positioning post (113), the laser light assembly (12) is provided with at least one first positioning hole (121), and the camera decorative ring (20) is provided with at least one second positioning hole (22). The positioning pin (113) is inserted into the first positioning hole (121) and at least partially inserted into the second positioning hole (22).
4. The electronic device according to claim 3, characterized in that, The positioning post (113), the first buckle (111), and the first bracket (11) are integrally formed.
5. The electronic device according to claim 2, characterized in that, The first buckle (111) includes a plurality of first buckles (111), which are spaced apart around the first groove (112); The second buckle (21) also includes a plurality of them, each of the second buckles (21) being disposed opposite to one of the first buckles (111).
6. The electronic device according to claim 1, characterized in that, The first buckle (111) is provided with a first chamfer (111a), and the second buckle (21) is provided with a second chamfer (211). The second chamfer (211) engages with the first chamfer (111a).
7. The electronic device according to claim 2, characterized in that, The laser light assembly (12) includes a flexible circuit board (122) and a laser light (123). The flexible circuit board (122) is at least partially embedded in the first groove (112), and the laser lamp (123) is connected to the side of the flexible circuit board (122) near the camera decorative ring (20).
8. The electronic device according to claim 2, characterized in that, The electronic device also includes a motherboard bracket (30), wherein... The motherboard bracket (30) is provided with a second groove (31), and the first bracket (11) is embedded in the second groove (31).
9. The electronic device according to claim 8, characterized in that, The electronic device further includes a first adhesive layer (126), which is bonded between the second groove (31) and the first bracket (11); Wherein, the adhesive force of the first adhesive layer (126) to the side of the second groove (31) is less than the adhesive force of the first adhesive layer (126) to the side of the first bracket (11).
10. The electronic device according to claim 8, characterized in that, The motherboard bracket (30) is provided with at least one third buckle (32) near the second groove (31). The third buckle (32) is located on the side of the motherboard bracket (30) near the camera decorative ring (20) and is fastened to the laser focusing assembly (10).
Citation Information
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