Back-drilling information generation method and device, storage medium and electronic equipment

Abstract

Embodiments of the present application provide a back drilling information generation method and device, a storage medium and an electronic device, wherein the back drilling information generation method comprises: determining a back drilling start surface of a multi-layer circuit board, and determining a target area on the back drilling start surface, wherein the back drilling start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board; determining back drilling depth information corresponding to the target area, and generating first back drilling attributes corresponding to each first via in the target area according to the back drilling depth information; in a case where it is determined that the target area passes an electrical connectivity detection, generating first back drilling information corresponding to a plurality of first vias according to a plurality of first back drilling attributes, wherein the electrical connectivity detection is used to detect an electrical connection state between a plurality of circuit boards connected by the plurality of first vias, and the multi-layer circuit board comprises a plurality of circuit boards.

Description

Technical Field

[0001] This application relates to the field of circuit design, and more specifically, to a method and apparatus for generating back-drilling information, a storage medium, and an electronic device. Background Technology

[0002] Traditional methods for adding backdrills are signal-driven, meaning backdrill attributes are added to the network before generating production-ready backdrill information. Specifically, this involves the following steps: assigning backdrill attributes to the signal; setting the backdrill layer and parameters (this step is generally complex, mainly referencing Signal Integrity (SI) simulation results for high-speed signals to determine the required backdrill layer; some require double-sided backdrilling, others single-sided); and generating production backdrill data. Based on these steps, Electronic Design Automation (EDA) software automatically generates the coordinates of the vias, the corresponding backdrill depth, and other backdrill parameters (e.g., the drill bit size can be pre-set or communicated directly with the PCB manufacturer).

[0003] The signal-driven backdrilling method described above only generates backdrilling information for the signal layer; it cannot directly generate backdrilling information for the ground and power layers. To optimize current flow, ground and power layers are typically multi-layered. If backdrilling information could also be generated for the ground and power layers, they would have to be isolated using a no-route layer at the drilled-out ground and power layers. This approach also carries a potential risk: if the ground and power layers are not distributed in other locations within the depth covered by the backdrilling, redundant backdrilling will be generated, resulting in wasted costs.

[0004] Therefore, the problem that signal-driven back-drilling addition methods in related technologies only generate back-drilling information for the signal layer of the circuit board, and cannot directly generate back-drilling information for the ground layer and power layer, has not yet been effectively solved. Summary of the Invention

[0005] This application provides a method, apparatus, storage medium, and electronic device for generating back-drilling information, to at least solve the problem in related technologies where signal-driven back-drilling addition methods only generate back-drilling information for the signal layer of the circuit board, and cannot directly generate back-drilling information for the ground layer and power layer.

[0006] According to one embodiment of this application, a method for generating back-drilling information is provided, specifically including: determining a back-drilling start surface of a multilayer circuit board, and determining a target area on the back-drilling start surface, wherein the back-drilling start surface is located at one of the following: a signal layer, a ground layer, or a power layer of the multilayer circuit board; determining back-drilling depth information corresponding to the target area, and generating a first back-drilling attribute corresponding to each first via in the target area based on the back-drilling depth information; and, if it is determined that the target area passes electrical connectivity detection, generating first back-drilling information corresponding to multiple first vias based on multiple first back-drilling attributes, wherein the electrical connectivity detection is used to detect the electrical connection status between multiple circuit boards connected by multiple first vias, and the multilayer circuit board includes multiple circuit boards.

[0007] In an exemplary embodiment, determining the back-drilling depth information corresponding to the target area includes: determining whether a first instruction for indicating a first position of the back-drilling end face corresponding to the target area has been received; if the first instruction is received, parsing the first instruction to determine the first position of the back-drilling end face; if the first instruction is not received, determining the first position of the back-drilling end face based on the hierarchical structure information of the multilayer circuit board; determining a first distance between the back-drilling start face and the back-drilling end face based on the first position and a second position of the back-drilling start face, and determining a second distance between every two adjacent circuit boards in the multilayer circuit board and a target thickness of the back-drilling end face; calculating the sum of the first distance, the second distance, and the target thickness; and determining the back-drilling depth information based on the sum and a preset back-drilling error.

[0008] In an exemplary embodiment, before generating a first back-drill attribute corresponding to each first through hole in the target area based on the back-drill depth information, the method further includes: filtering through holes in the target area to determine a second through hole in the target area, wherein the second through hole is a through hole for which a second back-drill attribute has been generated by signal driving; and determining other through holes in the target area other than the second through hole as the first through hole.

[0009] In an exemplary embodiment, after generating first back-drilling information corresponding to multiple first through holes based on multiple first back-drilling attributes, the method further includes: calling an information generation interface corresponding to the target region; obtaining second back-drilling attributes corresponding to second through holes in the target region according to the information generation interface, and generating second back-drilling information corresponding to the second through holes according to the second back-drilling attributes, wherein the second through hole is a through hole whose second back-drilling attributes have been generated by signal driving; generating a back-drilling information table corresponding to the target region based on the first back-drilling information and the second back-drilling information; and determining the working parameters corresponding to the drilling machine according to the back-drilling information table, so that the drilling machine drills holes in the target region based on the working parameters.

[0010] In an exemplary embodiment, generating a first back-drill attribute corresponding to each first through hole within the target area based on the back-drill depth information includes: determining the coordinate position of each first through hole in the back-drill start face; adding the coordinate position of each first through hole, the back-drill start face, and the back-drill depth information to the through hole attribute corresponding to each first through hole to generate the first back-drill attribute corresponding to each first through hole.

[0011] In an exemplary embodiment, after generating first back-drilling information corresponding to a plurality of first through holes based on a plurality of first back-drilling attributes, the method further includes: performing back-drilling in the target area based on the first back-drilling information to generate the plurality of first through holes in the target area; performing a filling detection on the plurality of first through holes; and determining that, if the first detection result of the filling detection indicates that the plurality of first through holes have all been filled with target material, it is permissible to place devices and / or traces in the target area.

[0012] In an exemplary embodiment, after generating first back-drilling information corresponding to multiple first through-holes based on multiple first back-drilling attributes, the method further includes: performing electrical connectivity detection on the target area; determining that the target area passes the electrical connectivity detection if a second detection result of the electrical connectivity detection indicates that the electrical connectivity status between the multiple circuit boards connected to each first through-hole is normal; determining that the target area fails the electrical connectivity detection if the second detection result indicates that the electrical connectivity status between the multiple circuit boards connected to a third through-hole among the multiple first through-holes is open-circuit; receiving a second instruction indicating whether back-drilling is allowed in the target area if the second instruction indicates that back-drilling is allowed in the target area; and making the target area pass the electrical connectivity detection by at least one of the following methods: updating the area range corresponding to the target area so that the updated target area passes the electrical connectivity detection, wherein the updated target area does not include the third through-hole; and deleting the third through-hole in the target area so that the target area passes the electrical connectivity detection.

[0013] According to another embodiment of this application, a back-drilling information generation apparatus is provided, comprising: a first determining module, configured to determine a back-drilling start surface of a multilayer circuit board and determine a target area on the back-drilling start surface, wherein the back-drilling start surface is located at one of the following: a signal layer, a ground layer, or a power layer of the multilayer circuit board; a second determining module, configured to determine back-drilling depth information corresponding to the target area and generate a first back-drilling attribute corresponding to each first via in the target area based on the back-drilling depth information; and a generation module, configured to generate first back-drilling information corresponding to multiple first vias based on multiple first back-drilling attributes when it is determined that the target area passes electrical connectivity detection, wherein the electrical connectivity detection is used to detect the electrical connection status between multiple circuit boards connected by multiple first vias, and the multilayer circuit board comprises: multiple circuit boards.

[0014] According to yet another embodiment of this application, a computer-readable storage medium is also provided, wherein a computer program is stored in the computer program, and the computer program is configured to execute the steps in the above method embodiments when it is run.

[0015] According to yet another embodiment of this application, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in the above method embodiments.

[0016] According to yet another embodiment of this application, a computer program product is also provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0017] The back-drilling information generation method of this application determines the back-drilling start surface of a multilayer circuit board and a target area on the back-drilling start surface. The back-drilling start surface can be one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board. The back-drilling depth information corresponding to the target area is determined, and a first back-drilling attribute corresponding to each first via in the target area is generated based on the back-drilling depth information. If the target area is determined by electrical connectivity detection used to indicate the electrical connection status between multiple circuit boards connected by multiple first vias, first back-drilling information corresponding to multiple first vias is generated based on the multiple first back-drilling attributes. In other words, the back-drilling start surface in this embodiment can be not only the signal layer of the multilayer circuit board, but also the ground layer or power layer of the multilayer circuit board. After determining the back-drilling depth information corresponding to the target area, the first back-drilling attribute corresponding to each first via in the target area can be automatically generated based on the back-drilling depth information, and then the first back-drilling information corresponding to multiple first vias can be generated through multiple first back-drilling attributes, without needing to generate back-drilling information through signal driving. According to the embodiments of this application, the problem that the signal-driven back-drilling addition method in the related art can only generate back-drilling information for the signal layer of the circuit board and cannot directly generate back-drilling information for the ground layer and power layer can be solved. Therefore, it is not limited to generating back-drilling information for the signal layer of the circuit board, but can also generate back-drilling information for the ground layer or power layer. Attached Figure Description

[0018] Figure 1 This is a hardware structure block diagram of a computer terminal for a method of generating back-drilling information according to an embodiment of this application.

[0019] Figure 2 This is a flowchart of a method for generating back-drilling information according to an embodiment of this application;

[0020] Figure 3 This is a flowchart of the technical solution for setting up a back drill in related technologies;

[0021] Figure 4 This is a schematic diagram of a back-drilling technique according to an optional embodiment of this application;

[0022] Figure 5 This is a schematic diagram of a method for determining the minimum back-drilling depth d according to an optional embodiment of this application;

[0023] Figure 6 This is a structural block diagram of a back-drilling information generation apparatus according to an embodiment of this application. Detailed Implementation

[0024] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0025] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0026] The methods and embodiments provided in this application can be executed on a mobile terminal, a computer terminal, or a similar computing device. Taking running on a computer terminal as an example, Figure 1 This is a hardware structure block diagram of a computer terminal for a method of generating back-drilling information according to an embodiment of this application. Figure 1 As shown, a computer terminal may include one or more ( Figure 1 Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data are also shown. The computer terminal may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the computer terminal described above. For example, the computer terminal may also include components that are more complex than those described above. Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0027] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the method for determining the interaction state in this embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thus implementing the above-described method. The memory 104 may include high-speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to a computer terminal via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0028] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider for the computer terminal. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0029] Figure 2 This is a flowchart of a method for generating back-drilling information according to an embodiment of this application, which can be applied to... Figure 1 In computer terminals, such as Figure 2 As shown, the process includes the following steps:

[0030] Step S202: Determine the back-drilling start surface of the multilayer circuit board, and determine the target area on the back-drilling start surface, wherein the back-drilling start surface is located in one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board;

[0031] The aforementioned multilayer circuit board is a type of circuit board formed by laminating two or more single-layer circuit boards (i.e., the multiple circuit boards of this application) together with an insulating layer and a copper foil layer. It allows wiring on different layers of the circuit board and connects the layers via through-holes or blind / buried vias, thereby increasing the flexibility and complexity of circuit design.

[0032] When performing back-drilling on a multilayer circuit board, the surface from which drilling begins is called the back-drilling start surface. In other words, the back-drilling start surface indicates the surface of the circuit board in the multilayer circuit board where back-drilling will begin.

[0033] The aforementioned back-drilling starting surface can also be located in: wiring layer, etc.

[0034] Step S204: Determine the back drill depth information corresponding to the target area, and generate the first back drill attribute corresponding to each first through hole in the target area based on the back drill depth information;

[0035] Step S206: If the target area passes the electrical connectivity test, generate first back-drill information corresponding to multiple first through holes based on multiple first back-drill attributes. The electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by multiple first through holes. The multilayer circuit board includes multiple circuit boards.

[0036] The back-drilling information generation method of this application determines the back-drilling start surface of a multilayer circuit board and a target area on the back-drilling start surface. The back-drilling start surface can be one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board. The back-drilling depth information corresponding to the target area is determined, and a first back-drilling attribute corresponding to each first via in the target area is generated based on the back-drilling depth information. If the target area is determined by electrical connectivity detection used to indicate the electrical connection status between multiple circuit boards connected by multiple first vias, first back-drilling information corresponding to multiple first vias is generated based on the multiple first back-drilling attributes. In other words, the back-drilling start surface in this embodiment can be not only the signal layer of the multilayer circuit board, but also the ground layer or power layer of the multilayer circuit board. After determining the back-drilling depth information corresponding to the target area, the first back-drilling attribute corresponding to each first via in the target area can be automatically generated based on the back-drilling depth information, and then the first back-drilling information corresponding to multiple first vias can be generated through multiple first back-drilling attributes, without needing to generate back-drilling information through signal driving. According to the embodiments of this application, the problem that the signal-driven back-drilling addition method in the related art can only generate back-drilling information for the signal layer of the circuit board and cannot directly generate back-drilling information for the ground layer and power layer can be solved. Therefore, it is not limited to generating back-drilling information for the signal layer of the circuit board, but can also generate back-drilling information for the ground layer or power layer.

[0037] Optionally, the determination of the back-drilling depth information corresponding to the target area in step S204 above includes: determining whether a first instruction for indicating a first position of the back-drilling end surface corresponding to the target area has been received; if the first instruction has been received, parsing the first instruction to determine the first position of the back-drilling end surface; if the first instruction has not been received, determining the first position of the back-drilling end surface according to the hierarchical structure information of the multilayer circuit board; determining a first distance between the back-drilling start surface and the back-drilling end surface according to the first position and the second position of the back-drilling start surface, and determining a second distance between every two adjacent circuit boards in the multilayer circuit board and the target thickness of the back-drilling end surface; calculating the sum of the first distance, the second distance and the target thickness; and determining the back-drilling depth information according to the sum and a preset back-drilling error.

[0038] Understandably, when performing back-drilling on multilayer circuit boards, the surface on which the drilling ends is called the back-drilling end surface. In other words, the back-drilling end surface is used to indicate the surface of the circuit board where back-drilling ends in a multilayer circuit board.

[0039] In this embodiment of the application, the method for determining the back-drilling end face includes: determining the first position of the back-drilling end face through a first instruction sent by the target object, that is, the target object can specify the first position of the back-drilling end face. Alternatively, the first position of the back-drilling end face can be automatically calculated. Specifically:

[0040] The target object can send a first command, which indicates the first position of the back-drilling end surface; alternatively, the back-drilling end surface can be automatically calculated using information such as the hierarchical structure information of the multilayer circuit board.

[0041] It is understood that the above hierarchical information may include: the name, function (e.g., signal layer, power layer, ground layer), thickness, and relative position between each layer of the multilayer circuit board.

[0042] The method of calculating the first position of the back-drilling end surface using hierarchical information is only an example. In specific applications, the first position of the back-drilling end surface can also be calculated in other ways, such as by using information such as the dielectric material and thickness between each layer of the circuit board.

[0043] After determining the first position, the back drill depth information can be determined based on the first position and the second position of the back drill starting face. Specifically:

[0044] The first distance between the start and end faces of back drilling is determined based on the first and second positions. For example, if the start face of back drilling is the top layer, i.e., layer L1, and the end face of back drilling is the ground layer L13, then the first distance is the distance from the top layer to layer L13.

[0045] Determine the second distance between each two adjacent circuit boards in the multilayer circuit board and the target thickness of the back-drilling end surface; calculate the sum of the first distance, the second distance, and the target thickness; determine the back-drilling depth information based on the sum and the preset back-drilling error.

[0046] The preset back-drilling error refers to the tolerance in the manufacturing process of multilayer circuit boards. It is assumed that the preset back-drilling error is 2mil. In order to ensure that the back-drilling is not mistakenly drilled into the layer below the end of the back-drilling, the actual back-drilling depth will be set to be less than or equal to the calculated sum minus the preset back-drilling error.

[0047] The difference between the sum and the preset back-drilling error can be used to determine the back-drilling depth information.

[0048] The embodiments of this application maintain the signal integrity and functionality of multilayer circuit boards while avoiding unnecessary cost waste and potential manufacturing errors, thereby improving the efficiency and manufacturing quality of multilayer circuit board design. The above method is particularly suitable for complex circuit board designs, reducing the designer's workload and improving the accuracy of back-drilling parameter settings.

[0049] Optionally, before generating the first back-drill attribute corresponding to each first through hole in the target area based on the back-drill depth information in step S204 above, the method further includes: filtering the through holes in the target area to determine the second through hole in the target area, wherein the second through hole is a through hole for which a second back-drill attribute has been generated by signal driving; and determining the other through holes in the target area other than the second through hole as the first through hole.

[0050] It is understood that the through-hole in the target area may include two parts: a second through-hole determined by signal driving, and a first through-hole determined by the regional back drilling method of the embodiments of this application. In some specific applications, the through-hole in the target area may also include only the first through-hole.

[0051] The above embodiments avoid repeating the process for through holes that have already undergone back-drilling (i.e., the second through hole) by screening and distinguishing between the first and second through holes. This avoids unnecessary work, saves design time and resources, and prevents potential errors such as over-drilling, thereby avoiding problems that could affect the functionality and stability of the circuit board due to over-drilling.

[0052] Optionally, after generating first back-drilling information corresponding to multiple first through holes based on multiple first back-drilling attributes in step S206 above, the method further includes: calling an information generation interface corresponding to the target area; obtaining second back-drilling attributes corresponding to second through holes in the target area according to the information generation interface, and generating second back-drilling information corresponding to the second through holes according to the second back-drilling attributes, wherein the second through hole is a through hole whose second back-drilling attributes have been generated by signal driving; generating a back-drilling information table corresponding to the target area based on the first back-drilling information and the second back-drilling information; determining the working parameters corresponding to the drilling machine according to the back-drilling information table, so that the drilling machine drills holes in the target area based on the working parameters.

[0053] Understandably, after determining the first back-drilling information, a back-drilling information table can be generated. The back-drilling information table can be used to instruct the drilling machine to determine working parameters such as the drilling depth for each through hole. The back-drilling information table can also be used as reference data for subsequent maintenance of multilayer circuit boards.

[0054] For example, consider a 14-layer multilayer circuit board. The top (L1) and bottom (L14) layers are wiring layers, while layers L2 to L13 contain signal layers, ground layers, and power layers. The target area is located on the top layer L1 and contains multiple vias. The first via has already been assigned a first back-drill attribute, while the second via has a second back-drill attribute generated by a signal-driven method. An interface needs to be called to obtain the second back-drill attribute.

[0055] By calling the information generation interface, the second back-drill attribute can be obtained, and the second back-drill information can be generated based on the second back-drill attribute.

[0056] Then, a regional back-drill attribute is added to the first through-hole; a signal-driven back-drill attribute is added to the second through-hole. The back-drill attributes corresponding to the first and second through-holes are integrated to generate a back-drill information table. The back-drill information table contains the back-drill attributes of all through-holes within the target area, facilitating subsequent processing.

[0057] Among them, the first back-drilling attribute can be a regional back-drilling attribute; the second back-drilling attribute can be a signal-driven back-drilling attribute.

[0058] Furthermore, based on the generated back-drilling information table, the operating parameters of the drilling machine can be determined. These parameters include, but are not limited to, drill bit selection, drilling speed, and drilling depth. This ensures that the drilling machine can correctly drill all through holes within the target area according to the guidance in the back-drilling information table, including both necessary area-type back-drilling and signal-driven back-drilling.

[0059] The above technical solution ensures that all through-holes requiring back drilling are correctly processed without manually adjusting the back drilling properties and information of each through-hole. This not only improves design efficiency and accuracy but also reduces potential errors, ensures signal integrity and functional stability of the circuit board, and optimizes the overall production cost and manufacturing process of the multilayer circuit board.

[0060] Optionally, step S204 above, which generates the first back-drill attribute corresponding to each first through hole in the target area based on the back-drill depth information, includes: determining the coordinate position of each first through hole in the back-drill start face; adding the coordinate position of each first through hole, the back-drill start face, and the back-drill depth information to the through hole attribute corresponding to each first through hole to generate the first back-drill attribute corresponding to each first through hole.

[0061] It is understandable that the first back-drill attribute can be generated using information such as the coordinate position of the first through hole, the back-drill start face, and the back-drill depth.

[0062] Through the above technical solution, each first through hole is given a first back-drill attribute, and this information can be used to set the specific parameters of the drilling machine to ensure that each through hole is back-drilled at the correct level and at the specified depth, thereby optimizing the signal transmission of the circuit board.

[0063] Optionally, after generating the first back-drill information corresponding to the multiple first through holes based on the multiple first back-drill attributes in step S206 above, the method further includes: performing back-drilling in the target area based on the first back-drill information to generate the multiple first through holes in the target area; performing a filling detection on the multiple first through holes; and determining that it is permissible to place devices and / or traces in the target area if the first detection result of the filling detection indicates that the multiple first through holes have been filled with the target material.

[0064] Understandably, during the circuit board manufacturing stage, manufacturers may receive documents or similar process files containing back-drilling information. These documents detail the coordinates of each first via, the starting face for back-drilling, and the back-drilling depth. Based on this initial back-drilling information, manufacturers use precision drilling machines to back-drill the vias within the target area. For example, for a specific via, the manufacturer might drill from the top layer to a depth of 70 mils, ensuring that only the necessary via portion is removed, avoiding impact on the underlying structure of the circuit board.

[0065] After back-drilling, these through-holes can be filled using resin or other filler materials (i.e., wood veneer) to seal the holes created by back drilling. Then, processes such as baking, grinding, re-copper plating, and electroplating are performed to restore the electrical connectivity of the through-holes. Filling inspection is a crucial step to verify the success of the filling process. Typically, filling inspection uses X-ray inspection, ultrasonic testing, or other non-destructive testing techniques to check whether each first through-hole has been completely filled with the target filler material.

[0066] After the fill test is completed, if the test results for all the first vias show that they have been completely filled with the target filler material, then it can be determined that these vias are capable of carrying circuit wiring or placing components again. At this point, designers or manufacturers can safely place components and perform wiring in the target area without worrying about the impact of back-drilling on the circuit board's functionality.

[0067] The embodiments of this application ensure the integrity and electrical performance of the structure through fill detection, providing safety and reliability for placing devices and wiring on the circuit board.

[0068] Optionally, after generating the first back-drilling information corresponding to the multiple first through holes based on the multiple first back-drilling attributes in step S206 above, the method further includes: performing electrical connectivity detection on the target area; determining that the target area passes the electrical connectivity detection when the second detection result of the electrical connectivity detection indicates that the electrical connectivity status between the multiple circuit boards connected to each first through hole is normal; determining that the target area fails the electrical connectivity detection when the second detection result indicates that the electrical connectivity status between the multiple circuit boards connected to the third through hole among the multiple first through holes is open circuit; receiving a second instruction indicating whether back-drilling is allowed in the target area when the second instruction indicates that back-drilling is allowed in the target area; and making the target area pass the electrical connectivity detection by at least one of the following methods: updating the area range corresponding to the target area so that the updated target area passes the electrical connectivity detection, wherein the updated target area does not include the third through hole; or deleting the third through hole in the target area so that the target area passes the electrical connectivity detection.

[0069] Understandably, if the electrical connections between the multiple circuit boards connected to each of the first through-holes are all normal, the target area can be determined to have passed the electrical connectivity test. However, if the electrical connections between the multiple circuit boards connected to a third through-hole within the multiple first through-holes are open, the target area is determined to have failed the electrical connectivity test. In this case, the target area can be adjusted or the third through-hole can be adjusted to make it pass the electrical connectivity test. Specifically:

[0070] You can narrow down the target area so that the target area does not include the third through hole; or you can delete the third through hole within the target area.

[0071] Alternatively, the third via can be moved to a location other than the target area in the multilayer circuit board, thereby enabling the target area to pass the electrical connectivity test.

[0072] Through the above technical solutions, designers and manufacturers can ensure that the circuit board maintains good electrical connectivity after back-drilling, avoiding functional defects caused by improper back-drilling and improving the reliability and production quality of the circuit board. This dynamic adjustment and problem-solving mechanism is an important component of circuit board design and manufacturing, helping to optimize circuit board performance while reducing manufacturing risks and costs.

[0073] To better understand the process of generating back-drilling information as described above, the implementation flow of the method will be further explained below with reference to optional embodiments, but this is not intended to limit the technical solution of the embodiments of this application.

[0074] In high-speed circuits, crosstalk between signal lines is particularly severe. This not only affects the quality of data transmission but also increases the bit error rate, thereby impacting the stability and performance of the entire system. Furthermore, with the increase in the number of circuit board layers and the density of traces, effectively controlling signal delay, reflection, and attenuation has become a crucial technical challenge for circuit designers.

[0075] To address the issue of crosstalk in high-speed signals, back-drilling technology emerged as an advanced printed circuit board (PCB) manufacturing process. The main purpose of back-drilling is to improve signal integrity by removing excess vias, thereby reducing interference between signal lines. Specifically, back-drilling involves locally removing vias that do not penetrate the entire board thickness on the back of the circuit board or on a non-signal layer, retaining only the portion relevant to actual signal transmission. This reduces coupling effects between signal lines and improves signal purity.

[0076] Figure 3 This is a flowchart of the technical solution for setting up a back drill in related technologies, such as... Figure 3 As shown:

[0077] Step S301: Assign back-drilling properties to the signal;

[0078] Theoretically, all signals can be assigned the backdrill attribute. However, for ground planes, there are typically multiple connections, i.e., through... Figure 3 The method used cannot generate back-drilling information for the grounding layer;

[0079] Step S302: Set the back-drilling layer and back-drilling parameters;

[0080] Setting the back-drilling layer and back-drilling parameters is generally quite complex. It mainly refers to the simulation results of SI for high-speed signals and sets the layers that need to be back-drilled. Some are double-sided back-drilled, and some are single-sided back-drilled.

[0081] Step S303: Generate production back drill data.

[0082] Generate production back-drilling data. Based on steps S301 and S302, the EDA software automatically generates the coordinate position of the through hole, the corresponding back-drilling depth, and other back-drilling parameters (e.g., the size of the drill bit used can be set in advance or directly communicated with the PCB manufacturer).

[0083] pass Figure 3It is known that the traditional way to add backdrills is to add backdrill attributes to the network and then generate backdrill information for production.

[0084] Figure 3 Traditional back-drilling only generates back-drilling information for signal layers; it cannot directly generate back-drilling information for ground and power layers. To optimize current flow, ground and power layers are typically multi-layered. If back-drilling information could also be generated for ground and power layers, they would have to be isolated with a no-route layer at the drilled-out ground and power layers. This approach carries a potential risk: if the ground and power layers are not distributed in other areas within the back-drill depth coverage, redundant back-drilling will be generated, resulting in wasted costs. Because traditional methods of setting up area back-drilling are cumbersome and incur manufacturing costs, components or traces are generally not placed at the back-drilled hole on the starting side of the back-drill. In situations where through-holes are required and components need to be placed on both sides of the board, blind via technology is often used. However, blind via technology is a more advanced PCB manufacturing process, and its manufacturing cost is generally much higher than that of back-drilling.

[0085] To address the aforementioned issues, this application proposes an optional embodiment of a method for setting regional back-drilling. The main steps include: determining the starting face of the regional back-drilling; calculating the minimum back-drilling depth d of the selected area; adding the back-drilling depth information, the back-drilling starting face information, and other necessary back-drilling information to the attributes of all vias within the selected area; and generating back-drilling information for production. Specifically, the design concept of this optional embodiment is as follows: at the initial design stage, back-drilling is added to the vias within the area using a Special Integrated Design Language (Skill), then the back-drilled holes are filled with resin, and finally, a Panelized Orifice Filling Via Process (POFV) is used to place components on both sides of the PCB using back-drilling. A key point of this optional embodiment is that at the initial design stage, the vias on one side of the area are back-drilled. The back-drilling information directly added to the vias can also be referred to as regional back-drilling. The regional back-drilling in this optional embodiment does not include back-drilling generated by a signal network.

[0086] Figure 4 This is a schematic diagram of a back-drilling technique according to an optional embodiment of this application, such as... Figure 4 As shown, the multilayer circuit board includes a signal layer and a ground / power layer. In an optional embodiment of this application, a back-drilling start surface can be determined, thereby determining the safety distance D between the back-drilling start surface and the signal layer, and the safety distance D1 between the ground / power layer and the signal layer, and then drilling at the via. That is, an optional embodiment of this application proposes a method for setting regional back-drilling, mainly implemented through the following four modules, specifically:

[0087] Module 1: Add information on back drilling of through holes in the region.

[0088] (1) Where there are through holes, select the area (i.e., the target area) where you want to place the components or traces on the Top surface (top layer, front of the circuit board) or Bot surface (bottom layer, back of the circuit board). If you select on the Top surface, set the Top surface as the area for back drilling (i.e., the back drilling start surface); if you select on the Bot surface, set the Bot surface as the area for back drilling.

[0089] (2) Calculate the minimum back drilling depth d (i.e., back drilling depth information) of the selected area. Figure 5 This is a schematic diagram of a method for determining the minimum back-drilling depth d according to an optional embodiment of this application, as shown below. Figure 5 As shown, for electrical safety, back drilling is set to remove layer L3 (layer L3 is the back drilling end layer), and back drilling of layer L2 is not performed. If the board manufacturer presets the back drilling error to d1, the minimum back drilling depth d = H - d1. Wherein, H (i.e., the sum) is the distance between the upper surface of layer L2 and the upper surface of layer L4.

[0090] (3) Add the back-drill depth information (i.e., the minimum back-drill depth d) to the through-hole attributes of all through-holes (i.e., the first through-holes) in the selected area (excluding through-holes that have already been assigned signal-driven back-drill information (i.e., the second through-holes)) to generate the back-drill attribute (i.e., the first back-drill attribute) for each through-hole. Also, calculate whether adding the back-drill attribute to the through-hole will cause an open circuit (i.e., perform an electrical connectivity test). If an open circuit occurs (i.e., the electrical connectivity test fails), highlight the through-hole that caused the open circuit.

[0091] (4) Confirm whether to add a region back drill to the via in this area. If a region back drill is added, continue to the next step; otherwise, end the command. After ending the command, keep the via highlighted to facilitate layout engineers to further investigate whether to add a region back drill attribute to this via.

[0092] (5) If a regional back drill is added in (4), a regional back drill note needs to be added to the through hole to distinguish the back drill through hole generated by the signal drive, so as to facilitate the inspection of the regional back drill through hole.

[0093] Module 2: Design Rule Check (DRC) for Hiding Backdrill Vias, Components, and Routers. This module checks the mouse-selected area (target area). If any components or traces generate DRCs with backdrill vias, it calls the `Waived` command (ignore command) to hide the corresponding DRCs based on their coordinates. Module 2 is typically used during the final drawing stage. The layout engineer determines whether to use this module based on the specific requirements.

[0094] In other words, when placing devices or traces in the back drill hole, DRC may occur, indicating that there is an error in the back drill hole. However, in the optional embodiments of this application, the back drill holes are filled with resin material in the final stage. After filling, the back drill holes can be used to place devices or traces. Therefore, DRC can be ignored here.

[0095] Module 3: Generate back-drilling information for production. Call the back-drilling information generation interface (i.e., the information generation interface). First, generate network-driven back-drilling information (i.e., the second back-drilling information). Then, organize the through-hole coordinates, back-drilling start face, back-drilling depth, and other back-drilling information for adding regional back-drilling into a table (i.e., the back-drilling information table) along with corresponding descriptions, and add it to the corresponding back-drilling layer of the target data (which can be Gerber data).

[0096] Module 4: Cancel the selection of added through-hole back drill information. If the layout engineer does not need to add area back drills here, cancel the back drills added directly through the through holes. This step can be considered the sum of the inverse operations of Module 3, Module 2, and Module 1.

[0097] Through the above four modules, the designed data is sent to the factory. After back drilling, the factory fills the back drill holes with resin (i.e., the target material), then bakes the board, grinds it flat, and performs copper plating and electroplating processes again. This enables the placement of components or traces on both sides of the PCB through-holes through the back drilling process.

[0098] According to an optional embodiment of this application, a novel design method for adding regional back drills can be easily implemented, improving PCB board space utilization and reducing PCB manufacturing costs. Furthermore, this optional embodiment automatically adds regional back drill attributes to through-holes using a skill, facilitating the minimization and control of the number of back drills while simultaneously achieving the goal of placing components and routing traces at the back drill holes, maximizing cost savings in PCB manufacturing. In addition, this optional embodiment utilizes back drills combined with PO FV technology to enable the placement of components or routing traces on both sides of PCB through-holes.

[0099] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0100] This embodiment also provides a back-drilling information generation device, which is used to implement the above embodiments and preferred embodiments, and will not be repeated as already described. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0101] Figure 6 This is a structural block diagram of a back-drilling information generation apparatus according to an embodiment of this application, such as... Figure 6 As shown, the device includes:

[0102] The first determining module 62 is used to determine the back-drilling start surface of the multilayer circuit board and to determine a target area on the back-drilling start surface, wherein the back-drilling start surface is located in one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board.

[0103] The second determining module 64 is used to determine the back drill depth information corresponding to the target area, and generate the first back drill attribute corresponding to each first through hole in the target area based on the back drill depth information.

[0104] The third determining module 66 is used to generate first back drill information corresponding to multiple first through holes based on multiple first back drill attributes when the target area is determined to have passed the electrical connectivity detection. The electrical connectivity detection is used to detect the electrical connection status between multiple circuit boards connected by multiple first through holes. The multilayer circuit board includes multiple circuit boards.

[0105] The back-drilling information generation apparatus of this application determines the back-drilling start surface of a multilayer circuit board and defines a target area on the back-drilling start surface. The back-drilling start surface can be one of the following: a signal layer, a ground layer, or a power layer of the multilayer circuit board. It determines the back-drilling depth information corresponding to the target area and generates a first back-drilling attribute corresponding to each first via in the target area based on the back-drilling depth information. If the target area is determined by electrical connectivity detection used to indicate the electrical connection status between multiple circuit boards connected by multiple first vias, it generates first back-drilling information corresponding to multiple first vias based on the multiple first back-drilling attributes. In other words, the back-drilling start surface in this embodiment can be not only a signal layer of the multilayer circuit board, but also a ground layer or a power layer. After determining the back-drilling depth information corresponding to the target area, it can automatically generate the first back-drilling attribute corresponding to each first via in the target area based on the back-drilling depth information, and then generate first back-drilling information corresponding to multiple first vias through multiple first back-drilling attributes, without needing to generate back-drilling information through signal driving. According to the embodiments of this application, the problem that the signal-driven back-drilling addition method in the related art can only generate back-drilling information for the signal layer of the circuit board and cannot directly generate back-drilling information for the ground layer and power layer can be solved. Therefore, it is not limited to generating back-drilling information for the signal layer of the circuit board, but can also generate back-drilling information for the ground layer or power layer.

[0106] In an exemplary embodiment, the second determining module 64 is further configured to determine whether a first instruction for indicating a first position of the back-drilling end surface corresponding to the target area has been received; if the first instruction is received, the first instruction is parsed to determine the first position of the back-drilling end surface; if the first instruction is not received, the first position of the back-drilling end surface is determined according to the hierarchical structure information of the multilayer circuit board; a first distance between the back-drilling start surface and the back-drilling end surface is determined according to the first position and the second position of the back-drilling start surface, and a second distance between every two adjacent circuit boards in the multilayer circuit board and a target thickness of the back-drilling end surface are determined; the sum of the first distance, the second distance and the target thickness is calculated; and the back-drilling depth information is determined according to the sum and a preset back-drilling error.

[0107] In an exemplary embodiment, the second determining module 64 is further configured to screen the through holes in the target area to determine the second through hole in the target area, wherein the second through hole is a through hole that has generated a second back-drill attribute by signal driving; and to determine the other through holes in the target area other than the second through hole as the first through hole.

[0108] In an exemplary embodiment, the generation module 66 is further configured to: call the information generation interface corresponding to the target area; obtain the second back-drilling attribute corresponding to the second through hole in the target area according to the information generation interface; and generate the second back-drilling information corresponding to the second through hole according to the second back-drilling attribute, wherein the second through hole is a through hole whose second back-drilling attribute has been generated by signal driving; generate a back-drilling information table corresponding to the target area according to the first back-drilling information and the second back-drilling information; and determine the working parameters corresponding to the drilling machine according to the back-drilling information table, so that the drilling machine drills the target area based on the working parameters.

[0109] In an exemplary embodiment, the second determining module 64 is further configured to determine the coordinate position of each first through hole in the back drill starting face; and add the coordinate position of each first through hole, the back drill starting face, and the back drill depth information to the through hole attribute corresponding to each first through hole to generate the first back drill attribute corresponding to each first through hole.

[0110] In an exemplary embodiment, the generation module 66 is further configured to perform back drilling in the target area according to the first back drilling information to generate the plurality of first through holes in the target area; perform filling detection on the plurality of first through holes; and determine that it is permissible to place devices and / or traces in the target area if the first detection result of the filling detection indicates that the plurality of first through holes have been filled with target material.

[0111] In an exemplary embodiment, the generation module 66 is further configured to perform electrical connectivity detection on the target area; determine that the target area passes the electrical connectivity detection if the second detection result of the electrical connectivity detection indicates that the electrical connectivity status between the plurality of circuit boards connected to each first through hole is normal; determine that the target area fails the electrical connectivity detection if the second detection result indicates that the electrical connectivity status between the plurality of circuit boards connected to the third through hole among the plurality of first through holes is open circuit; receive a second instruction indicating whether back drilling is allowed in the target area if the second instruction indicates that back drilling is allowed in the target area; and make the target area pass the electrical connectivity detection by at least one of the following methods: updating the area range corresponding to the target area so that the updated target area passes the electrical connectivity detection, wherein the updated target area does not include the third through hole; or deleting the third through hole in the target area so that the target area passes the electrical connectivity detection.

[0112] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in the above method embodiments when it is run.

[0113] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0114] Optionally, in this embodiment, the storage medium may be configured to store program code for performing the following steps:

[0115] S1, determine the back-drilling start surface of the multilayer circuit board, and determine the target area on the back-drilling start surface, wherein the back-drilling start surface is located in one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board;

[0116] S2, determine the back drill depth information corresponding to the target area, and generate the first back drill attribute corresponding to each first through hole in the target area based on the back drill depth information;

[0117] S3, if the target area passes the electrical connectivity test, generate first back-drill information corresponding to multiple first through holes based on multiple first back-drill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

[0118] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in the above method embodiments.

[0119] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0120] Optionally, in this embodiment, the processor can be configured to perform the following steps via a computer program:

[0121] S1, determine the back-drilling start surface of the multilayer circuit board, and determine the target area on the back-drilling start surface, wherein the back-drilling start surface is located in one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board;

[0122] S2, determine the back drill depth information corresponding to the target area, and generate the first back drill attribute corresponding to each first through hole in the target area based on the back drill depth information;

[0123] S3, if the target area passes the electrical connectivity test, generate first back-drill information corresponding to multiple first through holes based on multiple first back-drill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

[0124] Embodiments of this application also provide a computer program product, including a computer program that, when executed by a processor, is implemented to perform the steps in the above-described method embodiments.

[0125] Optionally, in this embodiment, the above-mentioned computer program product can be executed by a processor using the following steps:

[0126] S1, determine the back-drilling start surface of the multilayer circuit board, and determine the target area on the back-drilling start surface, wherein the back-drilling start surface is located in one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board;

[0127] S2, determine the back drill depth information corresponding to the target area, and generate the first back drill attribute corresponding to each first through hole in the target area based on the back drill depth information;

[0128] S3, if the target area passes the electrical connectivity test, generate first back-drill information corresponding to multiple first through holes based on multiple first back-drill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

[0129] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0130] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0131] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A method for generating back-drilling information, characterized in that, include: Determine the back-drilling start surface of the multilayer circuit board, and determine the target area on the back-drilling start surface, wherein the back-drilling start surface is located in one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board; Determine the back drill depth information corresponding to the target area, and generate the first back drill attribute corresponding to each first through hole in the target area based on the back drill depth information; If the target area is determined to pass the electrical connectivity test, first back drill information corresponding to multiple first through holes is generated according to multiple first back drill attributes. The electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by multiple first through holes. The multilayer circuit board includes multiple circuit boards. The method further includes, before generating the first back-drill attribute corresponding to each first through hole within the target area based on the back-drill depth information: The through holes in the target area are screened to determine the second through hole in the target area, wherein the second through hole is a through hole whose second back-drilling attribute has been generated by signal driving. The other through holes in the target area, excluding the second through hole, are designated as the first through hole; The method further includes, after generating first back drill information corresponding to multiple first through holes based on multiple first back drill attributes: Call the information generation interface corresponding to the target area; The second back-drill attribute corresponding to the second through hole in the target area is obtained according to the information generation interface, and the second back-drill information corresponding to the second through hole is generated according to the second back-drill attribute, wherein the second through hole is a through hole whose second back-drill attribute has been generated by signal driving. Generate a back-drilling information table corresponding to the target area based on the first back-drilling information and the second back-drilling information; The drilling machine's operating parameters are determined based on the back drilling information table, so that the drilling machine can drill holes in the target area based on the operating parameters.

2. The method according to claim 1, characterized in that, Determining the back-drilling depth information corresponding to the target area includes: Determine whether a first instruction has been received to indicate the first position of the back-drilling end face corresponding to the target area; Upon receiving the first instruction, the first instruction is parsed to determine the first position of the back drill end face; In the absence of the first instruction, the first position of the back drill end surface is determined based on the hierarchical structure information of the multilayer circuit board; Based on the first position and the second position of the back-drilling start surface, a first distance between the back-drilling start surface and the back-drilling end surface is determined, and a second distance between every two adjacent circuit boards in the multilayer circuit board and the target thickness of the back-drilling end surface are determined. Calculate the sum of the first distance, the second distance, and the target thickness; The back-drilling depth information is determined based on the sum and the preset back-drilling error.

3. The method according to claim 1, characterized in that, Based on the back-drilling depth information, generate the first back-drilling attribute corresponding to each first through hole within the target area, including: Determine the coordinate position of each first through hole in the back drill starting face; The coordinate position of each first through hole, the back drill start face, and the back drill depth information are added to the through hole attribute corresponding to each first through hole to generate the first back drill attribute corresponding to each first through hole.

4. The method according to claim 1, characterized in that, After generating first back drill information corresponding to multiple first through holes based on multiple first back drill attributes, the method further includes: Back drilling is performed in the target area according to the first back drilling information to generate the plurality of first through holes in the target area; The filling detection is performed on the plurality of first through holes; If the first detection result of the filling detection indicates that all of the plurality of first vias have been filled with the target material, it is determined that it is permissible to place devices and / or traces in the target area.

5. The method according to claim 1, characterized in that, After generating first back drill information corresponding to multiple first through holes based on multiple first back drill attributes, the method further includes: Electrical connectivity testing is performed on the target area; If the second test result of the electrical connectivity test indicates that the electrical connectivity between the multiple circuit boards connected to each first through hole is in a normal state, then the target area is determined to have passed the electrical connectivity test. If the second detection result indicates that the electrical connection between the multiple circuit boards connected by the third through hole in the plurality of first through holes is in an open circuit state, it is determined that the target area has failed the electrical connectivity test. If it is determined that the target area has failed the electrical connectivity test, a second instruction is received to indicate whether back drilling is permitted in the target area; If the second instruction indicates that back drilling is permitted in the target area, the target area is made to pass the electrical connectivity test by at least one of the following methods: Update the area range corresponding to the target area so that the updated target area passes the electrical connectivity detection, wherein the updated target area does not include the third through hole; Delete the third through hole in the target area so that the target area passes the electrical connectivity test.

6. A device for generating back-drilling information, characterized in that, include: The first determining module is used to determine the back-drilling start surface of the multilayer circuit board and to determine the target area on the back-drilling start surface, wherein the back-drilling start surface is located in one of the following: the signal layer, ground layer, and power layer of the multilayer circuit board; The second determining module is used to determine the back drill depth information corresponding to the target area, and generate the first back drill attribute corresponding to each first through hole in the target area based on the back drill depth information. A generation module is used to generate first back drill information corresponding to multiple first through holes based on multiple first back drill attributes when it is determined that the target area has passed the electrical connectivity detection. The electrical connectivity detection is used to detect the electrical connection status between multiple circuit boards connected by multiple first through holes. The multilayer circuit board includes multiple circuit boards. The second determining module is further configured to screen the through holes in the target area to determine the second through hole in the target area, wherein the second through hole is a through hole that has generated a second back-drill attribute by signal driving; and to determine the other through holes in the target area other than the second through hole as the first through hole; The generation module is further configured to: call the information generation interface corresponding to the target area; obtain the second back-drill attribute corresponding to the second through hole in the target area according to the information generation interface; generate the second back-drill information corresponding to the second through hole according to the second back-drill attribute, wherein the second through hole is a through hole whose second back-drill attribute has been generated by signal driving; generate a back-drill information table corresponding to the target area according to the first back-drill information and the second back-drill information; and determine the working parameters corresponding to the drilling machine according to the back-drill information table, so that the drilling machine drills the target area based on the working parameters.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the method according to any one of claims 1 to 5.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 5.

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