A detector and imaging apparatus

Abstract

The embodiment of the specification discloses a kind of detector and imaging device, the detector includes first detector component, for receiving imaging signal, the first detector component includes first substrate and first imaging unit, wherein, the first imaging unit is arranged at the first end of the first substrate first side along first direction;The imaging device includes the detector as described above and anti-scatter grid, for absorbing part of radiation, the anti-scatter grid is arranged above the first side of first detector component along third direction, the position of the first imaging unit in the first detector component at least partially coincides with in first direction.

Description

Technical Field

[0001] This specification relates to the field of detector technology, and in particular to a detector and imaging device. Background Technology

[0002] Energy integration detectors can process visible light generated by scintillation crystals using application-specific integrated circuit (ASIC) chips that integrate photodiodes and analog-to-digital converters (ADCs). In this type of detector, the ASIC chip has the photodiode and ADC regions located at opposite ends, with pads integrated at the ASIC edge for wire bonding. In actual detector fabrication, the ASIC chips are attached to the substrate surface sequentially along the width of the ASIC, forming a chip array for visible light reception and processing. The pads at the ASIC edge are then connected to the substrate pins using wire bonding. To reduce substrate warping caused by mounting long chips along the length of a single substrate, fewer chips are typically used, and the length of each individual ASIC chip is reduced. However, this method reduces the number of photosensitive elements and the photosensitive area of ​​the ASIC chip along the substrate's length in the imaging device. This results in insufficient photosensitive area per ASIC chip when the required area is large, leading to poor image quality; conversely, it results in wasted area when the required area is small.

[0003] Therefore, it is necessary to provide a detector and imaging device to prevent substrate warping. Furthermore, by combining multiple detector assemblies, the imaging area along the length of the detector can be increased without altering any individual detector assembly. Summary of the Invention

[0004] One embodiment of this specification provides a detector. The detector includes: a first detector assembly for receiving radiation and converting it into an electrical signal; the first detector assembly includes a first substrate and a first imaging unit, wherein the first imaging unit is disposed at a first end of a first side surface of the first substrate along a first direction.

[0005] One embodiment of this specification provides an imaging device, the imaging device comprising: a first detector assembly for receiving radiation and converting it into an electrical signal, the first detector assembly including a first substrate and a first imaging unit, wherein the first imaging unit is disposed at a first end of a first side surface of the first substrate along a first direction; and an anti-scattering grid for absorbing a portion of the radiation, the anti-scattering grid being disposed above the first side surface of the first detector assembly along a third direction, the anti-scattering grid at least partially overlapping the position of the first imaging unit in the first detector assembly in the first direction. Attached Figure Description

[0006] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0007] Figure 1 This is a schematic diagram of the detector structure according to some embodiments of this specification;

[0008] Figure 2 This is an enlarged schematic diagram of the edge of the first end shown in some embodiments of this specification;

[0009] Figure 3 This is a schematic diagram of the detector structure according to some embodiments of this specification;

[0010] Figure 4 This is a structural schematic diagram of the first connector according to some embodiments shown in this specification;

[0011] Figure 5 This is a schematic diagram of the detector structure according to some embodiments of this specification;

[0012] Figure 6 This is a schematic diagram of the structure of another detector according to some embodiments of this specification;

[0013] Figure 7 This is a schematic diagram of the structure of another detector according to some embodiments of this specification;

[0014] Figure 8 This is a schematic diagram of the structure of another detector according to some embodiments of this specification;

[0015] Figure 9 This is a schematic diagram of the structure of another detector according to some embodiments of this specification;

[0016] Figure 10 These are schematic diagrams of the imaging apparatus shown in some embodiments of this specification;

[0017] Figure 11 These are schematic diagrams of the imaging apparatus shown in some embodiments of this specification;

[0018] Figure 12 This is an installation diagram showing a stepped shaft connecting pin according to some embodiments of this specification;

[0019] Figure 13 This is a schematic diagram of the installation of the anti-scattering grid and the two first detector assemblies according to some embodiments of this specification;

[0020] Figure 14 This is a structural schematic diagram of the third connector according to some embodiments of this specification.

[0021] Explanation of reference numerals in the attached drawings: 10, detector; 100, first detector assembly; 110, first substrate; 120, connection hole; 130, first imaging unit; 131, imaging subunit; 1311, analog-to-digital conversion unit; 1312, photosensitive unit; 132, crystal; 200, first connector; 210, step; 220, first groove; 230, connecting pin; 500, anti-scattering grid; 510, extension; 600, third connector; 610, third step; 620, fourth step; 630, third groove; 700, thermally conductive material; 20, imaging system; 800, scanning gantry; 900, scanning gantry support; 1000, scanning bed; 1100, scanning bed support. Detailed Implementation

[0022] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0023] As indicated in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0024] To construct multi-slice CT systems, the ASIC chips on the detector are typically quite long. However, due to wafer manufacturing yield limitations, the length of the ASIC can only be maintained within a certain range (e.g., less than 30 mm). To construct detectors with a larger number of rows, ASIC chips with the same structure need to be mirror-mounted along the length of the ASIC. However, this approach results in a large area of ​​ASIC chip array covered by a single substrate, making the substrate prone to warping and affecting the subsequent bonding of scintillation crystals. This specification provides a detector in which the ASIC chip is placed at the edge of the substrate, thereby reducing the area of ​​the ASIC chip array covered by a single substrate, reducing substrate warping, and allowing multiple substrates to be spliced ​​and combined to increase the ASIC chip array area. More details on placing ASIC chips at the substrate edge can be found later. Figures 1-3 And related descriptions. More information about the ability to combine and use multiple substrates can be found later. Figures 4-9 And its related descriptions.

[0025] Figure 1 This is a schematic diagram of the detector structure according to some embodiments of this specification.

[0026] like Figure 1 As shown, the detector 10 includes a first detector assembly 100. The first detector assembly 100 includes a first substrate 110 and a first imaging unit 130.

[0027] The first detector assembly 100 is used to receive imaging signals. These imaging signals can be electrical signals. The first detector assembly 100 can receive radiation (such as X-rays) and convert the radiation into electrical signals. The first detector assembly 100 is also capable of performing preliminary processing on the converted electrical signals. The first detector assembly 100 can also output the received imaging signals to other components of the imaging apparatus, such as the processor of the imaging apparatus.

[0028] The first substrate 110 can support and connect electronic components, serving as the mounting base for the first imaging unit 130. The first substrate 110 can be made of a non-conductive material, coated with copper foil or other metals, and circuit patterns and holes are formed through printing, etching, or other techniques to realize circuit functions. For example, the first substrate 110 can be a PCB substrate.

[0029] The first imaging unit 130 is capable of receiving X-rays and converting them into electrical signals. The first imaging unit 130 performs specific circuit or system functions and includes a large number of tiny, interconnected electronic devices and circuit units. These circuit units are connected via structures such as diodes, semiconductor transistors, capacitors, and resistors. Figure 1 As shown, the first imaging unit 130 is disposed on the first side of the first substrate 110 along the first direction (e.g., Figure 1 The first end (in the Z direction shown). In some embodiments, the first side can be any side of the first substrate 110. In some embodiments, the first side can be the side on which the circuit is arranged on the first substrate 110. The first direction can be set as the length direction of the first substrate 110. The first imaging unit 130 can be fixed to the first substrate 110 in a variety of ways, for example, the first imaging unit 130 can be fixed to the first substrate 110 by a fastener, or it can be glued to the first substrate 110 with thermally conductive adhesive.

[0030] In some embodiments of this specification, the detector 10, which includes only the first detector assembly 100, can be applied to a CT system (e.g., in scenarios where the exposure area requirement is small). By placing the first imaging unit 130 at the first end of the first substrate 110, the warping of the PCB substrate can be reduced compared to conventional detectors, as well as the adverse effects on subsequent scintillation crystal bonding. At the same time, by combining multiple detector assemblies (e.g., multiple first detector assemblies), the imaging area in the longitudinal direction of the detector can be increased without changing a single detector assembly.

[0031] In some embodiments, such as Figure 1 As shown, the first imaging unit 130 may include a plurality of imaging subunits 131, the plurality of imaging subunits 131 being arranged along a second direction on a first side (e.g., Figure 1 The arrangement is shown in the X direction. The second direction can be set as the width direction of the first substrate 110, and the second direction is perpendicular to the first direction, i.e. Figure 1 The X direction shown is perpendicular to the Z direction. Multiple imaging sub-units 131 can be fixedly arranged on the first side surface in various ways to form a first imaging unit 130. The fixing methods of the multiple imaging sub-units 131 are similar to the fixing methods of the first imaging unit 130 described above. For example... Figure 1 As shown, the first detector assembly 100 has imaging sub-units 131 arranged in a row along the second direction. The row of imaging sub-units 131 forms the first imaging unit 130.

[0032] In some embodiments, such as Figure 1 As shown, the imaging subunit 131 may include an analog-to-digital conversion unit 1311 and a photosensitive unit 1312 arranged along the first direction.

[0033] The analog-to-digital converter 1311 is used to convert analog signals (such as electrical signals) into digital signals. The analog-to-digital converter 1311 may consist of electronic devices and / or circuit units.

[0034] The photosensitive unit 1312 is used to convert the received optical signal into an electrical signal. The photosensitive unit 1312 may include a photodiode.

[0035] In some embodiments, such as Figure 3 As shown, the detector 10 may also include two first detector components 100, which are symmetrically arranged along the end face of the first end.

[0036] Specifically, the two first detector components 100 can be arranged along the first direction, the first ends of the two first detector components 100 are close to each other, the first imaging units 130 of the two first detector components 100 are close to each other, and the end faces of the two first substrates 110 at the first ends are spliced ​​together.

[0037] Some embodiments of this specification can form a detector 10 with double the number of photosensitive units 1312 by symmetrically arranging two first detector components 100 along the end face of the first end, thereby doubling the photosensitive area of ​​the photosensitive units 1312 and increasing the area for receiving optical signals.

[0038] like Figure 1 as well as Figure 3 As shown, the distance between the photosensitive unit 1312 and the edge of the first end is less than the distance between the analog-to-digital conversion unit 1311 and the edge of the first end. Therefore, when the two first detector components 100 are arranged symmetrically, the two photosensitive units 1312 can be brought close to each other and arranged uniformly after the two first detector components 100 are combined, which helps to avoid light signal loss and thus ensure uniform imaging.

[0039] By setting the first imaging unit 130 at the first end of the first detector assembly 100, when the first detector assembly 100 needs to have a larger imaging area, two first detector assemblies 100 can be symmetrically assembled to increase the imaging area, that is, the photosensitive area of ​​the photosensitive unit 1312. It is not necessary to redesign the detector assembly in order to make a detector assembly with a larger imaging area, which not only avoids increased costs, but also makes it suitable for different exposure scenarios.

[0040] In some embodiments, such as Figure 2As shown, the edge of the first imaging unit 130 near its first end is at a certain distance L from the edge of the first end of the first substrate 110. It should be understood that if the edge of the first imaging unit 130 near its first end extends beyond the edge of the first end of the first substrate 110, the first imaging unit 130 is at risk of wear. Furthermore, due to manufacturing errors, the first end of the first substrate 110 may not be a plane perfectly perpendicular to the first direction. Therefore, a certain distance L can be formed between the edge of the first imaging unit 130 near its first end and the edge of the first end of the first substrate 110 to protect the first imaging unit 130. In some embodiments, the distance L can be related to the distance between two adjacent rows of photosensitive devices (e.g., photodiodes) in the photosensitive unit 1312. For example, the distance L can be 0.5M, where M is the distance between two adjacent rows of photosensitive devices in the photosensitive unit 1312. By setting the distance L to 0.5M, when the two first detector assemblies 100 are arranged symmetrically, the distance between the photosensitive devices near the first end in the photosensitive units 1312 of the two first detector assemblies 100 is M, thereby ensuring that the photosensitive devices in the two combined photosensitive units 1312 are evenly arranged. In some embodiments, the distance L does not need to be exactly 0.5M, but can be set to a size range of approximately 0.5M. In some embodiments, the distance L between the edge of the first imaging unit 130 near the first end and the edge of the first end of the first substrate 110 is in the range of 35 micrometers to 45 micrometers. When the two first detector assemblies 100 are arranged symmetrically along the end face of the first end, since the distance L is designed to be 35 micrometers to 45 micrometers, it can avoid the distance between the two first imaging units 130 being too small, thus avoiding the inability to fully receive the light signal, while ensuring that the first imaging unit 130 is not worn.

[0041] In some embodiments, the detector 10 can fix the two first detector assemblies 100 in various ways. For example, the first ends of the two first detector assemblies 100 can be fixed by adhesive bonding. In some embodiments, the detector 10 can also be provided with a limiting structure, which can be used to limit the relative position of the two first detector assemblies 100. For example, the limiting structure can be fixed by snapping or engaging with the two first detector assemblies 100, and the limiting structure and the detector 10 can be installed by a compatible structure. For example, it can be installed by a protrusion and a groove, or by a hole and a rod.

[0042] In some embodiments, the limiting structure may be a first connector 200. For example... Figure 4As shown, the two first detector assemblies 100 in detector 10 are connected by a first connector 200, which is disposed on a second side of the two first detector assemblies 100. The second side is opposite to the first side. The second side may be the side of the first substrate 110 that is furthest from the subject after installation.

[0043] The first connector 200 can connect and support two first detector assemblies 100. The first connector 200 may include a support portion for supporting the two first detector assemblies 100 respectively. In some embodiments, the support portion may include a side of the first connector 200 facing the second side. In some embodiments, the support portion may form a surface contact with the second side. In some embodiments, the support portion may form multiple point contacts with the second side. In some embodiments, the contact position between the support portion and the second side may be symmetrically arranged relative to the plane of symmetry of the detector 10 (e.g., the end face of the first end of the first detector assembly 100). In some embodiments, the contact area between the support portion and the second side may be greater than or equal to one-fifth of the area of ​​the second side to ensure the stability of the first detector assembly 100 and prevent the first substrate 110 from warping under gravity. In some embodiments, the first connector 200 can restrict the relative movement between the two first detector assemblies 100 to keep them stable. For example, the two first detector assemblies 100 can be fixed to the first connector 200 with thermally conductive adhesive.

[0044] In some embodiments, the first connector 200 may be provided with a connection structure that mates with the first detector assembly 100. This connection structure can restrict the degree of freedom of movement and / or the free end of rotation of the first detector assembly 100. For example, the first detector assembly 100 may have at least one groove or hole, and the connection structure may include at least two protrusions adapted to the aforementioned at least one groove. Alternatively, at least two grooves or holes may be provided on the first connector 200, and each first detector assembly 100 may have at least one protrusion. In some embodiments, the first connector 200 may also be connected to the first detector assembly 100 through various connection methods, and correspondingly, the connection structure may include other structures. For example, the connection method may be a snap-fit ​​connection, and correspondingly, the connection structure may include a snap-fit ​​structure, i.e., using a snap-fit ​​to install the first detector assembly 100 onto the first connector 200. As another example, the connection method may be a threaded connection, and correspondingly, the connection structure may include screws or threaded holes.

[0045] In some embodiments of this specification, when the first connector 200 is used to support the two first detector assemblies 100, the stability of the first detector assembly 100 can be improved. The connection structure can restrict the movement of the first detector assembly 100, thereby improving the accuracy and stability when the two first detector assemblies 100 are docked.

[0046] In some embodiments, the aforementioned connection structure may consist of at least two connecting pins 230. Correspondingly, each first detector assembly 100 may include at least one connecting hole 120, with each connecting pin 230 and a connecting hole 120 engaging with each other. The connecting pin 230 is disposed on the side of the first connector 200 near the first detector assembly 100, and the connecting hole 120 may be formed on the second side of the first detector assembly 100, or may pass through both the first and second sides of the first detector assembly 100. The axis of the connecting pin 230 is perpendicular to the side of the first connector 200 near the first detector assembly 100, and the axis of the connecting hole 120 is perpendicular to the first side. In some embodiments, the connecting pin 230 and the connecting hole 120 may be a transition fit or a clearance fit. By utilizing the engagement of the connecting pin 230 and the connecting hole 120, the two first detector assemblies 100 can be conveniently and quickly installed and fixed.

[0047] In some embodiments, the connection hole 120 is disposed in a region of the first substrate 110 that does not cover the first imaging unit 130, and correspondingly, the connection pin 230 is also disposed in this region. In some embodiments, the connection hole 120 is disposed on a support portion, which is used to support the region of the first substrate 110 that does not cover the first imaging unit 130.

[0048] like Figure 4 , Figure 5 as well as Figure 6 As shown, the first connector 200 may include two connecting pins 230, and each first detector assembly 100 includes a connecting hole 120. Each connecting pin 230 engages with a connecting hole 120, and the connecting hole 120 on each first detector assembly 100 is connected to one of the connecting pins 230 of the first connector 200. When the two first detector assemblies 100 are aligned and their two first ends are in contact with each other, the center distance between the two connecting pins 230 is equal to the center distance between the two connecting holes 120.

[0049] Some embodiments of this specification utilize two connecting pins 230 in conjunction with two connecting holes 120, i.e., using one connecting pin 230 to position one first detector assembly 100, which can avoid over-positioning and reduce the machining accuracy requirements of the connecting pins 230 and connecting holes 120.

[0050] like Figure 6As shown, the first imaging unit 130 may further include a crystal 132. The crystal 132 can be used to convert the energy of X-rays, converting high-energy photons into low-energy visible light. The crystal 132 may be disposed above the first imaging unit 130 along a third direction. The first imaging unit 130 can receive the low-energy visible light converted by the crystal 132 and convert the low-energy visible light into an electrical signal. In some embodiments, a plurality of photosensitive units 1312 of the first imaging unit 130 may fall within the area covered by the crystal 132.

[0051] like Figure 7 as well as Figure 8 As shown, the first connector 200 may further include four connecting pins 230, and correspondingly, each first detector assembly 100 may include two connecting holes 120. The four connecting pins 230 and the four connecting holes 120 can be fitted one-to-one. When the four connecting pins 230 and the four connecting holes 120 are fitted together, the first ends of the two first detector assemblies 100 can be aligned and fitted together. The four connecting pins 230 and the corresponding connecting holes 120 can be distributed in various ways, and the aforementioned various distribution methods are not limited to... Figure 7 as well as Figure 8 The arrangement method. For example... Figure 7 As shown, the four connecting pins 230 can be arranged in a straight line along the first direction, and the connecting holes 120 are correspondingly set with the connecting pins 230. Figure 8 As shown, the four connecting pins 230 can also be arranged in two rows along the second direction, with two connecting pins 230 in each row, and the connecting holes 120 are set in correspondence with the connecting pins 230.

[0052] Some embodiments of this specification utilize four connecting pins 230 in conjunction with four connecting holes 120, that is, two connecting pins 230 are used to position a first detector assembly 100, which can restrict the rotational freedom of the first detector assembly 100 and improve the stability and positioning accuracy of the first detector assembly 100.

[0053] In some embodiments, the first connector 200 includes a first recess 220. For example... Figures 4 to 8 As shown, the first connector 200 has two steps 210 formed on both sides along the second direction, and the portion between the two steps 210 is a first groove 220. Connecting pins 230 are respectively disposed on the two steps 210. The two steps 210 are the support portions of the first connector 200, and the sides of the two steps 210 near the second side can support the first connector 200.

[0054] The first groove 220 is disposed on the side of the first connector 200 near the first detector assembly 100. The first groove 220 may be a through groove with its through direction perpendicular to the first direction.

[0055] In some embodiments, a thermally conductive material (not shown) is disposed within the first groove 220. The thermally conductive material can be used to dissipate heat from the first detector assembly 100. The thermally conductive material can be a soft, high-viscosity heat-dissipating material. For example, the thermally conductive material can be silicone, a phase change material, etc. In some embodiments, the thermally conductive material can completely fill the first groove 220. The volume of the thermally conductive material can be larger than the volume of the first groove 220, and the thermally conductive material can be squeezed into the first groove 220 under pressure, thereby fixing it within the first groove 220.

[0056] In some embodiments, when viewed along a third direction, the first groove 220 and the first imaging unit 130 at least partially overlap in the first direction, so that the thermally conductive material in the first groove 220 can form a thermally conductive channel with the portion of the first imaging unit 130 that overlaps, thereby improving the heat dissipation effect of the first imaging unit 130. In some embodiments, the first connector 200 may be made of a material with thermal conductivity. For example, a metal or graphite may be selected.

[0057] In some embodiments, such as Figure 6 As shown, along a third direction (such as...) Figure 8 Observing from the Y direction (as shown), the overlapping portion of the first groove 220 and the first detector assembly 100 in the first direction covers the first imaging units 130 of the two first detector assemblies 100. That is, the length of the overlapping portion of the first groove 220 and the first detector assembly 100 is at least greater than or equal to twice the length of the first imaging unit 130 along the first substrate 110. This ensures that after the first connector 200 is installed, the first imaging unit 130 can completely fall within the area covered by the first groove 220, and the thermally conductive material therein can dissipate heat from the first imaging unit 130, thereby improving the heat dissipation efficiency. The third direction, the second direction, and the first direction are all perpendicular to each other, that is, the Y direction, the X direction, and the Z direction are all perpendicular to each other.

[0058] In some embodiments, detector 10 further includes a second detector assembly. Similar to the first detector assembly 100, the second detector assembly can also be used to receive imaging signals.

[0059] The second detector assembly includes a second substrate and a second imaging unit. The second imaging unit may be disposed at a second end of a third side surface of the second substrate along a first direction. The third side surface may be the side of the second substrate facing the subject. The second imaging unit is arranged in the same manner as the first imaging unit 130 in the second direction. In some embodiments, the first detector assembly 100 and the second detector assembly may be arranged along the first direction. The first end of the first detector assembly 100 and the second end of the second detector assembly may be close to each other. In some embodiments, the first imaging unit 130 and the second imaging unit may be aligned. In some embodiments, the third side surface is coplanar with the first side surface, and the arrangement of the second imaging unit along the second direction is the same as the arrangement of the first imaging unit 130 along the second direction. In some embodiments, the electronic components of the second imaging unit and the first imaging unit 130 may be the same or different.

[0060] The second detector assembly can be a detector module different from the first detector assembly 100. For example, the second detector assembly can be a detector module with the same structure as the first detector assembly 100 but a different circuit arrangement. As another example, the second detector assembly can be a detector module with both a different structure and a different circuit arrangement than the first detector assembly 100.

[0061] In some embodiments, the structure of the second detector assembly may be the same as that of the first detector assembly 100. In this case, the second detector assembly and the first detector assembly 100 can be connected with reference to the connection method of the two first detector assemblies 100 described above in this specification.

[0062] In some embodiments, the structure of the second detector assembly may differ from that of the first detector assembly 100. For example, the thickness of the second substrate and the first substrate 110 in a third direction may differ. Another example is that the length of the second substrate and the first substrate 110 along a first direction may differ. Yet another example is that the width of the second substrate and the first substrate 110 along a second direction may differ. However, it should be understood that when the structure of the second detector assembly differs from that of the first detector assembly 100, the photosensitive units in the first imaging unit 130 and the second imaging unit should be on the same plane and arranged neatly after assembly, so that the assembled second detector assembly and the first detector assembly 100 can achieve uniform imaging.

[0063] The detector 10 also includes a second connector. The second connector can be used to connect the first detector assembly 100 and the second detector assembly. The second connector is disposed on a second side of the first detector assembly 100 and a fourth side of the second detector assembly. In some embodiments, the third side can be the side of the second substrate facing the subject. The second side is opposite to the first side, and the fourth side is opposite to the third side. The connection method of the second connector connecting the first detector assembly 100 and the second detector assembly can refer to the connection method of the first connector 200 connecting two first detector assemblies 100 described above.

[0064] The second connector ensures that the first imaging unit 130 and the photosensitive units in the second imaging unit are aligned on the same plane and arranged neatly after assembly. For example, when the second substrate and the first substrate 110 have different thicknesses in a third direction, the height of the side connecting the second connector to the second substrate and the first substrate 110 in the third direction can be different. This allows the upper surfaces of the first imaging unit 130 and the second imaging unit to be flush when the second substrate and the first substrate 110 are mounted on the second connector, enabling uniform imaging of the photosensitive units within the first imaging unit 130 and the second imaging unit.

[0065] In some embodiments, referring to the first connector 200, the second connector has a similar structure, but the second connector has a second groove, and a first step and a second step are formed on both sides of the second groove along a first direction. Connecting pins 230 identical to those on the first connector 200 can be provided on the first and second steps. The first and second steps can respectively support the first detector assembly 100 and the second detector assembly. For example, if the first substrate 110 and the second substrate have different thicknesses, the heights of the first and second steps are also different to make the upper surfaces of the first imaging unit 130 and the second imaging unit flush.

[0066] In some embodiments, the detector 10 may further include a plurality of first detector components 100 and / or second detector components. Each pair of detector components (such as first detector component 100 and / or second detector component) can be combined to obtain a detector component combination, and multiple such detector component combinations can be arranged in a row along a second direction. Figure 9As shown, detector 10 may include a plurality of first detector components 100, wherein every two first detector components 100 can be combined to obtain a detector component combination, and the plurality of such detector component combinations can be arranged in a row along a second direction. For example, detector 10 may also include a plurality of second detector components, wherein every two second detector components can be combined to obtain a detector component combination, and the plurality of such detector component combinations can be arranged in a row along a second direction. For yet another example, detector 10 may also include a plurality of first detector components 100 and second detector components, wherein one first detector component 100 and one second detector component can be combined to obtain a detector component combination, and the plurality of such detector component combinations can be arranged in a row along a second direction. In some embodiments, at least a portion of the structure in two adjacent detector component combinations can abut or connect to each other. For example, the first substrate 110 and / or the second substrate corresponding to two adjacent detector component combinations can abut or connect to each other. For yet another example, the first connector 200 and / or the second connector corresponding to two adjacent detector component combinations can abut or connect to each other. The connection can be a detachable connection or a non-detachable connection. A detachable connection can include one or more of threaded connections, snap-fit ​​connections, fasteners, etc. Non-detachable connections may include one or more of bonding, welding, etc. In some embodiments, the first imaging unit 130 and / or the second imaging unit corresponding to the combination of multiple detector components are located in the same plane. In some embodiments, the first connector 200 and / or the second connector corresponding to the combination of multiple detector components may be integrally formed. Some embodiments of this specification allow users to freely extend the imaging area of ​​the detector 10 in the second direction as needed by combining multiple first detector components 100 and / or second detector components to adapt to different usage scenarios.

[0067] This specification also provides an imaging device, which includes a first detector assembly and an anti-scattering grid disposed above the first detector assembly. By using the anti-scattering grid to absorb and filter some of the X-rays scattered and refracted from the CT scan, interference signals can be reduced and the quality of CT images can be improved.

[0068] Figure 10 This is a schematic diagram of the imaging system according to some embodiments of this specification. Figure 11 This is a schematic diagram of the imaging device according to some embodiments of this specification.

[0069] In some embodiments, such as Figure 10As shown, the imaging system 20 may include a scanning gantry 800, a scanning gantry support 900, a scanning bed 1000, and a scanning bed support 1100. The imaging system 20 can be used to perform X-ray imaging. The scanning gantry 800 is rotatably mounted on the scanning gantry support 900. The scanning bed 1000 is slidably mounted on the scanning bed support 1100. The scanning gantry 800 has a ring-shaped structure, and the scanning bed 1000 can extend into the inner hole of the scanning gantry 800. The biological object to be detected can be placed on the scanning bed 1000. By moving the scanning bed 1000, the biological object is moved until the part of the biological object to be detected enters the scanning gantry 800.

[0070] In some embodiments, such as Figure 11 As shown, the imaging device may include a first detector assembly 100 and an anti-scattering grid 500.

[0071] Imaging devices can be installed on the aforementioned imaging system 20. For example, a first detector assembly 100 and an anti-scattering grid 500 are mounted on the scanning gantry 800. The first detector assembly 100 receives X-rays and converts them into electrical signals. The anti-scattering grid 500 absorbs a portion of the X-rays. The imaging system 20 may also include an emitter mounted on the scanning gantry 800. The emitter emits X-rays. After exiting the emitter, the X-rays pass through biological tissues at different locations and are then received at corresponding positions on the imaging device. By analyzing the results on the first detector assembly 100, internal information of the corresponding location can be obtained. The anti-scattering grid 500 absorbs and filters X-rays scattered, refracted, and overflowing from CT scans. The anti-scattering grid 500 is generally made of pure tungsten material and is a grid structure formed from tungsten plates. The type of X-rays absorbed by the aforementioned anti-scattering grid 500 can be preset; different types of X-rays require different anti-scattering grids 500. Some embodiments of this specification filter out rays that the first imaging unit 130 does not need to absorb by setting an anti-scattering grid 500, thereby avoiding the generation of interference signals or reducing the intensity of rays.

[0072] like Figure 11 As shown, the first imaging unit 130 is disposed at a first end of a first side surface of the first substrate 110 along a first direction. An anti-scattering grid 500 is disposed above the first side surface of the first detector assembly 100 along a third direction. Further details regarding the first detector assembly 100 can be found in the preceding description of this specification.

[0073] The anti-scattering grid 500 and the first imaging unit 130 in the first detector assembly 100 are at least partially overlapped in the first direction. This ensures that at least a portion of the X-rays passing through the biological tissue are absorbed and filtered by the anti-scattering grid 500 before irradiating the first imaging unit 130. In some embodiments, the anti-scattering grid 500 may cover the first imaging unit 130, such that all X-rays passing through the biological tissue are absorbed and filtered by the anti-scattering grid 500 before irradiating the first imaging unit 130.

[0074] The anti-scattering grid 500 and the first detector assembly 100 can be connected in various ways. In some embodiments, the first detector assembly 100 may be provided with a connection structure that cooperates with the anti-scattering grid 500. Using this connection structure to connect the anti-scattering grid 500 and the first detector assembly 100 can restrict the degrees of freedom of movement and / or rotational freedom of the anti-scattering grid 500 and the first detector assembly 100. For example, the first detector assembly 100 may be provided with at least one groove, and the connection structure may include at least one protrusion adapted to the aforementioned at least one groove, the protrusion being disposed on the side of the anti-scattering grid 500 facing the first detector assembly 100. Alternatively, at least one groove may be disposed on the anti-scattering grid 500, and at least one protrusion may be disposed on the first detector assembly 100. In some embodiments, the anti-scattering grid 500 may also be connected to the first detector assembly 100 through other connection methods, and correspondingly, the connection structure may also include other structures. For example, the connection method may be a snap-fit ​​connection, and correspondingly, the connection structure may also include a snap-fit ​​structure, i.e., using snaps to install the anti-scattering grid 500 onto the first detector assembly 100. For example, the connection method can be a threaded connection, and the corresponding connection structure can also include screws or threaded holes, that is, the anti-scattering grid 500 is installed on the first detector assembly 100 using screws.

[0075] In some embodiments, the first detector assembly 100 is provided with at least one connection hole 120, and the anti-scattering grid 500 is provided with at least one mounting hole (not shown in the figure), and each mounting hole is coaxial with a connection hole 120.

[0076] In some embodiments, a rod-like structure, a column-like structure, or a pin (e.g., connecting pin 230) can be used to simultaneously pass through a set of coaxial connecting holes 120 and mounting holes to connect the first detector assembly 100 and the anti-scattering grid 500.

[0077] In some embodiments, when the first detector assembly 100 is connected to the anti-scattering grid 500 via the connecting pin 230, the connecting pin 230 may be a stepped shaft. For example... Figure 12As shown, the larger diameter portion of the connecting pin 230 mates with the connecting hole 120 of the first detector assembly 100 for installation, while the smaller diameter portion mates with the mounting hole of the anti-scattering grid 500 for installation. The stepped shaft limits the distance between the anti-scattering grid 500 and the first detector assembly 100, preventing the anti-scattering grid 500 from scratching the first imaging unit 130 of the first detector assembly 100.

[0078] Figure 13 This is a schematic diagram illustrating the installation of an anti-scattering grid and two first detector assemblies according to some embodiments of this specification. In some embodiments, such as Figure 13 As shown, the imaging device includes two first detector assemblies 100 and a first connector 200. The first connector 200 is disposed on a second side of the two first detector assemblies 100, opposite to the first side. The two first detector assemblies 100 are symmetrically arranged along the end faces of their first ends. Further details regarding the first and second sides can be found in the preceding descriptions of this specification.

[0079] The first connector 200 can be used to simultaneously connect two first detector assemblies 100 and the anti-scattering grid 500, simplifying the structure and eliminating the need for additional connection structures between the first detector assemblies 100 and the anti-scattering grid 500. The first connector 200 is provided with a plurality of connecting pins 230, at least two of which are connected to two mounting holes through a connecting hole 120. For example, each first detector assembly 100 has one connecting hole 120, and the anti-scattering grid 500 has two mounting holes, which are coaxial with the connecting hole 120 on each first detector assembly 100. The first connector 200 can be provided with two connecting pins 230, which can pass through each set of coaxial mounting holes and connecting holes 120 respectively, to connect and fix the two first detector assemblies 100 and the anti-scattering grid 500. For example, each first detector assembly 100 is provided with two connection holes, and the anti-scattering grid 500 is provided with two mounting holes. The two mounting holes are coaxial with one connection hole 120 on each first detector assembly 100. The first connector 200 can be provided with four connecting pins 230. Two of the four connecting pins 230 can pass through each set of coaxial mounting holes and connection holes 120 respectively to connect and fix the two first detector assemblies 100 and the anti-scattering grid 500 at the same time. The other two of the four connecting pins 230 can pass through only the mounting holes in the first detector assembly 100 to fix the first detector assembly 100.

[0080] In some embodiments, such as Figure 14As shown, the anti-scattering grid 500 includes an extension 510 extending from a first end of the first detector assembly 100 along a first direction, and the anti-scattering grid 500 is provided with at least two mounting holes (not shown in the figure). At least one of the mounting holes is located on the extension 510, and at least one mounting hole is coaxial with the connection hole 120 on the first detector assembly 100.

[0081] like Figure 14 As shown, the imaging device also includes a third connector 600 for connecting the first detector assembly 100. The third connector 600 is disposed on the second side of the first detector assembly 100. The third connector 600 includes a third step 610, a fourth step 620 and a third groove 630 between the third step 610 and the fourth step 620.

[0082] The third step 610 can be used to connect the first detector assembly 100 and the anti-scattering grid 500. In some embodiments, at least one connecting pin 230 can be provided on the third step 610, the first detector assembly 100 can be provided with a connecting hole 120 coaxial with the connecting pin 230, and the anti-scattering grid 500 can be provided with a mounting hole coaxial with the connecting pin 230. The connecting pin 230 on the third step 610 is correspondingly fitted with the connecting hole 120 and the mounting hole. In some embodiments, the third step 610 and the first detector assembly 100 can form a surface contact, improving the stability of the first detector assembly 100. In some embodiments, the third connector 600 can be a split structure. The third step 610 on the third connector 600 is detachably connected to the third connector 600, which can accommodate first detector assemblies 100 of different sizes.

[0083] The fourth step 620 can be used to support the extension 510 of the anti-scattering grid 500. In some embodiments, at least one connecting pin 230 can be provided on the fourth step 620, and a mounting hole coaxial with the connecting pin 230 can be provided on the extension 510, with the connecting pin 230 correspondingly engaging with the mounting hole. In some embodiments, the fourth step 620 and the extension 510 can form a surface contact, improving the stability of the extension 510. In some embodiments, the connecting pin 230 on the fourth step 620 can be provided with a step or shoulder, using the step or shoulder to limit the relative position of the extension 510 and the fourth step 620, forming a gap between the extension 510 and the fourth step 620, preventing the anti-scattering grid 500 from contacting the first imaging unit 130 of the first detector assembly 100. In some embodiments, the side of the fourth step 620 facing the extension 510 can be higher than the first imaging unit 130. In some embodiments, the side of the fourth step 620 facing the third step 610 can abut against the first end of the first detector assembly 100. In some embodiments, a stepped surface or groove for supporting the first end of the first detector assembly 100 may be provided on the side of the fourth step 620 facing the third step 610.

[0084] A third groove 630 can be formed between the third step 610 and the fourth step 620. The third groove 630 can be used to place the thermally conductive material 700. In some embodiments, the thermally conductive material 700 can completely fill the third groove 630. The thermally conductive material 700 can be used to dissipate heat from the first imaging unit 130. In some embodiments, the length of the third groove 630 along the first direction is greater than the length of the first imaging unit 130 along the first direction, so that the first imaging unit 130 can fall entirely within the area where the thermally conductive material is located, which is beneficial to improving the efficiency of heat dissipation.

[0085] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification and therefore remain within the spirit and scope of the exemplary embodiments described herein.

[0086] Furthermore, this specification uses specific terms to describe embodiments thereof. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "an embodiment," "one embodiment," or "an alternative embodiment" in different locations throughout this specification do not necessarily refer to the same embodiment. Moreover, certain features, structures, or characteristics in one or more embodiments of this specification can be appropriately combined.

Claims

1. A detector, characterized in that, include: A first detector assembly (100) is used to receive imaging signals. The first detector assembly (100) includes a first substrate (110) and a first imaging unit (130), wherein the first imaging unit (130) is disposed at a first end of a first side surface of the first substrate (110) along a first direction. The detector (10) includes two first detector components (100) and a first connector (200). The two first detector components (100) are symmetrically arranged along the end face of the first end. The first connector (200) is used to connect the two first detector components (100). The first connector (200) is disposed on the second side of the two first detector components (100), and the second side is opposite to the first side. The first connector (200) includes a first groove (220) in which a thermally conductive material (700) is disposed. When viewed in a third direction, the first imaging unit (130) falls completely within the area covered by the first groove (220).

2. The detector as described in claim 1, characterized in that, The first imaging unit (130) includes a plurality of imaging subunits (131), which are arranged on the first side along a second direction, wherein the second direction is perpendicular to the first direction.

3. The detector as described in claim 1, characterized in that, The first connector (200) includes at least two connecting pins (230), and each of the first detector components (100) includes at least one connecting hole (120), with each connecting pin (230) and a connecting hole (120) cooperating with each other.

4. The detector as described in claim 1, characterized in that, When viewed along the third direction, the overlapping portion of the first groove (220) and the first detector assembly (100) in the first direction covers the first imaging unit (130) of the two first detector assemblies (100).

5. The detector as claimed in claim 1, characterized in that, The detector (10) also includes: The second detector assembly is used to receive imaging signals. The second detector assembly includes a second substrate and a second imaging unit. The second imaging unit is disposed at the second end of the third side surface of the second substrate along the first direction. The first detector assembly (100) and the second detector assembly are arranged along the first direction. The first end of the first detector assembly (100) and the second end of the second detector assembly are close to each other. The third side surface is coplanar with the first side surface. The second connector is used to connect the first detector assembly (100) and the second detector assembly. The second connector is disposed on a second side of the first detector assembly (100) and a fourth side of the second detector assembly, wherein the second side is opposite to the first side and the fourth side is opposite to the third side.

6. An imaging device, characterized in that, include: A first detector assembly (100) for receiving imaging signals includes a first substrate (110) and a first imaging unit (130), wherein the first imaging unit (130) is disposed at a first end of a first side surface of the first substrate (110) along a first direction; and An anti-scattering grid (500) for absorbing a portion of the radiation is disposed above a first side of the first detector assembly (100) along a third direction, and the anti-scattering grid (500) at least partially overlaps with the position of the first imaging unit (130) in the first detector assembly (100) in a first direction. The imaging device includes two first detector assemblies (100) and a first connector (200). The two first detector assemblies (100) are symmetrically arranged along the end face of the first end. The first connector (200) is used to connect the two first detector assemblies (100). The first connector (200) is disposed on the second side of the two first detector assemblies (100), and the second side is opposite to the first side. The first connector (200) includes a first groove (220) in which a thermally conductive material (700) is disposed. When viewed in a third direction, the first imaging unit (130) falls completely within the area covered by the first groove (220).

7. The imaging apparatus as claimed in claim 6, characterized in that, The first detector assembly (100) is provided with at least one connection hole (120), and the anti-scattering grid (500) is provided with at least one mounting hole, each mounting hole being coaxial with a connection hole (120).

8. The imaging apparatus as claimed in claim 7, characterized in that, The imaging device further includes: The first connector (200) is provided with a plurality of connecting pins (230), at least two of which are connected to two mounting holes through a connecting hole (120).

9. The imaging apparatus as claimed in claim 7, characterized in that, The anti-scattering grid (500) includes an extension (510) extending from a first end of the first detector assembly (100) along the first direction, and the imaging device further includes: A third connector (600) is disposed on the second side of the first detector assembly (100). The third connector (600) includes a third step (610), a fourth step (620), and a second groove between the third step (610) and the fourth step (620). The third step (610) supports the first detector assembly (100), and the fourth step (620) supports the extension (510). A connecting pin (230) is provided on the third step (610) to connect the mounting hole and the connecting hole (120).

Images