Power semiconductor module hold-down device

Abstract

The application discloses a power semiconductor module pressing device, which comprises a telescopic mechanism, a support plate, two groups of guiding mechanisms and a pressing unit, wherein the telescopic mechanism is vertically arranged on an external device rack, and an output end of the telescopic mechanism is fixedly connected with the support plate; the two groups of guiding mechanisms are symmetrically and vertically arranged on the external device rack, and the two groups of guiding mechanisms respectively penetrate through the support plate and are slidably connected with the support plate; the pressing unit comprises a U-shaped frame and a pressing assembly, wherein the U-shaped frame is detachably connected with the support plate; and the pressing assembly is fixedly arranged on the U-shaped frame. Thus, the adjustable pressing mechanism can reduce the dependence on various pressing guiding blocks, effectively controls and reduces the use cost while ensuring the installation quality.

Description

Technical Field

[0001] This application relates to the technical field of auxiliary clamping fixtures, and more particularly to a power semiconductor module clamping device. Background Technology

[0002] The installation process of power semiconductor devices, especially critical components such as metal-oxide-semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors (IGBTs), and power integrated circuits, typically involves using a screw-pressing machine to install screws. During this process, the screw-pressing machine must be equipped with a clamping mechanism to ensure workpiece stability and facilitate installation. However, while current commercially available power semiconductor module clamping devices (such as the patent design with publication number CN221020634U) achieve a degree of versatility—that is, by replacing the clamping guide block to accommodate different models of power semiconductor modules, thus achieving multi-purpose functionality—this design also introduces significant cost issues.

[0003] Specifically, whenever dealing with different models of power semiconductor modules, operators need to replace the clamping guide blocks with the corresponding models. This means that in order to adapt to the diverse power semiconductor modules on the market, users must stock multiple clamping guide blocks of different specifications. This not only increases the additional management and maintenance burden, but more importantly, it increases the user's overall cost of use. Summary of the Invention

[0004] This application aims to at least partially address one of the technical problems in the related art.

[0005] Therefore, one objective of this application is to provide a power semiconductor module clamping device that, through adjustable clamping components, reduces reliance on multiple clamping guide blocks, thereby effectively controlling and reducing usage costs while ensuring installation quality.

[0006] To achieve the above objectives, a first aspect of this application provides a power semiconductor module clamping device, comprising a telescopic mechanism, a support plate, two sets of guide mechanisms, and a clamping unit. The telescopic mechanism is vertically mounted on a peripheral frame, and its output end is fixedly connected to the support plate. The two sets of guide mechanisms are symmetrically and vertically mounted on the peripheral frame, and each set of guide mechanisms passes through the support plate and is slidably connected to it. The clamping unit includes a U-shaped frame and a clamping assembly, wherein the U-shaped frame is detachably connected to the support plate, and the clamping assembly is fixedly mounted on the U-shaped frame.

[0007] The power semiconductor module clamping device of this application embodiment, through an adjustable clamping mechanism, can reduce the reliance on multiple clamping guide blocks, effectively controlling and reducing usage costs while ensuring installation quality.

[0008] In addition, the power semiconductor module clamping device proposed in this application may also have the following additional technical features:

[0009] In one embodiment of this application, each group of guiding mechanisms includes two symmetrically distributed guiding mechanisms. Each guiding mechanism includes a support base, a guide post, and a limiting plate. The support base is fixedly connected to the peripheral frame by threaded fasteners. The guide post is vertically fixed on the support base and passes through the support plate, and is slidably connected to the support plate. The limiting plate is fixedly disposed at the top end of the guide post.

[0010] In one embodiment of this application, the clamping assembly includes a support block, two clamping mechanisms, an adjusting mechanism, a ratchet mechanism, and two traction ropes. The support block is fixedly mounted on the U-shaped frame. Two symmetrically distributed slide rails are respectively formed on the two side walls of the support block. An installation groove is formed on the top surface of the support block, and a channel connecting the slide rails and the installation groove is formed inside the support block. The two clamping mechanisms are slidably connected to their respective slide rails. The adjusting mechanism is rotatably mounted within the installation groove. The ratchet mechanism is connected to both the adjusting mechanism and the support block. The two traction ropes are respectively disposed within their respective channels, with one end of each traction rope connected to the adjusting mechanism and the other end connected to each of the two clamping mechanisms.

[0011] In one embodiment of this application, the clamping mechanism includes two guide rods, an H-shaped clamping frame, two springs, and two clamping guide blocks. The two guide rods are slidably disposed within corresponding slide rails, with one end of each guide rod fixedly connected to the H-shaped clamping frame. The H-shaped clamping frame has a working through hole in its center. The two springs are respectively disposed within corresponding slide rails, with one end of each spring fixedly connected to the other end of a guide rod and the other end of each spring fixedly connected to the end wall of the slide rail. The other end of each guide rod is fixedly connected to the other end of a traction rope. The two clamping guide blocks are slidably disposed within side grooves of the H-shaped clamping frame, and each clamping guide block has a clearance hole.

[0012] In one embodiment of this application, the adjusting mechanism includes a winding drum and a drive handle, wherein the winding drum is rotatably disposed in the mounting groove and is fixedly connected to one end of the traction rope; the drive handle is connected to the rotating shaft of the winding drum.

[0013] In one embodiment of this application, the ratchet mechanism includes a ratchet, a check pawl, and a spring plate. The ratchet is fixedly mounted on the take-up drum and is coaxial with the take-up drum. One end of the check pawl is pivotally connected to the support block via a support shaft, and the other end of the check pawl is in contact with the ratchet. One end of the spring plate is fixedly connected to the support block, and the other end of the spring plate is in contact with the check pawl.

[0014] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0016] Figure 1 This is a perspective view of a power semiconductor module clamping device according to an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the structure of a clamping assembly according to an embodiment of this application;

[0018] Figure 3 This is a cross-sectional view of a clamping assembly according to an embodiment of this application;

[0019] Figure 4 This is a schematic cross-sectional view of a clamping assembly according to an embodiment of this application;

[0020] Figure 5 This is a cross-sectional view of a clamping assembly according to another embodiment of this application.

[0021] As shown in the figure: 10. Telescopic mechanism; 20. Support plate; 30. Guide mechanism; 31. Support seat; 32. Guide column; 33. Limiting plate; 40. Clamping unit; 41. U-shaped frame; 42. Clamping assembly; 421. Support block; 422. Clamping mechanism; 4221. Guide rod; 4222. H-shaped clamping frame; 4223. Spring; 4224. Clamping guide block; 423. Adjustment mechanism; 4231. Rewind drum; 4232. Drive handle; 424. Ratchet mechanism; 4241. Ratchet; 4242. Check pawl; 4243. Spring plate; 425. Traction rope; 4201. Slide rail; 4202. Mounting groove; 4203. Channel; 4204. Working through hole; 4205. Clearance hole. Detailed Implementation

[0022] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0023] The power semiconductor module clamping device of this application embodiment will now be described with reference to the accompanying drawings.

[0024] like Figures 1-4 As shown, the power semiconductor module clamping device of this application embodiment includes a telescopic mechanism 10, a support plate 20, two sets of guide mechanisms 30 and a clamping unit 40.

[0025] The telescopic mechanism 10 is vertically mounted on the external frame (not shown in the figure), and its output end is fixedly connected to the support plate 20. It should be noted that the telescopic mechanism 10 described in this embodiment can be a cylinder, a hydraulic cylinder, or an electric telescopic rod, and the initial state of the output end of the telescopic mechanism 10 is an extended state.

[0026] Two sets of guide mechanisms 30 are symmetrically and vertically arranged on the external equipment frame, and the two sets of guide mechanisms 30 respectively pass through the support plate 20 and are slidably connected to the support plate 20.

[0027] The clamping unit 40 may include a U-shaped frame 41 and a clamping assembly 42, wherein the U-shaped frame 41 is detachably connected to the support plate 20, and the clamping assembly 42 is fixedly mounted on the U-shaped frame 41. It is understood that the detachable connection between the U-shaped frame 41 and the support plate 20 described in this embodiment facilitates the installation and replacement of the clamping assembly 42. For example, the U-shaped frame 41 may be connected to the support plate 20 by means of snap-fit, riveting, or threaded fasteners (e.g., screws, bolts, or bolts).

[0028] Specifically, when it is necessary to press the workpiece (power semiconductor module) on the worktable, the relevant operator can control the telescopic mechanism 10 to work. At this time, the output end of the telescopic mechanism retracts and drives the pressing unit 40 to move down along the guide mechanism 30 through the support plate 20. The pressing component 42 in the pressing unit 40 presses down on the workpiece until the workpiece on the worktable is pressed.

[0029] In one embodiment of this application, such as Figure 1 As shown, each group of guide mechanisms 30 may include two symmetrically distributed guide mechanisms 30, and each guide mechanism 30 may include a support base 31, a guide post 32 and a limiting plate 33.

[0030] The support base 31 is fixedly connected to the external device frame by threaded fasteners. The guide post 32 is vertically fixed on the support base 31, and the guide post 32 passes through the support plate 20 and is slidably connected to the support plate 20. The limiting plate 33 is fixedly installed at the top of the guide post 32.

[0031] It is understandable that by setting the guide mechanism 30, the support plate 20 can move stably along the guide column 32 when it is lifted and moved, thereby ensuring the installation stability of the support plate 20 driving the pressing unit 40 during operation.

[0032] In one embodiment of this application, such as Figures 1-4 As shown, the clamping assembly 42 may include a support block 421, two clamping mechanisms 422, an adjustment mechanism 423, a ratchet mechanism 424, and two traction ropes 425.

[0033] The support block 421 is fixedly mounted on the U-shaped frame 41. Two symmetrically distributed slides 4201 are opened on the two side walls of the support block 421. An installation groove 4202 is opened on the top surface of the support block 421. A channel 4203 connecting the slides 4201 and the installation groove 4202 is opened inside the support block 421.

[0034] Two clamping mechanisms 422 are slidably connected to the corresponding slide rails 4201, and the adjusting mechanism 423 is rotatably set in the mounting groove 4202.

[0035] The ratchet mechanism 424 is connected to the adjustment mechanism 423 and the support block 421 respectively. The two traction ropes 425 are respectively set in the corresponding channels 4203, and one end of the traction rope 425 is connected to the adjustment mechanism 423, and the other end of the traction rope 425 is connected to the two clamping mechanisms 422 respectively.

[0036] To clearly illustrate the previous embodiment, in one embodiment of this application, as follows: Figure 2 and Figure 3 As shown, the clamping mechanism 422 may include two guide rods 4221, an H-shaped clamping frame 4222, two springs 4223, and two clamping guide blocks 4224.

[0037] Two guide rods 4221 are slidably disposed in the corresponding slide rails 4201, and one end of the guide rod 4221 is fixedly connected to the H-shaped clamping frame 4222. The H-shaped clamping frame 4222 has a working through hole 4204 in the middle.

[0038] Two springs 4223 are respectively installed in the corresponding slide rails 4201, and one end of the spring 4223 is fixedly connected to the other end of the guide rod 4221, and the other end of the spring 4223 is fixedly connected to the end wall of the slide rail 4201. The other end of the guide rod 4221 is fixedly connected to the other end of the traction rope 425.

[0039] Two clamping guide blocks 4224 are slidably disposed in the sliding grooves (not specifically marked in the figure) on both sides of the H-shaped clamping frame 4222, and the clamping guide blocks 4224 are provided with clearance holes 4205. It can be understood that by providing working through holes 4204 and clearance holes 4205, it is convenient for the screw-feeding rotating tool on the screw machine to perform the screw-feeding operation on the workpiece.

[0040] Furthermore, in one embodiment of this application, such as Figure 3 and Figure 4 As shown, the adjustment mechanism 423 may include a take-up drum 4231 and a drive handle 4232. The take-up drum 4231 is rotatably disposed in the mounting groove 4202 and is fixedly connected to one end of the traction rope 425. The drive handle 4232 is connected to the rotating shaft of the take-up drum 4231.

[0041] Furthermore, in one embodiment of this application, such as Figure 4 As shown, the ratchet mechanism 424 may include a ratchet 4241, a check pawl 4242, and a spring plate 4243. The ratchet 4241 is fixedly mounted on the take-up drum 4231 and is coaxial with the take-up drum 4231.

[0042] One end of the check pawl 4242 is pivotally connected to the support block 421 via a support shaft, and the other end of the check pawl 4242 is in contact with the ratchet 4241. One end of the spring plate 4243 is fixedly connected to the support block 421, and the other end of the spring plate 4243 is in contact with the check pawl 4242.

[0043] Understandably, in order to facilitate the operation of the check pawl 4242, an operating handle can also be provided at the top of the support shaft, and the handle end of the operating handle extends to the outside of the mounting groove 4202.

[0044] Specifically, before clamping the workpiece, the operator can adjust the clamping assembly 42 according to the size of the workpiece and the position of the threaded hole. That is, the operator can manually rotate the drive handle 4232, which drives the winding drum 4231 and ratchet 4241 to rotate synchronously. The rotating winding drum 4231 simultaneously winds up the two traction ropes 425. During the winding process, the two traction ropes 425 pull the two clamping mechanisms 422 to move towards each other along the slide rail 4201, at which point the guide rod 4221 in the clamping mechanism 422 compresses the spring 4223. Furthermore, by adjusting the distance between the two clamping mechanisms 422, the clamping range in the lateral direction (from one clamping mechanism 422 to the other) is adjusted until the working through hole 4204 on the H-shaped clamping frame 4222 corresponds to the mounting hole on the workpiece.

[0045] When it is necessary to adjust the clamping range in the longitudinal direction, the operator can adjust the clamping range by pulling the clamping guide block 4224 to move it on the H-shaped clamping frame 4222.

[0046] When the positions of the two clamping mechanisms 422 need to be reset, the operator can move the check pawl 4242 away from the ratchet 4241. After the ratchet 4241 is released from its limit, the compressed spring 4223, under the action of elastic potential energy, pushes the guide rod 4221, causing the H-shaped clamping frame 4222 and the two clamping guide blocks 4224 to move back to their reset positions along the slide 4201. At the same time, the resetting guide rod 4221 pulls the winding drum 4231 through the traction rope 425, causing the drive handle 4232 and the ratchet 4241 to rotate in the opposite direction to reset.

[0047] As one possible scenario, such as Figure 5 As shown, in order to increase the stability of the clamping guide block 4224 in the H-shaped clamping frame 4222 groove, anti-slip protrusions 50 can be provided on both sides of the groove of the H-shaped clamping frame 4222 to increase the friction with the clamping guide block 4224.

[0048] In summary, the power semiconductor module clamping device of this application embodiment, through an adjustable clamping mechanism, can reduce reliance on multiple clamping guide blocks, effectively controlling and reducing usage costs while ensuring installation quality.

[0049] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0051] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A power semiconductor module clamping device, characterized in that, It includes a telescopic mechanism, a support plate, two sets of guide mechanisms, and a clamping unit, among which, The retractable mechanism is vertically mounted on the external frame, and the output end of the retractable mechanism is fixedly connected to the support plate. The two sets of guide mechanisms are symmetrically and vertically arranged on the external frame, and the two sets of guide mechanisms respectively pass through the support plate and are slidably connected to the support plate; The clamping unit includes a U-shaped frame and a clamping assembly, wherein... The U-shaped frame is detachably connected to the support plate; The clamping assembly is fixedly mounted on the U-shaped frame; Each set of guiding mechanisms includes two symmetrically distributed guiding mechanisms, and each guiding mechanism includes a support base, a guide post, and a limiting plate, wherein, The support base is fixedly connected to the external device frame by threaded fasteners; The guide post is vertically fixed on the support base, and the guide post passes through the support plate and is slidably connected to the support plate; The limiting plate is fixedly installed at the top of the guide post; The clamping assembly includes a support block, two clamping mechanisms, an adjustment mechanism, a ratchet mechanism, and two traction ropes, wherein... The support block is fixedly mounted on the U-shaped frame. Two symmetrically distributed slide rails are respectively opened on the two side walls of the support block. An installation groove is opened on the top surface of the support block. A channel connecting the slide rails and the installation groove is opened inside the support block. The two clamping mechanisms are slidably connected to their respective slide rails; The adjustment mechanism is rotatably mounted in the mounting slot; The ratchet mechanism is connected to the adjustment mechanism and the support block respectively; The two traction ropes are respectively set in the corresponding channels, and one end of the traction rope is connected to the adjustment mechanism, and the other end of the traction rope is respectively connected to the two clamping mechanisms; The clamping mechanism includes two guide rods, an H-shaped clamping frame, two springs, and two clamping guide blocks, wherein, The two guide rods are slidably disposed in the corresponding slide rails, and one end of the guide rod is fixedly connected to the H-shaped clamping frame, wherein the H-shaped clamping frame has a working through hole in the middle. Two springs are respectively installed in the corresponding slide rails, and one end of each spring is fixedly connected to the other end of the guide rod, and the other end of each spring is fixedly connected to the end wall of the slide rail. The other end of the guide rod is fixedly connected to the other end of the traction rope. The two clamping guide blocks are respectively slidably disposed in the sliding grooves on both sides of the H-shaped clamping frame, and the clamping guide blocks are provided with clearance holes.

2. The power semiconductor module clamping device according to claim 1, characterized in that, The adjusting mechanism includes a take-up drum and a drive handle, wherein... The winding drum is rotatably disposed in the mounting groove, and the winding drum is fixedly connected to one end of the traction rope; The drive handle is connected to the rotating shaft of the take-up drum.

3. The power semiconductor module clamping device according to claim 2, characterized in that, The ratchet mechanism includes a ratchet, a check pawl, and a spring plate, wherein, The ratchet is fixedly mounted on the take-up drum and is coaxial with the take-up drum. One end of the check pawl is pivotally connected to the support block via a support shaft, and the other end of the check pawl is in contact with the ratchet. One end of the spring sheet is fixedly connected to the support block, and the other end of the spring sheet is in contact with the anti-return claw.

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