Laser positioning device and wafer detection system

CN119581383APending Publication Date: 2025-03-07DONGFANG JINGYUAN ELECTRON LTD
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Patent Information

Application Number
CN202411677131.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-21
Publication Date
2025-03-07

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Abstract

The invention discloses a laser positioning device and a wafer detection system. The laser positioning device comprises an objective table, an orthogonality test feedback assembly and a light path assembly. The objective table comprises a moving mechanism, a bearing part and a measuring mirror, the moving mechanism is used for driving the bearing part to move in a first direction and a second direction, the measuring mirror is installed on the bearing part, a first measuring surface of the measuring mirror intersects with the first direction, and a second measuring surface of the measuring mirror intersects with the second direction; the orthogonality test feedback assembly is provided with a first measuring head and a second measuring head, the first measuring head emits a first laser beam towards the first measuring surface along the first direction, and the second measuring head emits a second laser beam; and the light path assembly is used for dividing the second laser beam into a plurality of third laser beams and emitting the third laser beams to the second measuring surface along the second direction. Multi-point high-precision positioning can be provided through the first laser beam and the plurality of third laser beams.
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Citation Information

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