Laser positioning device and wafer detection system
CN119581383APending Publication Date: 2025-03-07DONGFANG JINGYUAN ELECTRON LTD
Patent Information
- Application Number
- CN202411677131.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-03-07
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Figure CN119581383A_ABST
Abstract
The invention discloses a laser positioning device and a wafer detection system. The laser positioning device comprises an objective table, an orthogonality test feedback assembly and a light path assembly. The objective table comprises a moving mechanism, a bearing part and a measuring mirror, the moving mechanism is used for driving the bearing part to move in a first direction and a second direction, the measuring mirror is installed on the bearing part, a first measuring surface of the measuring mirror intersects with the first direction, and a second measuring surface of the measuring mirror intersects with the second direction; the orthogonality test feedback assembly is provided with a first measuring head and a second measuring head, the first measuring head emits a first laser beam towards the first measuring surface along the first direction, and the second measuring head emits a second laser beam; and the light path assembly is used for dividing the second laser beam into a plurality of third laser beams and emitting the third laser beams to the second measuring surface along the second direction. Multi-point high-precision positioning can be provided through the first laser beam and the plurality of third laser beams.
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Citation Information
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