Sealing system

Abstract

The present invention relates to a sealing system for sealing sealing portions (22a, 22b) in a liquid-tight manner, the sealing portions (22a, 22b) being arranged between a plastic wall of a first component (17) and a wall of a second component (27, 28) made of a metallic material, particularly aluminum, wherein the wall made of the metallic material is preferably connected to the plastic wall (19), particularly in a material-to-material bonding manner and / or a shape-fitting manner. The invention is characterized in that the sealing system includes sealing components (25a, 25b) made of metallic material, preferably aluminum, and particularly flat, which cover the sealing portions (22a, 22b) when sealing the sealing portions in a liquid-tight manner. In one aspect, the sealing components (25a, 25b) are connected to the plastic wall of the first component (17) in a liquid-tight manner, particularly in a material-to-material bonding manner, and in another aspect, the sealing components (25a, 25b) are welded to the wall of the second component (27, 28) made of metallic material in a liquid-tight manner, preferably by laser welding.

Description

Technical Field

[0001] This invention relates to a sealing system for liquid-tightly sealing a sealing portion between a plastic wall disposed in a first component and a wall made of a metallic material, particularly aluminum, wherein the metallic wall is particularly preferably connected to the plastic wall, especially in a material-to-material bonding and / or form-fitting manner. Furthermore, the invention also relates to a method for sealing such a sealing portion and to an apparatus comprising such a first component, a second component, and such a sealing portion.

[0002] In particular, not only for equipment such as cooling devices for power electronic components, but also for applications where plastic and metal materials must meet special sealing requirements, in order to combine the specific advantages of each material. Background Technology

[0003] Depending on the design of the equipment, there is often a question of whether these materials can be adequately liquid-tightly sealed.

[0004] US Patent Publication No. 2022 / 395933A1 discloses a method for forming a liquid-tight pressure fit between a component and an internal element. The method includes the steps of connecting one component to another by applying heat to a first component, a second component, or a plurality of components thereof, and cooling the first and second components, wherein the steps of applying heat and cooling apply pressure to the second component and the internal element through a liquid-tight element to form a liquid-tight seal.

[0005] US Patent Publication No. 2022 / 305597A1 discloses a method for manufacturing a hybrid heat exchanger. The method includes texturing a metal surface using a laser to form multiple microstructures, and subsequently bonding a plastic component to the multiple microstructures via fusion bonding. During the fusion bonding process, the plastic component is bonded to the metal surface.

[0006] US Patent Publication No. 2008 / 260455A1 discloses a composite seal in which a first metal layer and a second metal layer are arranged alternately. A mineral layer is disposed between the metal layers. The metal layers and the mineral layer have inner and outer perimeters, wherein the inner perimeters overlap each other to form an opening. The metal layers are joined at a boundary, preferably at the outer boundary, by welding. The metal layers are preferably thin films made of noble metals or high-temperature alloys, and the mineral layer may be mica, vermiculite, or a modified vermiculite material. Summary of the Invention

[0007] Therefore, the object of the present invention is to further improve the sealing system, the method, and the device mentioned above.

[0008] This objective is achieved by a sealing system having the features of claim 1, by a method having the features of claim 7, and by a device having the features of claim 9.

[0009] Therefore, the sealing system according to the invention, which has a sealing member comprising a first component and a second component, according to claim 1, is characterized by a separate, particularly flat sealing member made of a metallic material, preferably aluminum, which covers the sealing portion when sealing the sealing portion in a liquid-tight manner, wherein, on the one hand, the sealing member is connected to the plastic wall of the first component in a liquid-tight manner, particularly in a material-to-material bonding manner, and on the other hand, is welded to the wall of the second component made of a metallic material in a liquid-tight manner, preferably by laser welding.

[0010] A "metallic" material is a material in which at least one component is made of metal. Therefore, a metal can be a pure metal, but it can also include alloys such as steel.

[0011] The use of a separate sealing component made of such a metallic material according to the invention enables the corresponding sealing portion to be sealed in a particularly reliable liquid-tight manner, wherein the sealing component is then connected to the plastic wall in a liquid-tight manner on one hand and welded to the wall made of the metallic material in a liquid-tight manner on the other hand by utilizing a suitable connection method.

[0012] According to the invention, the sealing member can advantageously have a thickness at least in the deformation section, which enables elastic deformation of the deformation section, which in particular compensates for the difference in thermal expansion behavior of the plastic wall of the first component and the wall of the second component made of a metallic material, especially material-related and / or design-related differences.

[0013] If the sealing part is a preferred circumferential sealing gap between the plastic wall of the first component and the wall of the second component made of metal, then the sealing member can be specified as a preferred circumferential sealing frame that covers the sealing gap during sealing in particular by means of a first connecting section of the sealing member, particularly a circumferential connecting section, being liquid-tightly connected to the first component, and a second connecting section of the sealing member, particularly a circumferential connecting section, being connected to the second component.

[0014] Preferably, the two connecting sections of the sealing frame can extend in different planes and can be connected to each other by an intermediate section, which connects the two connecting sections to each other, particularly by a deformable section.

[0015] Regarding the liquid-tight connection between a sealing component on one side and the plastic wall of a first component on the other side, this may include: pressing at least one connecting surface of the plastic wall of the first component against a connecting surface of the sealing component made of a metallic material, particularly against a connecting surface disposed on a first connecting section, wherein the connecting surface of the sealing component has nanostructures and / or microstructures applied to the connecting surface, particularly by chemical and / or physical microstructuring methods, wherein the nanostructures and / or microstructures particularly cause surface enlargement and / or have three-dimensional recesses, preferably including undercuts and / or barbs.

[0016] Furthermore, regarding the liquid-tight connection between a sealing component on one side and a wall made of metallic material of a second component on the other side, this may include: at least one connecting surface of the sealing component being connected to the connecting surface of the wall made of metallic material of the second component by laser welding, particularly laser transmission welding.

[0017] The method of the present invention for liquid-tight sealing between the plastic wall of the first component and the metal wall of the second component according to claim 7 includes at least the following measures:

[0018] a) Processing one or the first connecting surface of the sealing component using chemical and / or physical microstructuring methods, thereby applying a nanostructure to the connecting surface, wherein the nanostructure and / or microstructure specifically results in surface enlargement and / or recesses, the recesses including undercuts and / or barbs.

[0019] b) Using a sealing component to cover the sealing area in a liquid-tight manner, wherein

[0020] b1) One of the sealing components or the first connecting surface is pressed into one of the plastic walls of the first assembly or the connecting surface in a liquid-tight manner, and wherein

[0021] b2) One of the sealing components or the second connecting surface is welded in a liquid-tight manner, particularly by laser welding, to one of the walls of the second component made of metallic material or the connecting surface.

[0022] Regarding the device according to claim 9, preferably, this can be a hybrid cooling assembly for dissipating heat from an object to be cooled, such as a power electronic module, wherein a cooling medium capable of dissipating waste heat can be conducted through the hybrid cooling assembly, wherein a first component having a plastic wall is a plastic substrate of the hybrid cooling assembly, and wherein a second component having a wall made of a metallic material is a cooling body of the hybrid cooling assembly made of a metallic material, wherein the object to be cooled can be arranged on the cooling body, and wherein, in the case of forming a sealing portion covered by a sealing member and particularly forming a circumferential gap, the cooling body is connected to the plastic substrate in a material-to-material bonding manner and / or shape-fitting manner.

[0023] In this context, the sealing component can be, in particular, a circumferential, preferably closed sealing frame that covers the sealing gap. Specifically, the first connecting surface of the sealing frame, in particular a circumferential, preferably closed connecting surface, especially the connecting strip, is connected in a liquid-sealed manner to the circumferential connecting surface, especially the connecting strip, of the plastic wall of the substrate of the mixing cooling assembly, and the second connecting surface of the sealing frame, preferably a circumferential, preferably closed connecting surface, especially the connecting strip, is connected to the connecting surface of the cooling body of the mixing cooling assembly, in particular a circumferential connecting surface.

[0024] Advantageously, the liquid-tight connection between the sealing frame on one side and the plastic wall of the substrate on the other side may include: a liquid-tight press-fit between the connecting surface of the plastic wall of the substrate and a first connecting surface of the sealing frame, wherein the first connecting surface of the sealing frame has a nanostructure and / or a microstructure, particularly applied to the connecting surface by chemical and / or physical microstructuring methods, wherein the nanostructure and / or microstructure particularly causes surface enlargement and / or has a recess, which includes undercuts and / or has barbs.

[0025] At least one object to be cooled can be arranged in the hybrid cooling assembly and connected to the cooling body when it is in contact with the cooling body. This is achieved in particular by welding the outer side of the object to be cooled, which is made of a metallic material, to one side of the cooling body.

[0026] As for other aspects, one side of the cooling body can form a limiting surface for the cooling medium channel of the mixed cooling assembly, through which the cooling medium can be conducted to dissipate the object to be cooled or its waste heat. On the other hand, the other side of the cooling body can form a cooling surface, and the object to be cooled can be arranged or disposed on the cooling surface, particularly by welding the outer side of the object to be cooled to the other side of the cooling body.

[0027] Additionally, the sealing frame may be specified to include: a first edge segment, preferably an outer edge segment, on which a first connecting surface is disposed; and a second edge segment, preferably an inner edge segment, on which a second connecting surface is disposed; and a deformable segment of the sealing frame is disposed between the two edge segments, the deformable segment having a thickness capable of achieving elastic deformation of the deformable segment, which can compensate for, in particular, material-related and / or design-related differences in the thermal expansion behavior of the plastic wall of the substrate and the metallic material of the coolant. Attached Figure Description

[0028] Other features of the invention become apparent from the appended claims, the following description of preferred embodiments of the invention, and the accompanying drawings, in which:

[0029] Figure 1 A perspective view (partial cross-section) of the hybrid cooling assembly is shown, wherein the sealing portion is sealed using a sealing system according to the invention.

[0030] Figure 2 Also shown Figure 1 A perspective view (partial cross-section) of the hybrid cooling assembly, where details are omitted.

[0031] Figure 3 Shown from Figure 1 The longitudinal section of the hybrid cooling assembly,

[0032] Figure 4 Show Figure 3 A magnified view of details IV. Detailed Implementation

[0033] The sealing system according to the invention will be described with reference to the hybrid cooling assembly 10. Using this assembly, heat is dissipated from the object to be cooled by conduction of a cooling medium, particularly a coolant from a coolant source (not shown), through the hybrid cooling assembly 10, and waste heat emitted by the object to be cooled 11 is carried away by the cooling medium. However, this sealing system can also be used in conjunction with other equipment.

[0034] In this configuration, the hybrid cooling assembly 10 includes an inlet 12 and an outlet 13. Cooling medium is supplied to the hybrid cooling assembly 10 via the inlet 12, and after absorbing heat from the object to be cooled 11, the cooling medium is discharged from the hybrid cooling assembly 10 again via the outlet 13. The object to be cooled 11 may be, for example, a power electronic chip.

[0035] In this case, the top surface 14 and bottom surface 15 of the object to be cooled 11 will be cooled. For this purpose, the cooling medium is guided along both the top surface 14 and the bottom surface 15, that is, guided through the cooling channels 16a or 16b of the mixing cooling assembly 10, respectively.

[0036] In this case, the hybrid cooling assembly 10 includes an injection-molded base 17 made of plastic, the base 17 having different walls and an internal space 18, cooling channels 16a and 16b formed in the internal space 18, and the object to be cooled 11 arranged in the internal space 18.

[0037] Additionally, the hybrid cooling assembly 10 includes cooling bodies 27 and 28, which are made of metallic materials, particularly aluminum, respectively. These bodies are arranged in a parallel plane, with the object to be cooled 11 located between them. The (upper) cooling body 27 rests against the top surface 14 of the object to be cooled 11, and the (lower) cooling body 28 rests against the bottom surface 15 of the object to be cooled 11. The top surface 14 and bottom surface 15 of the object to be cooled 11 can, for example, be welded to the cooling bodies 27 and 28, respectively.

[0038] The inner wall 19 of the substrate 17, arranged in the internal space 18, includes a frame-like, circumferential edge region with a circumferential connecting groove 20, in which the (circumferential) edge segment 21 of the object to be cooled 17 is arranged. In this case, the edge segment 21 is connected to the inner wall 19 in a material-to-material bonding manner.

[0039] There are sealing portions formed as circumferential sealing gaps 22a and 22b between the object to be cooled 11 and the inner wall 19 of the substrate 10. Without a seal, the cooling medium flowing through the cooling channels 16a and 16b may or will unintentionally penetrate between the object to be cooled 11 and the inner wall 19 through the sealing portions.

[0040] In this case, a sealing gap 22a is arranged between the top surface 14 of the object to be cooled 11 and the top surface 23 of the inner wall 19 of the substrate 17, and another sealing gap 22b is arranged between the bottom surface 15 of the object to be cooled 11 and the bottom surface 24 of the inner wall 19 of the substrate 17.

[0041] For the liquid-tight sealing of gaps 22a and 22b, a sealing system is now provided, which in this case includes either a flat, frame-like sealing element or a sealing frame 25a for sealing gap 22a and a sealing frame 25b for sealing gap 22b, respectively. It will be understood that, depending on the application or the type of sealing location, other sealing elements that are not frame-like may also be used.

[0042] The sealing components or individual sealing frames 25a, 25b are each made of a metallic material, preferably aluminum, or composed of such a metallic material. For liquid-tight sealing, they respectively cover the corresponding sealing gaps 22a or 22b and are each liquid-tightly connected to the inner wall 19 of the base 17 and the corresponding cooling body 27 or 28.

[0043] Specifically, in this case, the interior, circumferential edge and connection area of ​​each sealing frame 25a, 25b have a corresponding strip connection surface 26a, which is liquid-tightly connected to the outside of the corresponding coolant 27 or 28 by correspondingly oppositely arranged circumferential strip connection surfaces 27a or 28a.

[0044] Each sealing frame 25a, 25b has a separate strip-shaped connecting surface 26b on its outer circumferential edge and connecting area. This connecting surface 26b is liquid-tightly connected to the top surface 23 or the bottom surface 24 of the (plastic) inner wall 19 via corresponding oppositely arranged annular strip-shaped connecting surfaces 23a or 24.

[0045] For this fluid-tight connection between the top surface 23 of the (plastic) inner wall 19 and the outer (metallic) connecting surface 26b of the sealing frame 25a, or for connecting the bottom surface 24 of the inner wall 19 to the outer connecting surface 26b of the sealing frame 25b, the respective outer connecting surfaces 26b of the sealing frames 25a, 25b have nanostructures and / or microstructures applied to the outer connecting surfaces 26b, particularly by chemical and / or physical microstructuring methods, and particularly have the following nanostructures and / or microstructures that cause surface enlargement and / or have depressions, which include undercuts and / or barbs.

[0046] The connecting surface 26b, processed in this manner, is then pressed against the (plastic) inner wall 19 during the manufacture of the hybrid cooling assembly 10. However, it is understood that other joining techniques could theoretically be envisioned for this fluid-tight connection.

[0047] In this case, the fluid-tight connection between the internal (metal) connecting surface 26a and the respective opposing (metal) connecting surfaces 27a of the upper cooling body 27, or the internal (metal) connecting surface 26a and the respective opposing (metal) connecting surfaces 28a of the lower cooling body 28, is achieved by laser (sealing) welding of these two metal surfaces. In this example, it will be understood that other connection methods are also conceivable for achieving this fluid-tight connection.

[0048] Additionally, each sealing frame 20a, 25b has a deformable section 29 formed as an intermediate section, which is arranged between the outer edge or connecting section and the inner edge or connecting section of the respective sealing frame 25a or 25b. In this case, the deformable section 29 has a thickness of a few millimeters, which allows for elastic deformation of the deformable section 29, thereby compensating for material-related and / or design-related differences in the thermal expansion behavior of the (plastic) inner wall 19 of the substrate 17 and the metallic material of the cooling body 27 or 28.

[0049] List of reference numerals in the attached diagram:

[0050] 10 Hybrid Cooling Components

[0051] 11 Objects awaiting cooling

[0052] 12 entrances

[0053] 13 Exports

[0054] 14 Top surface of the object to be cooled

[0055] 15. Bottom surface of the object to be cooled

[0056] 16a cooling channel

[0057] 16b cooling channel

[0058] 17. Matrix of hybrid cooling assembly

[0059] 18 Interior Space

[0060] 19 Inner Wall

[0061] 20 Connecting grooves on the inner wall

[0062] 21 Edge sections of the object to be cooled

[0063] 22a Sealing gap

[0064] 22b Sealing gap

[0065] 23 Top surface of the inner wall

[0066] 23a Top surface connection surface

[0067] 24 Bottom surface of the inner wall

[0068] 24a bottom surface connection surface

[0069] 25a Sealing Frame

[0070] 25b Sealing Frame

[0071] 26a Sealing Frame Internal Connection Surface

[0072] 26b sealing frame external connection surface

[0073] 27 Upper cooling body

[0074] 27a Upper Cooling Body Connection Surface

[0075] 28 lower cooling body

[0076] 28 Connecting surfaces of the lower cooling body

[0077] 29 Deformation Section

Claims

1. A sealing system for providing a liquid-tight seal to a sealing component. Its features are, The sealing system includes a sealing member having a first component and a second component. The sealing portion is disposed between a plastic wall of the first component and a metal wall of the second component, wherein the metal wall is connected to the plastic wall. The sealing system includes a flat sealing member made of metal that covers the sealing portion when sealing it in a liquid-tight manner. In one aspect, the sealing member is liquid-tightly connected to the plastic wall of the first component, and in another aspect, the sealing member is liquid-tightly welded to the metal wall of the second component.

2. The sealing system according to claim 1, characterized in that, The metallic material is aluminum.

3. The sealing system according to claim 1, characterized in that, The sealing component has a thickness at least in the deformation section, the thickness allowing elastic deformation of the deformation section to compensate for the difference in thermal expansion behavior between the plastic wall of the first component and the metal wall of the second component.

4. The sealing system according to claim 3, characterized in that, The elastic deformation can compensate for material-related and / or design-related differences in the thermal expansion behavior of the plastic wall of the first component and the metal wall of the second component.

5. The sealing system according to claim 1, characterized in that, The sealing part is a sealing gap located between the plastic wall of the first component and the metal wall of the second component.

6. The sealing system according to claim 5, characterized in that, The sealing gap is a circumferential sealing gap.

7. The sealing system according to claim 6, characterized in that, The sealing component is a sealing frame that covers the sealing gap when sealing the sealing gap in such a way that a first connecting section of the sealing component is liquid-tightly connected to the first component, and a second connecting section of the sealing component is liquid-tightly connected to the second component.

8. The sealing system according to claim 7, characterized in that, The sealing frame is a circumferential sealing frame.

9. The sealing system according to claim 7, characterized in that, The first connecting section of the sealing component is a circumferential connecting section, and the second connecting section of the sealing component is a circumferential connecting section.

10. The sealing system according to claim 7, characterized in that, The two connecting sections of the sealing frame extend in different planes and are connected to each other by an intermediate section that connects the two connecting sections to each other.

11. The sealing system according to claim 10, characterized in that, The intermediate section connects the two connecting sections to each other through a deformable section.

12. The sealing system according to claim 1, characterized in that, The liquid-tight connection between the sealing component on one side and the plastic wall of the first component on the other side includes pressing at least one connecting surface of the plastic wall of the first component against a connecting surface of the sealing component made of a metallic material, wherein the connecting surface of the sealing component made of a metallic material is arranged in a first connecting section, wherein the connecting surface of the sealing component has nanostructures and / or microstructures applied to the connecting surface by chemical and / or physical microstructuring methods.

13. The sealing system according to claim 12, characterized in that, The nanostructures and / or microstructures cause surface enlargement and / or three-dimensional depressions.

14. The sealing system according to claim 13, characterized in that, The three-dimensional recess includes an undercut and / or has barbs.

15. The sealing system according to claim 7, characterized in that, The liquid-tight connection between the sealing component on one side and the wall of the second component made of metal material on the other side includes: at least one connecting surface of the sealing component is connected to the connecting surface of the wall of the second component made of metal material by laser welding, wherein the connecting surface of the sealing component is arranged in the second connecting section.

16. The sealing system according to claim 15, characterized in that, The at least one connecting surface of the sealing component is connected to the connecting surface of the wall of the second component made of metallic material by laser transmission welding.

17. A method for sealing a sealing portion between a plastic wall of a first component and a wall of a second component made of a metallic material using a sealing system as described in one or more of the preceding claims, wherein, The wall made of a metallic material is connected to the plastic wall, characterized in that the method includes the following measures: a) Processing a first connecting surface of a sealing component made of a metallic material using chemical and / or physical microstructuring methods, such that nanostructures and / or microstructures are applied to the connecting surface, wherein the nanostructures and / or microstructures cause surface enlargement and / or recesses, the recesses including undercuts and / or barbs. b) Covering the sealed portion in a liquid-tight manner using a sealing component, wherein b1) The first connecting surface of the sealing member is pressed together with the connecting surface of the plastic wall of the first component in a liquid-tight manner, and wherein b2) The second connecting surface of the sealing component is welded to the connecting surface of the wall of the second component made of metal material in a liquid-tight manner.

18. The method according to claim 17, characterized in that, The metal is aluminum, and the first connecting surface is a flat first connecting surface.

19. The method according to claim 17, characterized in that, The wall, made of metallic material, is attached to the plastic wall in a material-to-material bonding manner and / or a shape-fitting manner.

20. An apparatus comprising a first component having a plastic wall and a second component having a wall made of a metallic material, wherein the wall made of the metallic material is connected to the plastic wall of the first component, and wherein a sealing portion is located between the plastic wall of the first component and the wall made of the metallic material of the second component. Its features are, The sealing portion is sealed in a liquid-tight manner by a sealing system comprising a sealing member made of a metal material, which covers the sealing portion when sealing it in a liquid-tight manner. In one aspect, the sealing member is liquid-tightly connected to the plastic wall of the first component, and in another aspect, the sealing member is liquid-tightly welded to the metal wall of the second component.

21. The device according to claim 20, characterized in that, The device is a hybrid cooling assembly for dissipating heat from an object to be cooled, wherein a cooling medium can be conducted through the hybrid cooling assembly, the cooling medium can dissipate waste heat, and a first component having the plastic wall is a plastic substrate of the hybrid cooling assembly, and a second component having a wall made of a metal material is a metal cooling body of the hybrid cooling assembly, wherein the object to be cooled can be arranged on the cooling body, and wherein the cooling body is connected to the plastic substrate when forming a sealing portion covered by the sealing member.

22. The device according to claim 21, characterized in that, The object to be cooled is a power electronic module.

23. The device according to claim 21, characterized in that, The cooling body is connected to a substrate made of plastic when forming a sealing area covered by the sealing component and when forming a circumferential gap.

24. The device according to claim 21, characterized in that, The sealing component is a sealing frame that covers the sealing gap in such a way that a first connecting surface of the sealing frame is liquid-tightly connected to the connecting surface of the plastic wall of the substrate of the hybrid cooling assembly, and a second connecting surface of the sealing frame is liquid-tightly connected to the connecting surface of the cooling body of the hybrid cooling assembly.

25. The device according to claim 24, characterized in that, The connecting surface of the cooling body of the hybrid cooling assembly is a circumferential connecting surface.

26. The device according to claim 24, characterized in that, The liquid-tight connection between the sealing frame on one side and the plastic wall of the substrate on the other side includes pressing the connecting surface of the plastic wall of the substrate against a first connecting surface of the sealing frame, wherein the first connecting surface of the sealing frame has a nanostructure and / or a microstructure, the nanostructure and / or microstructure being applied to the connecting surface by chemical and / or physical microstructuring methods.

27. The device according to claim 26, characterized in that, The nanostructures and / or microstructures cause surface enlargement and / or have depressions, which include undercuts and / or barbs.

28. The device according to claim 21, characterized in that, At least one object to be cooled is arranged in the hybrid cooling assembly, and the object to be cooled is connected to the cooling body while in contact with the cooling body.

29. The device according to claim 21, characterized in that, One side of the cooling body forms a limiting surface for the cooling medium channel of the hybrid cooling assembly. The cooling medium can be conducted through the limiting surface of the cooling medium channel to discharge the object to be cooled or the waste heat of the object to be cooled. The other side of the cooling body forms a cooling surface on which the object to be cooled can be arranged or placed.

30. The device according to claim 24, characterized in that, The sealing frame includes: a first edge segment, on which the first connecting surface is disposed; and a second edge segment, on which the second connecting surface is disposed; and a deformable segment of the sealing frame is disposed between the two edge segments, the deformable segment having a thickness capable of elastic deformation of the deformable segment, the thickness being capable of compensating for the difference in thermal expansion behavior between the plastic wall of the substrate and the metallic material of the coolant.

31. The device according to claim 30, characterized in that, The first edge segment is the outer edge segment, and the second edge segment is the inner edge segment.

32. The device according to claim 30, characterized in that, The thickness can compensate for material-related and / or design-related differences in the thermal expansion behavior of the plastic wall of the substrate and the metal material of the coolant.

Images