A laser cutting device and method for cutting diamond

Abstract

The application discloses a kind of laser cutting devices of diamond, including the laser emission component capable of emitting laser beam, the laser emission component includes the output end near product side;Product is close to the side of output end and is provided with shielding unit, and the shielding unit is provided with light transmission area;Laser beam includes machining beam and edge beam, and the light transmission area can only be supplied machining beam to pass through.By being provided with shielding unit on product, shielding unit is provided with light transmission area, wherein light transmission area can make the machining beam of output end pass through, and edge beam is shielded, to reduce the ablation of edge beam to product (diamond), avoid causing cutting path to expand, reduce material loss.

Description

Technical Field

[0001] This invention relates to the field of diamond processing technology, and in particular to a laser cutting device and method for diamond. Background Technology

[0002] Diamond possesses unique material properties, such as an ultra-wide bandgap, high breakdown field strength, and high carrier saturation drift velocity, making it promising for applications in high-power electronic devices, 5G / 6G communications, microwave / millimeter-wave integrated circuits, and detection and sensing. Furthermore, diamond's high hardness makes it suitable for manufacturing precision cutting tools, and its high thermal conductivity makes it an excellent thermal management material. In recent years, significant progress has been made in the preparation technology of diamond single crystals both domestically and internationally; however, the processing efficiency and quality of diamond still need improvement.

[0003] For example, publication number "CN117943706A" discloses "a processing technology for high-strength CVD diamond using laser processing." The laser cutting machine includes a worktable, with a drive assembly fixedly installed on the left side of the worktable. A connecting ring is fixedly sleeved at the output end of the drive assembly, and a laser emitter is fixedly installed in the middle of the connecting ring. A ring-shaped tube is fixedly installed at the bottom end of the laser emitter. Diamond has the highest Mohs hardness and extremely high thermal conductivity, making it more difficult to laser process than other materials. However, when the laser comes into contact with diamond and raises its temperature to around 700°C, the diamond begins to transform into graphite, making this part of the material particularly easy to remove by the laser. Therefore, in actual laser processing, the edge of the laser beam creates a continuous process of transformation into graphite, ablation, and re-transformation into graphite and then ablation on the surface diamond, resulting in an abnormally wide surface cut and high material loss. Summary of the Invention

[0004] In view of the problems of large cutting width and high material loss in the prior art mentioned in the background, the present invention provides a laser cutting device for diamond. By filtering out part of the edge beam through a shielding unit, weak light is prevented from ablating the surface diamond, thereby significantly reducing the cutting width and reducing material loss.

[0005] To achieve the above objectives, the present invention adopts the following technical solution.

[0006] A laser cutting apparatus for diamond includes a laser emitting assembly capable of emitting a laser beam, the laser emitting assembly including an output end near the product side; A blocking unit is provided on the side of the product near the output end, and the blocking unit is provided with a light-transmitting area; The laser beam includes a processing beam and an edge beam, and the light-transmitting area allows only the processing beam to pass through.

[0007] In existing technologies, diamond processing and manufacturing mainly utilize diamond wire saws and laser processing. Diamond wire sawing has extremely low processing efficiency and is prone to generating chips and cracks during the process. Laser processing is a non-contact processing technology with advantages such as high efficiency, high precision, and low wear. However, current laser processing methods suffer from a certain degree of wear. For example, after cutting a 20mm × 20mm diamond cross-section, the kerf width can reach 0.5mm, resulting in significant wear. This is partly due to the Gaussian distribution of the laser beam; as the cutting progresses, the focal point shifts downwards, and the diverging beam at the upper end continuously ablates the kerf wall, resulting in a tapered kerf. Furthermore, although the light intensity decreases to 1 / e of the peak value according to the definition of the spot diameter... 2 The diameter of the circular area formed is the laser spot diameter, which is also the main part responsible for the laser ablation effect. However, in practice, each laser beam includes a weak light area and a central beam. If only one laser beam is used for processing, the weak light area of ​​the spot may cause a continuous process of transformation of the diamond on the upper surface into graphite, ablation, and then transformation back into graphite and ablation, resulting in an abnormally wide surface cut. If multiple laser beams are used for processing simultaneously, the weak light areas of the edge laser beams within this laser beam group will also cause a continuous process of transformation of the diamond on the surface into graphite, ablation, and then transformation back into graphite and ablation. Subsequent polishing and grinding are usually required to form a diamond sheet with parallel top and bottom surfaces. Therefore, the wider cut at the upper end results in more material needing to be polished away, causing high material loss.

[0008] In this application, a shielding unit is provided on the product, and the shielding unit has a light-transmitting area. The light-transmitting area allows the processing beam at the output end to pass through while shielding the edge beam, thereby reducing the ablation of the edge beam on the product (diamond), avoiding widening of the cutting path, and reducing material loss. The laser beam is the laser used for processing diamond, which can be a single laser beam or a combination of multiple laser beams. The edge beam is the part of the laser beam's edge that would cause additional ablation. If the laser beam consists of only one laser beam, the edge beam is the weak light area of ​​that laser beam. If the laser beam consists of several laser beams, the edge beam is the outermost weak light area of ​​the laser beam, that is, the weak light area of ​​the laser beam at the edge of the laser beam away from the processing center, which would cause additional ablation to the cutting path. The processing beam is the portion of the laser beam excluding the edge beam. If the laser beam consists of only one laser beam, the processing beam is the portion of the laser beam that does not include the weak light area. If the laser beam comprises several laser rays, the processing beam is the portion excluding the weak light area at the very edge of the laser beam. This includes the central beam and weak light area of ​​all laser rays in non-edge positions, as well as the central beam and weak light area near the processing center of the laser rays in edge positions. The lengths of the blocking unit and the light-transmitting area need to be set according to whether there is relative displacement with the product. If the blocking unit is fixedly connected to the diamond product, the lengths of the blocking unit and the light-transmitting area need to be greater than or equal to the length of the diamond product. If the blocking unit is displaced from the diamond product during the cutting process, the lengths of the blocking unit and the light-transmitting area can be less than the length of the diamond product.

[0009] Preferably, the shielding unit includes a shielding plate with a light-transmitting area. The shielding plate with the light-transmitting area blocks the edge beam. The shape of the light-transmitting area on the shielding plate varies according to processing requirements, mainly including a strip-shaped through-hole structure and a circular through-hole structure, respectively adapting to cutting and drilling conditions. In the processing using the strip-shaped through-hole, since the through-hole can only block the edge beams on both sides, it cannot block the ablation of the product by the edge beam in the cutting direction. Therefore, the product in the forward direction is first ablated by the edge beam, and then by the processing beam, thereby improving processing efficiency and fully utilizing the auxiliary processing of the edge beam.

[0010] The light-transmitting area on the shielding plate is a slot or a through-hole structure. The shape of the light-transmitting area on the shielding plate can be changed as needed, mainly including slot and through-hole shapes. The slot shape is suitable for situations requiring laser beam cutting. During use, because the slot only blocks the edge beams on both sides of the laser beam, while the edge beams along the laser beam's direction of travel are not blocked, the edge beams along the direction of travel continue to process the product, improving cutting efficiency, fully utilizing the energy of the edge beams, and controlling the slot width. Furthermore, the slot shape can be formed by placing two shielding plates on the product, leaving a gap between them, or by machining a single slot on one shielding plate. The slots on the shielding plate can be directly machined using the laser beam, making the blocking of the laser beam's edge beams more suitable. The through-hole shape is suitable for products that require drilling. During use, the through-hole blocks all edge beams, allowing only the processing beam to pass through, thus avoiding the widening of the hole during drilling and completely limiting interference from edge beams. The structure of the through-hole is formed in the same way as that of the through-slot, and can be obtained by splicing or direct processing.

[0011] The shielding unit is attached to the product. Attaching the shielding unit to the product provides a stable shielding effect, thus preventing large gaps between the shielding unit and the product from allowing light to enter and continuously erode the cut edge, causing the cut edge to widen.

[0012] Preferably, the shielding unit includes staggered rotating components respectively disposed on both sides. Each staggered rotating component includes a rotating shield and an empty area. The rotating shield can block the edge beam, while the edge beam can pass through the empty area. When the rotation reaches the minimum distance between the edges of the rotating shields on both sides, a light-transmitting area is formed between the edges of the rotating shields on both sides. Since the laser beam passes between the two staggered rotating components, there will be a period of time during the rotation of the rotating shield to block the edge beam. However, since the empty area is a slot structure, it will not block the processing beam or the edge beam in the laser beam. When the rotating shield corresponds to the laser beam, the processing beam is not blocked. Therefore, it is ensured that the processing beam continuously processes the product, while the edge beam only processes the product when the laser beam corresponds to the empty area. Therefore, the processing beam received on the product is continuous, while the edge beam received is intermittent. During processing, the edge beam can heat the product, thereby improving processing efficiency. Since the edge beam processes the product intermittently, it can never reach the ablation standard and is always cycling between heating and cooling. This ensures the heating effect of the edge beam on the product while avoiding ablation, maximizing the heating effect of the edge beam, and avoiding affecting the cutting width of the laser processing.

[0013] Preferably, several blocking units are arranged along the laser beam emission direction, and the staggered rotating components on each blocking unit are misaligned. By arranging several blocking units and staggering the staggered rotating components in the blocking units along the laser beam emission direction, the staggered rotating components in different blocking units can block the edge beams in different directions of the laser beam, thereby achieving a comprehensive blocking effect on the edge beams. This reduces the ablation of edge beams in various directions during drilling, avoids widening the cutting path, and ensures that the heating effect of the edge beams on the product is guaranteed because the rotating shields and empty areas alternately correspond to the laser beam, thus ensuring processing efficiency.

[0014] Preferably, the rotating shield has a fan-shaped structure. By setting the rotating shield to a fan-shaped structure, the relative gap between the edges of the two rotating shields can be stabilized at the required size in the light-transmitting area during rotation.

[0015] Preferably, the shielding unit includes a planetary drive gear set, which includes planetary gears connected to a rotating shield. A through hole is located at the center of the planetary drive gear set. The rotating shield synchronously rotates around the planetary gears and revolves around the through hole. By setting the planetary gear set, the rotating shield can simultaneously rotate around the through hole while rotating. Driven by this revolution, the edge of the rotating shield can form a circular shielding area. Furthermore, since the revolution continuously moves the rotating shield to different positions on the laser beam, it can achieve shielding effects on different positions of the laser beam, without creating blind spots or continuous shielding, thus preventing edge beam ablation of the product. Meanwhile, since the rotating shield also rotates synchronously, there will be a period of time during the rotation and revolution periods when the laser beam is in an empty area. Therefore, even during the revolution, there will be no obstruction when the laser beam is in an empty area. At this time, the edge beams in all directions can heat the product, thereby ensuring the uniformity of heating, improving the heating efficiency of the product, and improving the processing efficiency.

[0016] Preferably, the rotating shield has a notch. During its revolution, when the notch is directly opposite the perforation, it is positioned on one side of the perforation along the cutting direction. By controlling the gear meshing, rotation speed, and notch position, the notch on the rotating shield ensures that during rotation, when the notch is directly opposite the perforation, it is also positioned on the side of the perforation facing the cutting direction. This ensures that during the entire rotation and revolution, the edge beam is not blocked only on the side of the perforation facing the cutting direction, thereby improving cutting efficiency during the cutting process. Simultaneously, it ensures that there are no blind spots in the blocking of other parts and guarantees intermittent blocking, ensuring that the edge beam only generates heating without ablation in other areas.

[0017] Preferably, the planetary drive gear set includes a central gear, with a through hole disposed on the central gear. The central gear is connected to drive teeth, which are offset from the planetary gears along the axial direction. The drive teeth are connected to a drive unit. The central gear transmits the output force of the drive unit, typically a motor, through the drive teeth. The offset arrangement of the drive teeth from the planetary gears along the axial direction prevents the meshing position of the drive teeth from interfering with the revolution of the planetary gears, thus ensuring the stability of the device.

[0018] The present invention also provides a cutting method, comprising the following steps: S1. Place the blocking unit on the side of the product closer to the output end and adjust the size of the light transmission area; S2. Set the parameters of the laser emitting component. The laser emitting component emits a laser beam. The processing beam passes through the light-transmitting area, and the edge beam is blocked by the blocking unit. S3. The product moves relative to the laser beam, forming a laser cutting trajectory.

[0019] In step S1, after placing the blocking unit on the product, a laser beam is used to cut the blocking unit to form a light-transmitting area. The blocking unit can only be cut by the processing beam, and the light-transmitting area can only be passed through by the processing beam. The material of the blocking unit is an opaque material, such as ceramic, opaque quartz, opaque crystalline materials (such as garnet, barite, etc.), metal, or alloy. The blocking unit is placed directly on the product and processed and cut by laser. The material of the blocking unit is selected so that it can be cut by the processing beam but not by the edge beam. This allows the light-transmitting area on the blocking unit to accurately match the size of the processing beam in the laser beam. The edge beam in the laser beam cannot penetrate and cut the blocking unit, ensuring the accuracy of the light-transmitting area and better adaptability to the laser beam.

[0020] Preferably, in step S2, the staggered rotating components drive the rotating shield and the empty area; When the rotating shields on both sides come close to each other, they form a light-transmitting area and block the edge beams; When the empty areas on both sides approach each other, the light-transmitting area disappears, and the edge beam passes through the blocking unit and processes the product. By rotating the shield and alternately aligning with the empty area to receive the laser beam, it is ensured that the edge beam on the laser beam can alternately act on the product. When the empty area aligns with the laser beam, the edge beam can heat the product; while when the rotating shield aligns with the laser beam, the edge beam does not heat the product, and the parts of the product that were previously heated by the edge beam dissipate heat at this time, waiting for the next time the empty area aligns with the laser beam to be reheated, thus ensuring that the edge beam can continuously heat the auxiliary processing beam.

[0021] Preferably, the staggered rotating assembly is connected to a planetary drive gear set. The staggered rotating assembly rotates on its own axis while simultaneously revolving around a central point, intermittently blocking the edge beam of the laser beam. By synchronously revolving and rotating, the blocked area maintains a complete circular structure, eliminating any blind spots. Furthermore, the real-time change in the blocking position through the revolution prevents the edge beam from continuously heating a single area, while the rotation ensures that edge beams from all directions simultaneously heat the product over a period of time, guaranteeing uniform heating.

[0022] The beneficial effects of this invention are as follows: (1) By filtering out part of the edge beam domain through the shielding unit, weak light is prevented from ablating the surface diamond, thereby significantly reducing the width of the cutting track and reducing material loss; (2) It can utilize the ablation effect of the edge beam on the product to improve processing efficiency in situations where cutting is required; (3) It can intermittently block the edge beam, so that the edge beam can act on the product intermittently, thereby ensuring the heating of the product by the edge beam, while controlling the non-necessary areas to prevent ablation, thus ensuring the processing effect and processing quality. (4) It can rely on synchronous rotation and revolution to ensure all-round blocking of the edge beam without creating a blind spot, while ensuring intermittent heating of the edge beam and uniform heating of the whole, further improving the control of processing quality. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention.

[0024] Figure 2 This is a schematic diagram of the first structure of Embodiment 1.

[0025] Figure 3 This is a schematic diagram of the second structure of Embodiment 1.

[0026] Figure 4 This is a structural schematic diagram of Example 3.

[0027] Figure 5 This is a schematic diagram of the structure of Example 4.

[0028] Figure 6 This is a structural schematic diagram of Example 5.

[0029] Figure 7 This is a structural schematic diagram of Example 6.

[0030] Figure 8 This is a comparison diagram of the processing of diamond products in this invention.

[0031] Figure 9 This is a schematic diagram of the first state of the product processed by the laser beam in this invention.

[0032] Figure 10 This is a schematic diagram of the second state of the product processed by the laser beam in this invention.

[0033] In the picture: 1 laser emitting component, 11 output terminals; 2 blocking units, 21 light-transmitting areas; 3. Blinds 4 staggered rotating components, 41 rotating shield, 42 empty area, 43 notch; 5 planetary drive gear set, 51 planetary gear, 52 through-hole gear, 53 center gear; 6 translation elements; 7. Product clamping and moving components; 8 laser beams, 81 processing beams, 82 edge beams. Detailed Implementation

[0034] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0035] Example 1: like Figure 1 As shown, a laser cutting device for diamond includes a laser emitting component 1 capable of emitting a laser beam, and the laser emitting component 1 includes an output end 11 near the product side. A blocking unit 2 is provided on the side of the product near the output end 11, and a light-transmitting area 21 is provided on the blocking unit 2; The laser beam 8 includes a processing beam 81 and an edge beam 82, and the light-transmitting area 21 can only be passed through by the processing beam.

[0036] In this embodiment, by setting a shielding unit 2 on the product, and setting a light-transmitting area 21 on the shielding unit 2, the light-transmitting area 21 allows the processing beam to pass through while shielding the edge beam, thereby reducing the ablation of the edge beam on the product (diamond), avoiding the widening of the cutting path, and reducing material loss.

[0037] like Figure 2 , 3 As shown, the shielding unit 2 includes a shielding plate 3, on which a light-transmitting area 21 is provided. The light-transmitting area 21 has a through-slot structure. In this embodiment, the shielding plate is attached to the product, and the specific attachment method in this embodiment is adhesive bonding. This achieves a stable shielding effect, thereby avoiding a large gap between the shielding plate and the product, which would cause light to enter the gap and continuously erode the cut edge of the product, resulting in the widening of the cut edge.

[0038] like Figure 9 , 10 As shown, laser beam 8 is the laser used to process diamond, which can be a single laser beam or a combination of multiple laser beams; edge beam 82 is the area at the edge of laser beam 8 where additional ablation occurs; if laser beam 8 consists of only one laser beam, then edge beam 82 is the weak light area of ​​that laser beam; if laser beam 8 consists of several laser beams, then edge beam 82 is the outermost weak light area of ​​laser beam 8, that is, the weak light area of ​​the laser beams at the edge of laser beam 8 on the side away from the processing center, that is, this weak light area will cause additional ablation to the cutting path; processing beam 81 is the portion of laser beam 8 excluding edge beam 82; if laser beam 8 consists of only one laser beam, then processing beam 81 is the portion of the laser beam excluding the weak light area; if laser beam 8 consists of several laser beams, then processing beam 81 is the remaining portion of laser beam 8 excluding the weak light area at the outermost edge, including the central beam and weak light area of ​​all laser beams in non-edge positions, as well as the central beam and weak light area of ​​laser beams in edge positions near the processing center.

[0039] This embodiment discloses a laser cutting device for diamond. In this embodiment, the main body of the shielding unit 2 on the laser emitting component 1 is a shielding plate 3. A light-transmitting area 21 is formed on the shielding plate 3. In this embodiment, the light-transmitting area 21 is a slot structure, wherein the extension direction of the slot is the same as the cutting direction, and the light-transmitting area 21 is aligned with the center of the laser beam. The laser beam includes a processing beam and an edge beam, with the processing beam playing the main processing role. Under normal processing conditions, the light spot generated by the processing beam typically includes a light intensity drop to 1 / e of the peak value. 2The circular area formed at the edge of the laser beam may undergo a continuous process of transformation into graphite, ablation, and re-ablation of the diamond on the upper surface, resulting in an abnormally wide surface cut. In this embodiment, a shielding plate 3 is provided, and the size of the light-transmitting area 21 on the shielding plate 3 corresponds to the size of the processing beam. Therefore, after the laser beam passes through the light-transmitting area 21, the edge beam is blocked by the shielding plate 3 and cannot pass through the light-transmitting area 21. Thus, only the processing beam processes the product, preventing the edge beam from burning the product and reducing the widening of the cut during processing. The through-groove structure in this embodiment can be achieved through... Figure 2 , 3 As shown, the slot is formed by the gap between two baffles, or by a slot machined in the middle of a baffle. In this embodiment, the slot can be pre-cut into the shape by machining, or the baffle can be placed on the product and cut directly by a laser beam. It is necessary to ensure that the material of the baffle can be cut by the processing beam but not by the edge beam, so that the processed slot can only pass through the processing beam in the laser beam.

[0040] In actual processing, the through-groove shape of the light-transmitting area 21 in this embodiment is suitable for situations where laser beams are required for cutting. During use, since the through-groove only blocks the edge beams on both sides of the laser beam, while the edge beams along the direction of laser beam travel are not blocked, the edge beams along the direction of travel continue to process the product, improving cutting efficiency, making full use of the energy of the edge beams, and controlling the groove width.

[0041] like Figure 8 As shown, where Figure 8 The left side shows a cross-sectional view of the cutting path of a diamond product produced using this invention, while... Figure 8 The image on the right side shows a cross-sectional view of the cutting path in the existing technology, clearly showing that... Figure 8 The top of the cutting path on the right side has an expanded portion that has been ablated by the edge beam, while the top of the cutting path on the left side does not have this feature. Therefore, in this embodiment, the laser beam uses a blocking unit to block the edge beam, which can prevent the edge beam from causing an ablation effect on the diamond product.

[0042] In this embodiment, an implementation group and a control group are set up. The control group does not have an occlusion unit. The implementation group uses the occlusion unit in this embodiment, and the following comparison data are obtained. Control group kerf width 210~250μm 230~280μm 280~320μm 330~350μm Implementation group cut width 120~140μm 140~160μm 150~170μm 160~180μm

[0043] Example 2: like Figure 1As shown, a laser cutting device for diamond includes a laser emitting component 1 capable of emitting a laser beam, and the laser emitting component 1 includes an output end 11 near the product side. A blocking unit 2 is provided on the side of the product near the output end 11, and a light-transmitting area 21 is provided on the blocking unit 2; The laser beam 8 includes a processing beam 81 and an edge beam 82, and the light-transmitting area 21 can only be passed through by the processing beam.

[0044] The shielding unit 2 includes a shielding plate 3, on which a light-transmitting area 21 is provided. The light-transmitting area 21 has a through-hole structure. In this embodiment, the shielding plate is attached to the product, and the specific attachment method in this embodiment is adhesive bonding. This achieves a stable shielding effect, thereby avoiding a large gap between the shielding plate and the product, which would allow light to enter the gap and cause continuous ablation at the cut edge of the product, resulting in the widening of the cut edge.

[0045] This embodiment discloses a laser cutting device for diamond. The shielding unit 2 on the laser emitting component 1 is primarily a shielding plate 3. The shielding plate 3 has a light-transmitting area 21. In this embodiment, the light-transmitting area 21 is a through-hole structure, aligned with the center of the laser beam. During use, the through-hole structure of the light-transmitting area 21 can completely shield the edge beams in all directions surrounding the laser beam. The laser beam includes a processing beam and an edge beam, with the processing beam playing the primary processing role. Under normal processing conditions, the light spot generated by the processing beam typically includes a light intensity drop to 1 / e of the peak value. 2 The laser beam forms a circular area, but the edge beam may also ablate the portion of the upper surface diamond that has been converted into graphite. This edge beam can also create a continuous process of conversion to graphite, ablation, and re-conversion to graphite, resulting in an abnormally wide surface cut. In this embodiment, a shielding plate 3 is provided, and the size of the light-transmitting area 21 on the shielding plate 3 corresponds to the size of the processing beam. Therefore, after the laser beam passes through the light-transmitting area 21, the edge beam is blocked by the shielding plate 3 and cannot pass through the light-transmitting area 21. Thus, only the processing beam processes the product, preventing the edge beam from burning the product and reducing the widening of the cut during processing.

[0046] In actual processing, the light-transmitting area 21 of the through hole shape in this embodiment is suitable for products that require drilling. During use, the through hole blocks all edge beams, allowing only the processing beam to pass through, thereby avoiding the widening of the hole during drilling and fully limiting the interference of edge beams.

[0047] Example 3: like Figure 4As shown, unlike Embodiment 1, in this embodiment, the blocking unit 2 includes staggered rotating components 4 respectively disposed on both sides. The staggered rotating components 4 include rotating shields 41 and empty areas 42. The rotating shields 41 can block the edge beam, while the edge beam can pass through the empty areas 42. When the rotation reaches the minimum distance between the edges of the rotating shields 41 on both sides, a light-transmitting area 21 is formed between the edges of the rotating shields 41 on both sides. Since the laser beam passes between the two staggered rotating components 4, there will be a period of time during the rotation of the rotating shields 41 that the edge beam is blocked. However, since the empty area 42 is a slot structure, it will not block the processing beam or the edge beam in the laser beam. When the rotating shields 41 correspond to the laser beam, the processing beam is not blocked. Therefore, it is ensured that the processing beam continuously processes the product, while the edge beam only processes the product when the laser beam corresponds to the empty area 42. Therefore, the processing beam received on the product is continuous, while the edge beam received is intermittent. During processing, the edge beam can heat the product, thereby improving processing efficiency. Since the edge beam's processing of the product is intermittent, it can never reach the ablation standard and is always cycling between heating and cooling. This ensures the heating effect of the edge beam on the product while avoiding ablation and maximizing the use of the edge beam's heating effect, while also avoiding affecting the width of the laser processing cut. In this embodiment, the shielding unit 2 is kept in close contact with the diamond product to ensure a stable and effective shielding effect. Alternatively, a micron-level gap can be left between the shielding unit 2 and the diamond product to avoid friction during rotation.

[0048] like Figure 4 As shown, the rotating shield 41 has a fan-shaped structure. By setting the rotating shield 41 to a fan-shaped structure, the relative gap between the edges of the two rotating shields 41 can be stabilized at the required size of the light-transmitting area 21 during rotation.

[0049] This embodiment discloses a laser cutting device for diamond. In this embodiment, two staggered rotating components 4 are provided, respectively disposed on both sides. The staggered rotating components 4 can be rotated by a driving component, which includes, but is not limited to, direct motor drive, gear drive, pulley drive, etc., which are not specifically described in this embodiment. Each staggered rotating component 4 is provided with a rotating shield 41 and an empty area 42. The edge shape of the rotating shield 41 is fan-shaped, and the rotational contour of the rotating shield 41 is a perfect circle. Since this embodiment provides two staggered rotating components 4, the gap between the rotational contours of the rotating shield 41 on the two staggered rotating components 4 is adjusted to a size that allows only the processing beam to pass through. Meanwhile, since the staggered rotating assembly 4 in this embodiment is provided with rotating shields 41 and empty areas 42, when the two rotating shields 41 are close to each other and in relative positions, a light-transmitting area 21 will be formed at the minimum gap between the edge contours of the two rotating shields 41. However, if the two rotating shields 41 are far apart from each other, the minimum gap cannot be reached between the edge contours of the two rotating shields 41, and the light-transmitting area 21 cannot be formed. As a result, both the processing beam and the edge beam can act on the product.

[0050] Therefore, in this embodiment, the laser beam processes the product continuously. Since the laser beam passes between the two staggered rotating components 4, and the two rotating baffles 41 approach each other, they block the edge beam of the laser beam. Because the rotating baffles 41 have a fan-shaped structure, there is a period of time during their rotation that the edge beam is blocked. When the two opposing rotating baffles 41 move away from each other, i.e., after the rotating baffles 41 separate from the laser beam, they become an empty area 42 corresponding to the laser beam. Because the empty area 42 has a slotted structure, it does not block the processing beam or the edge beam in the laser beam. Even when the rotating baffles 41 correspond to the laser beam, the processing beam is not blocked. Therefore, it is ensured that the processing beam continuously processes the product, while the edge beam only processes the product when the laser beam corresponds to the empty area 42. Therefore, the connection on the product... The received processing beam is continuous, while the received edge beam is intermittent. During processing, although the energy of the edge beam is lower than that of the processing beam, it can still heat the product, thereby improving processing efficiency. If the product is heated continuously for a long time, ablation will occur. In this embodiment, since the processing of the product by the edge beam is intermittent, the edge beam can never reach the ablation standard and always cycles between heating and cooling. This ensures the heating effect of the edge beam on the product while avoiding ablation. By controlling the rotation frequency of the staggered rotating component 4 and the ratio and distribution of the rotating shield 41 and the empty area 42, the processing effect of the edge beam on the product is always kept below the ablation threshold, thereby maximizing the heating effect of the edge beam while avoiding affecting the cutting width of the laser processing.

[0051] Furthermore, in this embodiment, a translation unit 6 is installed on the staggered rotating assembly 4. The translation unit 6 is a slide rail mechanism that can drive the staggered rotating assembly 4 to translate, thereby changing the gap between the two sides of the staggered rotating assembly 4, and thus affecting the size of the light-transmitting area 21. In actual operation, the spot diameter of the fundamental mode Gaussian light has a hyperbolic distribution, that is, the laser beam is similar to a cone. When the focal point moves down, the spot diameter at the light-shielding part increases, causing partial blocking of the processing beam, which reduces the processing efficiency. Therefore, in this embodiment, the translation unit 6 drives the staggered rotating assembly 4 to move, thereby ensuring that the edge beam is blocked while not blocking the processing beam.

[0052] In this embodiment, the staggered rotating components 4 are respectively arranged on both sides. The perpendicular direction of the line connecting the center points of the two staggered rotating components 4 is the cutting direction of the laser beam in this embodiment. Therefore, during the cutting process, the staggered rotating components 4 only block the edge beams on both sides of the cutting direction. Blocking the edge beams on both sides can ensure heating and improve the processing efficiency of the processing beam. However, if the edge beams in the cutting direction are not blocked, the continuous heating of the edge beams in the cutting direction can produce ablation. Before the processing beam processes the product, the surface is ablated first to remove some material, thereby reducing the processing burden of the processing beam and ensuring processing efficiency.

[0053] Example 4: like Figure 5 As shown, unlike Embodiment 1, in this embodiment, several shielding units 2 are provided along the laser beam emission direction, and the staggered rotating components 4 on each shielding unit 2 are misaligned. By providing several shielding units 2 and staggering the staggered rotating components 4 in the shielding units 2 along the laser beam emission direction, the staggered rotating components 4 in different shielding units 2 can shield the edge beams in different directions of the laser beam, thereby achieving a comprehensive shielding effect of the edge beams. This reduces the ablation of edge beams in various directions during drilling, avoids widening the cutting path, and ensures the heating effect of the edge beams on the product by the alternating rotation of the shielding plate 41 and the empty area 42, thus guaranteeing processing efficiency.

[0054] This embodiment discloses a laser cutting device for diamond. Unlike the cutting process requiring travel in Embodiment 3, this embodiment primarily addresses scenarios requiring drilling, such as drilling a single hole in the diamond or performing pre-drilling operations to cut the diamond. In such cases, it is necessary to block the omnidirectional edge beam of the laser beam. To avoid the continuous blocking method used in Embodiment 2, which affects processing efficiency, this embodiment employs an intermittent omnidirectional blocking processing method. In this embodiment, the blocking unit 2 remains in close contact with the diamond product to ensure a stable and effective blocking effect. Alternatively, a micrometer-level gap can be maintained between the blocking unit 2 and the diamond product to prevent friction during rotation.

[0055] In this embodiment, two sets of shielding units 2 are arranged along the axial direction. Each set of shielding units 2 contains two staggered rotating components 4. Assuming that the emission direction of the laser beam processing product in this embodiment is from top to bottom, that is, two sets of shielding units 2 are stacked in the vertical direction in this embodiment. Each set of shielding units 2 is provided with a rotating shield 41 and an empty area 42. Therefore, both the upper and lower sets of shielding units 2 can shield the edge beam. In this embodiment, it is necessary to control that the staggered rotating components 4 in the upper and lower shielding units 2 are staggered. In this embodiment, the two upper staggered rotating components 4 are arranged along the left and right sides, while the two lower staggered rotating components 4 are arranged along the top and bottom sides. This allows the upper and lower sets of shielding units 2 to shield the edge beam in different directions, achieving all-round shielding and ensuring the quality of laser beam drilling. The adjustment method of the size of the light transmission area 21 in this embodiment is the same as that in embodiment 3, which is achieved by the translation unit 6.

[0056] Example 5: like Figure 6As shown, unlike Embodiment 1, the shielding unit 2 in this embodiment includes a planetary drive gear set 5, which includes planetary gears 51. A rotating shielding plate 41 is connected to the planetary drive gear set 5. A through hole 52 is provided at the center of the planetary drive gear set 5. The rotating shielding plate 41 rotates synchronously around the planetary gears 51 and revolves around the through hole 52. By setting the planetary gear set 51, the rotating shielding plate 41 can simultaneously rotate around the through hole 52 while rotating. Driven by this revolution, the edge of the rotating shielding plate 41 can form a circular shielding area. Simultaneously, since the revolution continuously drives the rotating shielding plate 41 to different positions of the laser beam, it can achieve shielding effects on different positions of the laser beam, without creating blind spots or continuous shielding, thus preventing edge beam ablation of the product. Simultaneously, since the rotating shield 41 also rotates synchronously, there will be a period of time during the rotation and revolution periods when the laser beam corresponds to the empty region 42. Therefore, even during revolution, no obstruction will occur when the laser beam corresponds to the empty region 42. At this time, the edge beams in all directions can heat the product, thereby ensuring the uniformity of heating, improving the heating efficiency of the product, and improving the processing efficiency. In this embodiment, the shielding unit 2 is kept in close contact with the diamond product to ensure a stable and effective shielding effect. Alternatively, a micron-level gap can be left between the shielding unit 2 and the diamond product to avoid friction during rotation.

[0057] like Figure 6 As shown, the planetary drive gear set 5 includes a central gear 53, with a through hole 52 disposed on the central gear 53. The central gear 53 is connected to drive teeth, which are offset from the planetary gears 51 along the axial direction. The drive teeth are connected to a drive unit. The central gear 53 transmits the output force of the drive unit through the drive teeth. The drive unit is generally a motor. The offset arrangement of the drive teeth and planetary gears 51 along the axial direction avoids interference between the meshing position of the drive teeth and the revolution motion of the planetary gears 51, ensuring the stability of the device.

[0058] This embodiment discloses a laser cutting device for diamond. Unlike the cutting process in Embodiment 3, this embodiment mainly addresses the scenario of drilling, such as drilling a diamond individually or performing a pre-drilling operation to cut the diamond. In this case, it is necessary to block the edge beam of the laser beam in all directions. To avoid the continuous blocking method used in Embodiment 2 that affects processing efficiency, this embodiment uses an intermittent all-round blocking processing method. This embodiment takes the cutting direction as the up and down direction as an example for explanation.

[0059] This embodiment differs from Embodiment 4 in that it uses only one set of blocking units 2. The internal arrangement of the blocking unit 2 is more flexible and varied. It can use only one set of staggered rotating components 4; it can use two sets of staggered rotating components 4; it can use a rotating shield 41 without an empty area 42; or it can use both a rotating shield 41 and an empty area 42. The specific arrangement and operation are as follows: In this embodiment, compared to embodiment 3, a planetary drive gear set 5 is added. The planetary gears 51 in the planetary drive gear set 5 drive the rotating shield 41 to rotate and revolve. In this embodiment, the following example is used: two planetary gears 51, two staggered rotating components 4, and rotating shield 41 and empty area 42 are set on the rotating components.

[0060] In this embodiment, the planetary drive gear assembly 5 includes a central gear 53 located at the center position. Planetary gears 51 are connected to the left and right sides of the central gear 53, respectively. An interleaved rotation assembly 4 is connected to the planetary gears 51 on both sides. The interleaved rotation assembly 4 is provided with rotating baffles 41 and empty areas 42 arranged at intervals. During operation, when the central gear 53 moves, it will drive the planetary gears 51 to revolve and rotate synchronously. Therefore, the rotating baffles 41 and empty areas 42 will rotate and revolve synchronously around the center point. The edge of the rotating baffle 41 is controlled to be at the intersection of the processing beam and the edge beam, that is, there is a gap between the edge of the rotating baffle 41 and the center point. This gap is half the diameter of the processing beam spot. Due to its revolution, the trajectory formed by the edge of the rotating shield 41 will create a circular structure at the center. This revolution allows the rotating shield 41 to achieve an all-around shielding effect. Furthermore, the revolution prevents the rotating shield 41 from remaining stationary in one area for an extended period, and also prevents edge beams from passing through any one area for too long, thus achieving circumferential cyclic shielding of edge beams. During this process, the rotating shield 41 and the empty area 42 rotate. When the empty area 42 faces the center point, it allows all edge beams to pass through, ensuring uniform heating. Therefore, this embodiment uses fewer rotating shields 41 and shielding units 2 to achieve an all-around edge beam shielding effect, while ensuring that the shielded area has no blind spots and forms a circular shielding area through revolution, thus guaranteeing processing accuracy.

[0061] During the cutting process, as the depth of the cutting path increases, the focal point needs to be moved downwards. In this embodiment, since the planetary drive gear group 5 is used, the size of the light transmission area 21 is not easy to change. Unlike embodiment 3, this embodiment uses the method of moving the product to change the position of the focal point on the product. The product clamping and moving component 7 drives the product to adapt to the position of the focal point, that is, the absolute position of the focal point remains unchanged, and the product moves upwards. Thus, in this embodiment, the laser beam and the light transmission area 21 do not need to be adjusted again after the initial adjustment.

[0062] Example 6: like Figure 7 As shown, unlike Embodiment 1, this embodiment has a notch 43 on the rotating shield 41. During revolution, when the notch 43 is directly opposite the perforation 52, the notch 43 is located on the side of the perforation 52 along the cutting direction. By controlling the gear meshing relationship, rotation speed, and the opening position of the notch 43 on the rotating shield 41, during rotation, when the notch 43 is directly opposite the perforation 52, the notch 43 is also located on the side of the perforation 52 facing the cutting direction. This ensures that during the entire rotation and revolution, the edge beam is not blocked only on the side of the perforation 52 facing the cutting direction, thereby improving the cutting efficiency under cutting conditions. At the same time, it ensures that there are no dead angles in the blocking of other parts and ensures intermittent blocking, ensuring that the edge beam only generates heating and does not produce an ablation effect in other parts. In this embodiment, the shielding unit 2 is kept in close contact with the diamond product to ensure a stable and effective shielding effect. A micron-level gap can also be left between the shielding unit 2 and the diamond product to avoid friction during rotation.

[0063] like Figure 7 As shown, the planetary drive gear set 5 includes a central gear 53, with a through hole 52 disposed on the central gear 53. The central gear 53 is connected to drive teeth, which are offset from the planetary gears 51 along the axial direction. The drive teeth are connected to a drive unit. The central gear 53 transmits the output force of the drive unit through the drive teeth. The drive unit is generally a motor. The offset arrangement of the drive teeth and planetary gears 51 along the axial direction avoids interference between the meshing position of the drive teeth and the revolution motion of the planetary gears 51, ensuring the stability of the device.

[0064] This embodiment discloses a laser cutting device for diamond. In this embodiment, the working condition is the same as that in embodiment 3, which requires forward cutting. The main working condition in this embodiment is the scenario where forward cutting is required. In this working condition, it is necessary to block the edge beam of the laser beam except for the side with the forward direction. At the same time, it is necessary to avoid the continuous blocking in embodiment 2 and to avoid blocking the edge beam on the side with the forward direction. This embodiment adopts a targeted revolution blocking processing method, which can form a circular blocking area with a gap 43, and block the edge beam except for the side with the forward direction in all directions. Since this embodiment uses revolution, there are no dead corners in the blocking area. At the same time, the revolution allows the part of the perforation 52 that can transmit the edge beam to cycle between blocking and non-blocking states, so as to perform heat dissipation.

[0065] Specifically, in this embodiment, only one central gear 53 and one planetary gear 51 are provided. The planetary gear 51 is provided with a rotating shield 41, which is a whole circular plate structure, but there is a notch 43. The angle of the notch 43 is not large. During the rotation, when the notch 43 gradually approaches the center point of the perforation 52 and is directly in front of it along the cutting direction, the opening direction of the notch 43 gradually faces the center point of the perforation 52, so that more edge beams can be irradiated directly in front of the center point, while the other parts continuously alternate between edge beam blocking and non-blocking. In this embodiment, the same method of adjusting the product position by fixing the focal position as in embodiment 5 is used to avoid adjusting the size of the light transmission area 21 again during the processing.

[0066] Therefore, the beneficial effects that the device in this embodiment can achieve are as follows: alternating between blocking and non-blocking through revolution; obtaining more edge beam illumination on the product part in the cutting direction through the notch 43, thereby improving processing efficiency; reducing the number of parts used and reducing costs; and forming a circular blocking area through revolution, thereby reducing blocking dead angles.

Claims

1. A laser cutting device for diamond, characterized in that, It includes a laser emitting assembly (1) capable of emitting a laser beam, the laser emitting assembly (1) including an output end (11) near the product side. A shielding unit (2) is provided on the side of the product near the output end (11), and a light-transmitting area (21) is provided on the shielding unit (2). The laser beam includes a processing beam and an edge beam, and the light-transmitting area (21) can only be passed through by the processing beam; The shielding unit (2) includes staggered rotating components (4) respectively disposed on both sides of the laser emitting component (1). The staggered rotating component (4) includes a rotating shield (41) and an empty area (42). The rotating shield (41) can block the edge beam, which can pass through the empty area (42). When the rotation is rotated to the minimum distance between the edges of the two rotating shields (41), a light-transmitting area (21) is formed between the edges of the two rotating shields (41).

2. The laser cutting device for diamond according to claim 1, characterized in that, The shielding unit (2) includes a shielding plate (3), and the shielding plate (3) is provided with a light-transmitting area (21).

3. The laser cutting device for diamond according to claim 2, characterized in that, The light-transmitting area (21) on the shielding plate (3) is a through groove or through hole structure.

4. The laser cutting device for diamond according to claim 1, characterized in that, The shielding unit (2) is attached to the product.

5. A laser cutting apparatus for diamond according to any one of claims 1-4, characterized in that, The shielding unit (2) includes a planetary drive gear set (5), which includes a planetary gear (51). The planetary gear (51) is connected to a rotating shield (41). The planetary drive gear set (5) has a perforation (52) at its center. The rotating shield (41) rotates synchronously around the planetary gear (51) and revolves around the perforation (52).

6. The laser cutting device for diamond according to claim 5, characterized in that, The rotating shield (41) is provided with a notch (43). During the revolution, when the notch (43) is facing the perforation (52), the notch (43) is on one side of the perforation (52) along the cutting direction.

7. A cutting method using a laser cutting apparatus for diamond according to any one of claims 1-6, characterized in that, It includes the following steps: S1. Place the blocking unit (2) on the side of the product closer to the output end (11) and adjust the size of the light transmission area (21); S2. Set the parameters of the laser emitting component (1). The laser emitting component (1) emits a laser beam. The processing beam passes through the light-transmitting area (21). The edge beam is blocked by the blocking unit (2). S3. The product moves relative to the laser beam, forming a laser cutting trajectory.

8. A cutting method according to claim 7, characterized in that, In step S1, after the shielding unit (2) is placed on the product, the shielding unit (2) is cut with a laser beam to form a light-transmitting area (21). The shielding unit (2) can only be cut by the processing beam, and the light-transmitting area (21) can only be passed through by the processing beam.

9. A cutting method according to claim 7, characterized in that, In step S2, the staggered rotating component (4) drives the rotating shield (41) and the empty area (42). When the rotating shields (41) on both sides approach each other, they form a light-transmitting area (21) and block the edge beam; When the empty areas (42) on both sides approach each other, the light-transmitting area (21) disappears, and the edge beam passes through the blocking unit (2) and processes the product.

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