Substrate placement optimization using substrate measurements
CN119604973AActive Publication Date: 2025-03-11APPLIED MATERIALS INC
Patent Information
- Application Number
- CN202380056621.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-05-23
- Filing Date
- 2023-08-22
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2043-08-22
Smart Images
Figure CN119604973A_ABST
Abstract
A computer readable medium includes instructions that, when executed by a processing device, cause the processing device to perform an operation. The operations include processing a first substrate in a processing chamber while the first substrate is supported by a substrate support in a first placement position. The first substrate includes a first surface profile after processing. The operations further include generating a first surface profile map of the first surface profile using the substrate measurement system. The operations further include determining a plurality of etch rates corresponding to the plurality of locations on the first substrate. The operations also include processing data associated with the plurality of etch rates using a model that outputs one or more estimated surface profiles associated with the one or more estimated placement locations. The operations also include determining a suggested placement of the substrate on the substrate support based on the one or more estimated placement locations.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
CN107330132A
Systems and methods of placing substrates in semiconductor manufacturing equipment
TW202123363A
Substrate processing apparatus, information processing apparatus, and substrate processing method
US20210020487A1