热敏打印头用引线键合夹具及其应用
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANDONG HUALING ELECTRONICS
- Filing Date
- 2024-11-29
- Publication Date
- 2026-07-17
AI Technical Summary
In the wire bonding process, the surface protrusion of the thermal substrate of the existing thermal printer causes poor flatness after the pressure plate is pressed, which makes it easy to lift up, affecting processing efficiency and easily damaging the components. Moreover, the existing technology cannot achieve continuous preheating and wire bonding of the components to be processed.
Design a wire bonding fixture for thermal printheads, which adopts a support base plate and pressure plate structure. The pressure plate is provided with a hollow processing window and a positioning boss. Combined with a ball and spring mechanism, it ensures that the pressure plate is flat and clamped to the product surface. The number of processing windows in the fixture is increased to realize the continuous processing of multiple products.
It improves the flatness of the product clamping surface, avoids the pressure plate from warping, reduces the risk of component damage, and enables continuous wire bonding of multiple products to be processed, significantly improving processing efficiency.
Smart Images
Figure CN119609971B_ABST