Preparation method of copper-diamond / copper composite material

CN119615156AActive Publication Date: 2025-03-14SHAANXI ZHONGTIAN ROCKET TECH CO LTD
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Patent Information

Application Number
CN202411521049.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-29
Publication Date
2025-03-14
Estimated Expiration
2044-10-29

AI Technical Summary

Technical Problem

The processing of traditional diamond/copper materials is difficult, resulting in the destruction of diamond particles at the processing boundary. The electroplating process is severely polluted, poor uniformity and stability, making it difficult to meet the needs of industrialization.

Method used

The hot-pressed semi-cladding process is used to closely combine the copper layer with diamond/copper material through interatomic diffusion, control the thickness of the copper layer, and electroplating is carried out through the near-forming process to reduce the cost of material preparation.

Benefits of technology

The firm combination of the copper layer and diamond/copper material is achieved, the thermal conductivity and low expansion of the material are improved, the electroplating process is optimized, the preparation cost is reduced, and the problem of difficult processing of the material is solved.

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Abstract

The invention relates to a preparation method of a copper-diamond / copper composite material, and belongs to the technical field of material preparation. The method comprises the following steps: putting a diamond / copper material and a copper sheet with a clean and dry surface into a hot-pressing furnace, and carrying out pressurized infiltration treatment by adopting a hot-pressing semi-cladding process to prepare a copper-diamond / copper composite material blank; and grinding and polishing the copper layer on the surface of the blank to obtain the copper-diamond / copper composite material. According to the method, a copper layer and a diamond / copper material are tightly combined through inter-atomic diffusion through a semi-cladding process, so that the thickness of the copper layer on the surface of the prepared material can be effectively controlled, and the bonding property of the copper layer and the diamond / copper material is firmer; and meanwhile, through the near-forming process, a corresponding product can be obtained by only carrying out conventional machining on the copper layer and then carrying out electrogilding treatment, so that the preparation cost of the material is reduced to the maximum extent, and the technical problem that the diamond / copper composite material is difficult to machine is solved.
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Citation Information

Patent Citations

  • Preparation method for diamond / copper composite material with high heat conductivity and low thermal expansion coefficient

    CN102732764A

  • Preparation method of diamond-copper composite

    CN105838916A

  • Method for coating surface of diamond / copper composite material with copper

    CN112974809A

  • Preparation method of metallized diamond / copper composite substrate with high thermal conductivity surface

    CN114309596A

  • Near-net forming method of six-surface copper-coated diamond / copper composite material

    CN117428195A

Cited By

  • Multi-particle-size diamond-copper composite material and preparation method thereof

    CN121514492A