Chip, manufacturing method of chip, and optical computing device

Abstract

The embodiment of the invention discloses a chip, a manufacturing method of the chip and optical computing equipment. The chip comprises a grating coupler, and the manufacturing method of the chip comprises the following steps: providing a substrate, and forming a patterned mask layer on the substrate; etching the substrate based on the patterned mask layer to form at least one part of the grating coupler; forming a first dielectric layer on the graphical mask layer, wherein the first dielectric layer covers the at least one part of the grating coupler and covers the graphical mask layer; removing one part of the first dielectric layer to expose at least one part of the side wall of the graphical mask layer; and removing the patterned mask layer to obtain the planarized surface of the first dielectric layer.

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