Display module, preparation method thereof and display device

Abstract

The application provides a display module, a preparation method thereof and a display device, and relates to the field of display technology. The display module comprises a substrate, a light-emitting component, a connecting piece and a wire; the light-emitting component is arranged on the substrate; the connecting piece is electrically connected to the light-emitting component; the connecting piece comprises a first connecting part and a second connecting part arranged in layers; the second connecting part is arranged on the substrate; the first connecting part is arranged on the surface of the second connecting part away from the substrate; the first connecting part covers a first part of the second connecting part; the wire comprises a main body and a contact part; the contact part is electrically connected to the main body; one end of the contact part away from the main body is electrically connected to the first connecting part; the surface of the contact part towards the substrate covers a second part of the second connecting part; and in the thickness direction of the substrate, the thickness of the contact part is smaller than the thickness of the first connecting part. The application can reduce the possibility of short circuit and other conditions of the light-emitting component and the wire, and ensure the normal use of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to display modules and their manufacturing methods, and display devices. Background Technology

[0002] Light-emitting diode (LED) display modules have the characteristics of high brightness, low power consumption and simple driving method, and are widely used in display devices.

[0003] The display module includes a substrate, a light-emitting component, and a driver chip. The light-emitting component is disposed on a first surface of the substrate, and the driver chip is disposed on a second surface of the substrate. The driver chip is electrically connected to the light-emitting component through wiring to control the light-emitting process of the light-emitting component. However, the light-emitting component and wiring are prone to short circuits, which can affect the normal use of the display module. Summary of the Invention

[0004] This application provides a display module and its manufacturing method, as well as a display device, to solve the problem that short circuits in the light-emitting components and wiring can affect the normal use of the display module.

[0005] This application provides a display module, including a substrate, connectors, and traces;

[0006] The connector is used to electrically connect the light-emitting component. The connector includes a first connecting portion and a second connecting portion stacked together. The second connecting portion is disposed on the substrate. The first connecting portion is disposed on the surface of the second connecting portion away from the substrate. The first connecting portion covers a first portion of the second connecting portion.

[0007] The trace includes a body and a contact portion. The contact portion is electrically connected to the body, and one end of the contact portion away from the body is electrically connected to the first connection portion. The surface of the contact portion facing the substrate covers a second portion of the second connection portion. The first portion and the second portion of the second connection portion are arranged in a direction perpendicular to the thickness of the substrate.

[0008] By adopting the above technical solution, the connector is configured to include a first connecting portion and a second connecting portion stacked together, with the first connecting portion covering a first portion of the second connecting portion. When forming traces, initial traces can be formed by deposition or other methods. The portion of the initial trace covering the surface of the substrate forms the main body, the portion of the initial trace covering the second portion of the second connecting portion away from the surface of the substrate forms the contact portion, and the remaining portion of the initial trace covers the surface of the first connecting portion away from the second connecting portion. Subsequently, the portion of the initial trace covering the first connecting portion is removed, thereby forming a trace between the main body and the contact portion.

[0009] In the thickness direction of the substrate, the thickness of the contact portion is less than the thickness of the first connecting portion, so that a discontinuity is formed between the initial trace covering the first connecting portion away from the surface of the second connecting portion and the initial trace covering the second part of the second connecting portion away from the surface of the substrate. This reduces the difficulty of removing the initial trace covering the first connecting portion, reduces the possibility of the initial trace connecting multiple traces or multiple light-emitting components, and reduces the possibility of short circuits in the light-emitting components and traces, thus ensuring the normal use of the display module.

[0010] In some possible implementations, the thickness of the contact portion is less than the thickness of the first connecting portion in the thickness direction of the substrate.

[0011] In some possible implementations, the first portion and the second portion of the second connection are arranged in a direction perpendicular to the thickness of the substrate;

[0012] In a direction perpendicular to the thickness of the substrate, the end of the first connection portion facing away from the trace is flush with the first portion of the second connection portion; and / or, the second portion of the second connection portion protrudes relative to the first connection portion at the end facing the trace.

[0013] Preferably, in the direction perpendicular to the thickness of the substrate, the length of the second portion of the second connection is greater than or equal to 10 micrometers.

[0014] In some possible implementations, the first portion and the second portion of the second connecting portion are arranged along a first direction;

[0015] In the first direction, the first portion of the second connection is flush with the end of the trace away from the first connection; and / or, the length of the second portion of the second connection is greater than or equal to 10 micrometers.

[0016] In some possible implementations, the connector further includes a third connecting portion disposed on the substrate;

[0017] The first part of the third connecting portion is connected to the second connecting portion away from the surface of the substrate, and the second part of the third connecting portion is connected to the main body away from the surface of the substrate.

[0018] In some possible implementations, at least a portion of the connector is configured as a multi-layered structure.

[0019] In some possible implementations, the display module has a display area and a non-display area disposed around the periphery of the display area; the connector and the wiring are disposed within the non-display area;

[0020] The display module further includes a light-emitting component located within the display area. The light-emitting component includes a conductive layer and a connecting layer. The conductive layer is disposed on the substrate and connected to the connecting layer on a surface opposite to the substrate. The conductive layer is electrically connected to the connector.

[0021] At least one of the first connecting portion and the second connecting portion is disposed on the same layer and the same material in the conductive layer or the connecting layer.

[0022] This application also provides a method for manufacturing a display module, including:

[0023] Provide substrate;

[0024] A connector and a light-emitting component are formed; the connector includes a first connecting portion and a second connecting portion stacked together, the second connecting portion being disposed on the substrate, the first connecting portion being disposed on the surface of the second connecting portion away from the substrate, and the first connecting portion covering a first portion of the second connecting portion;

[0025] The trace is formed; the trace includes a body and a contact portion, the contact portion is electrically connected to the body, and one end of the contact portion away from the body is electrically connected to the first connection portion; the surface of the contact portion facing the substrate covers a second portion of the second connection portion.

[0026] By adopting the above technical solution, when forming traces, initial traces can be formed by deposition or other methods. The portion of the initial traces covering the surface of the substrate forms the main body, the portion of the initial traces covering the second part of the second connection portion away from the surface of the substrate forms the contact portion, and the remaining portion of the initial traces covers the surface of the first connection portion away from the second connection portion; then the portion of the initial traces covering the first connection portion is removed, thereby forming a trace between the main body and the contact portion.

[0027] In the thickness direction of the substrate, the thickness of the contact portion is less than the thickness of the first connecting portion, so that a discontinuity is formed between the initial trace covering the first connecting portion away from the surface of the second connecting portion and the initial trace covering the second part of the second connecting portion away from the surface of the substrate. This reduces the difficulty of removing the initial trace covering the first connecting portion, reduces the possibility of the initial trace connecting multiple traces or multiple light-emitting components, and reduces the possibility of short circuits in the light-emitting components and traces, thus ensuring the normal use of the display module.

[0028] In some possible implementations, forming the trace includes:

[0029] A protective layer is formed; the protective layer covers the surface of the first connecting portion that is opposite to the first portion of the second connecting portion;

[0030] An initial trace is formed; a first portion of the initial trace covers the surface of the substrate, a second portion of the initial trace covers a second portion of the second connection portion, and a third portion of the initial trace covers the surface of the protective layer opposite to the first connection portion.

[0031] The protective layer and the third portion of the initial trace are removed. The first portion of the initial trace forms the main body, and the second portion of the initial trace forms the contact portion. The thickness of the contact portion is less than the thickness of the first connecting portion. The main body and the contact portion form the trace.

[0032] In some possible implementations, the display module has a display area and a non-display area disposed around the periphery of the display area;

[0033] The connector comprises:

[0034] A metal layer is formed on the surface of the substrate, wherein a first portion of the metal layer is located in the display area and a second portion of the metal layer is located in the non-display area;

[0035] A portion of the first metal layer and a portion of the second metal layer are removed, and the remaining portion of the first metal layer located in the display area is used to form the light-emitting component, while the remaining portion of the second metal layer located in the non-display area forms the connector.

[0036] This application also provides a display device, including the display module described in any of the above embodiments.

[0037] Since the display device includes the display module described in any of the above claims, the advantages of the display device including the display module described in any of the above claims can be specifically found in the relevant descriptions above, and will not be repeated here. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0039] Figure 1 This is a schematic diagram of the structure of the display module provided in the embodiments of this application;

[0040] Figure 2 Provided for the embodiments of this application Figure 1 A magnified view of a portion of the Central Africa display area;

[0041] Figure 3 A schematic diagram of the structure of a display module including a third connecting part provided for an embodiment of this application;

[0042] Figure 4A schematic diagram of the structure of a display module including a third connecting portion, provided for an embodiment of this application;

[0043] Figure 5 A schematic flowchart illustrating the manufacturing method of the display module provided in this application embodiment;

[0044] Figure 6 This is a schematic diagram of the structure of the substrate provided in the embodiments of this application;

[0045] Figure 7 This is a schematic diagram of the structure for forming a metal layer provided in an embodiment of this application;

[0046] Figure 8 Provided for the embodiments of this application Figure 7 A schematic diagram of a structure in which a conductive layer, a connecting layer, a first connecting part, and a second connecting part are formed on the basis of a metal layer;

[0047] Figure 9 This is a schematic diagram of the structure forming a partial metal layer provided in an embodiment of this application;

[0048] Figure 10 Provided for the embodiments of this application Figure 9 A schematic diagram of a structure in which a conductive layer and a first connection portion are formed on top of a metal layer;

[0049] Figure 11 This is a schematic diagram of the structure for forming a protective layer provided in an embodiment of this application;

[0050] Figure 12 This is a schematic diagram of the structure for forming the initial trace provided in an embodiment of this application;

[0051] Figure 13 This is a schematic diagram of the initial wiring provided in an embodiment of this application.

[0052] Explanation of reference numerals in the attached figures:

[0053] 10. Display area; 20. Non-display area;

[0054] 100. Substrate;

[0055] 200. Connecting parts;

[0056] 210. First connecting part; 220. Second connecting part; 230. Third connecting part;

[0057] 300. Wiring;

[0058] 310. Main body; 320. Contact part; 330. Initial wiring;

[0059] 400. Protective layer;

[0060] 500, driver chip;

[0061] 600. Light-emitting components;

[0062] 610. Conductive layer; 620. Connecting layer;

[0063] 700, Metal layer.

[0064] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0065] As described in the background section, the display module includes a substrate, a light-emitting component, and a driving chip. The light-emitting component is disposed on a first surface of the substrate, and the driving chip is disposed on a second surface of the substrate. The driving chip is electrically connected to the light-emitting component via traces to control the light-emitting process of the light-emitting component. The display module also includes a connector. A first end of the connector is electrically connected to the end of the trace away from the driving chip, and a second end of the connector is electrically connected to the light-emitting component, so that the trace is electrically connected to the light-emitting component through the connector.

[0066] During the formation of traces, a protective layer is typically formed on the surface of the connector away from the substrate. Then, initial traces are formed through deposition or other methods. Part of the initial traces cover the surface of the substrate, and part of the initial traces cover the protective layer on the surface away from the substrate. Subsequently, the protective layer and the portion of the initial traces covering the protective layer are removed to allow the remaining portion of the initial traces to form traces. However, since the portion of the initial traces covering the surface of the substrate is connected to the portion of the initial traces covering the protective layer, when the protective layer and the portion of the initial traces covering the protective layer are removed, the portion of the initial traces covering the surface of the substrate may simultaneously connect to multiple traces or multiple light-emitting components. This can easily lead to short circuits between the light-emitting components and the traces, thus affecting the normal use of the display module.

[0067] To address the aforementioned technical problems, this application provides a display module, its manufacturing method, and a display device. The display module comprises a connector including a first connecting portion and a second connecting portion stacked together, with the first connecting portion covering a first portion of the second connecting portion. When forming traces, initial traces can be formed by deposition or other methods. A portion of the initial trace covering the surface of the substrate forms the main body, a portion of the initial trace covering the second portion of the second connecting portion away from the substrate forms a contact portion, and the remaining portion of the initial trace covers the surface of the first connecting portion away from the second connecting portion. Subsequently, the portion of the initial trace covering the first connecting portion is removed, thereby forming traces between the main body and the contact portion.

[0068] In the thickness direction of the substrate, the thickness of the contact portion is less than the thickness of the first connecting portion, so that a discontinuity is formed between the initial trace covering the first connecting portion away from the surface of the second connecting portion and the initial trace covering the second part of the second connecting portion away from the surface of the substrate. This reduces the difficulty of removing the initial trace covering the first connecting portion, reduces the possibility of the initial trace connecting multiple traces or multiple light-emitting components, and reduces the possibility of short circuits in the light-emitting components and traces, thus ensuring the normal use of the display module.

[0069] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0070] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0071] Reference Figure 1 and Figure 2 This application provides a display module including a substrate 100, a light-emitting component 600, a connector 200, and a trace 300. The connector 200 and the light-emitting component 600 are both disposed on the first surface of the substrate 100. The connector 200 is electrically connected to the light-emitting component 600 and is also electrically connected to the trace 300. One end of the trace 300 away from the connector 200 is electrically connected to a driver chip 500, so that the driver chip 500 is electrically connected to the light-emitting component 600 in sequence through the trace 300 and the connector 200 to control the light-emitting process of the light-emitting component 600.

[0072] For example, the display module may also include a driver chip 500, the light-emitting component 600 may be disposed on the first surface of the substrate 100, the driver chip 500 may be disposed on the second surface of the substrate 100, or the driver chip 500 may be disposed at other locations on the substrate 100. This application embodiment does not further limit this.

[0073] The display module has a display area 10 and a non-display area 20 disposed around the display area 10; wherein, the light-emitting component 600 can be disposed in the display area 10, the connector 200 and the trace 300 can be disposed in the non-display area 20, and the trace 300 can extend from the first surface of the substrate 100 through the edge of the substrate 100 to the second surface of the substrate 100, so that the driving chip 500 disposed on the second surface of the substrate 100 can be electrically connected to the light-emitting component 600 located on the first surface of the substrate 100 through the trace 300.

[0074] Reference Figure 1 and Figure 2 In some possible implementations, the connector 200 may include a first connecting portion 210 and a second connecting portion 220 stacked together. The second connecting portion 220 is disposed on the substrate 100 and may include a first part and a second part connected to each other. The first part of the second connecting portion 220 and the second part of the second connecting portion 220 are arranged in a direction perpendicular to the thickness of the substrate 100. The first connecting portion 210 is disposed on the surface of the second connecting portion 220 away from the substrate 100 and covers the first part of the second connecting portion 220.

[0075] For example, the trace 300 includes a body 310 and a contact portion 320. The body 310 and the contact portion 320 are configured as portions of the trace 300 located on the first surface of the substrate 100. The body 310 may be configured as a portion of the trace 300 located on the first surface of the substrate 100 that does not cover the second connection portion 220.

[0076] The contact portion 320 is electrically connected to the main body 310, and the end of the contact portion 320 facing away from the main body 310 is electrically connected to the first connecting portion 210; the surface of the contact portion 320 facing the substrate 100 covers the second part of the second connecting portion 220, and in the thickness direction of the substrate 100, the thickness of the contact portion 320 is less than the thickness of the first connecting portion 210.

[0077] It is easy to understand that when the trace 300 is formed, the initial trace 330 can be formed by deposition or other means. The portion of the initial trace 330 covering the surface of the substrate 100 forms the main body 310, the portion of the initial trace 330 covering the second part of the second connection portion 220 away from the surface of the substrate 100 forms the contact portion 320, and the remaining portion of the initial trace 330 covers the surface of the first connection portion 210 away from the second connection portion 220. Since the thickness of the contact portion 320 is less than the thickness of the first connection portion 210, a discontinuity is formed between the portion of the initial trace 330 covering the surface of the first connection portion 210 away from the surface of the second connection portion 220 and the portion of the initial trace 330 covering the second part of the second connection portion 220 away from the surface of the substrate 100. This reduces the possibility that the initial trace 330 can simultaneously connect multiple traces 300 or multiple light-emitting components 600.

[0078] In some possible implementations, the first portion of the second connection portion 220 and the second portion of the second connection portion 220 can be arranged along a first direction (i.e., the X direction in the figure). The first direction can be set as the direction from the display area 10 to the non-display area 20, that is, the second portion of the second connection portion 220 is away from the display area 10 relative to the first portion of the second connection portion 220. In the first direction, the trace 300 can be provided at one end of the connector 200 away from the light-emitting component 600.

[0079] With a plane parallel to the first direction and perpendicular to the thickness direction of the substrate 100 as the cross-section, the cross-sectional shape of the first connecting portion 210 and the cross-sectional shape of the second connecting portion 220 can both be set as rectangles. Alternatively, the cross-sectional shape of the first connecting portion 210 can also be set as a trapezoid. The side of the first connecting portion 210 away from the substrate 100 is set as the lower base of the trapezoid, and the side of the first connecting portion 210 close to the substrate 100 is set as the upper base of the trapezoid, so that it is easier to form a break between the initial trace 330 covering the first connecting portion 210 and the initial trace 330 covering the second part of the second connecting portion 220.

[0080] For example, in the first direction, the end of the first connection portion 210 facing away from the trace 300 can be flush with the first part of the second connection portion 220 to facilitate the formation process of the first connection portion 210 and the second connection portion 220; and / or, the length of the second part of the second connection portion 220 can be greater than or equal to 10 micrometers. For example, the length of the second part of the second connection portion 220 can be set to one of 10 micrometers, 12 micrometers, 14 micrometers, 16 micrometers, 18 micrometers and 20 micrometers so that the surface of the contact portion 320 facing the substrate 100 can be stably attached to the second part of the second connection portion 220.

[0081] In the thickness direction of the substrate 100, the difference between the thickness of the first connection portion 210 and the thickness of the contact portion 320 can be greater than or equal to 200 angstroms, and the thickness of the connector 200 can be set to be greater than or equal to 1000 angstroms. For example, the thickness of the first connection portion 210 can be set to 1200 angstroms, and the thickness of the contact portion 320 can be set to one of 500 angstroms, 600 angstroms, 700 angstroms, 800 angstroms, 900 angstroms, and 1000 angstroms, in order to reduce the possibility that the portion of the initial trace 330 covering the second part of the second connection portion 220 is connected to the portion of the initial trace 330 covering the first connection portion 210.

[0082] For example, in the thickness direction of the substrate 100, the contact portion 320 can be flush with the surface of the substrate 100 away from the main body 310 to make the structure of the trace 300 more stable; and / or, in the thickness direction of the substrate 100, the thickness of the main body 310 can be set to be greater than or equal to 1 micrometer, for example, the thickness of the main body 310 can be set to one of 1 micrometer, 1.2 micrometer, 1.4 micrometer, 1.6 micrometer, 1.8 micrometer and 2 micrometer.

[0083] It is easy to understand that, in the thickness direction of the substrate 100, the thickness of the connector 200 is greater than the thickness of the main body 310. When the connector 200 is composed of a first connecting portion 210 and a second connecting portion 220, the thickness of the second connecting portion 220 is greater than the thickness of the first connecting portion 210, and the first end of the second connecting portion 220 away from the light-emitting component 600 abuts against the main body 310 of the trace 300, so as to increase the contact area between the second connecting portion 220 and the trace 300, improve the electrical contact quality between the connector 200 and the trace 300, and improve the performance of the connector 200.

[0084] Reference Figure 3 and Figure 4 In some possible implementations, the connector 200 may further include a third connecting portion 230, which may be disposed between the substrate 100 and the second connecting portion 220. (Refer to...) Figure 4 In the first direction, both ends of the third connecting part 230 can be flush with the second connecting part 200.

[0085] Or, refer to Figure 3 In the first direction, the third connection portion 230 may include a first part and a second part connected to each other. The first part of the third connection portion 230 may be flush with the first part of the second connection portion 220 at one end away from the trace 300. The first part of the third connection portion 230 is connected to the second connection portion 220 away from the surface of the substrate 100. The second part of the third connection portion 230 is connected to the main body 310 away from the surface of the substrate 100.

[0086] For example, at least a portion of the connector 200 is configured as a multi-layer structure. For instance, the connector 200 is configured such that at least one of the first connecting portion 210, the second connecting portion 220, and the third connecting portion 230 can be configured as a multi-layer structure to facilitate the forming process of the connector 200.

[0087] For example, the first connecting portion 210, the second connecting portion 220 and the third connecting portion 230 are all configured as multilayer structures. Multilayer metal layers 700 can be formed on the surface of the substrate 100 by deposition or other methods. Then, a portion of each metal layer 700 is removed along the thickness direction of the multilayer metal layers 700 by etching or other methods, so that the remaining portion of the multilayer metal layers 700 forms the first connecting portion 210, the second connecting portion 220 and the third connecting portion 230, thereby making the forming process of the first connecting portion 210, the second connecting portion 220 and the third connecting portion 230 more convenient.

[0088] The light-emitting component 600 may include a conductive layer 610 and a connecting layer 620, as well as a light-emitting unit, etc. The conductive layer 610 is disposed on the substrate 100, and the connecting layer 620 is electrically connected to the surface of the conductive layer 610 away from the substrate 100. The surface of the connecting layer 620 away from the conductive layer 610 can be used to electrically connect the light-emitting unit, so that the conductive layer 610 is electrically connected to the light-emitting unit through the connecting layer 620.

[0089] The connector 200 is electrically connected to the conductive layer 610, enabling the driver chip 500 to be electrically connected to the conductive layer 610 via the trace 300 and the connector 200. The connector 200 is configured such that at least one of the first connecting portion 210 and the second connecting portion 220 is disposed on the same layer and made of the same material on the conductive layer 610 or the connecting layer 620. For example, the first connecting portion 210 may be disposed on the same layer and made of the same material on the conductive layer 610, and the second connecting portion 220 may be disposed on the same layer and made of the same material on the connecting layer 620.

[0090] In summary, when forming the trace 300, the initial trace 330 can be formed by deposition or other methods. The portion of the initial trace 330 covering the surface of the substrate 100 forms the main body 310, the portion of the initial trace 330 covering the second part of the second connection portion 220 away from the surface of the substrate 100 forms the contact portion 320, and the remaining portion of the initial trace 330 covers the surface of the first connection portion 210 away from the second connection portion 220; then the portion of the initial trace 330 covering the first connection portion 210 is removed, thereby forming the trace 300 by the main body 310 and the contact portion 320.

[0091] In the thickness direction of the substrate 100, the thickness of the contact portion 320 is less than the thickness of the first connecting portion 210, so that a discontinuity is formed between the portion of the initial trace 330 covering the first connecting portion 210 away from the surface of the second connecting portion 220 and the portion of the initial trace 330 covering the second portion of the second connecting portion 220 away from the surface of the substrate 100. This reduces the difficulty of removing the portion of the initial trace 330 covering the first connecting portion 210, reduces the possibility that the initial trace 330 is connected to multiple traces 300 or multiple light-emitting components 600 at the same time, and reduces the possibility of short circuits between the light-emitting components 600 and the traces 300, thus ensuring the normal use of the display module.

[0092] Reference Figure 5 This application embodiment also provides a method for manufacturing a display module, including: S100, providing a substrate;

[0093] Reference Figure 1 and Figure 6 For example, the display module has a display area 10 and a non-display area 20 disposed around the display area 10. The substrate 100 has a first surface and a second surface opposite to the first surface. The first surface of the substrate 100 can be used to support structures such as the body 310 of the subsequent light-emitting component 600, connector 200 and wiring 300, wherein the light-emitting component 600 is located in the display area 10, and the connector 200 and wiring 300 are located in the non-display area 20. The second surface of the substrate 100 can be used to support the driver chip 500 so that the driver chip 500 located on the second surface of the substrate 100 can be electrically connected to the light-emitting component 600 through the wiring 300 and connector 200.

[0094] After providing the substrate 100, the fabrication method further includes: S200, forming a connector;

[0095] Reference Figure 6 and Figure 7 In some possible embodiments, the connector 200 includes a first connecting portion 210 and a second connecting portion 220 stacked together. The second connecting portion 220 is disposed on the substrate 100, and the second portion includes the first portion and the second portion connected to each other. The first connecting portion 210 is disposed on the surface of the second connecting portion 220 away from the substrate 100, and the first connecting portion 210 covers the first portion of the second connecting portion 220, while the second portion of the second connecting portion 220 is exposed.

[0096] For example, forming a connector 200 includes: forming a metal layer 700;

[0097] Reference Figure 7 and Figure 8 A metal layer 700 can be formed on the surface of the substrate 100 by means of physical vapor deposition (PVD), such that the first part of the metal layer 700 is located in the display area 10 and the second part of the metal layer 700 is located in the non-display area 20. The first part of the metal layer 700 can be used to form the light-emitting component 600, and the second part of the metal layer 700 can be used to form the first connection part 210 and the second connection part 220. The material of the metal layer 700 can be set to a material such as aluminum or copper.

[0098] It should be noted that the number of metal layers 700 can be set to one or more, and the number of metal layers 700 can be adjusted according to the thickness of the metal layers 700. For example, when the thickness of the metal layers 700 is large, the number of metal layers 700 can be set to multiple, that is, the metal layers 700 are formed by multiple depositions. When the thickness of the metal layers 700 is small, the number of metal layers 700 can be set to one, that is, the metal layers 700 are formed by one deposition.

[0099] Reference Figure 8 and Figure 9 After forming the metal layer 700, the preparation method further includes: removing a portion of the first portion of the metal layer 700 and a portion of the second portion of the metal layer 700, the remaining first portion of the metal layer 700 located in the display area 10 is used to form the light-emitting component 600, and the remaining second portion of the metal layer 700 located in the non-display area 20 forms the connector 200, so as to make the forming process of the connector 200 and the light-emitting component 600 more convenient.

[0100] For example, a portion of the first portion of the metal layer 700 and a portion of the second portion of the metal layer 700 can be removed along the thickness direction of the metal layer 700 by means of etching, and the remaining first portion of the metal layer 700 located in the display area 10 forms a conductive layer 610 and a connecting layer 620; the remaining second portion of the metal layer 700 located in the non-display area 20 forms a first connecting portion 210 and a second connecting portion 220.

[0101] Reference Figure 10 It should be noted that a metal layer 700 can be formed on the surface of the substrate 100 by deposition or other means. The first part of the metal layer 700 is located in the display area 10, and the second part of the metal layer 700 is located in the non-display area 20. Then, a portion of the first part of the metal layer 700 and a portion of the second part of the metal layer 700 are removed, so that the remaining first part of the metal layer 700 located in the display area 10 forms a conductive layer 610, and the remaining second part of the metal layer 700 located in the non-display area 20 forms a second connection portion 220.

[0102] Subsequently, a third metal layer 700 can be formed on the surface of the conductive layer 610 away from the substrate 100 and the surface of the first connection portion 210 away from the substrate 100 by deposition or other methods. This makes the third metal layer 700 covering the conductive layer 610 form the connection layer 620, and the third metal layer 700 covering the second connection portion 220 form the first connection portion 210, thereby making the formation process of the connector 200 and the light-emitting component 600 more convenient.

[0103] It is easy to understand that when the connector 200 also includes a third connecting portion 230, the second portion of the metal layer 700 with a certain thickness is removed, and the remaining second portion of the metal layer 700 located in the non-display area 20 is used to form the connected second connecting portion 220 and the third connecting portion 230. The embodiments of this application will not be described in detail here.

[0104] In some possible implementations, after forming the connector 200, the fabrication method further includes: S300, forming a trace;

[0105] Reference Figure 1 , Figure 11 and Figure 12 The trace 300 includes a main body 310 and a contact portion 320. The main body 310 is formed on the first surface of the substrate 100. The contact portion 320 is electrically connected to the main body 310. One end of the contact portion 320 away from the main body 310 is electrically connected to the first connection portion 210. The surface of the contact portion 320 facing the substrate 100 covers the second part of the second connection portion 220. In the thickness direction of the substrate 100, the thickness of the contact portion 320 is less than the thickness of the first connection portion 210.

[0106] For example, forming trace 300 includes: forming a protective layer 400;

[0107] Reference Figure 11 and Figure 12 The protective layer 400 can be configured as a thin film structure, so that the protective layer 400 covers the surface of the first connecting portion 210 away from the first part of the second connecting portion 220. The protective layer 400 can also cover the surface of the light-emitting component 600 away from the substrate 100, so as to provide a certain protection for the light-emitting component 600 through the protective layer 400.

[0108] A protective layer 400 can be formed on the surface of the first connecting portion 210 away from the second connecting portion 220 and on the surface of the light-emitting component 600 away from the substrate 100 by deposition or other methods; or, when the protective layer 400 is a thin film structure, the protective layer 400 can also be formed on the surface of the first part of the first connecting portion 210 away from the second connecting portion 220 and on the surface of the light-emitting component 600 away from the substrate 100 by bonding or other methods, so as to make the forming process of the protective layer 400 and the subsequent removal process of the protective layer 400 more convenient.

[0109] For example, after forming the protective layer 400, the fabrication method further includes: forming an initial trace 330;

[0110] Reference Figure 12 and Figure 13Initial traces 330 can be formed on the surface of substrate 100 by physical vapor deposition or chemical vapor deposition (CVD). The first part 330a of the initial traces 330 covers the surface of substrate 100, the second part 330b of the initial traces 330 covers the second part of the second connection 220, and the third part 330c of the initial traces 330 covers the surface of the protective layer 400 away from the first connection 210.

[0111] It is easy to understand that, in the thickness direction of the substrate 100, the first portion 330a of the initial trace 330, which faces away from the surface of the substrate 100, can be flush with the second portion 330b of the initial trace 330, which faces away from the surface of the second connection portion 220, and the thickness of the second portion of the initial trace 330 is less than the thickness of the first connection portion 210, so that a discontinuity is formed between the third portion 330c of the initial trace 330 and the second portion 330b of the initial trace 330.

[0112] It should be noted that the initial trace 330 may also include a fourth portion 330d. The fourth portion 330d of the initial trace 330 may be formed on the side of the substrate 100 and the second surface of the substrate 100. The first end of the fourth portion 330d of the initial trace 330 is electrically connected to the driver chip 500, and the second end of the fourth portion 330d of the initial trace 330 is electrically connected to the first portion of the initial trace 330.

[0113] For example, after forming the initial trace 330, the fabrication method further includes: removing the protective layer 400 and the third portion 330c of the initial trace 330, forming the body 310 from the first portion 330a of the initial trace 330, forming the contact portion 320 from the second portion 330b of the initial trace 330, and forming the trace 300 from the body 310 and the contact portion 320.

[0114] The protective layer 400 and the third portion 330c of the initial trace 330 covering the surface of the protective layer 400 can be removed by peeling off the protective layer 400, so that the light-emitting component 600 and the first connection portion 210 are exposed away from the surface of the substrate 100. Since there is a discontinuity between the third portion 330c of the initial trace 330 and the second portion 330b of the initial trace 330, the difficulty of removing the third portion 330c of the initial trace 330 covering the first connection portion 210 is reduced, and the possibility of the initial trace 330 connecting multiple traces 300 or multiple light-emitting components 600 is reduced.

[0115] In summary, when forming the trace 300, the initial trace 330 can be formed by deposition or other methods. The portion of the initial trace 330 covering the surface of the substrate 100 forms the main body 310, the portion of the initial trace 330 covering the second part of the second connection portion 220 away from the surface of the substrate 100 forms the contact portion 320, and the remaining portion of the initial trace 330 covers the surface of the first connection portion 210 away from the second connection portion 220; then the portion of the initial trace 330 covering the first connection portion 210 is removed, thereby forming the trace 300 by the main body 310 and the contact portion 320.

[0116] In the thickness direction of the substrate 100, the thickness of the contact portion 320 is less than the thickness of the first connecting portion 210, so that a discontinuity is formed between the portion of the initial trace 330 covering the first connecting portion 210 away from the surface of the second connecting portion 220 and the portion of the initial trace 330 covering the second portion of the second connecting portion 220 away from the surface of the substrate 100. This reduces the difficulty of removing the portion of the initial trace 330 covering the first connecting portion 210, reduces the possibility of the initial trace 330 connecting multiple traces 300 or multiple light-emitting components 600, and reduces the possibility of short circuits between the light-emitting components 600 and the traces 300, thus ensuring the normal use of the display module.

[0117] This application also provides a display device including the display module described in any of the above embodiments. Since the display device includes the display module described in any of the above embodiments, the advantages of this display device including the display module described in any of the above embodiments can be specifically found in the relevant descriptions above, and will not be repeated here.

[0118] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0119] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0120] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display module, characterized in that, Includes substrate, light-emitting components, connectors, and wiring; The light-emitting component is disposed on the substrate, and the connector is electrically connected to the light-emitting component. The connector includes a first connecting portion and a second connecting portion stacked together. The bottom surface of the first connecting portion and the top surface of the second connecting portion are in contact with each other. The second connecting portion is disposed on the substrate, and the first connecting portion is disposed on the surface of the second connecting portion away from the substrate. The first connecting portion covers a first portion of the second connecting portion. The trace includes a main body and a contact portion. The contact portion is electrically connected to the main body, and one end of the contact portion facing away from the main body is electrically connected to the first connection portion. The surface of the contact portion facing the substrate covers a second portion of the second connection portion. The first portion and the second portion of the second connection portion are arranged in a direction perpendicular to the thickness of the substrate. In the thickness direction of the substrate, the thickness of the contact portion is less than the thickness of the first connecting portion, and the second portion of the second connecting portion protrudes from the end of the trace relative to the first connecting portion. When the trace is formed, there is a gap between the portion of the initial trace covering the first connection portion away from the surface of the second connection portion and the portion of the initial trace covering the second portion away from the surface of the substrate.

2. The display module according to claim 1, characterized in that, In the thickness direction of the substrate, the difference between the thickness of the first connecting portion and the thickness of the contact portion is greater than or equal to 200 angstroms.

3. The display module according to claim 2, characterized in that, In a direction perpendicular to the thickness of the substrate, the end of the first connection portion facing away from the trace is flush with the first part of the second connection portion. In a direction perpendicular to the thickness of the substrate, the length of the second portion of the second connection is greater than or equal to 10 micrometers.

4. The display module according to claim 1, characterized in that, The connector further includes a third connecting portion, which is disposed on the substrate; The first part of the third connecting portion is connected to the second connecting portion away from the surface of the substrate, and the second part of the third connecting portion is connected to the main body away from the surface of the substrate.

5. The display module according to claim 1 or 4, characterized in that, At least a portion of the connector is configured as a multi-layered structure.

6. The display module according to any one of claims 1-4, characterized in that, The display module has a display area and a non-display area disposed around the display area; the connector and the wiring are disposed within the non-display area; The display module further includes a light-emitting component located within the display area. The light-emitting component includes a conductive layer and a connecting layer. The conductive layer is disposed on the substrate and connected to the connecting layer on a surface opposite to the substrate. The conductive layer is electrically connected to the connector. At least one of the first connecting portion and the second connecting portion is disposed on the same layer and the same material in the conductive layer or the connecting layer.

7. A method for manufacturing a display module, characterized in that, include: Provide substrate; A connector and a light-emitting component are formed; the connector is electrically connected to the light-emitting component, the connector includes a first connecting portion and a second connecting portion stacked together, the second connecting portion is disposed on the substrate, the first connecting portion is disposed on the surface of the second connecting portion away from the substrate, and the first connecting portion covers a first portion of the second connecting portion; A trace is formed; the trace includes a body and a contact portion, the contact portion is electrically connected to the body, and one end of the contact portion away from the body is electrically connected to the first connection portion; the surface of the contact portion facing the substrate covers a second portion of the second connection portion, the thickness of the contact portion is less than the thickness of the first connection portion, and one end of the second portion of the second connection portion facing the trace protrudes relative to the first connection portion. When the trace is formed, there is a gap between the portion of the initial trace covering the first connection portion away from the surface of the second connection portion and the portion of the initial trace covering the second portion away from the surface of the substrate.

8. The method for manufacturing a display module according to claim 7, characterized in that, Forming the aforementioned trace includes: A protective layer is formed; the protective layer covers the surface of the first connecting portion that is opposite to the first portion of the second connecting portion; An initial trace is formed; a first portion of the initial trace covers the surface of the substrate, a second portion of the initial trace covers a second portion of the second connection portion, and a third portion of the initial trace covers the surface of the protective layer opposite to the first connection portion. The protective layer and the third portion of the initial trace are removed, the first portion of the initial trace forms the body, the second portion of the initial trace forms the contact portion, and the body and the contact portion form the trace.

9. The method for preparing a display module according to claim 7, characterized in that, The display module has a display area and a non-display area disposed around the display area; The connector comprises: A metal layer is formed on the surface of the substrate, wherein a first portion of the metal layer is located in the display area and a second portion of the metal layer is located in the non-display area; A portion of the first metal layer and a portion of the second metal layer are removed, and the remaining portion of the first metal layer located in the display area is used to form the light-emitting component, while the remaining portion of the second metal layer located in the non-display area forms the connector.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-6.

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