Hybrid integrated suspended line structure

Abstract

The application discloses a hybrid integrated suspended line structure, which is formed by a self-encapsulating structure arranged by stacking a plurality of circuit boards, wherein the circuit boards comprise at least three layers of PCB boards and at least three layers of metal plates; at least two layers of the metal plates are arranged in a stacked mode with upper and lower plates connected to each other; the upper surface and the lower surface of a metal stacked layer formed by the two metal plates in the stacked mode are respectively provided with a layer of PCB board; the upper surface of the PCB board on the upper surface of the metal stacked layer is provided with a layer of PCB board; the metal plates are partially cut to form air-filled air cavities; and main circuits are arranged on the preselected metal plates and the PCB boards. According to the application, the multi-layer self-encapsulating structure is formed by stacking the multi-layer PCB / metal plates; the circuits can be designed on the PCB boards and the metal plates; the suspended line structure circuit processing design is performed by using the PCB boards; other metal filters or other device designs are performed on the metal plates; and the integration with other active and passive circuits is facilitated.

Description

Technical Field

[0001] This invention relates to the field of radio frequency, microwave, and terahertz circuit technology, and in particular to a hybrid integrated suspension line structure. Background Technology

[0002] Transmission lines are a key component of modern microwave and millimeter-wave circuits. In recent years, circuits based on dielectric integrated suspension lines (SISL) and metal integrated suspension lines (MISL) have been reported.

[0003] The aforementioned Integrated Suspension Line (SISL) is based on traditional multilayer PCB technology and has the advantages of self-encapsulation, low loss, and easy integration. Active and passive circuits designed based on the SISL platform have fully utilized its advantages and have been widely reported.

[0004] The newly unveiled Metal Integrated Suspension Line (MISL) platform, utilizing mature metal processing technology, offers advantages such as high machining accuracy and low cost. Circuits designed based on MISL exhibit high quality factors, excellent heat dissipation, and the ability to operate at higher frequencies, and are increasingly becoming a research hotspot.

[0005] However, circuits based on dielectric integrated suspension lines (SISL) and metal integrated suspension lines (MISL) each have their own advantages and disadvantages. Therefore, it is necessary to develop a new type of integrated suspension line circuit. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings and defects of the prior art and provide a hybrid-integrated suspended line (HISL) structure that can take into account the performance of both SISL and MISL.

[0007] A hybrid integrated suspension line structure is provided, which is a self-encapsulated structure formed by stacking multiple circuit boards. The multi-layer circuit boards include at least three PCBs and at least three metal plates. At least two of the metal plates are stacked and connected to each other. A PCB is arranged on the upper and lower surfaces of the metal stack layer formed by the two stacked metal plates. A PCB is arranged on the upper surface of the PCB on the upper surface of the metal stack layer. The interior of the metal plates is partially cut out to form an air-filled cavity. The main circuit is arranged on the pre-selected metal plates and PCBs.

[0008] The PCB board and the metal plate have metallized through holes that penetrate all the metal plates and the PCB board.

[0009] In this process, multilayer circuit boards are connected by countersunk holes, rivets, or soldering to form a self-encapsulated structure.

[0010] The PCB board is manufactured using circuit board processing technology.

[0011] The metal plate is made of stainless steel, copper, or alloy materials through processes including metal etching.

[0012] The circuit design is carried out on the metal plate by etching a preset pattern and preset geometry.

[0013] The air cavity contains physical components, including amplifiers, capacitors, and inductors.

[0014] The main circuit includes a microwave radio frequency circuit, which includes a power divider and a combiner.

[0015] The main circuit is a transmission line structure.

[0016] The main circuit includes a PCB-based patch and suspension wire resonator, and a metal plate-based coaxial resonator.

[0017] This invention utilizes a multi-layer PCB / metal board stacking structure to form a multi-layer self-encapsulated structure. Circuit design can be performed on both the PCB and metal boards. The PCB can be used for the fabrication and design of suspended line structure circuits, while the metal boards can be used for the design of other metal filters or other devices. This facilitates integration with other active and passive circuits. Each metal layer can be fabricated independently, and the circuits can be integrated by riveting or soldering.

[0018] This invention employs a hybrid PCB and metal plate stacking process, which provides better heat dissipation performance compared to dielectric integrated suspension line (SISL). Compared to metal integrated suspension line platform (MISL), the PCB process can fabricate and design more conventional circuits and facilitates interconnection between circuits. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the hybrid integrated suspension line structure according to an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of a resonator-type filter with a hybrid integrated suspension line structure according to an embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the coplanar waveguide (CPW) feeding structure of the hybrid integrated suspension line structure according to an embodiment of the present invention. Detailed Implementation

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0023] Please see Figures 1 to 3 As shown, the hybrid-integrated suspended line (HISL) structure disclosed in this embodiment of the invention realizes a multi-layer transmission line circuit with a hybrid structure based on a multi-layer hybrid PCB board and metal board processing technology. It is formed by stacking multiple circuit boards to form a self-encapsulated structure. The multi-layer circuit board includes at least three PCB boards and at least three metal boards. At least two of the metal boards are stacked and connected to each other. A PCB board is arranged on the upper and lower surfaces of the metal stack layer formed by the two stacked metal boards. A PCB board is arranged on the upper surface of the PCB board on the upper surface of the metal stack layer. The interior of the metal board is partially cut out to form an air-filled cavity. The main circuit is arranged on the pre-selected metal board and PCB board.

[0024] The Hybrid Integrated Suspended Line (HISL) structure disclosed in this invention fully utilizes the advantage of PCB boards in easily arranging traditional circuits, while also leveraging the advantage of metal plate structures in achieving high unloaded Q values ​​to design hybrid circuit structures. Based on this Hybrid Integrated Suspended Line (HISL) structure, high-Q metal / PCB transmission lines, metal / PCB resonators, etc., can be designed, achieving high Q and self-encapsulating characteristics while also providing good heat dissipation performance, thereby meeting the needs of specific scenarios.

[0025] Figure 1 The diagram shows the overall structure based on the Hybrid Integrated Suspension Line (HISL) structure, which is a multi-layer PCB / metal board stacked structure. For ease of explanation, a six-layer structure is used as an example, but the circuit board involved in this invention is not limited to a six-layer stacked structure.

[0026] Please see Figure 1 As shown, Figure 1 This invention illustrates a six-layer hybrid integrated suspension line structure according to an embodiment of the present invention. The hybrid integrated suspension line structure is composed of multiple layers of PCB / metal boards stacked together. Taking a six-layer PCB / metal board as an example, it can be composed of... Figure 1 The PCB board / metal board in the middle specifically includes a first PCB board 1, a first metal board 2, a second PCB board 3, a second metal board 4, a third metal board 5, and a third PCB board 6. Among them, the first metal board 2, the second metal board 4, and the third metal board 5 are partially cut off to form an air-filled hollow cavity.

[0027] In this embodiment, the main circuit, namely the microwave radio frequency circuit, is designed primarily on the second PCB board 3 and the second metal plate 4, but it can also be designed on any layer, and is not limited thereto. Furthermore, any complex patterns and arbitrary geometric shapes can be etched and processed on the second metal plate 4 for circuit design.

[0028] In this embodiment of the application, each PCB layer can be manufactured using mature circuit board processing technology;

[0029] In this embodiment, each metal plate can be made of stainless steel, copper, or other alloys through processes such as metal etching.

[0030] In this embodiment, the thickness of each metal plate and PCB board can be set according to actual needs.

[0031] Figure 1 The HISL shown can be externally connected using traditional riveting or soldering. Other physical components such as amplifiers, capacitors, and inductors can also be placed in the cavity structure formed by this structure.

[0032] To form a closed cavity structure, in this embodiment, metallized through-holes 8 are drilled in each PCB board and metal plate, such as... Figure 3 As shown, it extends through all metal plates and the PCB board.

[0033] Preferably, the multilayer circuit boards are connected by countersunk holes, rivets or soldering to form a self-encapsulated structure.

[0034] like Figure 2 As shown, Figure 2 The structure of a resonator-type filter with a hybrid integrated suspended line structure according to an embodiment of the present invention is shown. Based on HISL design, the resonator-type filter circuit can be designed with transmission line structures of arbitrary shapes, such as surface-mount or suspended line resonators designed on a PCB board, or coaxial resonators designed on a metal plate. Vertical integration of the circuit is achieved by stacking multi-layer structures based on HISL, thereby enabling the design and implementation of RF microwave circuits such as power dividers and combiners with transmission line structures.

[0035] like Figure 3 As shown, Figure 3 This invention illustrates a coplanar waveguide (CPW) feed structure 7 with a hybrid integrated suspension line structure, which is... Figure 2 The circuit structure on the second PCB board can be directly fed to the circuit on the PCB board using a coplanar waveguide (CPW) feeding structure, or it can be coupled to feed the circuit on the metal board.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention.

[0037] Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of the equivalents of the claims be included within the invention.

[0038] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A hybrid integrated suspension line structure, characterized in that, A hybrid PCB board and metal board stacking process is adopted to realize a multi-layer transmission line circuit with a hybrid structure based on the multi-layer hybrid PCB board and metal board processing technology. The multi-layer PCB board / metal board stacking structure is formed by stacking and arranging multiple circuit boards to form a self-encapsulated structure. Circuit design is performed on PCB boards and metal boards. Suspended line structure circuits are fabricated and designed using PCB boards, while other metal filters or components are designed on the metal boards. The multilayer circuit board includes at least three PCB boards and at least three metal boards. At least two of the metal boards are stacked vertically and connected. A PCB board is placed on the upper and lower surfaces of the metal stack layer formed by the two stacked metal boards. A PCB board is placed on the upper surface of the PCB board on the upper surface of the metal stack layer. Partial removal of the interior of the metal boards forms air-filled cavities, in which physical components, including amplifiers, capacitors, and inductors, are arranged. The main circuit is arranged on pre-selected metal boards and PCB boards. Metallized through-holes are present on the PCB boards and metal boards, penetrating all metal boards and PCB boards. The multilayer circuit board is connected by countersunk holes, rivets, or soldering to form a self-encapsulated structure.

2. The hybrid integrated suspension line structure according to claim 1, characterized in that, The PCB board is manufactured using circuit board processing technology.

3. The hybrid integrated suspension line structure according to claim 1, characterized in that, The metal plate is made of copper or alloy materials through processes including metal etching; the alloy materials include stainless steel.

4. The hybrid integrated suspension line structure according to claim 1, characterized in that, Circuit design is performed on the metal plate by etching preset patterns and preset geometric shapes.

5. The hybrid integrated suspension line structure according to claim 1, characterized in that, The main circuit includes a microwave radio frequency circuit, which includes a power divider and a combiner.

6. The hybrid integrated suspension line structure according to claim 1, characterized in that, The main circuit is a transmission line structure.

7. The hybrid integrated suspension line structure according to claim 1, characterized in that, The main circuit includes a PCB-based patch and suspension wire resonator, as well as a metal plate-based coaxial resonator.

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