A connector detection method and device, computer equipment and storage medium

Abstract

The application relates to a connector detection method and device, computer equipment and a storage medium. The method comprises the following steps: obtaining historical detection data of the connector, performing standard detection parameter analysis to obtain a connector standard detection parameter qualified domain; measuring the connector to obtain connector size measurement data and connector offset measurement data; performing size qualification judgment based on the connector size measurement data and in combination with the connector size standard detection parameter qualified domain; performing offset qualification judgment based on the connector offset measurement data and in combination with the connector offset standard detection parameter qualified domain; and determining that the connector contact is poor in response to the result of one or more of the size qualification judgment and the offset qualification judgment being unqualified. The method can reduce misjudgment, quickly locate the fault cause, find the contact poor problem caused by multiple component offsets, and significantly improve the detection accuracy.

Description

Technical Field

[0001] This application relates to the field of connector testing technology, and in particular to a connector testing method, apparatus, computer equipment, and storage medium. Background Technology

[0002] In the assembly and testing of modern servers, the performance of PCIe devices such as network interface cards and memory cards is crucial to the overall system efficiency. This is especially true in high-performance computing and data center environments, where PCIe devices undertake critical tasks such as high-speed data transmission and network connectivity, highlighting their increasing importance. However, PCIe devices are connected via connectors, which are prone to poor contact. This often leads to reduced bandwidth, lower data transmission rates, and increased transmission error rates, severely impacting system stability and network device interoperability. Therefore, to ensure proper device operation and a good user experience, it is essential to quickly and effectively detect connector contact problems.

[0003] However, existing connector contact failure detection methods often rely on a single detection dimension, such as electrical signals or physical connections, which makes it impossible to fully capture potential problems in the equipment and results in a high false positive rate. In addition, traditional detection standards and tolerance ranges are usually statically set and lack the ability to be dynamically adjusted according to different equipment batches and historical data, causing some equipment to be falsely judged as qualified or unqualified. More importantly, existing methods are difficult to effectively identify contact failures caused by the misalignment of multiple components, especially in complex equipment, making it difficult to accurately locate the root cause of the fault, thereby affecting the efficiency of fault diagnosis and the level of automation of the production line. Summary of the Invention

[0004] Therefore, it is necessary to provide a connector testing method, apparatus, computer equipment, and storage medium that can reduce misjudgments, quickly locate the cause of faults, and identify contact problems caused by the misalignment of multiple components, thereby significantly improving the testing accuracy, in order to address the above-mentioned technical problems.

[0005] On the one hand, a connector testing method is provided, the method comprising:

[0006] Historical testing data of the connector is obtained, and standard testing parameters are analyzed to obtain the qualified range of connector standard testing parameters. The qualified range of connector standard testing parameters includes the qualified range of connector size standard testing parameters and the qualified range of connector offset standard testing parameters.

[0007] The connector is measured to obtain connector size measurement data and connector offset measurement data;

[0008] Based on the connector size measurement data and the qualified range of the connector size inspection parameters, a size qualification judgment is made;

[0009] Based on the connector offset measurement data and the qualified range of the connector offset inspection parameters, an offset qualification judgment is made, wherein the offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment;

[0010] If one or more of the results of the size acceptance judgment and the offset acceptance judgment are unacceptable, then the connector is determined to have poor contact.

[0011] In one embodiment, the connector includes at least one component, the at least one component corresponding to component size inspection parameters and component offset inspection parameters. The step of acquiring historical inspection data of the connector, performing standard inspection parameter analysis, and obtaining the connector inspection parameter pass range includes:

[0012] The historical inspection data of the connector is obtained to obtain the historical inspection data corresponding to the at least one component, wherein the historical inspection data corresponding to the at least one component includes: historical dataset of component size calibration parameters and historical dataset of component offset calibration parameters;

[0013] Based on the historical dataset of component size calibration parameters, the mean and standard deviation of the component size calibration parameters corresponding to the at least one component are calculated.

[0014] Based on the mean value and standard deviation of the component size inspection parameters, the tolerance range of the component size inspection parameters corresponding to the at least one component is obtained;

[0015] Based on the tolerance range of the component size inspection parameters, the qualified range of the component size inspection parameters of the at least one component is obtained, and then the qualified range of the connector size inspection parameters is obtained.

[0016] Based on the historical dataset of the component offset calibration parameters, the mean and standard deviation of the component offset calibration parameters corresponding to the at least one component are calculated.

[0017] Based on the historical dataset of the component offset calibration parameters, correlation analysis is performed to obtain the correlation strength between the component offset calibration parameters and the component size calibration parameters corresponding to the at least one component.

[0018] Based on the mean value and standard deviation of the component offset inspection parameters, and combined with the correlation strength between the component offset inspection parameters and the component size inspection parameters, the tolerance range of the component offset inspection parameters corresponding to the at least one component is obtained.

[0019] Based on the tolerance range of the component offset inspection parameters, the qualified range of the component offset inspection parameters corresponding to the at least one component is obtained, and then the qualified range of the connector offset inspection parameters is obtained.

[0020] In one embodiment, the tolerance range of the component size calibration parameters for the at least one component is obtained based on the mean value and standard deviation of the component size calibration parameters, including:

[0021] Obtain the standard deviation of the component size calibration parameter and the standard deviation of the component offset calibration parameter corresponding to the at least one component;

[0022] Obtain the average values ​​of the component size calibration parameters and the average values ​​of the component offset calibration parameters corresponding to the at least one component;

[0023] Based on the mean value and standard deviation of the component size inspection parameters, the tolerance range of the component size inspection parameters corresponding to the at least one component is obtained, wherein the tolerance range of the component size inspection parameters is expressed as:

[0024] ;

[0025] in, This represents the tolerance range of the component size calibration parameters corresponding to the i-th component. This represents the standard deviation of the component size calibration parameter corresponding to the i-th component. This represents the average component size calibration parameter value corresponding to the i-th component;

[0026] Based on the mean and standard deviation of the component offset calibration parameters, and considering the correlation strength between the component offset calibration parameters and the component size calibration parameters, the tolerance range of the component offset calibration parameters for the at least one component is obtained, including:

[0027] Several historical samples are selected from the historical dataset of component size calibration parameters and the historical dataset of component offset calibration parameters, respectively;

[0028] Based on the aforementioned historical samples, and according to the standard deviation of the component size calibration parameters and the standard deviation of the component offset calibration parameters, the size offset correlation coefficient corresponding to the at least one component is calculated, wherein the size offset correlation coefficient is obtained based on the following formula:

[0029] ;

[0030] in, This represents the k-th historical sample of the component size calibration parameters corresponding to the i-th component. This represents the k-th historical sample of the component offset calibration parameters corresponding to the j-th component, where n represents the number of historical samples selected. This represents the dimensional offset correlation coefficient between the component dimension calibration parameters corresponding to the i-th component and the component offset calibration parameters corresponding to the j-th component. This represents the standard deviation of the component offset calibration parameter corresponding to the j-th component. This represents the mean of the component offset calibration parameters corresponding to the j-th component;

[0031] Obtain the dimensional offset correlation coefficient and generate a dynamic adjustment coefficient corresponding to the at least one component, wherein the dynamic adjustment coefficient is obtained based on the following formula:

[0032] ;

[0033] in, This represents the dynamic adjustment coefficient of the component offset calibration parameter corresponding to the j-th component. Indicates the adjustment factor. The absolute value of the dimensional offset correlation coefficient between the component size calibration parameter corresponding to the i-th component and the component offset calibration parameter corresponding to the j-th component is given, where m represents the number of component size calibration parameters.

[0034] Based on the mean and standard deviation of the component offset calibration parameters, and in conjunction with the dynamic adjustment coefficient, the tolerance range of the component offset calibration parameters corresponding to the at least one component is obtained, wherein the tolerance range of the component offset calibration parameters is expressed as follows: ,in, This represents the tolerance range of the component offset calibration parameters corresponding to the j-th component.

[0035] In one embodiment, the connector is measured to obtain connector size measurement data and connector offset measurement data, including:

[0036] Based on at least one component included in the connector, obtain the component size calibration parameters and component offset calibration parameters corresponding to the at least one component;

[0037] Based on the component size calibration parameters, set the corresponding size measurement dimensions;

[0038] Based on the component offset calibration parameters, set the corresponding offset measurement dimension;

[0039] Based on the size measurement dimension and the offset measurement dimension, select the corresponding measurement tool, measure and record the connector, and obtain the connector size measurement data and connector offset measurement data.

[0040] In one embodiment, based on the connector size measurement data and the connector size inspection parameter acceptance range, a size acceptance judgment is made, including:

[0041] Based on the connector size measurement data, component size measurement data corresponding to at least one component included in the connector is obtained;

[0042] Based on the component size calibration parameters corresponding to the at least one component, the component size measurement data is extracted to obtain the component size calibration parameter measurement values ​​corresponding to the at least one component;

[0043] Obtain the acceptable range of component size inspection parameters corresponding to the at least one component;

[0044] If the measured value of the component size inspection parameter corresponding to the at least one component is within the acceptable range of the component size inspection parameter, then the at least one component is a size-acceptable component.

[0045] If all components in the connector are dimensionally acceptable, the result of the dimension acceptance judgment is acceptable; otherwise, the result of the dimension acceptance judgment is unacceptable.

[0046] In one embodiment, based on the connector offset measurement data and the acceptable range of the connector offset calibration parameters, an offset acceptance judgment is made, including:

[0047] Obtain the component information of the connector and determine whether there are multiple similar offset components;

[0048] In response to the absence of multiple similar offsettable components, the independent offset qualification judgment is performed, wherein the independent offset qualification judgment includes:

[0049] Based on the connector offset measurement data, component offset measurement data corresponding to at least one component included in the connector is obtained;

[0050] Based on the component offset calibration parameters corresponding to the at least one component, the component offset measurement data is extracted to obtain the component offset calibration parameter measurement values ​​corresponding to the at least one component;

[0051] Obtain the qualified field of the component offset inspection parameter corresponding to the at least one component;

[0052] If the measured value of the component offset calibration parameter corresponding to the at least one component is within the qualified range of the component offset calibration parameter, then the at least one component is an independent offset qualified component;

[0053] If all components in the connector are independently offset qualified components, the result of the offset qualification judgment is qualified; otherwise, the result of the offset qualification judgment is unqualified.

[0054] In response to the existence of multiple similar offsetable components, the composite offset qualification judgment is performed to obtain the composite offset qualification judgment result;

[0055] If the composite offset qualification judgment result is qualified, then the offset qualification judgment result is qualified; otherwise, the offset qualification judgment result is unqualified.

[0056] In one embodiment, the offset calibration parameter qualification field includes a component superimposed offset qualification field. In response to the existence of multiple similar offsettable components, the composite offset qualification judgment is performed to obtain the composite offset qualification judgment result, including:

[0057] Based on the component information in the connector and the corresponding component offset measurement data, the independent offset judgment is performed on all components in the connector.

[0058] In response to any component in the connector being an independently qualified offset component, a judgment of superimposed offsets of the same type is performed, including:

[0059] Obtain the types of the multiple similar offsetable components, and classify and group the component offset measurement data according to the types of the multiple similar offsetable components to obtain a classification and grouping measurement form. The classification and grouping measurement form includes at least: component type, component number, and component offset inspection parameter measurement value.

[0060] The component offset calibration parameter measurement values ​​in the classification and grouping measurement form are calibrated for offset direction to obtain the component offset amount;

[0061] Based on the component type and the component number, the component offsets of the plurality of similar offsetable components are counted. Based on the component offset superposition formula, the superposition offset of the plurality of similar offsetable components of the same component type is calculated. The component offset superposition formula is as follows: ,in, This represents the offset of the component stacking for the j-th component type. This represents the component offset of the i-th component number of the j-th component type. This indicates the offset direction of the component offset of the i-th component number of the j-th component type. N represents the absolute value of the component offset of the i-th component number of the j-th component type, and N represents the number of multiple offsettable components of the same type of the j-th component type.

[0062] Based on the component stacking offset corresponding to the multiple similar offsetable components of the same component type, and in conjunction with the qualified component stacking offset field corresponding to the same component type, a comparison is made. If the component stacking offset is within the qualified component stacking offset field, then the multiple similar offsetable components of the same component type are determined to be qualified stacking offset components.

[0063] If all of the plurality of similar offsetable components in the connector are qualified components for superimposed offset, then the composite offset qualification result of the connector is qualified.

[0064] On the other hand, a connector testing device is provided, the device comprising:

[0065] The standard inspection parameter qualified field generation module is used to acquire the historical test data of the connector, perform standard test parameter analysis, and obtain the connector standard inspection parameter qualified field, wherein the connector standard inspection parameter qualified field includes the connector size standard inspection parameter qualified field and the connector offset standard inspection parameter qualified field.

[0066] The equipment measurement module is used to acquire connector size measurement data and connector offset measurement data of the connector;

[0067] The size conformity judgment module is used to judge the size conformity based on the connector size measurement data and the conformity range of the connector size standard inspection parameters;

[0068] The offset qualification judgment module is used to perform offset qualification judgment based on the connector offset measurement data and the qualified range of the connector offset inspection parameters. The offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment.

[0069] The poor contact judgment module is used to determine that the connector has poor contact if one or more of the results of the size qualification judgment and the offset qualification judgment are unqualified.

[0070] In another aspect, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to perform the following steps:

[0071] Historical test data of the connector is obtained, and standard test parameter analysis is performed to obtain the qualified range of connector standard test parameters. The qualified range of connector standard test parameters includes the qualified range of connector size standard test parameters and the qualified range of connector offset standard test parameters.

[0072] The connector is measured to obtain connector size measurement data and connector offset measurement data;

[0073] Based on the connector size measurement data and the qualified range of the connector size inspection parameters, a size qualification judgment is made;

[0074] Based on the connector offset measurement data and the qualified range of the connector offset inspection parameters, an offset qualification judgment is made, wherein the offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment;

[0075] If one or more of the results of the size acceptance judgment and the offset acceptance judgment are unacceptable, then the connector is determined to have poor contact.

[0076] In another aspect, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0077] Historical test data of the connector is obtained, and standard test parameter analysis is performed to obtain the qualified range of connector standard test parameters. The qualified range of connector standard test parameters includes the qualified range of connector size standard test parameters and the qualified range of connector offset standard test parameters.

[0078] The connector is measured to obtain connector size measurement data and connector offset measurement data;

[0079] Based on the connector size measurement data and the qualified range of the connector size inspection parameters, a size qualification judgment is made;

[0080] Based on the connector offset measurement data and the qualified range of the connector offset inspection parameters, an offset qualification judgment is made, wherein the offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment;

[0081] If one or more of the results of the size acceptance judgment and the offset acceptance judgment are unacceptable, then the connector is determined to have poor contact.

[0082] The aforementioned connector testing method, apparatus, computer equipment, and storage medium, through multi-faceted measurement of the connector and analysis of standard testing parameters based on historical testing data, combining two important dimensions—connector size and connector offset—can comprehensively capture problems caused by poor contact, reduce the probability of misjudgment, improve fault tolerance, and make the test results more accurate. Simultaneously, the pass / fail domain dynamically generated based on historical data can be adjusted according to different equipment batches and production conditions, further reducing the risk of misjudgment caused by static standards. Furthermore, it can effectively help identify the causes of poor contact failures, assist in locating the root cause of connector contact problems, and provide important evidence for troubleshooting. Attached Figure Description

[0083] Figure 1 This is a diagram illustrating the application environment of the connector detection method in one embodiment;

[0084] Figure 2 This is a flowchart illustrating a connector detection method in one embodiment;

[0085] Figure 3 This is a structural block diagram of a connector detection device in one embodiment;

[0086] Figure 4 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0087] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0088] This application provides a connector testing method that can be applied to, for example... Figure 1 In the application environment shown, terminal 102 communicates with server 104 via a network. The user sends a connector contact failure detection request to server 104 through terminal 102. Server 104, based on the connector detection method provided in this application, obtains connector measurement data measured by the corresponding connector measuring tool, and judges the connector contact failure according to the qualified range of pre-stored or real-time calculated connector standard inspection parameters, finally returning the judgment result to terminal 102. Terminal 102 can be, but is not limited to, various personal computers, laptops, smartphones, tablets, and portable wearable devices, and server 104 can be implemented using a standalone server or a server cluster consisting of multiple servers.

[0089] In one embodiment, such as Figure 2 As shown, a connector testing method is provided, which is applied to... Figure 1 Taking server 104 as an example, the following steps are included:

[0090] Step 201: Obtain the historical test data of the connector, perform standard test parameter analysis, and obtain the qualified range of the connector standard test parameters. The qualified range of the connector standard test parameters includes the qualified range of the connector size standard test parameters and the qualified range of the connector offset standard test parameters.

[0091] Connectors are important components in hardware devices designed based on the PCI Express (Peripheral Component Interconnect Express) standard, used to enable connections between devices. They typically include: gold fingers, slots, and pins (PIN pins).

[0092] Specifically, the connector includes at least one component, which corresponds to component size inspection parameters and component offset inspection parameters. Historical inspection data of the connector is acquired to obtain historical inspection data corresponding to the at least one component. Based on the historical inspection data corresponding to the at least one component, the acceptable range of the component size inspection parameters corresponding to the at least one component is obtained, thereby obtaining the acceptable range of the connector size inspection parameters. Based on correlation analysis, the correlation strength between the component offset inspection parameters and the component size inspection parameters corresponding to the at least one component is obtained. Combining the correlation strength between the component offset inspection parameters and the component size inspection parameters, the acceptable range of the component offset inspection parameters corresponding to the at least one component is obtained, thereby obtaining the acceptable range of the connector offset inspection parameters.

[0093] Step 202: Measure the connector to obtain connector size measurement data and connector offset measurement data.

[0094] Specifically, based on at least one component included in the connector, component size calibration parameters and component offset calibration parameters corresponding to the at least one component are obtained; based on the component size calibration parameters, a corresponding size measurement dimension is set; based on the component offset calibration parameters, a corresponding offset measurement dimension is set; based on the size measurement dimension and the offset measurement dimension, connector size measurement data and connector offset measurement data of the connector are obtained.

[0095] Step 203: Based on the connector size measurement data and the qualified range of the connector size inspection parameters, determine the size qualification.

[0096] Specifically, based on the connector size measurement data, the component size inspection parameter measurement value corresponding to the at least one component is obtained; the qualified range of the component size inspection parameter corresponding to the at least one component is obtained; in response to the component size inspection parameter measurement value corresponding to the at least one component being within the qualified range of the component size inspection parameter, the at least one component is a size qualified component; in response to all components in the connector being size qualified components, the result of the size qualification judgment is qualified, otherwise, the result of the size qualification judgment is unqualified.

[0097] Step 204: Based on the connector offset measurement data and the qualified range of the connector offset inspection parameters, perform an offset qualification judgment. The offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment.

[0098] Specifically, the component information of the connector is obtained, and it is determined whether there are multiple similar offsettable components. If no multiple similar offsettable components exist, the independent offset qualification judgment is performed. This independent offset qualification judgment includes: obtaining the component offset inspection parameter measurement value corresponding to the at least one component based on the connector offset measurement data; obtaining the component offset inspection parameter qualification field corresponding to the at least one component; if the component offset inspection parameter measurement value corresponding to the at least one component is within the component offset inspection parameter qualification field, then the at least one component is an independently offset qualified component; if all components in the connector are independently offset qualified components, then the offset qualification judgment result is qualified; if multiple similar offsettable components exist, the composite offset qualification judgment is performed, and the composite offset qualification judgment result is obtained; if the composite offset qualification judgment result is qualified, then the offset qualification judgment result is qualified; otherwise, the offset qualification judgment result is unqualified.

[0099] Step 205: If one or more of the results of the size qualification judgment and the offset qualification judgment are unqualified, then the connector is determined to have poor contact.

[0100] The aforementioned connector testing method, by performing multi-faceted measurements on the connector and analyzing standard testing parameters based on historical testing data, combines two important dimensions—connector size and connector offset—to comprehensively capture problems caused by poor contact, reducing the probability of misjudgment, improving fault tolerance, and making the test results more accurate. Simultaneously, the pass / fail domain dynamically generated based on historical data can be adjusted according to different equipment batches and production conditions, further reducing the risk of misjudgment caused by static standards. Furthermore, it can effectively help identify the causes of poor contact, assist in locating the root cause of connector contact problems, and provide important evidence for troubleshooting.

[0101] In one embodiment, the connector includes at least one component, the at least one component corresponding to component size inspection parameters and component offset inspection parameters. The step of acquiring historical inspection data of the connector, performing standard inspection parameter analysis, and obtaining the connector's inspection parameter pass range includes:

[0102] The historical inspection data of the connector is obtained to obtain the historical inspection data corresponding to the at least one component, wherein the historical inspection data corresponding to the at least one component includes: historical dataset of component size calibration parameters and historical dataset of component offset calibration parameters;

[0103] Based on the historical dataset of component size calibration parameters, the mean and standard deviation of the component size calibration parameters corresponding to the at least one component are calculated.

[0104] Based on the mean value and standard deviation of the component size inspection parameters, the tolerance range of the component size inspection parameters corresponding to the at least one component is obtained;

[0105] Based on the tolerance range of the component size inspection parameters, the qualified range of the component size inspection parameters of the at least one component is obtained, and then the qualified range of the connector size inspection parameters is obtained.

[0106] Based on the historical dataset of the component offset calibration parameters, the mean and standard deviation of the component offset calibration parameters corresponding to the at least one component are calculated.

[0107] Based on the historical dataset of the component offset calibration parameters, correlation analysis is performed to obtain the correlation strength between the component offset calibration parameters and the component size calibration parameters corresponding to the at least one component.

[0108] Based on the mean value and standard deviation of the component offset inspection parameters, and combined with the correlation strength between the component offset inspection parameters and the component size inspection parameters, the tolerance range of the component offset inspection parameters corresponding to the at least one component is obtained.

[0109] Based on the tolerance range of the component offset inspection parameters, the qualified range of the component offset inspection parameters corresponding to the at least one component is obtained, and then the qualified range of the connector offset inspection parameters is obtained.

[0110] Specifically, this embodiment effectively adjusts the tolerance range based on the mean and standard deviation calculated using historical data, combined with the correlation between size and offset parameters, to obtain a more accurate and reliable qualified range of standard inspection parameters, thereby improving the accuracy of detection. At the same time, it can optimize the qualified range of standard inspection parameters according to the actual situation of different equipment, avoiding overly lenient or overly strict settings, reducing the false judgment rate, and thus greatly improving the accuracy of connector contact failure detection, which is especially suitable for complex and highly variable production environments.

[0111] In one embodiment, the tolerance range of the component size calibration parameters for the at least one component is obtained based on the mean value and standard deviation of the component size calibration parameters, including:

[0112] Obtain the standard deviation of the component size calibration parameter and the standard deviation of the component offset calibration parameter corresponding to the at least one component;

[0113] Obtain the average values ​​of the component size calibration parameters and the average values ​​of the component offset calibration parameters corresponding to the at least one component;

[0114] Based on the mean value and standard deviation of the component size inspection parameters, the tolerance range of the component size inspection parameters corresponding to the at least one component is obtained, wherein the tolerance range of the component size inspection parameters is expressed as:

[0115]

[0116] in, This represents the tolerance range of the component size calibration parameters corresponding to the i-th component. This represents the standard deviation of the component size calibration parameter corresponding to the i-th component. This represents the average component size calibration parameter value corresponding to the i-th component;

[0117] Based on the mean and standard deviation of the component offset calibration parameters, and considering the correlation strength between the component offset calibration parameters and the component size calibration parameters, the tolerance range of the component offset calibration parameters for the at least one component is obtained, including:

[0118] Several historical samples are selected from the historical dataset of component size calibration parameters and the historical dataset of component offset calibration parameters, respectively;

[0119] Based on the aforementioned historical samples, and according to the standard deviation of the component size calibration parameters and the standard deviation of the component offset calibration parameters, the size offset correlation coefficient corresponding to the at least one component is calculated, wherein the size offset correlation coefficient is obtained based on the following formula:

[0120]

[0121] in, This represents the k-th historical sample of the component size calibration parameters corresponding to the i-th component. This represents the k-th historical sample of the component offset calibration parameters corresponding to the j-th component, where n represents the number of historical samples selected. This represents the dimensional offset correlation coefficient between the component dimension calibration parameters corresponding to the i-th component and the component offset calibration parameters corresponding to the j-th component. This represents the standard deviation of the component offset calibration parameter corresponding to the j-th component. This represents the mean of the component offset calibration parameters corresponding to the j-th component;

[0122] Obtain the dimensional offset correlation coefficient and generate a dynamic adjustment coefficient corresponding to the at least one component, wherein the dynamic adjustment coefficient is obtained based on the following formula:

[0123]

[0124] in, This represents the dynamic adjustment coefficient of the component offset calibration parameter corresponding to the j-th component. Indicates the adjustment factor. The absolute value of the dimensional offset correlation coefficient between the component size calibration parameter corresponding to the i-th component and the component offset calibration parameter corresponding to the j-th component is given, where m represents the number of component size calibration parameters.

[0125] Based on the mean and standard deviation of the component offset calibration parameters, and in conjunction with the dynamic adjustment coefficient, the tolerance range of the component offset calibration parameters corresponding to the at least one component is obtained, wherein the tolerance range of the component offset calibration parameters is expressed as follows: ,in, This represents the tolerance range of the component offset calibration parameters corresponding to the j-th component.

[0126] Specifically, this embodiment provides a specific calculation method for the tolerance range of the calibration parameters. By introducing correlation analysis and dynamic adjustment coefficients between size and offset parameters, the accuracy of the tolerance range of component offset calibration parameters can be further enhanced. This is beneficial in connectors with multiple components or complex structures where size and offset may affect each other. It avoids the limitation that the detection of a single parameter is insufficient to reflect the true state of the device, improves the ability to identify poor contact problems in complex devices, reduces misjudgments, and provides a more reliable basis in high-precision testing.

[0127] In one embodiment, the connector is measured to obtain connector size measurement data and connector offset measurement data, including:

[0128] Based on at least one component included in the connector, obtain the component size calibration parameters and component offset calibration parameters corresponding to the at least one component;

[0129] Based on the component size calibration parameters, set the corresponding size measurement dimensions;

[0130] Based on the component offset calibration parameters, set the corresponding offset measurement dimension;

[0131] Based on the size measurement dimension and the offset measurement dimension, select the corresponding measurement tool, measure and record the connector, and obtain the connector size measurement data and connector offset measurement data.

[0132] Specifically, this embodiment differs from traditional single measurement methods by combining different measurement dimensions and tools to perform comprehensive measurements according to the specific needs of the connector assembly. This ensures that potential contact problems are captured from multiple angles, significantly improving the efficiency and accuracy of fault diagnosis and providing strong support for subsequent automated processing and troubleshooting.

[0133] In one embodiment, based on the connector size measurement data and the connector size inspection parameter acceptance range, a size acceptance judgment is made, including:

[0134] Based on the connector size measurement data, component size measurement data corresponding to at least one component included in the connector is obtained;

[0135] Based on the component size calibration parameters corresponding to the at least one component, the component size measurement data is extracted to obtain the component size calibration parameter measurement values ​​corresponding to the at least one component;

[0136] Obtain the acceptable range of component size inspection parameters corresponding to the at least one component;

[0137] If the measured value of the component size inspection parameter corresponding to the at least one component is within the acceptable range of the component size inspection parameter, then the at least one component is a size-acceptable component.

[0138] If all components in the connector are dimensionally acceptable, the result of the dimension acceptance judgment is acceptable; otherwise, the result of the dimension acceptance judgment is unacceptable.

[0139] Specifically, this embodiment classifies and extracts component size measurement data, performs independent qualification judgments for different components, reduces the impact of redundant data on the judgment process, can quickly identify components with unqualified dimensions, avoids missing problematic components, and improves the efficiency of fault location.

[0140] In one embodiment, based on the connector offset measurement data and the acceptable range of the connector offset calibration parameters, an offset acceptance judgment is made, including:

[0141] Obtain the component information of the connector and determine whether there are multiple similar offset components;

[0142] In response to the absence of multiple similar offsettable components, the independent offset qualification judgment is performed, wherein the independent offset qualification judgment includes:

[0143] Based on the connector offset measurement data, component offset measurement data corresponding to at least one component included in the connector is obtained;

[0144] Based on the component offset calibration parameters corresponding to the at least one component, the component offset measurement data is extracted to obtain the component offset calibration parameter measurement values ​​corresponding to the at least one component;

[0145] Obtain the qualified field of the component offset inspection parameter corresponding to the at least one component;

[0146] If the measured value of the component offset calibration parameter corresponding to the at least one component is within the qualified range of the component offset calibration parameter, then the at least one component is an independent offset qualified component;

[0147] If all components in the connector are independently offset qualified components, the result of the offset qualification judgment is qualified; otherwise, the result of the offset qualification judgment is unqualified.

[0148] In response to the existence of multiple similar offsetable components, the composite offset qualification judgment is performed to obtain the composite offset qualification judgment result;

[0149] If the composite offset qualification judgment result is qualified, then the offset qualification judgment result is qualified; otherwise, the offset qualification judgment result is unqualified.

[0150] Specifically, this embodiment can effectively identify the offset problem of a single component by using independent offset qualification judgment, while using composite offset qualification judgment can consider the offset effect of multiple components and make a comprehensive judgment. By combining independent offset qualification judgment and composite offset qualification judgment, this application enhances the detection capability of multiple similar offset components, can more accurately identify contact problems caused by multiple offset components, improve the comprehensiveness and accuracy of detection, reduce the risk of missed detection, and provide a reliable basis for connector fault location.

[0151] In one embodiment, the offset calibration parameter qualification field includes a component superimposed offset qualification field. In response to the existence of multiple similar offsettable components, the composite offset qualification judgment is performed to obtain the composite offset qualification judgment result, including:

[0152] Based on the component information in the connector and the corresponding component offset measurement data, the independent offset judgment is performed on all components in the connector.

[0153] In response to any component in the connector being an independently qualified offset component, a judgment of superimposed offsets of the same type is performed, including:

[0154] Obtain the types of the multiple similar offsetable components, and classify and group the component offset measurement data according to the types of the multiple similar offsetable components to obtain a classification and grouping measurement form. The classification and grouping measurement form includes at least: component type, component number, and component offset inspection parameter measurement value.

[0155] The component offset calibration parameter measurement values ​​in the classification and grouping measurement form are calibrated for offset direction to obtain the component offset amount;

[0156] Based on the component type and the component number, the component offsets of the plurality of similar offsetable components are counted. Based on the component offset superposition formula, the superposition offset of the plurality of similar offsetable components of the same component type is calculated. The component offset superposition formula is as follows: ,in, This represents the offset of the component stacking for the j-th component type. This represents the component offset of the i-th component number of the j-th component type. This indicates the offset direction of the component offset of the i-th component number of the j-th component type. N represents the absolute value of the component offset of the i-th component number of the j-th component type, and N represents the number of multiple offsettable components of the same type of the j-th component type.

[0157] Based on the component stacking offset corresponding to the multiple similar offsetable components of the same component type, and in conjunction with the qualified component stacking offset field corresponding to the same component type, a comparison is made. If the component stacking offset is within the qualified component stacking offset field, then the multiple similar offsetable components of the same component type are determined to be qualified stacking offset components.

[0158] If all of the plurality of similar offsetable components in the connector are qualified components for superimposed offset, then the composite offset qualification result of the connector is qualified.

[0159] It is worth noting that, in one embodiment, the qualified domain of component superposition offset corresponding to the same component type can be obtained based on statistical analysis methods according to the qualified domain of component offset inspection parameters corresponding to the same type of offsetable components, including:

[0160] Obtain the qualified field of the component offset inspection parameter corresponding to the type of this type of offsetable component, denoted as ,in, express The tolerance range of the component offset calibration parameters corresponding to the offsettable component class. for Standard deviation of the component offset calibration parameter corresponding to the offsettable component class. for The average component offset calibration parameter corresponding to the class of offsetable components. express The dynamic adjustment coefficient of the component offset calibration parameter corresponding to the offsettable component;

[0161] according to The standard deviation of the component offset calibration parameter corresponding to the offsettable component is calculated based on the following formula. The standard deviation of the component offset calibration parameters corresponding to the offsettable component is as follows: ,in, express The standard deviation of the component offset calibration parameters corresponding to the offsettable component is added together. express The number of offsetable components in a class;

[0162] according to The component offset calibration parameters corresponding to the offset-type components are summed with their standard deviations, and represented using confidence intervals of a normal distribution. The component superposition offset qualification domain corresponding to the class of offsetable components is obtained, wherein the preferred confidence interval is 95%, i.e., a range of 2 standard deviations. The component stack offset qualification field corresponding to the offsetable component is denoted as: By analogy, the qualified offset field for component superposition of any type of offsetable component can be obtained, which can be used to judge the superposition of the same type of offset of offsetable components of the same type.

[0163] Specifically, this embodiment calculates the offset of components by superimposing the offsets, so that the offset effect of each component is fully considered. At the same time, by classifying and grouping measurements and using the offset superposition formula, the composite offset of multiple components can be effectively identified, avoiding misjudgments that may be caused by judging offsets individually. This not only improves the ability to identify poor contact problems caused by multiple components, but also improves the accuracy and stability of offset judgment, ensuring that the overall performance of the equipment is effectively guaranteed.

[0164] It is worth noting that, in one embodiment, the qualified range of connector inspection parameters obtained based on a connector testing method specifically includes: the qualified range for connector solder pin width, which is 0.22±0.03mm; the qualified range for connector pin width, which is 0.1-0.15mm; the qualified range for connector pin spring height alignment, which is 0-0.15mm; the qualified range for connector positioning post diameter, which is 0.1±0.03mm; the qualified range for the center distance between the connector positioning post and the motherboard positioning hole, which is 20.025±0.05mm; the qualified range for the width of the positioning hole to be connected to the connector, which is 1.76±0.03mm; the qualified range for gold finger offset alignment, which is 0-0.075mm; the qualified range for connector pad offset, which is 0.35±0.05mm; the qualified range for connector stamping end spring height alignment, which is 0-0.06mm; and the qualified range for finished connector spring height alignment, which is 0-0.15mm.

[0165] It should be understood that, although Figure 2 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 2 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0166] In one embodiment, such as Figure 3 As shown, a connector testing device is provided, including: a standard inspection parameter qualified field generation module, an equipment measurement module, a dimensional qualified judgment module, an offset qualified judgment module, and a poor contact judgment module, wherein:

[0167] The standard inspection parameter qualified field generation module is used to acquire the historical test data of the connector, perform standard test parameter analysis, and obtain the connector standard inspection parameter qualified field, wherein the connector standard inspection parameter qualified field includes the connector size standard inspection parameter qualified field and the connector offset standard inspection parameter qualified field.

[0168] The equipment measurement module is used to acquire connector size measurement data and connector offset measurement data of the connector;

[0169] The size conformity judgment module is used to judge the size conformity based on the connector size measurement data and the conformity range of the connector size standard inspection parameters;

[0170] The offset qualification judgment module is used to perform offset qualification judgment based on the connector offset measurement data and the qualified range of the connector offset inspection parameters. The offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment.

[0171] The poor contact judgment module is used to determine that the connector has poor contact if one or more of the results of the size qualification judgment and the offset qualification judgment are unqualified.

[0172] The calibration parameter pass-through domain generation module is further configured to acquire the connector's historical inspection data to obtain historical inspection data corresponding to the at least one component. The historical inspection data corresponding to the at least one component includes: a historical dataset of component size calibration parameters and a historical dataset of component offset calibration parameters. Based on the historical dataset of component size calibration parameters, the mean and standard deviation of the component size calibration parameters corresponding to the at least one component are calculated. Based on the mean and standard deviation of the component size calibration parameters, the tolerance range of the component size calibration parameters corresponding to the at least one component is obtained. Based on the tolerance range of the component size calibration parameters, the pass-through domain of the component size calibration parameters for the at least one component is obtained, thereby obtaining the pass-through domain of the connector size calibration parameters. Based on the historical dataset of component offset inspection parameters, the mean and standard deviation of the component offset inspection parameters corresponding to the at least one component are calculated. Based on the historical dataset of component offset inspection parameters, correlation analysis is performed to determine the correlation strength between the component offset inspection parameters and component size inspection parameters corresponding to the at least one component. Based on the mean and standard deviation of the component offset inspection parameters, combined with the correlation strength between the component offset inspection parameters and component size inspection parameters, the tolerance range of the component offset inspection parameters corresponding to the at least one component is obtained. Based on the tolerance range of the component offset inspection parameters, the qualified domain of the component offset inspection parameters corresponding to the at least one component is obtained, and thus the qualified domain of the connector offset inspection parameters is obtained.

[0173] The equipment measurement module is further configured to obtain component size inspection parameters and component offset inspection parameters corresponding to the at least one component included in the connector; set the corresponding size measurement dimension according to the component size inspection parameters; and set the corresponding offset measurement dimension according to the component offset inspection parameters.

[0174] Based on the size measurement dimension and the offset measurement dimension, select the corresponding measurement tool, measure and record the connector, and obtain the connector size measurement data and connector offset measurement data.

[0175] The size qualification judgment module is further configured to: obtain component size measurement data corresponding to at least one component included in the connector based on the connector size measurement data; extract the component size measurement data according to the component size inspection parameters corresponding to the at least one component to obtain the component size inspection parameter measurement value corresponding to the at least one component; obtain the qualified domain of the component size inspection parameters corresponding to the at least one component; if the component size inspection parameter measurement value corresponding to the at least one component is within the qualified domain of the component size inspection parameters, then the at least one component is a size qualified component; if all components in the connector are size qualified components, then the result of the size qualification judgment is qualified, otherwise, the result of the size qualification judgment is unqualified.

[0176] The offset qualification judgment module is further configured to acquire component information of the connector and determine whether there are multiple similar offsettable components; in response to the absence of multiple similar offsettable components, the independent offset qualification judgment is performed, wherein the independent offset qualification judgment includes: obtaining component offset measurement data corresponding to at least one component included in the connector based on the connector offset measurement data; extracting the component offset measurement data based on the component offset inspection parameter corresponding to the at least one component to obtain the component offset inspection parameter measurement value corresponding to the at least one component; acquiring the qualified domain of the component offset inspection parameter corresponding to the at least one component; in response to the component offset inspection parameter measurement value corresponding to the at least one component being within the qualified domain of the component offset inspection parameter, the at least one component is an independently qualified offset component; in response to all components in the connector being independently qualified offset components, the result of the offset qualification judgment is qualified, otherwise, the result of the offset qualification judgment is unqualified; in response to the presence of multiple similar offsettable components, the composite offset qualification judgment is performed to obtain the composite offset qualification judgment result; in response to the composite offset qualification judgment result being qualified, the result of the offset qualification judgment is qualified, otherwise, the result of the offset qualification judgment is unqualified.

[0177] Specific limitations regarding the connector testing device can be found in the limitations of the connector testing method described above, and will not be repeated here. Each module in the aforementioned connector testing device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in hardware or independently of the processor in a computer device, or stored in software in the memory of a computer device, so that the processor can call and execute the operations corresponding to each module.

[0178] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 4As shown, the computer device includes a processor, memory, network interface, and database connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and the database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database stores connector detection data. The network interface communicates with external terminals via a network connection. When executed by the processor, the computer program implements a connector detection method.

[0179] Those skilled in the art will understand that Figure 4 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0180] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to perform the following steps:

[0181] Historical test data of the connector is obtained, and standard test parameter analysis is performed to obtain the qualified range of connector standard test parameters. The qualified range of connector standard test parameters includes the qualified range of connector size standard test parameters and the qualified range of connector offset standard test parameters.

[0182] The connector is measured to obtain connector size measurement data and connector offset measurement data;

[0183] Based on the connector size measurement data and the qualified range of the connector size inspection parameters, a size qualification judgment is made;

[0184] Based on the connector offset measurement data and the qualified range of the connector offset inspection parameters, an offset qualification judgment is made, wherein the offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment;

[0185] If one or more of the results of the size acceptance judgment and the offset acceptance judgment are unacceptable, then the connector is determined to have poor contact.

[0186] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0187] Historical test data of the connector is obtained, and standard test parameter analysis is performed to obtain the qualified range of connector standard test parameters. The qualified range of connector standard test parameters includes the qualified range of connector size standard test parameters and the qualified range of connector offset standard test parameters.

[0188] The connector is measured to obtain connector size measurement data and connector offset measurement data;

[0189] Based on the connector size measurement data and the qualified range of the connector size inspection parameters, a size qualification judgment is made;

[0190] Based on the connector offset measurement data and the qualified range of the connector offset inspection parameters, an offset qualification judgment is made, wherein the offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment;

[0191] If one or more of the results of the size acceptance judgment and the offset acceptance judgment are unacceptable, then the connector is determined to have poor contact.

[0192] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0193] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0194] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A connector testing method, characterized in that, The method includes: The process involves acquiring historical testing data of the connector, performing standard testing parameter analysis, and obtaining the qualified domains of the connector's standard testing parameters. These qualified domains include a qualified domain for connector size standard testing parameters and a qualified domain for connector offset standard testing parameters. The connector includes at least one component, and each component corresponds to component size standard testing parameters and component offset standard testing parameters. The acquisition of historical testing data and the analysis of standard testing parameters to obtain the qualified domains of the connector's standard testing parameters include: acquiring the historical testing data of the connector to obtain historical testing data corresponding to the at least one component, wherein the historical testing data corresponding to the at least one component includes: a historical dataset of component size standard testing parameters and a historical dataset of component offset standard testing parameters; calculating the mean and standard deviation of the component size standard testing parameters corresponding to the at least one component based on the historical dataset of component size standard testing parameters; and obtaining the qualified domains of the at least one component based on the mean and standard deviation of the component size standard testing parameters. The tolerance range of component size inspection parameters corresponding to the component is determined. Based on the tolerance range of component size inspection parameters, the qualified domain of component size inspection parameters for the at least one component is obtained, and then the qualified domain of connector size inspection parameters is obtained. Based on the historical dataset of component offset inspection parameters, the mean and standard deviation of component offset inspection parameters corresponding to the at least one component are calculated. Based on the historical dataset of component offset inspection parameters, the correlation strength between the component offset inspection parameters and component size inspection parameters corresponding to the at least one component is obtained through correlation analysis. Based on the mean and standard deviation of component offset inspection parameters, combined with the correlation strength between component offset inspection parameters and component size inspection parameters, the tolerance range of component offset inspection parameters corresponding to the at least one component is obtained. Based on the tolerance range of component offset inspection parameters, the qualified domain of component offset inspection parameters corresponding to the at least one component is obtained, and then the qualified domain of connector offset inspection parameters is obtained. The connector is measured to obtain connector size measurement data and connector offset measurement data; Based on the connector size measurement data and the qualified range of the connector size inspection parameters, a size qualification judgment is made; Based on the connector offset measurement data and the qualified range of the connector offset inspection parameters, an offset qualification judgment is made, wherein the offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment; If one or more of the results of the size acceptance judgment and the offset acceptance judgment are unacceptable, then the connector is determined to have poor contact.

2. The connector testing method according to claim 1, characterized in that, Based on the mean and standard deviation of the component size calibration parameters, the tolerance range of the component size calibration parameters corresponding to the at least one component is obtained, including: Obtain the standard deviation of the component size calibration parameter and the standard deviation of the component offset calibration parameter corresponding to the at least one component; Obtain the average values ​​of the component size calibration parameters and the average values ​​of the component offset calibration parameters corresponding to the at least one component; Based on the mean value and standard deviation of the component size inspection parameters, the tolerance range of the component size inspection parameters corresponding to the at least one component is obtained, wherein the tolerance range of the component size inspection parameters is expressed as: ； in, This represents the tolerance range of the component size calibration parameters corresponding to the i-th component. This represents the standard deviation of the component size calibration parameter corresponding to the i-th component. This represents the average component size calibration parameter value corresponding to the i-th component; Based on the mean and standard deviation of the component offset calibration parameters, and considering the correlation strength between the component offset calibration parameters and the component size calibration parameters, the tolerance range of the component offset calibration parameters for the at least one component is obtained, including: Several historical samples are selected from the historical dataset of component size calibration parameters and the historical dataset of component offset calibration parameters, respectively; Based on the aforementioned historical samples, and according to the standard deviation of the component size calibration parameters and the standard deviation of the component offset calibration parameters, the size offset correlation coefficient corresponding to the at least one component is calculated, wherein the size offset correlation coefficient is obtained based on the following formula: ； in, This represents the k-th historical sample of the component size calibration parameters corresponding to the i-th component. This represents the k-th historical sample of the component offset calibration parameters corresponding to the j-th component, where n represents the number of historical samples selected. This represents the dimensional offset correlation coefficient between the component dimension calibration parameters corresponding to the i-th component and the component offset calibration parameters corresponding to the j-th component. This represents the standard deviation of the component offset calibration parameter corresponding to the j-th component. This represents the mean of the component offset calibration parameters corresponding to the j-th component; Obtain the dimensional offset correlation coefficient and generate a dynamic adjustment coefficient corresponding to the at least one component, wherein the dynamic adjustment coefficient is obtained based on the following formula: ； in, This represents the dynamic adjustment coefficient of the component offset calibration parameter corresponding to the j-th component. Indicates the adjustment factor. The absolute value of the dimensional offset correlation coefficient between the component size calibration parameter corresponding to the i-th component and the component offset calibration parameter corresponding to the j-th component is given, where m represents the number of component size calibration parameters. Based on the mean and standard deviation of the component offset calibration parameters, and in conjunction with the dynamic adjustment coefficient, the tolerance range of the component offset calibration parameters corresponding to the at least one component is obtained, wherein the tolerance range of the component offset calibration parameters is expressed as follows: ； in, This represents the tolerance range of the component offset calibration parameters corresponding to the j-th component.

3. The connector testing method according to claim 1, characterized in that, The connector is measured to obtain connector size measurement data and connector offset measurement data, including: Based on at least one component included in the connector, obtain the component size calibration parameters and component offset calibration parameters corresponding to the at least one component; Based on the component size calibration parameters, set the corresponding size measurement dimensions; Based on the component offset calibration parameters, set the corresponding offset measurement dimension; Based on the size measurement dimension and the offset measurement dimension, select the corresponding measurement tool, measure and record the connector, and obtain the connector size measurement data and connector offset measurement data.

4. The connector testing method according to claim 1, characterized in that, Based on the connector size measurement data and the acceptable range of the connector size inspection parameters, a size acceptance judgment is made, including: Based on the connector size measurement data, component size measurement data corresponding to at least one component included in the connector is obtained; Based on the component size calibration parameters corresponding to the at least one component, the component size measurement data is extracted to obtain the component size calibration parameter measurement values ​​corresponding to the at least one component; Obtain the acceptable range of component size inspection parameters corresponding to the at least one component; If the measured value of the component size inspection parameter corresponding to the at least one component is within the acceptable range of the component size inspection parameter, then the at least one component is a size-acceptable component. If all components in the connector are dimensionally acceptable, the result of the dimension acceptance judgment is acceptable; otherwise, the result of the dimension acceptance judgment is unacceptable.

5. The connector testing method according to claim 1, characterized in that, Based on the connector offset measurement data and the acceptable range of the connector offset inspection parameters, an offset acceptance judgment is made, including: Obtain the component information of the connector and determine whether there are multiple similar offset components; In response to the absence of multiple similar offsettable components, the independent offset qualification judgment is performed, wherein the independent offset qualification judgment includes: Based on the connector offset measurement data, component offset measurement data corresponding to at least one component included in the connector is obtained; Based on the component offset calibration parameters corresponding to the at least one component, the component offset measurement data is extracted to obtain the component offset calibration parameter measurement values ​​corresponding to the at least one component; Obtain the qualified field of the component offset inspection parameter corresponding to the at least one component; If the measured value of the component offset calibration parameter corresponding to the at least one component is within the qualified range of the component offset calibration parameter, then the at least one component is an independent offset qualified component; If all components in the connector are independently offset qualified components, the result of the offset qualification judgment is qualified; otherwise, the result of the offset qualification judgment is unqualified. In response to the existence of multiple similar offsetable components, the composite offset qualification judgment is performed to obtain the composite offset qualification judgment result; If the composite offset qualification judgment result is qualified, then the offset qualification judgment result is qualified; otherwise, the offset qualification judgment result is unqualified.

6. The connector testing method according to claim 5, characterized in that, The offset calibration parameter qualification field includes a component superimposed offset qualification field. In response to the existence of multiple similar offsettable components, the composite offset qualification judgment is performed to obtain the composite offset qualification judgment result, including: Based on the component information in the connector and the corresponding component offset measurement data, the independent offset judgment is performed on all components in the connector. In response to any component in the connector being an independently qualified offset component, a judgment of superimposed offsets of the same type is performed, including: Obtain the types of the multiple similar offsetable components, and classify and group the component offset measurement data according to the types of the multiple similar offsetable components to obtain a classification and grouping measurement form. The classification and grouping measurement form includes at least: component type, component number, and component offset inspection parameter measurement value. The component offset calibration parameter measurement values ​​in the classification and grouping measurement form are calibrated for offset direction to obtain the component offset amount; Based on the component type and the component number, the component offsets of the plurality of similar offsetable components are counted. Based on the component offset superposition formula, the superposition offset of the plurality of similar offsetable components of the same component type is calculated. The component offset superposition formula is as follows: ； in, This represents the offset of the component stacking for the j-th component type. This represents the component offset of the i-th component number of the j-th component type. This indicates the offset direction of the component offset of the i-th component number of the j-th component type. N represents the absolute value of the component offset of the i-th component number of the j-th component type, and N represents the number of multiple offsettable components of the same type of the j-th component type. Based on the component stacking offset corresponding to the multiple similar offsetable components of the same component type, and in conjunction with the qualified component stacking offset field corresponding to the same component type, a comparison is made. If the component stacking offset is within the qualified component stacking offset field, then the multiple similar offsetable components of the same component type are determined to be qualified stacking offset components. If all of the plurality of similar offsetable components in the connector are qualified components for superimposed offset, then the composite offset qualification result of the connector is qualified.

7. A connector testing device, characterized in that, The apparatus for implementing the method as described in any one of claims 1-6 comprises: The standard inspection parameter qualified field generation module is used to acquire the historical test data of the connector, perform standard test parameter analysis, and obtain the connector standard inspection parameter qualified field, wherein the connector standard inspection parameter qualified field includes the connector size standard inspection parameter qualified field and the connector offset standard inspection parameter qualified field. The equipment measurement module is used to acquire connector size measurement data and connector offset measurement data of the connector; The size conformity judgment module is used to judge the size conformity based on the connector size measurement data and the conformity range of the connector size standard inspection parameters; The offset qualification judgment module is used to perform offset qualification judgment based on the connector offset measurement data and the qualified range of the connector offset inspection parameters. The offset qualification judgment includes at least one of the following: independent offset qualification judgment and composite offset qualification judgment. The poor contact judgment module is used to determine that the connector has poor contact if one or more of the results of the size qualification judgment and the offset qualification judgment are unqualified.

8. A computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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