发光单元及其制备方法、显示面板、显示装置
By designing a structure in the light-emitting unit that connects through trenches and insulating layers to the electrodes, the problem of low yield in vertical LED fabrication was solved, achieving uniform current distribution and good heat dissipation, thus improving fabrication efficiency and cost-effectiveness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2023-07-18
- Publication Date
- 2026-07-17
AI Technical Summary
The low yield of vertical LEDs in existing technologies is mainly due to stress mismatch damage to the epitaxial layer during laser lift-off.
A light-emitting unit structure was designed, including a substrate, an epitaxial layer, a through trench, an insulating layer, and a conductive layer. The substrate is exposed through the through trench, eliminating the need for laser lift-off, achieving vertical current distribution and good heat dissipation. The insulating layer and vias are used to connect the electrodes to ensure reliable current transmission.
This improved the fabrication yield of light-emitting units, achieved uniform current distribution and heat dissipation in vertical LEDs, and eliminated the step of laser substrate lift-off, thus reducing fabrication costs.
Smart Images
Figure CN119654988B_ABST