A desoldering device for magnetic element processing

Abstract

The application discloses a film removing and soldering device for magnetic element processing, which comprises a processing table, a mounting frame arranged above the processing table, a moving mechanism arranged on the inner top of the mounting frame, a movable mounting plate driven by the moving mechanism, a first electric telescopic rod connecting the bottom of the mounting plate with a positioning plate, three sets of clamping mechanisms arranged on the bottom of the positioning plate, first sliding blocks connected with the top of the clamping mechanisms on the two sides, the first sliding blocks moving in the sliding grooves of the positioning plate, a first lead screw mechanism connected with a first driving motor at one end, an element conveying mechanism arranged on the top of the processing table and matched with the clamping mechanisms, and a film removing device arranged on one side of the element conveying mechanism. The film removing and soldering device for magnetic element processing solves the problem that a protective film may be left on the surface of the existing magnetic element, and the film hinders the welding process. The film removing device is arranged on one side of the element conveying mechanism.

Description

Technical Field

[0001] This invention relates to the field of magnetic component technology, specifically to a device for removing solder coating during magnetic component processing. Background Technology

[0002] Magnetic components typically consist of windings and magnetic cores and are an important part of power electronics technology. They are mainly used for energy storage, energy conversion, and electrical isolation. Magnetic components mainly include two categories: transformers and inductors, and are widely used in various power supply circuits.

[0003] A search revealed that existing technology, such as announcement number CN205110994U, includes a linear automatic soldering device, comprising a frame and a conveying mechanism fixedly mounted on the frame. The conveying mechanism is further provided with a feeding mechanism and a linear positioning mechanism. The frame is also sequentially provided with a first soldering station, a second soldering station, and a material discharge mechanism. Both the first and second soldering stations include a flux mechanism and a solder pot fixedly mounted on one side of the linear positioning mechanism. The solder pot is also provided with high-temperature adhesive protection. The linear positioning mechanism is also provided with a soldering mechanism, which drives the soldering mechanism to sequentially pass through the first and second soldering stations to complete a double soldering process.

[0004] In summary, existing soldering equipment saves manpower, time, and reduces labor intensity. However, a protective film may remain on the surface of existing magnetic components. This film can hinder the soldering process, affecting the fluidity and wettability of the solder, thus leading to problems such as weak soldering and poor contact. Therefore, a film-removing soldering device for processing magnetic components is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a solder removal device for processing magnetic components, in order to solve the problem mentioned in the background art that a protective film may remain on the surface of existing magnetic components. This film can act as an obstacle during the soldering process, affecting the fluidity and wettability of the solder, thereby leading to weak soldering and poor contact.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a solder stripping device for processing magnetic components, comprising a processing table, a mounting frame disposed above the processing table, and a moving mechanism disposed on the top inner side of the mounting frame, the moving mechanism driving a mounting plate to move, and the bottom of the mounting plate being connected to a positioning plate via a first electric telescopic rod, the bottom of the positioning plate being fitted with three sets of clamping mechanisms, and the tops of the clamping mechanisms on both sides being connected to a first slider, the first slider moving within a groove in the positioning plate, and the first slider being connected to a first lead screw mechanism rotatably disposed within the groove, one end of the first lead screw mechanism being connected to a first drive motor, a component conveying mechanism cooperating with the clamping mechanism being disposed on the top of the processing table, and a solder stripping device disposed on one side of the component conveying mechanism. The film removal device includes a collection tank, inside which a filter plate is installed. A fan is installed at the bottom of the filter plate, and a mounting box is installed at the top of the filter plate. A second drive motor is installed on the outside of the mounting box, and the second drive motor can drive a worm gear installed inside the mounting box to rotate. The worm gear meshes with a worm wheel, and the worm wheel is installed on the outside of a first drive rod. A drive wheel is installed on the outside of the first drive rod, and the drive wheel can drive two other sets of driven wheels to rotate via a transmission belt. The driven wheels are installed on the outside of a second rotating rod, and one end of the second rotating rod extends through to the outside of the mounting box and connects to the film removal roller. A flux tank mechanism is provided on one side of the film removal device, and a solder pot mechanism and a component placement plate mechanism are installed on one side of the flux tank mechanism. Component cooling mechanisms are provided on both sides of the component placement plate mechanism.

[0007] Preferably, the moving mechanism includes a moving groove, and a driving block is provided at the top of the moving groove. The top of the driving block is connected to the second slider, and the second slider moves in a slider groove opened at the top of the inner side of the mounting frame. A second electric telescopic rod is provided inside the slider groove to drive the second slider to move. An electric screw mechanism is rotatably provided inside the moving groove, and the electric screw mechanism can drive the third slider to move. The bottom of the third slider is connected to the top of the mounting plate.

[0008] The above technical solution facilitates the movement of the driving components.

[0009] Preferably, two sets of limiting blocks are symmetrically arranged on the top of the movable groove, and the limiting blocks are slidably connected to the limiting rods arranged on the top inner side of the mounting frame.

[0010] The above technical solution improves the stability of the moving trough during movement.

[0011] Preferably, the clamping mechanism includes a mounting groove, and a bidirectional lead screw mechanism is rotatably arranged inside the mounting groove. One end of the bidirectional lead screw mechanism is connected to a third drive motor, and the outer side of the bidirectional lead screw mechanism is connected to two sets of symmetrically arranged positioning blocks. The bottom of the positioning blocks is connected to the clamping plate through a connecting rod.

[0012] The above technical solution facilitates the clamping of components.

[0013] Preferably, the positioning block is slidably connected to the inside of the mounting groove.

[0014] The above technical solution facilitates the movement of the positioning block.

[0015] Preferably, the component conveying mechanism includes a conveyor belt mechanism, and the conveyor belt mechanism is installed inside two sets of fixed plates, with a baffle installed between the top of one end of the two sets of fixed plates.

[0016] The above technical solution facilitates the transportation of components.

[0017] Preferably, a pressure pump is provided on the outer side of the flux tank mechanism.

[0018] The above technical solution facilitates soldering operations.

[0019] Preferably, the component cooling mechanism includes a blower, and the air outlet of the blower is connected to the cooling box through a first conveying pipe. The air outlet of the cooling box is connected to a uniform air distribution plate symmetrically arranged on the top of the component placement plate mechanism through a second conveying pipe, and several sets of air jets are installed on the inner side of the uniform air distribution plate.

[0020] The above technical solution facilitates faster component cooling.

[0021] Preferably, the cooling box is equipped with a cooler, and a cooling pipe is connected to one side of the cooler.

[0022] The above technical solution facilitates the cooling of the cooling box.

[0023] Compared with the prior art, the beneficial effects of the present invention are: the desoldering apparatus for processing magnetic components,

[0024] (1) To address the issue that a protective film may remain on the surface of existing magnetic components, which can hinder soldering and affect its flowability and wettability, leading to weak soldering and poor contact, this device incorporates a film removal device on one side of the component conveying mechanism. This device includes a collection tank containing a filter plate. A fan is installed at the bottom of the filter plate, and a mounting box is located at the top. A second drive motor is installed on the outside of the mounting box, driving a worm gear inside the mounting box to rotate. The worm gear meshes with the first drive rod and is mounted on the outside of the first drive rod. A drive wheel is set on the outside of the first drive rod, and the drive wheel can drive two other sets of driven wheels to rotate via a transmission belt. The driven wheels are mounted on the outside of the second rotating rod, and one end of the second rotating rod passes through to the outside of the mounting box and is connected to the film removal roller. In use, the clamping mechanism clamps the components conveyed on the component conveying mechanism, the moving mechanism drives the clamped components to move, and the second drive motor can drive the film removal roller to rotate, thereby polishing and removing the film on the surface of the component. After cleaning, the component is then soldered.

[0025] (2) In order to solve the problem of slow cooling after component soldering, this device provides a component cooling mechanism on both sides of the component placement board mechanism. The component cooling mechanism includes a blower, and the air outlet of the blower is connected to the cooling box through the first conveying pipe. The air outlet of the cooling box is connected to the air distribution plate symmetrically arranged on the top of the component placement board mechanism through the second conveying pipe. Several sets of air jets are installed on the inner side of the air distribution plate. The cooling box can cool the air blown out by the blower. The cooling air is sprayed out through the air jets to accelerate the cooling of the soldered components. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall front cross-sectional structure of the present invention;

[0027] Figure 2 For the present invention Figure 1 Enlarged structural diagram at point A in the middle;

[0028] Figure 3 This is a schematic diagram of the overall top cross-sectional structure of the present invention;

[0029] Figure 4 This is a schematic diagram of the connection relationship of the driving blocks in this invention;

[0030] Figure 5 This is a schematic diagram of the clamping mechanism of the present invention;

[0031] Figure 6 This is a schematic diagram showing the positional relationship between the clamping mechanism and the positioning plate of the present invention;

[0032] Figure 7 This is a schematic diagram of the component conveying mechanism of the present invention;

[0033] Figure 8 This is a schematic diagram of the membrane removal device of the present invention;

[0034] Figure 9 This is a schematic diagram of the internal structure of the cooling box of the present invention.

[0035] In the diagram: 1. Processing table; 101. Mounting frame; 2. Moving mechanism; 201. Moving groove; 2011. Limiting block; 2012. Limiting rod; 202. Driving block; 203. Second slider; 204. Second electric telescopic rod; 205. Electric lead screw mechanism; 206. Third slider; 3. Mounting plate; 301. First electric telescopic rod; 302. Positioning plate; 4. Clamping mechanism; 401. Mounting groove; 402. Bidirectional lead screw mechanism; 403. Third drive motor; 404. Positioning block; 405. Clamping plate; 5. First slider; 501. First lead screw mechanism; 502. First drive motor; 6. Component conveying mechanism; 601. Conveyor belt mechanism; 602. Fixing plate 603. Baffle; 7. Film removal device; 701. Collection tank; 702. Filter plate; 703. Exhaust fan; 704. Mounting box; 705. Second drive motor; 706. Worm gear; 7061. Worm wheel; 7062. First drive rod; 7063. Drive wheel; 7064. Transmission belt; 7065. Driven wheel; 707. Second rotating rod; 708. Film removal roller; 8. Flux tank mechanism; 801. Pressure pump; 9. Solder pot mechanism; 10. Component placement plate mechanism; 11. Component cooling mechanism; 111. Blower; 112. Cooling box; 1121. Refrigerator; 1122. Refrigeration pipe; 113. Second conveying pipe; 114. Air distribution plate; 115. Jet nozzle. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Please see Figure 1-9 The present invention provides a technical solution: a solder removal device for processing magnetic components, wherein a mounting frame 101 is provided above the processing table 1, and a moving mechanism 2 is installed on the top inner side of the mounting frame 101. The moving mechanism 2 can drive the mounting plate 3 to move, and the bottom of the mounting plate 3 is connected to the positioning plate 302 through a first electric telescopic rod 301.

[0038] Specifically, the moving mechanism 2 includes a moving groove 201, and a driving block 202 is provided at the top of the moving groove 201. The top of the driving block 202 is connected to the second slider 203, and the second slider 203 moves in the slider groove opened at the top of the inner side of the mounting bracket 101. A second electric telescopic rod 204 is provided inside the slider groove to drive the second slider 203 to move. Later, the second electric telescopic rod 204 can drive the second slider 203 and the moving groove 201 to move longitudinally, thereby changing the position of the component. An electric screw mechanism 205 is rotatably provided inside the moving groove 201, and the electric screw mechanism 205 can drive the third slider 206 to move. The bottom of the third slider 206 is connected to the top of the mounting plate 3, and later, the electric screw mechanism 205 can drive the component to move laterally.

[0039] In a further embodiment, two sets of limiting blocks 2011 are symmetrically arranged on the top of the moving groove 201, and the limiting blocks 2011 are slidably connected to the limiting rod 2012 arranged on the top inner side of the mounting bracket 101. Through the above operation, the moving direction of the moving groove 201 can be further limited, thereby improving the stability of the moving groove 201 when it moves.

[0040] Specifically, three sets of clamping mechanisms 4 are installed at the bottom of the positioning plate 302, and the tops of the clamping mechanisms 4 on both sides are connected to the first slider 5. The first slider 5 moves within the groove opened in the positioning plate 302, and is connected to the first lead screw mechanism 501 rotatably arranged within the groove. One end of the first lead screw mechanism 501 is connected to the first drive motor 502, which drives the first lead screw mechanism 501 to rotate, thereby moving the first slider 5 and displacing the clamping mechanisms 4 on both sides. This creates a certain gap between the three clamped components, facilitating subsequent film removal and soldering operations. The clamping mechanism 4 includes a mounting groove 401, and a bidirectional lead screw is rotatably arranged inside the mounting groove 401. Mechanism 402, one end of the bidirectional lead screw mechanism 402 is connected to the third drive motor 403, and the outer side of the bidirectional lead screw mechanism 402 is connected to two sets of symmetrically arranged positioning blocks 404. The bottom of the positioning block 404 is connected to the clamping plate 405 through the connecting rod. The positioning block 404 is slidably connected to the inside of the mounting groove 401. In use, the clamping mechanism 4 is moved to the top of the component by the moving mechanism 2. After the movement is completed, the first electric telescopic rod 301 is activated to drive the clamping mechanism 4 to move down. When the clamping plate 405 moves to both sides of the component, the third drive motor 403 is activated. The third drive motor 403 drives the two sets of clamping plates 405 to move closer and closer through the bidirectional lead screw mechanism 402, thereby clamping the component through the clamping plate 405.

[0041] Specifically, the top of the processing table 1 is equipped with a component conveying mechanism 6 that works in conjunction with the clamping mechanism 4. The component conveying mechanism 6 includes a conveyor belt mechanism 601, which is installed inside two sets of fixed plates 602. A baffle 603 is installed between the top of one end of the two sets of fixed plates 602. The conveyor belt mechanism 601 can convey components above it, and the baffle 603 can limit the conveyed components.

[0042] Specifically, a film removal device 7 is provided on one side of the component conveying mechanism 6. The film removal device 7 includes a collection tank 701, which can collect impurities from the grinding process during film removal. A filter plate 702 is installed inside the collection tank 701 to filter impurities from the grinding process. An exhaust fan 703 is installed at the bottom of the filter plate 702 to guide dust-laden impurities into the collection tank 701. A mounting box 704 is provided on the top of the filter plate 702. A second drive motor 705 is installed on the outside of the mounting box 704. The second drive motor 705 can drive the worm gear 706 installed inside the mounting box 704 to rotate. The worm gear 706 meshes with a worm wheel 7061, and the worm wheel 7061 is installed on the outside of the first drive rod 7062. A drive wheel is provided on the outside of the first drive rod 7062. 7063, and the driving wheel 7063 can drive the other two sets of driven wheels 7065 to rotate through the transmission belt 7064. The driven wheels 7065 are installed on the outside of the second rotating rod 707, and one end of the second rotating rod 707 passes through to the outside of the mounting box 704 and is connected to the film removal roller 708. In use, the clamping mechanism 4 clamps the components conveyed on the component conveying mechanism 6, and the moving mechanism 2 drives the clamped components to move. The second drive motor 705 is turned on. The second drive motor 705 can drive the worm wheel 7061 and the first drive rod 7062 to rotate through the worm 706. The first drive rod 7062 drives the driving wheel 7063 to rotate synchronously, thereby driving the driven wheels 7065 and the second rotating rod 707 to rotate through the transmission belt 7064, so that the film removal roller 708 rotates and polishes and removes the film from the components.

[0043] Specifically, a flux bath mechanism 8 is provided on one side of the film removal device 7, and a solder pot mechanism 9 and a component placement board mechanism 10 are installed on one side of the flux bath mechanism 8. Component cooling mechanisms 11 are provided on both sides of the component placement board mechanism 10.

[0044] In a further embodiment, a pressure pump 801 is provided on one side of the flux tank mechanism 8. After the film removal is completed, the moving mechanism 2 drives the clamped component to move sequentially to the flux tank mechanism 8 and the solder pot mechanism 9 for soldering operation.

[0045] Specifically, the component cooling mechanism 11 includes a blower 111, and the air outlet of the blower 111 is connected to the cooling box 112 through a first delivery pipe. The cooling box 112 is equipped with a cooler 1121, and a cooling pipe 1122 is connected to one side of the cooler 1121. The air outlet of the cooling box 112 is connected to a uniform air plate 114 symmetrically arranged on the top of the component placement plate mechanism 10 through a second delivery pipe 113, and several sets of jet nozzles 115 are installed on the inner side of the uniform air plate 114.

[0046] When in use, turn on the cooler 1121 and the blower 111. The cooler 1121 can cool the inside of the cooling box 112, thereby cooling the air blown out by the blower 111 through the cooling box 112. The cooling air is sprayed out through the jet nozzle 115 to accelerate the cooling of the solder components.

[0047] The terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of the present invention.

[0048] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A device for removing solder coating during the processing of magnetic components, comprising a processing table (1), characterized in that: A mounting frame (101) is provided above the processing table (1), and a moving mechanism (2) is installed on the top inner side of the mounting frame (101). The moving mechanism (2) can drive the mounting plate (3) to move. The bottom of the mounting plate (3) is connected to the positioning plate (302) through the first electric telescopic rod (301). The bottom of the positioning plate (302) is equipped with three sets of clamping mechanisms (4), and the top of the clamping mechanisms (4) on both sides is connected to the first slider (5). The clamping mechanism (4) includes a mounting groove (401), and a bidirectional screw mechanism (402) is rotatably arranged inside the mounting groove (401). One end of the bidirectional screw mechanism (402) is connected to the third drive motor (403), and the outside of the bidirectional screw mechanism (402) is connected to two symmetrically arranged positioning blocks (404). The bottom of the positioning block (404) is connected to the clamping plate (405) through the connecting rod. The positioning block (404) is slidably connected to the inside of the mounting groove (401). The first slider (5) moves in the groove opened in the positioning plate (302), and the first slider (5) is connected to the first lead screw mechanism (501) rotatably arranged in the groove. One end of the first lead screw mechanism (501) is connected to the first drive motor (502). The top of the processing table (1) is equipped with a component conveying mechanism (6) that works with the clamping mechanism (4), and a film removal device (7) is provided on one side of the component conveying mechanism (6). The membrane removal device (7) includes a collection tank (701), and a filter plate (702) is installed inside the collection tank (701). A fan (703) is installed at the bottom of the filter plate (702), and a mounting box (704) is provided at the top of the filter plate (702). A second drive motor (705) is installed on the outside of the mounting box (704), and the second drive motor (705) can drive the worm (706) installed inside the mounting box (704) to rotate. The worm (706) meshes with a worm wheel (7061), and the worm wheel (7061) is installed on the outside of a first drive rod (7062). A drive wheel (…) is provided on the outside of the first drive rod (7062). 7063), and the driving wheel (7063) can drive two other sets of driven wheels (7065) to rotate through the transmission belt (7064). The driven wheels (7065) are installed on the outside of the second rotating rod (707), and one end of the second rotating rod (707) passes through to the outside of the mounting box (704) and is connected to the film removal roller (708). A flux tank mechanism (8) is provided on one side of the film removal device (7), and a solder pot mechanism (9) and a component placement plate mechanism (10) are installed on one side of the flux tank mechanism (8). A pressure pump (801) is provided on the outside of the flux tank mechanism (8), and a component cooling mechanism (11) is provided on both sides of the component placement plate mechanism (10).

2. The device for removing solder coating for processing magnetic components according to claim 1, characterized in that: The moving mechanism (2) includes a moving groove (201), and a driving block (202) is provided on the top of the moving groove (201). The top of the driving block (202) is connected to the second slider (203), and the second slider (203) moves in the slider groove opened on the top of the inner side of the mounting frame (101). A second electric telescopic rod (204) is provided inside the slider groove to drive the second slider (203) to move. An electric screw mechanism (205) is rotatably provided inside the moving groove (201), and the electric screw mechanism (205) can drive the third slider (206) to move. The bottom of the third slider (206) is connected to the top of the mounting plate (3).

3. The device for removing solder coating for processing magnetic components according to claim 2, characterized in that: Two sets of limiting blocks (2011) are symmetrically arranged on the top of the moving slot (201), and the limiting blocks (2011) are slidably connected to the limiting rod (2012) arranged on the top inner side of the mounting frame (101).

4. The device for removing solder coating for processing magnetic components according to claim 1, characterized in that: The component conveying mechanism (6) includes a conveyor belt mechanism (601), and the conveyor belt mechanism (601) is installed inside two sets of fixed plates (602), and a baffle (603) is installed between the top of one end of the two sets of fixed plates (602).

5. The device for removing solder coating for processing magnetic components according to claim 1, characterized in that: The component cooling mechanism (11) includes a blower (111), and the air outlet of the blower (111) is connected to the cooling box (112) through a first conveying pipe. The air outlet of the cooling box (112) is connected to the top of the component placement plate mechanism (10) symmetrically arranged with a uniform air plate (114) through a second conveying pipe (113). Several sets of jet nozzles (115) are installed on the inner side of the uniform air plate (114).

6. The device for removing solder coating for processing magnetic components according to claim 5, characterized in that: The cooling box (112) is equipped with a cooler (1121), and a cooling pipe (1122) is connected to one side of the cooler (1121).

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