Simulated structure of road void disease and simulated production method

CN119666546BActive Publication Date: 2026-03-03TSINGHUA UNIVERSITY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2026-03-03

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Abstract

This application relates to a simulation structure and method for simulating road void defects. By breaking up the target void area in the intermediate structural layer, a void-filling layer and a control joint are laid in the target void area. Solvent is introduced into the target void area through the control joint to dissolve the void-filling layer, thereby forming a void defect in the target void area to simulate the void defect phenomenon in actual roads. The measurement results are more accurate, and the void formation time is faster. By changing the area and depth of the target void area, pressure can be applied to void defects of different degrees, thereby simulating the road load-bearing capacity under different degrees of voidness. By accurately reproducing the formation of void defects, the mechanical properties and stability of roads under different degrees of defects can be analyzed in depth, providing a reference for maintenance and repair, optimizing the allocation of maintenance resources and funds, improving maintenance efficiency and quality, reducing maintenance costs, and improving road traffic safety.
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Citation Information

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