Hot-melt conductive adhesive suitable for electrode membrane and battery separation state and electrode membrane module
CN119684926AInactive Publication Date: 2025-03-25SHANGHAI HIUV NEW MATERIALS CO LTD +1
Patent Information
- Application Number
- CN202311231049.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-22
- Publication Date
- 2025-03-25
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
The invention relates to the technical field of photovoltaic electrodes, and particularly discloses a hot-melt conductive adhesive suitable for an electrode film and a battery separation state and an electrode film module. In particular to a conductive adhesive which not only can be converted between a liquid state and a solid state, but also has no viscosity under a solid state condition and has viscosity under a molten state condition. The conductive adhesive contains at least one type of epoxy resin, so that the epoxy resin can present a non-viscous solid state at normal temperature, and after the epoxy resin is dissolved by a solvent, a latent curing agent is added, so that the epoxy resin in the liquid state can be convenient for construction and gluing operation; and after being dried, the product is in a non-viscous solid state. Afterwards, before the electrode film is combined with the battery, the conductive adhesive is in a viscous molten state at a high temperature to be bonded with the battery, and then the latent curing agent also acts at the high temperature, so that the epoxy resin of the conductive adhesive is cured and crosslinked, the bonding force of the epoxy resin is enhanced, and the viscosity of the epoxy resin is maintained after the epoxy resin is dried.
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Citation Information
Patent Citations
Epoxy hot melt adhesive and preparation method thereof
CN111363509A