Epoxy resin dual-curing adhesive, preparation method and application thereof

Abstract

The application provides an epoxy resin dual-curing adhesive as well as a preparation method and application thereof, and the epoxy resin dual-curing adhesive comprises the following components: long-chain flexible acrylic acid modified epoxy resin, a second epoxy resin, a cationic photo initiator and a photosensitizer; the raw material of the long-chain flexible acrylic acid modified epoxy resin comprises long-chain flexible acrylic acid and a first epoxy resin; the long-chain flexible acrylic acid comprises an acrylic acid derivative with a main chain carbon atom number of 8 or more. The long-chain flexible acrylic acid modified epoxy resin is used for chain extension and toughening, an unsaturated double bond is introduced, and then the epoxy resin is added, so that the initial bonding force of the adhesive is improved; the cationic ring-opening epoxy group and UV radical dual-curing are used, and the shear strength and peeling force of the adhesive are improved after UV irradiation, so that the toughness of the epoxy resin is significantly improved.

Description

Technical Field

[0001] This invention belongs to the field of adhesive technology, and relates to an epoxy resin dual-curing adhesive, its preparation method and application, specifically an epoxy resin dual-curing adhesive based on long-chain flexible acrylic acid modification, its preparation method and application. Background Technology

[0002] An adhesive is an inorganic or organic material that can firmly bond two or more materials together. It primarily achieves its bonding effect through the formation of chemical bonds and van der Waals forces at the interface. Epoxy resin is a common adhesive, widely used in various fields due to its excellent bond strength, chemical resistance, and good mechanical properties. However, the curing process of epoxy resin typically requires high temperatures and long times, which limits its use in certain applications. Furthermore, epoxy resin is relatively brittle and prone to fracture under high stress conditions.

[0003] To improve the brittleness and curing efficiency of epoxy resins, researchers have proposed various solutions. For example, adding toughening agents such as polyurethane and acrylates can increase the toughness of epoxy resins. In addition, some researchers have explored blending epoxy resins with other polymers such as polyester resins and polyimides to enhance their overall performance.

[0004] While existing solutions can improve the performance of epoxy resins to some extent, several problems remain. First, while adding toughening agents can improve the toughness of epoxy resins, it often reduces their bond strength and chemical resistance. Second, although blending modification can impart new functions to epoxy resins, it may affect their original properties, and the compatibility and stability of the blends are difficult to control.

[0005] Therefore, how to develop an epoxy resin adhesive that can maintain the original properties of epoxy resin while improving its toughness and curing efficiency is an urgent problem to be solved in this field. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide an epoxy resin dual-curing adhesive, its preparation method, and its application, specifically providing an epoxy resin dual-curing adhesive based on long-chain flexible acrylic acid modification, its preparation method, and its application.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] In a first aspect, the present invention provides an epoxy resin dual-curing adhesive, the epoxy resin dual-curing adhesive comprising the following components: long-chain flexible acrylic modified epoxy resin, a second epoxy resin, a cationic photoinitiator, and a photosensitizer;

[0009] The raw materials for preparing the long-chain flexible acrylic modified epoxy resin include long-chain flexible acrylic acid and a first epoxy resin.

[0010] The long-chain flexible acrylic acid includes acrylic acid derivatives with a main chain carbon number of 8 or more (e.g., 8, 9, 10, 12, 14, 16, etc.).

[0011] This invention improves the initial adhesive strength of an adhesive by using long-chain flexible acrylic acid to modify epoxy resin for chain extension and toughening, introducing unsaturated double bonds, and then adding epoxy resin. It employs cationic ring-opening epoxy groups and UV free radical dual curing, which enhances the shear strength and peel strength of the adhesive after UV irradiation, thus significantly improving the toughness of the epoxy resin. The invention utilizes UV curing technology, leveraging the effects of cationic photoinitiators and photosensitizers to rapidly cure the epoxy resin under UV irradiation, thereby greatly improving the curing efficiency of the epoxy resin. Furthermore, the invention first modifies the epoxy resin with long-chain flexible acrylic acid before adding additional epoxy resin, improving the compatibility and stability of the system.

[0012] In other words, by using UV curing technology and adding long-chain flexible acrylic and epoxy resin, this invention achieves the effects of improved initial adhesion and enhanced shear strength and peel strength after UV irradiation, thereby improving the performance of epoxy resin while reducing the curing cost of epoxy resin.

[0013] Preferably, the long-chain flexible acrylic acid comprises any one or a combination of at least two of 2-((3-(acryloyloxy)propoxy)carbonyl)-1-methylcyclohexane-1-carboxylic acid, (E)-4-(2-(acryloyloxy)ethoxy)-4-oxobut-2-enoic acid, and 2-(((6-(acryloyloxy)-6-oxohexyl)oxy)carbonyl)benzoic acid.

[0014] The structural formula of 2-((3-(acryloyloxy)propoxy)carbonyl)-1-methylcyclohexane-1-carboxylic acid is as follows:

[0015]

[0016] The structural formula of (E)-4-(2-(acryloyloxy)ethoxy)-4-oxobut-2-enoic acid is as follows:

[0017]

[0018] The structural formula of 2-(((6-(acryloyloxy)-6-oxohexyl)oxy)carbonyl)benzoic acid is as follows:

[0019]

[0020] Preferably, the first epoxy resin comprises bisphenol A epoxy resin and / or bisphenol F epoxy resin.

[0021] Preferably, the long-chain flexible acrylic-modified epoxy resin is prepared by the following method:

[0022] Long-chain flexible acrylic acid and a first epoxy resin are mixed and reacted to obtain the long-chain flexible acrylic acid modified epoxy resin.

[0023] Preferably, the mass ratio of the long-chain flexible acrylic acid to the first epoxy resin is 1:(1.5-2.5), for example, 1:1.5, 1:1.6, 1:1.7, 1:1.8, 1:1.9, 1:2, 1:2.1, 1:2.2, 1:2.3, 1:2.4, 1:2.5, etc.

[0024] Preferably, the reaction is carried out in the presence of a catalyst.

[0025] Preferably, the catalyst comprises triphenylphosphine.

[0026] Preferably, the amount of catalyst used is 0.3%-0.8% of the total weight of long-chain flexible acrylic acid and the first epoxy resin, such as 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, etc.

[0027] Preferably, the reaction temperature is 60-150℃, such as 60℃, 70℃, 80℃, 90℃, 100℃, 110℃, 120℃, 130℃, 140℃, 150℃, etc., and the reaction time is 1-3 hours, such as 1 hour, 2 hours, 3 hours, etc.

[0028] Preferably, the second epoxy resin comprises an aliphatic epoxy resin.

[0029] Preferably, the second epoxy resin comprises 3,4-epoxycyclohexylcarboxylic acid-3',4'-epoxycyclohexylmethyl ester.

[0030] Preferably, the cationic photoinitiator includes any one or a combination of at least two of Omnicat 250, Omnicat 432, or Omnicat 1176.

[0031] Preferably, the photosensitizer includes photoinitiator 184 (Irgacure 184).

[0032] Preferably, the epoxy resin dual-curing adhesive comprises the following components by weight:

[0033]

[0034] Preferably, the amount of long-chain flexible acrylic modified epoxy resin in the epoxy resin dual-curing adhesive can be 40 parts, 42 parts, 44 parts, 46 parts, 48 ​​parts, 50 parts, 52 parts, 54 parts, 56 parts, 58 parts, 60 parts, etc., by weight.

[0035] Preferably, the amount of the second epoxy resin in the epoxy resin dual-curing adhesive can be 80 parts, 82 parts, 84 parts, 86 parts, 88 parts, 90 parts, 92 parts, 94 parts, 96 parts, 98 parts, 100 parts, 102 parts, 104 parts, 106 parts, 108 parts, 110 parts, 112 parts, 114 parts, 116 parts, 118 parts, 120 parts, etc., by weight.

[0036] Preferably, the amount of cationic photoinitiator in the epoxy resin dual-curing adhesive can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part, etc., by weight.

[0037] Preferably, the amount of photosensitizer in the epoxy resin dual-curing adhesive can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part, etc., by weight.

[0038] In a second aspect, the present invention provides a method for preparing an epoxy resin dual-curing adhesive as described in the first aspect, the method comprising the following steps:

[0039] Long-chain flexible acrylic modified epoxy resin is mixed with a second epoxy resin, then a cationic photoinitiator and a photosensitizer are added, and the mixture is mixed again to obtain the epoxy resin dual-curing adhesive.

[0040] Thirdly, the present invention provides a bonding method for the epoxy resin dual-curing adhesive as described in the first aspect, the bonding method comprising the following steps:

[0041] An epoxy resin dual-curing adhesive is coated onto a substrate, and then cured by irradiation with a UV light source to complete the bonding.

[0042] Preferably, the power of the UV light source is 450-550W, such as 450W, 460W, 470W, 480W, 490W, 500W, 510W, 520W, 530W, 540W, 550W, etc.

[0043] Preferably, the irradiation time is 1-2 minutes, such as 1 minute, 1.5 minutes, 2 minutes, etc.

[0044] Preferably, the curing temperature is 55-65℃, such as 55℃, 58℃, 60℃, 62℃, 63℃, 65℃, etc.

[0045] In summary, to address the problems in the existing technology, the main technical means employed in this invention are as follows: 1. Chain extension and toughening using long-chain flexible acrylic modified epoxy resin: First, long-chain flexible acrylic resin is mixed with epoxy resin, and unsaturated double bonds are introduced through a chemical reaction, thereby increasing the flexibility of the epoxy resin and improving its fracture resistance. 2. Addition of epoxy resin: An appropriate amount of epoxy resin is added to the modified epoxy resin to enhance the initial adhesion. 3. Dual curing using cationic ring-opening epoxy groups and UV free radicals: Cationic photoinitiators and photosensitizers are added to the mixture, and UV light source is used for irradiation, causing the epoxy groups to undergo cationic ring-opening reactions, while simultaneously initiating free radical polymerization reactions, thereby improving shear strength and peel strength after UV irradiation. 4. Control of curing temperature and time: By adjusting the power of the UV light source and the irradiation time, the curing temperature and time of the epoxy resin are controlled, improving curing efficiency and shortening the curing cycle. 5. Select appropriate photosensitizers and photoinitiators: Choosing suitable photosensitizers and photoinitiators can ensure the effectiveness of UV curing while reducing the generation of harmful ultraviolet radiation and lowering curing costs. 6. Optimize the blending ratio: By optimizing the blending ratio of long-chain flexible acrylic modified epoxy resin, epoxy resin, photosensitizer, and photoinitiator, the compatibility and stability of the epoxy resin can be improved.

[0046] Fourthly, the present invention provides the application of the epoxy resin dual-curing adhesive as described in the first aspect in adhesives or sealants.

[0047] The epoxy resin dual-curing adhesive provided by this invention has wide applications in the fields of adhesives and sealants, composite materials, and polymer chemistry. In the field of adhesives and sealants, this invention provides a novel epoxy resin adhesive that not only maintains the excellent bonding strength, chemical resistance, and good mechanical properties of epoxy resin, but also significantly improves its toughness by introducing long-chain flexible acrylic modified epoxy resin for chain extension and toughening, enabling it to better adapt to high-stress environments and meet the needs of various industrial applications. Simultaneously, by employing cationic ring-opening epoxy groups and UV free radical dual curing, it not only greatly shortens the curing time and improves production efficiency, but also avoids the problems of high temperatures and long curing times required in traditional epoxy resin curing processes, reducing energy consumption and resulting in significant economic benefits. In the field of composite materials, the epoxy resin adhesive provided by this invention can be used as a matrix material to be compounded with other reinforcing materials such as carbon fiber and glass fiber to prepare high-performance composite materials. Because the epoxy resin adhesive of this invention possesses excellent adhesive and mechanical properties, it can effectively transfer loads, improve the strength and toughness of composite materials, and meet the demand for high-performance composite materials in aerospace, automotive manufacturing, wind power generation, and other fields. In the field of polymer chemistry, this invention provides a novel method for synthesizing epoxy resin. It involves introducing long-chain flexible acrylic modified epoxy resin for chain extension and toughening, followed by the addition of epoxy resin, and employing cationic ring-opening epoxy groups and UV free radical dual curing to achieve epoxy resin modification. This synthesis method is not only simple to operate and has mild reaction conditions, but also allows for precise control of the reaction process, improving product quality. Therefore, the adhesive provided by this invention has significant application value in the field of polymer chemistry and is expected to promote the research and application of epoxy resins and related materials. In summary, the adhesive provided by this invention has broad application prospects in the fields of adhesives and sealants, composite materials, and polymer chemistry, with huge market demand, and is expected to drive technological progress and industrial development in related fields.

[0048] Compared with the prior art, the present invention has at least the following beneficial effects:

[0049] (1) This invention uses long-chain flexible acrylic modified epoxy resin for chain extension and toughening, introduces unsaturated double bonds, and then adds epoxy resin. It adopts cationic ring-opening epoxy groups and UV free radical dual curing. This design not only maintains the original bonding strength and chemical corrosion resistance of epoxy resin, but also improves the toughness and curing efficiency of epoxy resin by introducing long-chain flexible acrylic and double bonds.

[0050] (2) The curing process of the present invention does not require high temperature and long time, but only UV irradiation, which greatly shortens the curing time and improves production efficiency. At the same time, due to the use of UV curing and free radical curing dual curing, the use of expensive UV light source equipment is avoided, and harmful ultraviolet radiation is reduced, making it more environmentally friendly and safer.

[0051] (3) The blending modification method of the present invention first modifies the epoxy resin with long-chain flexible acrylic acid, and then adds epoxy resin in addition. This not only gives the epoxy resin new functions, but also maintains its original properties. Moreover, by optimizing the compatibility and stability of the blend, the overall performance of the blend is improved.

[0052] (4) The adhesive of the present invention has significantly improved initial adhesive force and shear strength and peel strength after UV irradiation, indicating that the epoxy resin adhesive of the present invention has better adhesive performance and durability.

[0053] (5) The epoxy resin dual-curing adhesive of the present invention has a simple preparation process, readily available raw materials, low cost, and is suitable for large-scale production.

[0054] In summary, compared with the prior art, the present invention not only improves the toughness and curing efficiency of epoxy resin, but also maintains its original properties, is more environmentally friendly and safer, has higher bonding performance and durability, and has a simple preparation process, low cost, and is suitable for large-scale production, thus having significant advantages. Detailed Implementation

[0055] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0056] Preparation Example 1

[0057] This preparation example provides a long-chain flexible acrylic-modified epoxy resin, the preparation method of which includes the following steps:

[0058] Long-chain flexible acrylic acid and epoxy resin, along with a catalyst (triphenylphosphine), were mixed and reacted at 90°C for 3 hours to obtain the long-chain flexible acrylic acid modified epoxy resin.

[0059] The long-chain flexible acrylic acid is 2-((3-(acryloyloxy)propoxy)carbonyl)-1-methylcyclohexane-1-carboxylic acid, the epoxy resin is bisphenol A epoxy resin (128 epoxy resin), the mass ratio of long-chain flexible acrylic acid to epoxy resin is 1:2, and the amount of catalyst is 0.5% of the total weight of long-chain flexible acrylic acid and epoxy resin.

[0060] Preparation Example 2

[0061] This preparation example provides a long-chain flexible acrylic-modified epoxy resin, the preparation method of which includes the following steps:

[0062] Long-chain flexible acrylic acid and epoxy resin, along with a catalyst (triphenylphosphine), were mixed and reacted at 100°C for 2 hours to obtain the long-chain flexible acrylic acid modified epoxy resin.

[0063] The long-chain flexible acrylic acid is (E)-4-(2-(acryloyloxy)ethoxy)-4-oxobut-2-enoic acid, the epoxy resin is bisphenol A epoxy resin (128 epoxy resin), the mass ratio of long-chain flexible acrylic acid to epoxy resin is 1:1.5, and the amount of catalyst is 0.5% of the total weight of long-chain flexible acrylic acid and epoxy resin.

[0064] Preparation Example 3

[0065] This preparation example provides a long-chain flexible acrylic-modified epoxy resin, the preparation method of which includes the following steps:

[0066] Long-chain flexible acrylic acid and epoxy resin, along with a catalyst (triphenylphosphine), were mixed and reacted at 100°C for 2 hours to obtain the long-chain flexible acrylic acid modified epoxy resin.

[0067] The long-chain flexible acrylic acid is 2-(3-(acryloyloxy)propoxy)carbonyl)-1-methylcyclohexane-1-carboxylic acid, the epoxy resin is bisphenol F epoxy resin (NPEF-170), the mass ratio of long-chain flexible acrylic acid to epoxy resin is 1:2.5, and the amount of catalyst is 0.5% of the total weight of long-chain flexible acrylic acid and epoxy resin.

[0068] Comparative Preparation Example 1

[0069] This comparative preparation example provides an acrylic-modified epoxy resin, which differs from Preparation Example 1 only in that the long-chain flexible acrylic acid is replaced with an equal weight of acrylic acid.

[0070] Example 1

[0071] This embodiment provides an epoxy resin dual-curing adhesive, which comprises the following components by weight:

[0072]

[0073] The long-chain flexible acrylic modified epoxy resin was provided by Preparation Example 1. The epoxy resin was 3,4-epoxycyclohexylcarboxylic acid-3',4'-epoxycyclohexylmethyl ester, the cationic photoinitiator was Omnicat 250, and the photosensitizer was Irgacure 184.

[0074] The preparation method includes the following steps:

[0075] The long-chain flexible acrylic modified epoxy resin and epoxy resin are mixed in the prescribed amount, and then a cationic photoinitiator and a photosensitizer are added and mixed again to obtain the epoxy resin dual-curing adhesive.

[0076] Example 2

[0077] This embodiment provides an epoxy resin dual-curing adhesive, which comprises the following components by weight:

[0078]

[0079] In this example, the long-chain flexible acrylic modified epoxy resin was provided by Preparation Example 2. The epoxy resin was 3,4-epoxycyclohexylcarboxylic acid-3',4'-epoxycyclohexylmethyl ester, the cationic photoinitiator was Omnicat 432, and the photosensitizer was Irgacure 184.

[0080] The preparation method is the same as in Example 1.

[0081] Example 3

[0082] This embodiment provides an epoxy resin dual-curing adhesive, which comprises the following components by weight:

[0083]

[0084] In this example, the long-chain flexible acrylic modified epoxy resin was provided by Preparation Example 3. The epoxy resin was 3,4-epoxycyclohexylcarboxylic acid-3',4'-epoxycyclohexylmethyl ester, the cationic photoinitiator was Qitai 1176, and the photosensitizer was Irgacure 184.

[0085] The preparation method is the same as in Example 1.

[0086] Example 4

[0087] This embodiment provides an epoxy resin dual-curing adhesive, which comprises the following components by weight:

[0088]

[0089] The long-chain flexible acrylic modified epoxy resin was provided by Preparation Example 1. The epoxy resin was 3,4-epoxycyclohexylcarboxylic acid-3',4'-epoxycyclohexylmethyl ester, the cationic photoinitiator was Omnicat 432, and the photosensitizer was Irgacure 184.

[0090] The preparation method is the same as in Example 1.

[0091] Comparative Example 1

[0092] The only difference between this comparative example and Example 1 is that the long-chain flexible acrylic modified epoxy resin is replaced with the acrylic modified epoxy resin provided in Comparative Preparation Example 1.

[0093] Comparative Example 2

[0094] The only difference between this comparative example and Example 1 is that the amount of long-chain flexible acrylic modified epoxy resin used is 30 parts.

[0095] Comparative Example 3

[0096] The only difference between this comparative example and Example 1 is that the amount of long-chain flexible acrylic modified epoxy resin used is 70 parts.

[0097] The epoxy resin dual-curing adhesives provided in the examples and comparative examples were tested using the following methods:

[0098] (1) Initial adhesion: According to GBT 2792-1998, the epoxy resin dual-curing adhesive provided in the examples and comparative examples was applied to a PET film with a thickness of 50μm using a laboratory applicator, so that the film thickness was 30μm. The 25.4mm wide and 250mm long tape was bonded to the cleaned aluminum test plate. The test plate was moved back and forth 3 times with a pressure roller at a speed of 300mm / min under its own weight. After standing for 20 minutes, the 180° peel force test was performed at a test speed of 300mm / min.

[0099] (2) Opening time: Sensory evaluation, it takes a lot of force to tear the tape by hand, and the time required from when the tape is attached to the aluminum plate to when it is difficult to tear.

[0100] (3) Final shear strength: After UVB irradiation, the aluminum plate is bonded within 2 minutes. According to GB / T33332-2016, the tape sample is placed at the center of one end of the test aluminum plate. Without applying pressure, the tape sample is evenly rolled and bonded within an area of ​​(12±0.5)mm×(12±0.5)mm by the weight of the roller itself. The coating thickness is 30μm, the substrate is 50μm transparent PET, and the back of the tape is fixed with Debon 2020 structural adhesive (fixed in the middle with copper wire (diameter 2μm) to form a certain thickness). The test speed is 5mm / min.

[0101] (4) Final peel strength: According to GB / T 2792-1998, the epoxy resin dual-curing adhesives provided in the examples and comparative examples were applied to a 50 μm thick PET film using a laboratory coater, resulting in a film thickness of 30 μm. Then, a 365nm LED UV curing machine was used at 2000 mJ / cm². 2The adhesive tape (25.4mm × 200mm) was irradiated with energy, and within 1 minute, the irradiated tape was adhered to an aluminum plate (30mm × 120mm). The resulting laminate was then placed at 23°C, and its reaction rate was tested using infrared spectroscopy. After the reaction was complete, the 180° peel strength was tested.

[0102] The performance test results are shown in Table 1.

[0103] Table 1

[0104]

[0105]

[0106] As can be seen from Table 1, the epoxy resin dual-curing adhesives provided in the embodiments of the present invention all have high initial adhesion (5.6-8.2 N / 25 mm), and after UV curing, they all have high shear strength (9.8-12.4 MPa) and peel strength (18.6-22.7 N / 25 mm).

[0107] Compared with Example 1, the epoxy resin dual-curing adhesive provided in Comparative Example 1 uses conventional acrylic modified epoxy resin, and the adhesive has insufficient adhesion to the surface of the substrate, resulting in low peel force and shear strength. The epoxy resin dual-curing adhesive provided in Comparative Example 2 uses a small amount of long-chain flexible acrylic modified epoxy resin, which results in insufficient wetting of the aluminum plate surface of the backing substrate, leading to insufficient peel force and shear strength. The epoxy resin dual-curing adhesive provided in Comparative Example 3 uses a large amount of long-chain flexible acrylic modified epoxy resin, resulting in insufficient cohesion of the adhesive layer and a decrease in shear strength.

[0108] The applicant declares that this invention illustrates the epoxy resin dual-curing adhesive, its preparation method, and its application through the above embodiments. However, this invention is not limited to the above embodiments, meaning that this invention does not necessarily rely on the above embodiments for implementation. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of the raw materials in the product, additions of auxiliary components, and selection of specific methods all fall within the protection and disclosure scope of this invention.

Claims

1. An epoxy resin dual-curing adhesive, characterized in that, The epoxy resin dual-curing adhesive comprises the following components by weight: 40-60 parts of long-chain flexible acrylic modified epoxy resin; 80-120 parts of the second epoxy resin; 0.1-1 part of cationic photoinitiator; 0.1-1 part photosensitizer; The raw materials for preparing the long-chain flexible acrylic modified epoxy resin include long-chain flexible acrylic acid and a first epoxy resin. The long-chain flexible acrylic acid includes any one or a combination of at least two of the following: 2-((3-(acryloyloxy)propoxy)carbonyl)-1-methylcyclohexane-1-carboxylic acid, (E)-4-(2-(acryloyloxy)ethoxy)-4-oxobut-2-enoic acid, and 2-(((6-(acryloyloxy)-6-oxohexyl)oxy)carbonyl)benzoic acid; The first epoxy resin includes bisphenol A epoxy resin and / or bisphenol F epoxy resin; The second epoxy resin includes 3,4-epoxycyclohexylcarboxylic acid-3',4'-epoxycyclohexylmethyl ester.

2. The epoxy resin dual-curing adhesive according to claim 1, characterized in that, The long-chain flexible acrylic-modified epoxy resin is prepared by the following method: Long-chain flexible acrylic acid and a first epoxy resin are mixed and reacted to obtain the long-chain flexible acrylic acid modified epoxy resin.

3. The epoxy resin dual-curing adhesive according to claim 2, characterized in that, The mass ratio of the long-chain flexible acrylic acid to the first epoxy resin is 1:(1.5-2.5).

4. The epoxy resin dual-curing adhesive according to claim 2, characterized in that, The reaction is carried out in the presence of a catalyst.

5. The epoxy resin dual-curing adhesive according to claim 4, characterized in that, The catalyst includes triphenylphosphine.

6. The epoxy resin dual-curing adhesive according to claim 4, characterized in that, The amount of catalyst used is 0.3%-0.8% of the total weight of long-chain flexible acrylic acid and the first epoxy resin.

7. The epoxy resin dual-curing adhesive according to claim 2, characterized in that, The reaction temperature is 60-150℃, and the reaction time is 1-3 hours.

8. The epoxy resin dual-curing adhesive according to claim 1, characterized in that, The cationic photoinitiator includes any one or a combination of at least two of Omnicat 250, Omnicat 432, or Qitai 1176.

9. The epoxy resin dual-curing adhesive according to claim 1, characterized in that, The photosensitizer includes photoinitiator 184.

10. A method for preparing an epoxy resin dual-curing adhesive as described in any one of claims 1-9, characterized in that, The preparation method includes the following steps: Long-chain flexible acrylic modified epoxy resin is mixed with a second epoxy resin, then a cationic photoinitiator and a photosensitizer are added, and the mixture is mixed again to obtain the epoxy resin dual-curing adhesive.

11. A bonding method for an epoxy resin dual-curing adhesive as described in any one of claims 1-9, characterized in that, The bonding method includes the following steps: An epoxy resin dual-curing adhesive is coated onto a substrate, and then cured by irradiation with a UV light source to complete the bonding.

12. The bonding method according to claim 11, characterized in that, The power of the UV light source is 450-550W.

13. The bonding method according to claim 11, characterized in that, The irradiation time is 1-2 minutes.

14. The bonding method according to claim 11, characterized in that, The curing temperature is 55-65℃.

15. The use of an epoxy resin dual-curing adhesive as described in any one of claims 1-9 in an adhesive or sealant.

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