A method for preparing high-quality reinforced process metal heat-conducting gaskets

Abstract

This invention discloses a high-quality preparation method for enhanced metal thermal pads, relating to the field of metal thermal pad preparation technology. The method includes the following specific steps: Raw material preparation: providing a metal thermal pad substrate, the shape and size of which are selected according to actual needs; Ion implantation pretreatment: selecting ions that have good adhesion to the metal pad material and can enhance etching selectivity. This invention uses focused ion beam technology to perform high-precision processing on the surface of the metal thermal pad, enabling precise control of surface roughness, especially in critical areas in contact with other components, significantly reducing surface roughness, thereby greatly increasing the thermal contact area and improving heat transfer efficiency. This precise surface treatment not only optimizes the heat transfer path but also reduces resistance during heat transfer, allowing the metal thermal pad to function more efficiently in the heat dissipation system and significantly improving overall heat dissipation performance.

Description

Technical Field

[0001] This invention relates to the field of metal thermal pad preparation technology, specifically to a high-quality preparation method for a reinforced metal thermal pad. Background Technology

[0002] In modern industry and high-tech fields, such as electronic equipment, high-power electrical equipment, aerospace and new energy vehicles, efficient heat dissipation solutions are the core elements to ensure stable operation and extend service life of equipment. As an indispensable key component in the heat dissipation system, metal thermal pads undertake the important task of transferring heat from the heat source to the heat dissipation device. Their thermal conductivity and thermal contact performance are directly related to the efficiency of the entire heat dissipation system and the reliability of the equipment.

[0003] Traditional methods for manufacturing metal thermal pads, such as machining, chemical etching, or electroplating, can meet basic heat dissipation requirements to a certain extent. However, with technological advancements and stricter industry standards, these methods have gradually revealed numerous shortcomings. First, these methods struggle to precisely control the surface roughness of the metal thermal pads during manufacturing, resulting in limited thermal contact area and heat transfer efficiency. Second, traditional manufacturing methods lack precision when processing specific thermal contact performance areas, making it difficult to meet the growing demand for personalized heat dissipation. Furthermore, traditional methods also suffer from high energy consumption and significant environmental pollution, hindering sustainable development.

[0004] Focused ion beam (FIB) is a high-precision processing technology with broad application prospects in the field of micro-nano manufacturing. However, traditional techniques for processing metal thermal pads using FIB have several obvious drawbacks. First, the lack of an ion implantation pretreatment step tailored to the material characteristics of the metal thermal pad makes it difficult to precisely control the etching depth and shape during the etching process. Second, traditional methods fail to fully leverage the advantages of FIB in local fine processing, making it impossible to achieve customized roughness in different areas. Third, traditional techniques lack precise control over surface roughness and thermal contact performance during processing, resulting in the performance and quality of the final product failing to meet the requirements of high-end applications. Therefore, there is an urgent need for a novel enhanced process for the high-quality preparation of metal thermal pads to improve their performance and quality. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a high-quality preparation method for enhanced metal thermal pads. This method utilizes focused ion beam technology to achieve high-precision processing of the surface of the metal thermal pad, thereby improving its thermal contact performance and thermal conductivity. Through ion implantation pretreatment, etching selectivity is enhanced, and etching depth and shape are better controlled. High-precision milling and etching using focused ion beams can precisely control surface roughness to meet specific thermal contact requirements. At the same time, this method can also perform fine processing in local areas requiring specific thermal contact performance, thereby improving the stability and reliability of thermal contact performance.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a method for preparing high-quality metal thermal pads with enhanced processing, the method comprising the following specific steps:

[0007] Raw material preparation: Provide metal thermal pad bases; the shape and size of the bases can be selected according to actual needs.

[0008] Ion implantation pretreatment: Ions with good adhesion to the metal pad material and which can enhance etching selectivity are selected and ion implanted into the metal pad to better control the etching depth and shape during the processing.

[0009] Focused Ion Beam Machining: This process utilizes a focused ion beam to perform high-precision milling and preliminary etching on the surface of a metal thermal pad. By controlling the parameters of the focused ion beam, regions with different roughnesses are formed on the metal surface. In critical areas where the metal pad contacts other components, the location and extent are determined through heat dissipation system design analysis and heat flow simulation. During machining, the surface roughness is reduced through precise machining using the focused ion beam. A spiral scanning technique is employed for local fine scanning, and a high-resolution surface roughness measuring instrument is used to measure the surface roughness in real time. Based on the measurement results, the ion beam parameters and scanning mode are finely adjusted until the surface roughness of the critical areas meets the requirements. In non-contact critical areas, adjustments are made according to specific functional requirements. Specific machining targets are determined through heat conduction analysis and heat dissipation requirement assessment. The etching depth and scanning parameters are adjusted by controlling the focused ion beam etching time and beam current density. An electron microscope is used to observe the microstructure and assess whether the functional requirements are met. Based on the results, the etching parameters and scanning mode are further adjusted to optimize the machining effect.

[0010] Performance testing and quality inspection: The prepared metal thermal pads are subjected to performance testing and quality inspection. The performance and quality of the metal thermal pads are evaluated by using thermal conductivity testing, surface roughness measurement and microstructure observation methods.

[0011] Furthermore, in the raw material preparation step, the substrate material is selected from metals with good thermal conductivity, including but not limited to copper, aluminum, and silver. The metal substrate is cleaned by using an organic solvent, rinsing with deionized water, and drying.

[0012] Furthermore, in the ion implantation pretreatment step, ions that have good adhesion to the metal pad material and can enhance etching selectivity are selected, and the ions are selected as nitrogen ions, boron ions, or carbon ions.

[0013] Furthermore, in the ion implantation pretreatment step, the metal gasket undergoes ion implantation pretreatment with ion energy of 10-100 keV and beam current density of 0.1-1 μA / cm². 2 The injection time is 5-30 minutes.

[0014] Furthermore, in the focused ion beam processing step, the surface of the metal thermal pad is subjected to high-precision milling and preliminary etching using a focused ion beam, with a preliminary etching depth of 5-20 nanometers.

[0015] Furthermore, in the focused ion beam processing step, in the critical area where the metal gasket contacts other components, the surface roughness is precisely reduced using a focused ion beam during processing. This reduces the focused ion beam energy to 10-20 keV and adjusts the beam current density to 0.1-0.3 A / cm². 2 The surface roughness is measured in real time using a spiral scanning local fine scan and a high-resolution surface roughness measuring instrument. The scanning speed is controlled at 1-3 mm / s. The ion beam parameters and scanning mode are finely adjusted according to the measurement results until the surface roughness of the key area reaches 1-10 nanometers.

[0016] Furthermore, in the focused ion beam processing step, adjustments are made in non-contact critical areas according to specific functional requirements. Specific processing targets are determined through thermal conduction analysis and heat dissipation requirement assessment. The etching depth is adjusted to 100-200 nanometers. The etching depth and scanning parameters are adjusted by controlling the focused ion beam etching time and beam current density. The scanning angle is 45 degrees cross, and the scanning interval is 10-20 nanometers. The microstructure is observed using an electron microscope at a magnification of 1000-10000 times to assess whether the functional requirements are met. Based on the results, the etching parameters and scanning mode are further adjusted to optimize the processing effect.

[0017] Furthermore, in the performance testing and quality inspection steps, a thermal conductivity testing device is used to measure the thermal conductivity of the metal thermal pad. The prepared pad is placed in the testing device, a temperature gradient of 10-50 degrees Celsius is applied, and the heat flow and temperature difference through the pad are measured to calculate the thermal conductivity. For surface roughness measurement, an atomic force microscope or profilometer is used to measure the surface roughness of the metal thermal pad. For microstructure observation, a microscope is used to observe the microstructure of the metal thermal pad. The electron microscope magnification is 1000-10000 times to observe the directional arrangement of the thermally conductive filler and its bonding state with the metal surface, and the processing quality is evaluated. Based on the test and inspection results, the performance and quality of the metal thermal pad are evaluated.

[0018] Compared with existing technologies, this method for preparing high-quality metal thermal pads with enhanced processing has the following advantages:

[0019] I. This invention uses focused ion beam technology to perform high-precision processing on the surface of metal thermal pads, which can accurately control surface roughness, especially in key areas that come into contact with other components. This significantly reduces surface roughness, thereby greatly increasing the thermal contact area and improving heat transfer efficiency. This precise surface treatment not only optimizes the heat transfer path but also reduces the resistance in the heat transfer process, enabling the metal thermal pads to play a more efficient role in the heat dissipation system and significantly improving the overall heat dissipation performance.

[0020] Second, by precisely adjusting the parameters and scanning path of the focused ion beam, this invention achieves nanometer-level control precision, enabling precise customization of the surface roughness of different local areas. This ability to perform local fine processing allows the metal thermal pads to meet more complex and refined heat dissipation requirements, improving the adaptability and flexibility of the product.

[0021] Other advantages, objectives and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be learned from the practice of the invention. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0023] Figure 1 A flowchart of a method for preparing high-quality metal thermal pads with enhanced process;

[0024] Figure 2 This is a flowchart of a method for preparing high-quality metal thermal pads using focused ion beam processing. Detailed Implementation

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0026] Comparative Example 1

[0027] Copper was selected as the base material. Considering the heat dissipation requirements of specific electronic devices, it was prepared into a rectangular shape with dimensions of 100 mm in length, 50 mm in width, and 2 mm in thickness. The metal base was then cleaned. First, the metal pad was immersed in an acetone solution to remove surface oil and other impurities using the good solubility of acetone. The immersion time was 15 minutes. After that, it was rinsed multiple times with deionized water for 2 minutes each time to ensure that no impurities remained. Finally, it was air-dried naturally in a well-ventilated and dust-free environment for 2 hours to ensure that the base surface was clean and dry.

[0028] After a series of material analyses and experimental tests, nitrogen ions were selected for implantation, and the ion implantation parameters were set as follows: ion energy 50 keV and beam current density 0.5 μA / cm². 2 The injection time is 30 minutes. During the injection process, professional ion implantation equipment is used, and the stability and uniformity of the ion beam are monitored in real time. By adjusting the equipment parameters, it is ensured that nitrogen ions can be uniformly injected into the metal pad to avoid local concentrations that are too high or too low.

[0029] The focused ion beam equipment is started. For copper gaskets, preliminary surface etching is performed first. The ion beam energy is set to 20 keV and the beam current density is 0.6 A / cm². 2 A linear scanning path was selected. During the etching process, the etching depth and surface smoothness were observed in real time using a microscope. After multiple tests, the etching depth was determined to be controlled at around 30 nanometers to ensure uniform etching across the entire surface. Critical and non-critical areas were identified. The critical areas were those in contact with the heat dissipation components, and these areas underwent fine processing. The ion beam energy was reduced to 15 keV, and the beam current density was adjusted to 0.2 A / cm². 2The process employs a spiral scanning mode at a scanning speed of 2 mm / s. During processing, a high-resolution atomic force microscope is used to measure the surface roughness of critical areas in real time with a measurement accuracy of 0.8 nm. Based on the measurement results, the ion beam parameters are continuously adjusted to ensure that the surface roughness of critical areas is controlled within 5 nm to improve the thermal contact area and heat conduction efficiency. For non-critical areas, to increase the surface area and improve heat radiation dissipation, the etching depth is adjusted to 150 nm. A cross-scanning mode is used to create the microstructure with a scanning angle of 45 degrees and a scanning interval of 15 nm. An electron microscope is used to observe the microstructure of non-critical areas at a magnification of 5000x. By observing the changes in the microstructure, the etching effect is evaluated to determine whether it meets the requirements for heat radiation dissipation. If necessary, the etching parameters and scanning mode can be further adjusted to optimize the processing effect of non-critical areas.

[0030] Using professional thermal conductivity testing equipment, a 40-degree Celsius temperature gradient was applied. This temperature gradient was chosen based on considerations of the operating temperature range of the electronic equipment to ensure that the test results accurately reflect the thermal conductivity performance of the metal thermal pad under actual operating conditions. The heat flow and temperature difference through the pad were measured using high-precision heat flow and temperature sensors to ensure the accuracy of the measurement results. The thermal conductivity was calculated based on the measurement results and compared with design requirements to evaluate whether the thermal conductivity performance of the metal thermal pad meets expectations. Furthermore, a surface roughness measuring instrument was used to perform multi-point measurements on different areas of the metal thermal pad with a measurement accuracy of 0.5 nanometers. Multiple measurements were taken in both critical and non-critical areas. Each measurement point is averaged to ensure the reliability of the measurement results. The surface roughness distribution is evaluated to determine whether it meets the design requirements. If the surface roughness is uneven or exceeds the specified range, the processing parameters of the focused ion beam can be adjusted or rework can be performed. In addition, equipment such as microscopes are used. The electron microscope has a magnification of 8000x to observe the orientation of the thermally conductive filler and its bonding state with the metal surface. For metal gaskets containing thermally conductive fillers, the distribution and orientation of the filler in different areas and the bonding strength with the metal substrate are evaluated. If the filler is found to be unevenly distributed or loosely bonded, the processing technology can be adjusted or appropriate additives can be added to improve the performance and quality of the metal thermally conductive gasket.

[0031] In this comparative example, in terms of heat conduction, the key areas have good thermal contact area and heat conduction efficiency with the heat dissipation components, which can meet the heat dissipation requirements of general electronic devices. The heat radiation heat dissipation capacity of non-critical areas is moderate, and the overall heat dissipation performance is relatively balanced.

[0032] Comparative Example 2

[0033] Copper was selected as the base material and prepared into a rectangular shape with dimensions of 100 mm in length, 50 mm in width, and 2 mm in thickness. The metal base was cleaned by first using acetone as an organic solvent to remove surface oil and other impurities, then rinsing it multiple times with deionized water, and finally air-drying it to ensure that the base surface was clean and dry.

[0034] After experimental testing, nitrogen ions were selected for implantation, and the ion implantation parameters were set as follows: ion energy 50 keV and beam current density 0.5 μA / cm². 2 The injection time is 30 minutes.

[0035] The focused ion beam equipment is started. For copper gaskets, preliminary surface etching is performed first. The ion beam energy is set to 18 keV, and the beam current density is 0.55 A / cm². 2 The scanning path was selected as a linear scan, the etching depth was controlled at around 25 nanometers, and critical and non-critical areas were identified. The critical areas were the parts in contact with the heat dissipation components, and these areas were finely processed. The ion beam energy was reduced to 14 keV, and the beam current density was adjusted to 0.18 A / cm². 2 The method employs a spiral scanning mode with a scanning speed of 1.8 mm / s. A high-resolution atomic force microscope is used to measure the surface roughness of critical areas in real time with a measurement accuracy of 0.7 nm. The surface roughness of critical areas is controlled within the range of 4.5 nm. For non-critical areas, the etching depth is adjusted to 140 nm to increase the surface area and improve heat dissipation. A cross-scanning mode is used to create microstructures with a scanning angle of 40 degrees and a scanning interval of 14 nm. An electron microscope is used to observe the microstructure of non-critical areas at a magnification of 4500x.

[0036] Using professional thermal conductivity testing equipment, a temperature gradient of 40 degrees Celsius was applied to measure the heat flow and temperature difference through the gasket, and the thermal conductivity was calculated. Surface roughness was measured at multiple points in different areas of the metal thermal pad with a measurement accuracy of 0.5 nanometers to evaluate the surface roughness distribution. Additionally, microscopes and other equipment, including an electron microscope with a magnification of 8000x, were used to evaluate the directional arrangement of the thermally conductive filler and its bonding with the metal surface.

[0037] In this comparative example, the surface roughness of the critical area is smaller, the thermal contact with the heat dissipation element is closer, and the heat conduction efficiency is further improved. The etching depth and scanning parameters of the non-critical areas result in a relatively small increase in surface area. The heat radiation heat dissipation capacity is slightly weaker than that of the first comparative example, but the overall performance is more refined, making it suitable for scenarios with high requirements for heat conduction and relatively mild heat dissipation environment.

[0038] Comparative Example 3

[0039] Copper was selected as the base material and prepared into a rectangular shape with dimensions of 100 mm in length, 50 mm in width, and 2 mm in thickness. The metal base was cleaned by first using acetone as an organic solvent to remove surface oil and other impurities, then rinsing it multiple times with deionized water, and finally air-drying it to ensure that the base surface was clean and dry.

[0040] After experimental testing, nitrogen ions were selected for implantation, and the ion implantation parameters were set as follows: ion energy 50 keV and beam current density 0.5 μA / cm². 2 The injection time is 30 minutes.

[0041] The focused ion beam equipment is started. For the copper gasket, preliminary surface etching is first performed. The ion beam energy is set to 22 keV, and the beam current density is 0.65 A / cm². 2 The scanning path was selected as a linear scan, the etching depth was controlled at approximately 35 nanometers, and critical and non-critical areas were identified. The critical areas were those in contact with the heat dissipation components, and these areas underwent fine processing. The ion beam energy was reduced to 16 keV, and the beam current density was adjusted to 0.22 A / cm². 2 The method employs a spiral scanning mode at a scanning speed of 2.2 mm / s, using a high-resolution atomic force microscope to measure the surface roughness of critical areas in real time with a measurement accuracy of 0.9 nm. The surface roughness of critical areas is controlled within the range of 6 nm. For non-critical areas, the etching depth is adjusted to 160 nm to increase the surface area and improve heat dissipation. A cross-scanning mode is used to create microstructures with a scanning angle of 50 degrees and a scanning interval of 16 nm. The microstructure of non-critical areas is observed using an electron microscope at a magnification of 5500x.

[0042] Using professional thermal conductivity testing equipment, a temperature gradient of 40 degrees Celsius was applied to measure the heat flow and temperature difference through the gasket, and the thermal conductivity was calculated. In addition, a surface roughness measuring instrument was used to perform multi-point measurements on different areas of the metal thermal pad with a measurement accuracy of 0.5 nanometers to evaluate the surface roughness distribution. Furthermore, microscopes and other equipment were used, with an electron microscope at a magnification of 8000x, to evaluate the directional arrangement of the thermally conductive filler and its bonding state with the metal surface.

[0043] In this comparative example, the ion beam parameters in the critical area are relatively high, the surface roughness is slightly larger, and the thermal conductivity is slightly different from that of the first comparative example, but it can still meet the high heat dissipation requirements. The etching depth and scanning parameters in the non-critical areas are larger, the surface area is increased significantly, and the heat radiation heat dissipation capacity is relatively strong, making it suitable for use in situations with high heat dissipation requirements and complex heat dissipation environments.

[0044] Comparative Example 4

[0045] Copper was selected as the base material and prepared into a rectangular shape with dimensions of 100 mm in length, 50 mm in width, and 2 mm in thickness. The metal base was cleaned by first using acetone as an organic solvent to remove surface oil and other impurities, then rinsing it multiple times with deionized water, and finally air-drying it to ensure that the base surface was clean and dry.

[0046] After experimental testing, nitrogen ions were selected for implantation, and the ion implantation parameters were set as follows: ion energy 50 keV and beam current density 0.5 μA / cm². 2 The injection time is 30 minutes.

[0047] The focused ion beam equipment is started. For the copper gasket, preliminary surface etching is first performed. The ion beam energy is set to 21 keV, and the beam current density is 0.62 A / cm². 2 The scanning path was selected as a linear scan, and the etching depth was controlled at approximately 32 nanometers. Critical and non-critical areas were identified. The critical areas were those in contact with the heat dissipation components, and these areas underwent fine processing. The ion beam energy was reduced to 15.5 keV, and the beam current density was adjusted to 0.21 A / cm². 2 The method employs a spiral scanning mode at a scanning speed of 2.1 mm / s, using a high-resolution atomic force microscope to measure the surface roughness of critical areas in real time with a measurement accuracy of 0.85 nm. The surface roughness of critical areas is controlled within the range of 5.5 nm. For non-critical areas, the etching depth is adjusted to 155 nm to increase the surface area and improve heat dissipation. A cross-scanning mode is used to create microstructures with a scanning angle of 48 degrees and a scanning interval of 15.5 nm. The microstructures of non-critical areas are observed using an electron microscope at a magnification of 5200x.

[0048] Using professional thermal conductivity testing equipment, a temperature gradient of 40 degrees Celsius was applied to measure the heat flow and temperature difference through the gasket, and the thermal conductivity was calculated. In addition, a surface roughness measuring instrument was used to perform multi-point measurements on different areas of the metal thermal pad with a measurement accuracy of 0.5 nanometers to evaluate the surface roughness distribution. Furthermore, microscopes and other equipment were used, with an electron microscope at a magnification of 8000x, to evaluate the directional arrangement of the thermally conductive filler and its bonding state with the metal surface.

[0049] In this comparative example, the overall parameters are between those of Comparative Example 1 and Comparative Example 3, and the performance is relatively balanced. The heat conduction efficiency in the critical area and the heat radiation heat dissipation capacity in the non-critical area are also at a moderate level, making it suitable for scenarios with moderate heat dissipation requirements.

[0050] In summary, the enhanced process method for preparing high-quality metal thermal pads of the present invention provides a specific substrate material and performs cleaning treatment, pre-treats the metal pad with ion implantation, uses a focused ion beam to perform high-precision milling, etching, and roughness adjustment on the surface of the metal thermal pad, divides critical and non-critical areas for separate processing, and conducts rigorous performance testing and quality inspection. This method can produce metal thermal pads with good thermal conductivity and a specific surface roughness distribution. Based on the above four comparative examples, it can be concluded that by adjusting the parameters of the focused ion beam, under the condition that other factors remain unchanged, the performance of critical and non-critical areas of the metal pad can be specifically optimized, thereby improving the overall heat dissipation effect and quality of the metal thermal pad.

[0051] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A method for preparing high-quality reinforced metal thermal pads, characterized in that, The method includes the following specific steps: Raw material preparation: Provide metal thermal pad bases; the shape and size of the bases can be selected according to actual needs. Ion implantation pretreatment: Ions with good adhesion to the metal pad material and which can enhance etching selectivity are selected and ion implanted into the metal pad to better control the etching depth and shape during the processing. Focused ion beam machining: This method utilizes a focused ion beam to perform high-precision milling and preliminary etching on the surface of metal thermal pads. By controlling the parameters of the focused ion beam, regions with different roughnesses are formed on the metal surface. In critical areas where the metal pad contacts other components, the surface roughness is precisely reduced during machining using the focused ion beam. The focused ion beam energy is reduced to 10-20 keV, and the beam current density is adjusted to 0.1-0.3 A / cm². 2 The process employs a spiral scanning technique for localized fine scanning, using a high-resolution surface roughness measuring instrument to measure surface roughness in real time. The scanning speed is controlled at 1-3 mm / s. Based on the measurement results, the ion beam parameters and scanning mode are finely adjusted until the surface roughness in critical areas reaches 1-10 nanometers. In non-contact critical areas, adjustments are made according to specific functional requirements. Specific processing targets are determined through thermal conduction analysis and heat dissipation requirement assessment, and the etching depth is adjusted to 100-200 nanometers. The etching depth and scanning parameters are adjusted by controlling the focused ion beam etching time and beam current density. The scanning angle is 45 degrees cross, and the scanning interval is 10-20 nanometers. The microstructure is observed using an electron microscope at a magnification of 1000-10000 times to assess whether the functional requirements are met. Based on the results, the etching parameters and scanning mode are further adjusted to optimize the processing effect. Performance testing and quality inspection: The prepared metal thermal pads are subjected to performance testing and quality inspection. The performance and quality of the metal thermal pads are evaluated by using thermal conductivity testing, surface roughness measurement and microstructure observation methods.

2. The method for preparing a high-quality reinforced metal thermal pad according to claim 1, characterized in that, In the raw material preparation step, the substrate material is selected from metals with good thermal conductivity, including but not limited to copper, aluminum and silver. The metal substrate is cleaned by using organic solvents, rinsing with deionized water and drying.

3. The method for preparing a high-quality reinforced metal thermal pad according to claim 1, characterized in that, In the ion implantation pretreatment step, ions that have good adhesion to the metal pad material and can enhance etching selectivity are selected, and the ions are nitrogen ions, boron ions, or carbon ions.

4. The method for preparing a high-quality reinforced metal thermal pad according to claim 1, characterized in that, In the ion implantation pretreatment step, the metal gasket undergoes ion implantation pretreatment with ion energy of 10-100 keV and beam current density of 0.1-1 μA / cm². 2 The injection time is 5-30 minutes.

5. The method for preparing a high-quality reinforced metal thermal pad according to claim 1, characterized in that, In the focused ion beam processing step, the surface of the metal thermal pad is milled and pre-etched with high precision using a focused ion beam, with a pre-etching depth of 5-20 nanometers.

6. The method for preparing a high-quality reinforced metal thermal pad according to claim 1, characterized in that, In the performance testing and quality inspection steps, a thermal conductivity testing device is used to measure the thermal conductivity of the metal thermal pad. The prepared pad is placed in the testing device, a temperature gradient of 10-50 degrees Celsius is applied, and the heat flow and temperature difference through the pad are measured to calculate the thermal conductivity. For surface roughness measurement, an atomic force microscope or profilometer is used to measure the surface roughness of the metal thermal pad. For microstructure observation, a microscope is used to observe the microstructure of the metal thermal pad. The electron microscope magnification is 1000-10000 times to observe the directional arrangement of the thermally conductive filler and its bonding state with the metal surface to evaluate the processing quality. Based on the test and inspection results, the performance and quality of the metal thermal pad are evaluated.

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