Inspection apparatus and calibration method for semiconductor device substrate transport calibration

Abstract

This invention provides a detection device and calibration method for substrate transmission calibration of semiconductor equipment. The detection device can record the position information of the contact point of the detection device during transmission or when placed in the processing cavity. Based on the position information, it can be analyzed to determine whether the detection device is transmitted correctly or whether the detection device is placed in the center in the processing cavity. This allows for analysis of the cause of the device's positional deviation, providing a basis for adjusting relevant components of the semiconductor equipment and improving the deviation during substrate transmission or placement.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and in particular to a detection device and calibration method for substrate transmission calibration of semiconductor devices. Background Technology

[0002] In semiconductor manufacturing processes, the correct positioning of the substrate within the processing cavity of the semiconductor equipment—for example, whether the substrate is centered on the support structure—significantly impacts the processing results. Sensors are typically placed outside the processing cavity, near the transfer port, to measure the relative position of the substrate as it enters and exits the cavity. However, once the substrate enters the processing cavity, its actual position becomes difficult to determine.

[0003] In some existing technologies, a camera positioned inside the processing cavity is used to photograph the substrate placed on the carrier device; alternatively, a camera is placed at the edge of a test substrate, and after the substrate is transmitted to the carrier device, the surrounding chamber features are photographed. However, these methods require the acquisition of many images for subsequent analysis, resulting in large data volumes and low accuracy. Furthermore, the analysis results can only determine whether the substrate is centered on the carrier device, making it difficult to determine the cause of the substrate's positional deviation. Summary of the Invention

[0004] The purpose of this invention is to provide a detection device and calibration method for substrate transmission calibration of semiconductor equipment. This method can determine whether the position of the detection device is correct during transmission or within the processing cavity, and then analyze the cause of the positional deviation of the detection device to make targeted adjustments, thereby improving the process effect when processing the substrate.

[0005] One technical solution of the present invention is to provide a detection device for substrate transfer calibration of a semiconductor device, the detection device being able to be transferred into the processing cavity of the semiconductor device; the detection device includes a contact sensing device configured to record the position information of the contact point of the detection device during transfer or when placed in the processing cavity.

[0006] Optionally, during transmission, the detection device comes into contact with the transmission device via a contact sensing device.

[0007] Optionally, the transmission device includes a robotic arm for carrying the detection device and delivering or transferring the detection device into or out of the processing chamber.

[0008] Optionally, the transmission device includes several lifting pins for supporting the detection device and driving the detection device to rise or fall within the processing cavity.

[0009] Optionally, the detection device placed in the processing chamber contacts an electrostatic chuck or tray in the processing chamber via a contact sensing device, and the electrostatic chuck or tray supports the detection device.

[0010] Optionally, the detection device has the same vertical projection shape as the substrate awaiting processing by the semiconductor device.

[0011] Optionally, the detection device is provided with a notch for indicating the orientation of the detection device.

[0012] Optionally, the substrate awaiting processing by the semiconductor device is provided with a notch for indicating the orientation of the substrate;

[0013] The notch in the detection device is the same as the notch in the substrate.

[0014] Optionally, the coefficient of friction of the contact sensing device satisfies:

[0015] G 基片 μ 基片 =G 检测装置 μ 检测装置

[0016] Among them, G 基片 For the gravity of the substrate waiting to be processed by semiconductor equipment, G 检测装置 For the gravity of the detection device, μ 基片 μ is the coefficient of friction between the contact surfaces of the substrate and the robotic arm. 检测装置 The coefficient of friction between the contact surfaces of the detection device and the robotic arm.

[0017] Optionally, the contact sensing device includes a pressure sensing device.

[0018] Optionally, the pressure sensing device includes an electromagnetic touch sensing unit or a capacitive touch sensing unit.

[0019] Optionally, the detection device further includes:

[0020] A processor is used to process the data sensed by the contact sensing device;

[0021] Storage unit, used to store the data;

[0022] A signal transmission unit is used to transmit the data to an external control device in a wired or wireless manner when the detection device is transferred outside the processing cavity.

[0023] The power supply unit is used to provide electrical energy;

[0024] The control device is used to determine whether the detection device is being transmitted correctly, or whether the detection device is placed in the center of the processing cavity, based on the data transmitted by the detection device.

[0025] Another technical solution of the present invention is to provide a calibration method for semiconductor device substrate transmission calibration; when any of the above-mentioned detection devices is in transmission or placed in the processing cavity, the position information of the contact point of the detection device is recorded by a contact sensing device to determine whether the detection device is correctly transmitted or whether the detection device is placed in the center in the processing cavity.

[0026] Optionally, the center point of the expected contact area on the detection device that comes into contact with the robotic arm when the detection device is correctly transferred by the robotic arm is used as a reference mark;

[0027] Based on the position information collected when the detection device is transmitted by the robotic arm, calculate the first sensing area when the detection device is actually in contact with the robotic arm.

[0028] Calculate the coordinates of the center point of the first sensing area and compare them with the coordinates of the reference mark. Based on the comparison result, determine whether the detection device is offset on the robotic arm.

[0029] Optionally, based on the position information collected when the detection device comes into contact with the tray or electrostatic chuck, the second sensing area when the detection device is currently actually in contact with the tray or electrostatic chuck can be calculated.

[0030] Calculate the center coordinates of the second sensing area and compare them with the center coordinates of the detection device. Based on whether the comparison results match, determine whether the detection device is centered on the tray or electrostatic chuck.

[0031] Alternatively, the center coordinates of the second sensing area can be calculated and compared with the center coordinates of the tray or electrostatic chuck. Based on whether the comparison results match, it can be determined whether the detection device is centered on the tray or electrostatic chuck.

[0032] Optionally, the detection device is transmitted by three lifting pins. Based on the position information of the three contact points collected when the detection device contacts the lifting pins, the coordinates of the annulus and its center corresponding to the three contact points are calculated.

[0033] Compare the center coordinates of the ring with the center coordinates of the detection device, and determine whether the detection device is centered on the lifting pin based on whether the comparison results match.

[0034] Alternatively, the center coordinates of the ring can be compared with the center coordinates of the electrostatic chuck, and the detection device can be determined to be centered on the lifting pin based on whether the comparison results match.

[0035] Optionally, the transmission process of the detection device includes at least one of the following steps:

[0036] Step A1: The detection device is sent into the processing chamber by a robotic arm;

[0037] Step A2: The detection device is transferred from the robotic arm to a tray inside the processing chamber;

[0038] Step A3: The detection device is supported by the tray;

[0039] Step A4: The detection device is transferred from the tray to the robotic arm;

[0040] Step A5: The detection device is transmitted from the processing chamber through the robotic arm;

[0041] The contact sensing device can perform detection in any one of steps A1 to A5, or in multiple consecutive or multiple discontinuous steps of steps A1 to A5.

[0042] Optionally, the transmission process of the detection device includes at least one of the following steps:

[0043] Step B1: The detection device is sent into the processing chamber by a robotic arm;

[0044] Step B2: The detection device is transferred from the robotic arm to several lifting pins;

[0045] Step B3: The detection device descends with the lifting pin and is transferred to the electrostatic chuck;

[0046] Step B4: The detection device is carried by the electrostatic chuck;

[0047] Step B5: The detection device is transferred from the electrostatic chuck to the lifting pin and is lifted along with the lifting pin;

[0048] Step B6: The detection device is transferred from the lifting pin to the robotic arm;

[0049] Step B7: The detection device is transmitted from the processing chamber via the robotic arm;

[0050] The contact sensing device performs detection in any one of steps B1 to B7, or in multiple consecutive or multiple discontinuous steps within steps B1 to B7.

[0051] Optionally, when the processing chamber is equipped with an electrostatic chuck and a lifting pin, the contact sensing device performs at least one of the following detection operations:

[0052] Step C1: The contact sensing device shall detect at least once at the beginning and at the end of the first input process in which the robotic arm carries the detection device; the first input process is from the beginning when the robotic arm picks up the detection device from outside the processing cavity to the end before the lifting pin transfers the detection device into the processing cavity.

[0053] Step C2: The contact sensing device shall detect at least once at the beginning and at the end of the second input process in which the detection device is carried by the lifting pin; the second input process begins when the lifting pin contacts the detection device and ends before the detection device is transferred to the electrostatic chuck.

[0054] Step C3: The contact sensing device shall detect at least once at the beginning and at the end of the first placement state in which the detection device is carried by the electrostatic chuck; the first placement state begins when the electrostatic chuck contacts the detection device and ends before the detection device is transferred to the lifting pin.

[0055] Step C4: The contact sensing device shall detect at least once at the beginning and at the end of the first output process in which the detection device is carried by the lifting pin; the first output process begins when the lifting pin contacts the detection device and ends before the detection device is transferred to the robotic arm.

[0056] Step C5: The contact sensing device shall detect at least once at the beginning and at the end of the second output process in which the detection device is carried by the robotic arm; the second output process begins when the robotic arm contacts the detection device and ends before the detection device is transferred to a designated facility outside the processing chamber.

[0057] Optionally, when a tray is provided inside the processing cavity, the contact sensing device performs at least one of the following detection operations:

[0058] Step D1: The contact sensing device shall detect the device at least once at the beginning and at the end of the third input process in which the robotic arm carries the detection device; the third input process is from the beginning of the robotic arm taking the detection device from outside the processing cavity to the end of the process before transferring the detection device to the tray inside the processing cavity.

[0059] Step D2: The contact sensing device shall detect at least once at the beginning and at the end of the second placement state in which the detection device is carried by the tray; the second placement state begins when the tray contacts the detection device and ends before the detection device is transferred to the robotic arm.

[0060] Step D3: The contact sensing device shall detect at least once at the beginning and at the end of the third output process in which the detection device is carried by the robotic arm; the third output process begins when the robotic arm contacts the detection device and ends before the detection device is transferred to a designated facility outside the processing chamber.

[0061] Optionally, during the transmission process of the detection device and / or when the detection device is placed in the processing cavity, the semiconductor processing process in the processing cavity is either in a closed state or an open state.

[0062] When the semiconductor processing is in the on state, the position information recorded by the contact sensing device is also used to determine whether the process will cause the detection device to shift.

[0063] Compared with the prior art, the technical solution of the present invention has at least the following beneficial effects:

[0064] The detection device and calibration method for substrate transport calibration of semiconductor equipment described in this invention simulate the state of the contacted parts of the substrate and the situation when the substrate is transported or carried. By collecting the position information of the detection device when it comes into contact with the transport device or the carrying device, the position of the detection device during transport or in the processing cavity is determined to be correct. The cause of the positional deviation of the detection device is then analyzed and checked, providing guidance for further adjustment of relevant components of the semiconductor equipment and improvement of the deviation during substrate transport or placement, thereby improving the process effect when processing the substrate.

[0065] In the example of this invention, based on the area in contact with the transmission device or the carrier device when the detection device is correctly positioned, a location whose coordinates do not change frequently and which is easy to determine based on the geometry of the area can be selected as a reference mark. The location of the area sensed by the detection device during actual transmission or placement, mapped to the reference mark, is determined as the detection mark. The actual coordinates of the detection mark are calculated based on the collected position information and compared with the coordinates of the reference mark. Based on whether the comparison results match, it is determined whether the position of the detection device has shifted. This example can conveniently and quickly determine the positions of the reference mark and the detection mark, requires less pre-stored data, and effectively reduces the amount of computation when analyzing the detection data, thus improving efficiency. Attached Figure Description

[0066] Figure 1 This is a schematic diagram of the semiconductor device and detection apparatus equipped with an electrostatic chuck according to the present invention;

[0067] Figure 2 This is a schematic diagram of the semiconductor device and testing apparatus with a tray according to the present invention;

[0068] Figure 3 This is a schematic diagram of the component structure of the detection device of the present invention;

[0069] Figure 4 , Figure 5 , Figure 6 This is a schematic diagram of the present invention with contact sensing devices installed at different positions in the detection device;

[0070] Figure 7 This is a schematic diagram showing that the detection device of the present invention has no offset on the robotic arm;

[0071] Figure 8This is a schematic diagram showing the displacement of the detection device of the present invention on the robotic arm;

[0072] Figure 9 This is a schematic diagram showing that the detection device of the present invention has no offset on the tray or electrostatic chuck;

[0073] Figure 10 This is a schematic diagram showing the displacement of the detection device of the present invention on a tray or electrostatic chuck;

[0074] Figure 11 This is a schematic diagram showing that the detection device of the present invention has no offset on the three lifting pins;

[0075] Figure 12 This is a schematic diagram showing the displacement of the detection device of the present invention on the three lifting pins;

[0076] Figure 13 This is a schematic diagram of the process for transferring and placing the detection device in the semiconductor device with a tray according to the present invention;

[0077] Figure 14 This is a schematic diagram of the process for transferring and placing the detection device in the semiconductor device with an electrostatic chuck of the present invention. Detailed Implementation

[0078] Semiconductor equipment is used to perform semiconductor processes on substrates, such as etching, thin film deposition, and other methods, but is not limited to these. For example... Figure 1 , Figure 2 As shown, the semiconductor device includes a processing chamber 10, with a wafer transfer port 20 on the side wall of the processing chamber 10. When the wafer transfer port 20 is open, a robotic arm 30 for transferring substrates can enter and exit the processing chamber 10 through the wafer transfer port 20 under the action of its drive device 31, transferring the substrate carried by the robotic arm 30 into the processing chamber 10, or transferring the processed substrate out of the processing chamber 10 through the robotic arm 30. When the wafer transfer port 20 is closed, a gas delivery device 80 can introduce various gases required for the current process into the processing chamber 10. An exhaust device 90 connected to the processing chamber 10 can remove waste gas, by-products, etc., and maintain the required pressure inside the processing chamber 10. Other devices of the semiconductor device can be configured according to specific process requirements, and will not be described in detail here.

[0079] During the processing, the substrate is placed on a support device within the processing chamber 10. Some examples of support devices include a tray 70 (see...). Figure 2 The support mechanism 71 located within the processing chamber 10, which can drive the tray 70 to rotate (see...) Figure 2 The substrate can be transferred from the robotic arm 30 to the tray 70, or vice versa.

[0080] Other examples of carrier devices include electrostatic chuck 50 (see...) Figure 1 The base 51 located within the processing cavity 10 (see...) Figure 1 The electrostatic chuck 50 is equipped with a DC electrode. When energized, it generates an electrostatic attraction force between the electrostatic chuck 50 and the back of the substrate, thus adsorbing and fixing the substrate. When the power is off, the adsorption is released. A lifting pin 60 (see [reference needed]) that can rise or fall within the processing chamber 10 is used. Figure 1 The substrate can be transferred between the robotic arm 30 and the electrostatic chuck 50. Under the action of the lifting drive device 61, when the lifting pin 60 rises, it contacts the back of the substrate and drives the substrate to rise continuously, so that the substrate is separated from the electrostatic chuck 50 and reaches a height where the robotic arm 30 can take over the substrate and transfer the substrate to the robotic arm 30; or, the lifting pin 60 rises to a height where the substrate can be taken over from the robotic arm 30 and transferred from the robotic arm 30 to the lifting pin 60. The substrate falls with the lifting pin 60 until it lands on the electrostatic chuck 50, where the electrostatic chuck 50 supports the substrate.

[0081] This invention provides a detection device 40, applicable to various semiconductor devices, which can provide the necessary data information for substrate transfer calibration. Using a method essentially consistent with substrate transfer and placement, the detection device 40 is transferred into a processing cavity 10, placed on a carrier device within the processing cavity 10, and then transferred out of the processing cavity 10. The detection device 40 is equipped with a contact sensing device, which can collect and record the position information of the contact points of the detection device 40 during transfer or placement within the processing cavity 10. Based on this position information, it can be determined whether the detection device 40 has been correctly transferred or whether it is centered within the processing cavity 10, thereby analyzing the reasons for positional offset of the detection device 40 during transfer or placement. In other words, the position information obtained by the detection device 40 reflects the relative positional relationship between the substrate and the transfer or carrier device during transfer or placement, which can be used to deduce the reasons for substrate positional offset, providing guidance for further adjustment of relevant components of the semiconductor device and improving offset during substrate transfer or placement.

[0082] To simulate the contact between the substrate and the transmission or support device, the detection device 40 and the substrate should at least have approximately the same shape and size at the contact points with the transmission or support device. For example, if the transmission device supports the lower surface of the detection device 40 or the substrate during transmission, and the support device also supports the lower surface of the detection device 40 or the substrate, then the lower surface of the detection device 40 should at least have approximately the same shape and size as the lower surface of the substrate. The detection device 40 can have the same vertical projection shape as the substrate awaiting processing by the semiconductor device. If the robotic arm 30 contacts other surfaces of the substrate for transmission, the detection device 40 can also have approximately the same shape and size as the substrate on surfaces in the same direction. Alternatively, in some examples, the entire external shape and size of the detection device 40 can be identical to that of the substrate.

[0083] In some examples, depending on the location where it is expected to come into contact with the transmission or carrying device, the detection device 40 may place the contact sensing device on the entire surface 44 where that location is located (see [reference]). Figure 6 If any point on the surface is touched, the corresponding position information can be recorded, and the distance between the actual contact point and the expected contact point can be calculated. For example, contact sensing devices are arranged on the entire lower surface of the detection device 40. In other examples, contact sensing devices are only provided at the expected contact points (e.g., ...). Figure 4 If a contact sensing device is only installed at the part 42 where the robotic arm 30 is expected to contact the robot arm 30, then when the detection device 40 is transmitted or placed, if the contact sensing device does not detect the corresponding data at a certain point, it means that the point is not actually contacted, and it is determined that a positional offset has occurred. By combining the detection data of the contact sensing device at other points, the direction of the offset can be roughly determined, but it may not be able to give an accurate deviation distance.

[0084] In different examples, assuming that a detection device 40 is only used to detect the offset during the transmission process, then according to the specific shape and size of the bearing surface of the transmission device, a contact sensing device of the corresponding shape and size is installed only on the part of the detection device 40 that is expected to contact the transmission device, and no contact sensing device is installed around this part (e.g., ...). Figure 4 Assuming that different transmission devices will come into contact with the detection device 40 at different stages, a contact sensing device can be set on the expected contact surface of the detection device 40, corresponding to the combined shape and size of the bearing surfaces of different transmission devices (e.g., ...). Figure 5Contact sensing devices are provided at both the expected contact points 42 and 43 with the lifting pin 60. Assuming a detection device 40 is only used to detect offset when in contact with the carrier device, although it needs to be sent into or out of the processing chamber 10 and transferred to the carrier device via a transmission device, detection can be omitted during transmission. Instead of setting contact sensing devices at the contact points with the transmission device, contact sensing devices of appropriate shape and size are installed based on the specific shape and size of the carrier surface, according to the surface expected to contact the carrier device. Alternatively, for the above examples, no distinction can be made; contact sensing devices can be set based on the combined shape and size of the carrier surfaces of one or more transmission devices and one or more carrier devices. Or, contact sensing devices can be installed on the entire surface 44 where the expected contact points with the transmission device and carrier device are located (e.g., ...). Figure 6 ).

[0085] The touch sensing device includes a pressure sensing device capable of recording the location where applied pressure is applied to the touch sensing device. The pressure sensing device includes an electromagnetic touch sensing unit or a capacitive touch sensing unit. Examples of pressure sensing devices include a graphics tablet or an XY two-dimensional capacitive touch sensor, but are not limited to these.

[0086] like Figure 3 As shown, the example detection device 40 also includes a processor, a storage unit, a signal transmission unit, and a power supply unit. These units can be installed inside the detection device 40 or on other surfaces not connected to the transmission device or the carrier device (e.g., the contact sensing device is on the lower surface, and other units are installed inside or on the upper surface of the detection device 40). The power supply unit provides electrical energy to the detection device. The processor processes the data sensed by the contact sensing device, such as converting the measured pressure into an electrical signal and then into the coordinates of the actual contact point on the detection device 40. The storage unit stores relevant data. The signal transmission unit transmits the relevant data to a control device outside the detection device 40 via wired or wireless means for subsequent analysis. For example, the data recorded during transmission or placement within the processing cavity 10 is read or transmitted only after the detection device has been transferred outside the processing cavity 10.

[0087] The control device can perform calculations and analysis on the data sent by the detection device 40 to determine whether the detection device 40 has been correctly transmitted or whether it is centered in the processing cavity 10. The example control device is a component of the semiconductor equipment or an independent device. Furthermore, if it is determined that the detection device 40 has not been correctly transmitted or is not centered, the control device can provide prompts to maintenance personnel or provide relevant control commands for manually or automatically adjusting the transmission or carrying device of the semiconductor equipment.

[0088] The area where the detection device 40 is expected to contact the transmission device or carrier device when the transmission or placement position is correct can be called the expected contact area. Based on the range of this area, one or more reference markers (which can be points, lines, surfaces, etc., inside the area or on the edge of the area) are pre-set, and the coordinates of the reference markers are recorded at the control device. This reduces the amount of data that needs to be acquired and stored in advance. The coordinates of the expected contact area and its reference markers can be obtained, for example, through simulation calculations based on the geometry and related parameters of the detection device 40 and the transmission device or carrier device. The area where the detection device 40 contacts the transmission device or carrier device during actual transmission or placement is called the sensing area. If the expected contact area and the sensing area have the same shape and size, the position of the reference marker in the expected contact area will have a corresponding mapped position in the sensing area, which will be used as the detection marker. During actual transmission or placement, the coordinates of the sensing area and its detection markers are calculated based on the acquired position information and compared with the coordinates of the reference markers to determine whether the detection device 40 has shifted. The direction and distance of the shift can also be determined based on the difference between the two coordinates. Both regions are determined based on the detection device 40 itself. Therefore, both coordinates are calculated based on the coordinate system of the detection device 40 itself, without the need for additional conversion, which can reduce the amount of calculation.

[0089] For example, during transmission, the detection device 40 contacts the transmission device via a contact sensing device and records the position information of the contact point. The transmission device includes a robotic arm 30, which can carry the detection device 40 through the transfer port 20, sending the detection device 40 into or out of the processing chamber 10.

[0090] The substrate typically has a notch to indicate its orientation. This orientation is used to mark the crystal orientation and also to mark the substrate's direction during transport by the robotic arm 30, etc. (A specific sensor outside the processing cavity 10 detects the notch; if it is not detected, the substrate needs to be rotated until the notch is detected to achieve substrate positioning), helping subsequent processes determine the substrate's placement position, etc. Figure 3As shown, the example detection device 40 has a notch 41 that is substantially the same as the notch on the substrate to indicate the orientation of the detection device 40 so that the detection device 40 can be positioned by detecting the notch 41 by an external sensor, so that the direction of the robotic arm 30 and the like when transferring the detection device 40 is consistent with the direction when transferring the substrate.

[0091] Considering that the sliding of the substrate on the robotic arm 30 will cause displacement, the friction coefficient of the contact sensing device can be made to satisfy the following when designing the relevant parameters of the detection device 40:

[0092] G 基片 μ 基片 =G 检测装置 μ 检测装置

[0093] Among them, G 基片 For the gravity of the substrate, G 检测装置 To detect the gravity of the device 40, μ 基片 μ is the coefficient of friction between the contact surfaces of the substrate and the robotic arm 30. 检测装置 The coefficient of friction between the contact surfaces of the detection device 40 and the robotic arm 30 is measured. For example, the coefficient of friction μ can be adjusted by changing the material used for the contact surface of the detection device 40, or by changing the surface finish of the contact surface of the detection device 40. 基片 Adjustments were made.

[0094] Position information can be detected during the process of the robotic arm 30 transferring the detection device 40 into the processing cavity 10 and during the process of transferring it out of the processing cavity 10. For example, at least the process of the detection device 40 transferring into the processing cavity 10 can be detected and analyzed to determine whether the position of the detection device 40 on the robotic arm 30 is correct during the transfer. If the position is determined to be incorrect, the reasons for the positional deviation of the detection device 40 on the robotic arm 30 can be further analyzed, or whether the positional deviation of the detection device 40 on the robotic arm 30 will cause the detection device 40 to be unable to be centered in the processing cavity 10, or to be unable to be placed centered on the carrier device later. For example, multiple detections can be performed during the process of the detection device 40 transferring into the processing cavity 10, and the position information of the contact point can be recorded each time. The analysis can be performed to see if there are any changes in the position information collected during each detection. If there are any changes, it indicates that the detection device 40 has a deviation on the robotic arm 30 during the transfer. If there are no changes, it indicates that the detection device 40 has no deviation on the robotic arm 30 during the transfer. Whether the process of the robotic arm 30 transmitting the detection device 40 out of the processing chamber 10 needs to be detected and analyzed can be determined according to actual needs, and the present invention does not limit this.

[0095] For example, such as Figure 7 , Figure 8As shown, the center point of the expected contact area 101 when the detection device 40 contacts the robotic arm 30 can be used as a reference mark 102. During actual transmission, based on the position information collected when the detection device 40 contacts the robotic arm 30, the coordinates of the first sensing area 103 currently actually in contact with the detection device 40 and its center point 104 are calculated, and the coordinates of the center point 104 are compared with the coordinates of the reference mark 102. If the two coordinates match, it is determined that the detection device 40 has not shifted on the robotic arm 30; if the two coordinates do not match, it is determined that the detection device 40 has shifted on the robotic arm 30 (e.g., ...). Figure 8 It can also determine the direction and distance of the offset based on the difference between the two coordinates, which can serve as the basis for adjusting the robotic arm 30 itself or adjusting the parameters when the robotic arm 30 moves the detection device 40.

[0096] like Figure 1 As shown, in an embodiment where the semiconductor device uses the tray 70, the detection device 40 fed into the processing cavity 10 can be transferred from the robotic arm 30 to the tray 70; alternatively, the detection device 40 on the tray 70 can be transferred to the robotic arm 30 and carried out of the processing cavity 10 by the robotic arm 30. During the process of the detection device 40 being carried by the tray 70, the detection device 40 contacts the tray 70 through a contact sensing device and records the position information of the contact point. Based on the analysis of the collected position information, it can be determined whether the detection device 40 is centered on the tray 70. Assuming that the tray 70 itself is centered within the processing cavity 10, if the detection device 40 is centered on the tray 70, it is determined that it is also centered within the processing cavity 10.

[0097] The positional information of the detection device 40 when it comes into contact with the pallet 70 and the robotic arm 30 can be combined for analysis. For example, if the detection result when it comes into contact with the pallet 70 indicates that the detection device 40 is not centered on the pallet 70, and the detection result when it comes into contact with the robotic arm 30 indicates that there is no offset on the robotic arm 30, then the cause of the offset can be found during the transfer of the detection device 40 from the robotic arm 30 to the pallet 70, or from the pallet 70 itself. If it is determined that an offset has occurred on the robotic arm 30, then the cause can be mainly found from the robotic arm 30, such as whether the robotic arm 30 has shaken during the transfer process. This helps maintenance personnel to find problems more quickly.

[0098] like Figure 2As shown, in an embodiment where the semiconductor device uses the electrostatic chuck 50, the transmission device in contact with the contact sensing device further includes several lifting pins 60, which can support the detection device 40 and drive the detection device 40 to rise or fall within the processing cavity 10. The base 51 supporting the electrostatic chuck 50 is provided with several guide holes, which correspond to and communicate with several through holes on the electrostatic chuck 50, forming several vertical channels 52. Under the action of the lifting drive device 61, the multiple lifting pins 60 can rise along their respective corresponding channels 52 and continue to rise within the processing cavity 10, reaching a height where they can connect with the robotic arm 30 to the detection device 40; they can also return along the original path, descend within the processing cavity 10, and continue to descend along their corresponding channels, so that the top of the lifting pin 60 is lower than the bearing surface of the electrostatic chuck 50.

[0099] The detection device 40, fed into the processing chamber 10, is transferred from the robotic arm 30 to the already raised lifting pin 60. The lifting pin 60 then lowers along with the detection device 40 until it lands on the electrostatic chuck 50, where it is supported. At this point, the lifting pin 60 can continue to descend, disengaging from the back of the detection device 40. Alternatively, the lifting pin 60 can rise, passing through the channel and contacting the back of the detection device 40, lifting it to a certain height. The robotic arm 30, now inside the processing chamber 10, then takes over the detection device 40 and removes it from the processing chamber 10.

[0100] During the process of the detection device 40 being supported by the lifting pin 60 or the electrostatic chuck 50, the detection device 40 contacts the lifting pin 60 or the electrostatic chuck 50 respectively through a contact sensing device, and records the position information of the contact point. Based on the analysis of the collected position information, it can be determined whether the detection device 40 is centered on the lifting pin 60 or the electrostatic chuck 50. Assuming that the electrostatic chuck 50 itself is centered within the processing cavity 10, if the detection device 40 is centered on the electrostatic chuck 50, it is determined that it is also centered within the processing cavity 10.

[0101] The positional information of the detection device 40 when in contact with the electrostatic chuck 50, lifting pin 60, and robotic arm 30 can be analyzed in conjunction with the detection results when in contact with the electrostatic chuck 50. For example, if the detection results when in contact with the electrostatic chuck 50 indicate that the detection device 40 is not centered on the electrostatic chuck 50, but the detection results when in contact with the lifting pin 60 indicate that there is no offset on the lifting pin 60, then the cause of the offset can be found during the transfer of the detection device 40 from the lifting pin 60 to the electrostatic chuck 50, or within the electrostatic chuck 50 itself. If it is determined that an offset has occurred on the lifting pin 60, the detection results when in contact with the robotic arm 30 can be used for further analysis. If the detection results when in contact with the robotic arm 30 indicate that there is no offset on the robotic arm 30, then the cause of the offset can be found during the transfer of the detection device 40 from the robotic arm 30 to the lifting pin 60, or within the lifting pin 60 itself. For example, whether the multiple lifting pins 60 have different heights or different moving speeds. If it is determined that an offset has occurred on the robotic arm 30, then the cause can be primarily found within the robotic arm 30. This helps maintenance personnel troubleshoot the offset in stages, improving efficiency. Multiple tests can be performed during the contact process between the detection device 40 and each of the above-mentioned devices (robotic arm 30, lifting pin 60, electrostatic chuck 50 or tray 70); if the position information detected in each of the multiple tests when in contact with a certain device is different, it can also be determined that the detection device has shifted on that device.

[0102] The detection and analysis when the detection device 40 is in contact with the tray 70 or the electrostatic chuck 50 are similar; "tray 70 / electrostatic chuck 50" in the following text refers to either one. Figure 9 , Figure 10 As shown in one example, when the detection device 40 is placed in the center, the second sensing area 106 when the detection device 40 actually contacts the tray 70 / electrostatic chuck 50, and the expected contact area 105 on the detection device 40 with the tray 70 / electrostatic chuck 50, should be consistent in shape and size (e.g., ...). Figure 9 Based on the position information collected when the detection device 40 contacts the tray 70 / electrostatic chuck 50, the current actual second sensing area 106 and its shape and size are calculated. If it is inconsistent with the shape and size of the expected contact area 105 (compare...), Figure 9 , Figure 10 This indicates that the detection device 40 has shifted on the tray 70 / electrostatic chuck 50.

[0103] In another example, when the detection device 40 is centered on the tray 70 / electrostatic chuck 50, the center 109 of the current second sensing area 106 of the detection device 40 should coincide with the center 108 of the detection device 40 itself and be aligned with the center 107 of the tray 70 / electrostatic chuck 50. Then, based on the position information collected when the detection device 40 contacts the tray 70 / electrostatic chuck 50, the coordinates of the center 109 of the second sensing area 106 on the detection device 40 are calculated and compared with the coordinates of the center 107 of the tray 70 / electrostatic chuck 50. If the two do not match, it is determined that the detection device 40 is not centered on the tray 70 / electrostatic chuck 50 (e.g., ...). Figure 10 If the two coordinates match, it is determined that the detection device 40 is centered on the tray 70 / electrostatic chuck 50. Based on the difference between the coordinates of the center 109 of the second sensing area 106 and the coordinates of the center 107 of the tray 70 / electrostatic chuck 50, the direction and distance of the offset can be further determined. After converting to the same coordinate system, the values ​​of the two coordinates in the two-dimensional plane can be recorded and compared, ignoring the difference in coordinate values ​​in the vertical direction (this difference is caused, for example, by the thickness of the detection device 40 and has little relation to the positional offset).

[0104] In another example, the center 108 of the detection device 40 itself is used as a reference mark; based on the position information collected when the detection device 40 contacts the tray 70 / electrostatic chuck 50, the coordinates of the center 109 of the second sensing area 106 on the detection device 40 are calculated and compared with the coordinates of the center 108 of the detection device 40. If the two do not match, it is determined that the detection device 40 is not centered on the tray 70 / electrostatic chuck 50 (e.g., Figure 10 If the two match, it is determined that the detection device 40 is centered on the tray 70 / electrostatic chuck 50. Based on the difference between the coordinates of the center 109 of the second sensing area 106 and the coordinates of the center 108 of the detection device 40, the direction and distance of the offset can be further determined; compared with the previous example, no coordinate system transformation is required in this example, and the calculation is simpler.

[0105] like Figure 11 , Figure 12As shown, in the embodiment using the electrostatic chuck 50, at least three non-collinear lifting pins 60 are provided to transmit the detection device 40. That is, when the detection device 40 is carried by these lifting pins 60, the position information of at least three contact points 110 is collected. According to the principle that the three points are concyclic, a ring 120 can be determined. Therefore, based on the position information of the three contact points 110, the coordinates of a ring 120 and its center 121 can be calculated. The coordinates of the center 121 of the ring 120 are compared with the coordinates of the center 108 of the detection device 40 itself or the coordinates of the center 107 of the electrostatic chuck 50. If the two compared coordinates match, it is determined that the detection device 40 is centered on the lifting pins 60 (e.g., ...). Figure 11 If the two coordinates being compared do not match, it is determined that the detection device 40 is not centered on the lifting pin 60 (e.g., Figure 12 The direction and distance of the offset are further determined based on the difference between the compared coordinates, which serves as the basis for adjusting the lifting pin 60 itself or the parameters when the lifting pin 60 moves the detection device 40.

[0106] This invention also provides a calibration method for substrate transfer calibration in semiconductor devices, using the aforementioned detection device 40. The detection device 40 is transferred or placed in a manner substantially the same as that used for transferring or placing the substrate. During transfer or placement within the processing cavity 10, the detection device 40 records the position information of the contact point via a contact sensing device. This position information is analyzed to determine whether the detection device 40 has been correctly transferred or whether it is centered within the processing cavity 10. This provides guidance for further adjusting relevant components of the semiconductor device and improving offset during substrate transfer or placement.

[0107] like Figure 13 As shown, in an embodiment where a tray 70 is used within a semiconductor device, the transfer process to the detection device 40 includes at least one of the following steps:

[0108] Step A1: The detection device 40 is sent into the processing chamber 10 by the robotic arm 30;

[0109] Step A2: The detection device 40 is transferred from the robotic arm 30 to the tray 70 inside the processing chamber 10;

[0110] Step A3: The detection device 40 is supported by the tray 70;

[0111] Step A4: The detection device 40 is transferred from the tray 70 to the robotic arm 30;

[0112] Step A5: The detection device 40 is transmitted from the processing chamber 10 through the robotic arm 30.

[0113] The contact sensing device can perform detection in any one of steps A1 to A5, or in multiple consecutive or multiple discontinuous steps of steps A1 to A5.

[0114] In some examples, steps A1 to A5 can be performed in their entirety, and the detection can be implemented. Alternatively, only steps A1 and A5, involving the input and output of the detection device 40 to the processing cavity 10, can be performed, without actually transferring or placing the detection device 40 onto the tray 70. Alternatively, for the transfer process, detection can be performed only in step A1, where the detection device 40 is input to the processing cavity 10, and not in step A5, where the detection device 40 is output to the processing cavity 10. Alternatively, steps A1 to A5 can be performed in their entirety, but detection can only be performed in step A3 when the tray 70 carries the detection device 40.

[0115] For example, the contact sensing device may perform multiple detections in step A3, such as at least once at the beginning and once at the end of step A3 (i.e., once when the tray 70 begins to contact the detection device 40 and once before the detection device 40 moves to the robotic arm 30), or, in addition to the detections at the beginning and end, one or more additional detections may be performed in the middle of step A3.

[0116] For example, step A0 is included before step A1, corresponding to the process of the robotic arm 30 picking up the detection device 40 from outside the processing cavity 10 and carrying it. Then, the contact sensing device detects at least once at the beginning and end of the input process in which the robotic arm 30 carries the detection device 40 (or, one or more additional detections may be added between the beginning and end); this input process begins when the robotic arm 30 picks up the detection device 40 from outside the processing cavity 10 and ends before transferring the detection device 40 to the tray 70 inside the processing cavity 10.

[0117] After step A5, the robotic arm 30 can transfer the detection device 40 to a designated facility outside the processing cavity 10, such as a device for receiving a substrate processed by a semiconductor device. The contact sensing device of the detection device 40 will detect at least once at the beginning and end of the output process in which the robotic arm 30 carries the detection device 40; this output process begins when the detection device 40 is transferred from the tray 70 to the robotic arm 30, making contact with the robotic arm 30, and ends before the detection device 40 is transferred to the designated facility outside the processing cavity 10.

[0118] like Figure 14 As shown, in the embodiment using the electrostatic chuck 50 and the lifting pin 60, the transfer process of the detection device 40 includes at least one of the following steps:

[0119] Step B1: The detection device 40 is sent into the processing chamber 10 by the robotic arm 30;

[0120] Step B2: The detection device 40 is transferred from the robotic arm 30 to several lifting pins 60;

[0121] Step B3: The detection device 40 descends with the lifting pin 60 and is transferred to the electrostatic chuck 50;

[0122] Step B4: The detection device 40 is supported by the electrostatic chuck 50;

[0123] Step B5: The detection device 40 is transferred from the electrostatic chuck 50 to the lifting pin 60 and is lifted along with the lifting pin 60;

[0124] Step B6: The detection device 40 is transferred from the lifting pin 60 to the robotic arm 30;

[0125] Step B7: The detection device 40 is transmitted from the processing chamber 10 through the robotic arm 30.

[0126] The contact sensing device performs detection in any one of steps B1 to B7, or in multiple consecutive or multiple discontinuous steps within steps B1 to B7.

[0127] In some examples, steps B1 to B7 can be performed in their entirety, and the detection can be implemented. Alternatively, only steps B1 and B7, involving the entry and exit of the detection device 40 into the processing chamber 10, can be performed, without actually transferring or placing the detection device 40 onto the lifting pin 60 or the electrostatic chuck 50. Alternatively, for the transfer process, detection can be performed only in step B1, where the detection device 40 enters the processing chamber 10, and not in step B7, where the detection device 40 exits the processing chamber 10. Alternatively, steps B1 to B7 can be performed in their entirety, but detection can be performed only in steps B3 and B5 when the lifting pin 60 contacts the detection device 40, or only in step B4 when the tray 70 carries the detection device 40, or during the continuous process of steps B3 to B6.

[0128] For example, the contact sensing device may perform multiple detections in step B4, such as at least once at the beginning and once at the end of step B4 (i.e., once when the electrostatic chuck 50 begins to contact the detection device 40 and once before the detection device 40 moves to the lifting pin 60), or, in addition to the detections at the beginning and end, one or more additional detections may be performed in the middle of step B4.

[0129] For example, in steps B2 to B3, the contact sensing device detects at least once when the lifting pin 60 begins and ends its support of the detection device 40, that is, once when the lifting pin 60 contacts the detection device 40, and once before the detection device 40 is transferred to the electrostatic chuck 50 (or one or more additional detections may be added in between).

[0130] For example, in steps B5 to B6, the contact sensing device detects at least once when the lifting pin 60 begins and ends its load on the detection device 40, that is, it detects once when the lifting pin 60 contacts the detection device 40, and also once before the detection device 40 is transferred to the robotic arm 30 (or one or more additional detections may be added in between).

[0131] For example, step B0 is included before step B1, corresponding to the process of the robotic arm 30 picking up the detection device 40 from outside the processing cavity 10 and carrying it. Then, the contact sensing device detects at least once at the beginning and end of the input process in which the robotic arm 30 carries the detection device 40 (or, one or more additional detections may be added between the beginning and end); this input process begins when the robotic arm 30 picks up the detection device 40 from outside the processing cavity 10 and ends before transferring the detection device 40 to the lifting pin 60 inside the processing cavity 10.

[0132] After step B7, the robotic arm 30 can transfer the detection device 40 to a designated facility outside the processing cavity 10. The contact sensing device of the detection device 40 will detect at least once at the beginning and at the end of the output process in which the robotic arm 30 carries the detection device 40 (or, one or more additional detections may be added between the beginning and the end); the output process begins when the detection device 40 is transferred from the lifting pin 60 to the robotic arm 30, making contact with the robotic arm 30, and ends before the detection device 40 is transferred to the designated facility outside the processing cavity 10.

[0133] When the detection device 40 is transferred or placed, the semiconductor processing within the processing cavity 10 can be shut down. Devices involved in the transfer operation, such as the wafer transfer port 20, robotic arm 30, and lifting pin 60, will operate. The tray 70 / electrostatic chuck 50 will only support the detection device 40; functions such as controlling the substrate temperature will not be activated. Functions such as air intake, exhaust, temperature control, and gas dissociation within the processing cavity 10 can also be shut down. Alternatively, if other devices besides those performing the transfer operation are operating simultaneously during the substrate transfer or placement process, these devices can be activated during the transfer or placement of the detection device 40, and the process can be compared with the process when these devices are not activated to determine whether the process of activating these devices will cause the detection device 40 to shift.

[0134] In some embodiments, the detection device 40 is a test substrate, substantially the same as the actual substrate awaiting processing by the semiconductor device, used to test the semiconductor processes performed by the device. In this example, the relevant units of the detection device 40 are arranged on the test substrate, such as a contact sensing device located on the lower surface of the test substrate in contact with the transmission or carrier device. Thus, in addition to undergoing the processing performed on it by the semiconductor device on the carrier device (such as etching or thin film deposition on its upper surface), the test substrate can also serve as the detection device 40 to simulate positional offsets during transmission or placement.

[0135] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A detection device for substrate transfer calibration of semiconductor equipment, characterized in that, The detection device can be transmitted into the processing cavity of a semiconductor device; the detection device includes a contact sensing device configured to record the position information of the contact point of the detection device during transmission or when placed in the processing cavity, for determining whether the detection device is transmitted correctly or whether the detection device is placed in the center of the processing cavity.

2. The detection device as described in claim 1, characterized in that, During transmission, the detection device comes into contact with the transmission device via a contact sensing device.

3. The detection device as described in claim 2, characterized in that, The transmission device includes a robotic arm for carrying the detection device and delivering or transferring the detection device into or out of the processing chamber.

4. The detection device as described in claim 2, characterized in that, The transmission device includes several lifting pins, which are used to support the detection device and drive the detection device to be raised or lowered within the processing cavity.

5. The detection device as described in claim 1, characterized in that, The detection device placed in the processing chamber contacts the electrostatic chuck or tray in the processing chamber through a contact sensing device, and the electrostatic chuck or tray supports the detection device.

6. The detection device as described in claim 1, characterized in that, The detection device has the same vertical projection shape as the substrate awaiting processing by the semiconductor device.

7. The detection device as described in claim 1, characterized in that, The detection device is provided with a notch for indicating the orientation of the detection device; The substrate awaiting processing by the semiconductor device has a notch to indicate the orientation of the substrate; The notch in the detection device is the same as the notch in the substrate.

8. The detection device as described in claim 3, characterized in that, The coefficient of friction of the contact sensing device satisfies: G 基片 µ 基片 = G 检测装置 µ 检测装置 Among them, G 基片 For the gravity of the substrate waiting to be processed by semiconductor equipment, G 检测装置 For the gravity of the detection device, µ 基片 The coefficient of friction between the contact surfaces of the substrate and the robotic arm is μ. 检测装置 The coefficient of friction between the contact surfaces of the detection device and the robotic arm.

9. The detection device as described in claim 1, characterized in that, The contact sensing device includes a pressure sensing device.

10. The detection device as described in claim 9, characterized in that, The pressure sensing device includes an electromagnetic touch sensing unit or a capacitive touch sensing unit.

11. The detection device as claimed in claim 1, characterized in that, The detection device further includes: A processor is used to process the data sensed by the contact sensing device; Storage unit, used to store the data; A signal transmission unit is used to transmit the data to an external control device in a wired or wireless manner when the detection device is transferred outside the processing cavity. The power supply unit is used to provide electrical energy; The control device is used to determine whether the detection device is being transmitted correctly, or whether the detection device is placed in the center of the processing cavity, based on the data transmitted by the detection device.

12. A calibration method for substrate transmission calibration of semiconductor devices, characterized in that, During transmission or when placed in the processing cavity, the detection device according to any one of claims 1 to 11 records the position information of the contact point of the detection device through a contact sensing device, which is used to determine whether the detection device is correctly transmitted or whether the detection device is placed in the center in the processing cavity.

13. The calibration method as described in claim 12, characterized in that, When the detection device is correctly transferred by the robotic arm, the center point of the expected contact area on the detection device that will contact the robotic arm will be used as a reference mark. Based on the position information collected when the detection device is transmitted by the robotic arm, calculate the first sensing area when the detection device is actually in contact with the robotic arm. Calculate the coordinates of the center point of the first sensing area and compare them with the coordinates of the reference mark. Based on the comparison result, determine whether the detection device is offset on the robotic arm.

14. The calibration method as described in claim 12, characterized in that, Based on the position information collected when the detection device comes into contact with the tray or electrostatic chuck, the second sensing area when the detection device is currently actually in contact with the tray or electrostatic chuck is calculated. Calculate the center coordinates of the second sensing area and compare them with the center coordinates of the detection device. Based on whether the comparison results match, determine whether the detection device is centered on the tray or electrostatic chuck. Alternatively, the center coordinates of the second sensing area can be calculated and compared with the center coordinates of the tray or electrostatic chuck. Based on whether the comparison results match, it can be determined whether the detection device is centered on the tray or electrostatic chuck.

15. The calibration method as described in claim 12, characterized in that, The detection device is transmitted by three lifting pins. Based on the position information of the three contact points collected when the detection device contacts the lifting pins, the coordinates of the rings and their centers corresponding to the three contact points are calculated. Compare the center coordinates of the ring with the center coordinates of the detection device, and determine whether the detection device is centered on the lifting pin based on whether the comparison results match. Alternatively, the center coordinates of the ring can be compared with the center coordinates of the electrostatic chuck, and the detection device can be determined to be centered on the lifting pin based on whether the comparison results match.

16. The calibration method as described in claim 12, characterized in that, The transmission process of the detection device includes at least one of the following steps: Step A1: The detection device is sent into the processing chamber by a robotic arm; Step A2: The detection device is transferred from the robotic arm to a tray inside the processing chamber; Step A3: The detection device is supported by the tray; Step A4: The detection device is transferred from the tray to the robotic arm; Step A5: The detection device is transmitted from the processing chamber through the robotic arm; The contact sensing device can perform detection in any one of steps A1 to A5, or in multiple consecutive or multiple discontinuous steps of steps A1 to A5.

17. The calibration method as described in claim 12, characterized in that, The transmission process of the detection device includes at least one of the following steps: Step B1: The detection device is sent into the processing chamber by a robotic arm; Step B2: The detection device is transferred from the robotic arm to several lifting pins; Step B3: The detection device descends with the lifting pin and is transferred to the electrostatic chuck; Step B4: The detection device is carried by the electrostatic chuck; Step B5: The detection device is transferred from the electrostatic chuck to the lifting pin and is lifted along with the lifting pin; Step B6: The detection device is transferred from the lifting pin to the robotic arm; Step B7: The detection device is transmitted from the processing chamber via the robotic arm; The contact sensing device can perform detection in any one of steps B1 to B7, or in multiple consecutive or multiple discontinuous steps of steps B1 to B7.

18. The calibration method as described in claim 12, characterized in that, When the processing chamber is equipped with an electrostatic chuck and a lifting pin, the contact sensing device performs at least one of the following detection operations: Step C1: The contact sensing device shall detect at least once at the beginning and at the end of the first input process in which the robotic arm carries the detection device; the first input process is from the beginning when the robotic arm picks up the detection device from outside the processing cavity to the end before the lifting pin transfers the detection device into the processing cavity. Step C2: The contact sensing device shall detect at least once at the beginning and at the end of the second input process in which the detection device is carried by the lifting pin; the second input process begins when the lifting pin contacts the detection device and ends before the detection device is transferred to the electrostatic chuck. Step C3: The contact sensing device shall detect at least once at the beginning and at the end of the first placement state in which the detection device is carried by the electrostatic chuck; the first placement state begins when the electrostatic chuck contacts the detection device and ends before the detection device is transferred to the lifting pin. Step C4: The contact sensing device shall detect at least once at the beginning and at the end of the first output process in which the detection device is carried by the lifting pin; the first output process begins when the lifting pin contacts the detection device and ends before the detection device is transferred to the robotic arm. Step C5: The contact sensing device shall detect at least once at the beginning and at the end of the second output process in which the detection device is carried by the robotic arm; the second output process begins when the robotic arm contacts the detection device and ends before the detection device is transferred to a designated facility outside the processing chamber.

19. The calibration method as described in claim 12, characterized in that, When a tray is provided inside the processing chamber, the contact sensing device performs at least one of the following detection operations: Step D1: The contact sensing device shall detect the device at least once at the beginning and at the end of the third input process in which the robotic arm carries the detection device; the third input process is from the beginning of the robotic arm taking the detection device from outside the processing cavity to the end of the process before transferring the detection device to the tray inside the processing cavity. Step D2: The contact sensing device shall detect at least once at the beginning and at the end of the second placement state in which the detection device is carried by the tray; the second placement state begins when the tray contacts the detection device and ends before the detection device is transferred to the robotic arm. Step D3: The contact sensing device shall detect at least once at the beginning and at the end of the third output process in which the detection device is carried by the robotic arm; the third output process begins when the robotic arm contacts the detection device and ends before the detection device is transferred to a designated facility outside the processing chamber.

20. The calibration method according to any one of claims 12 to 19, characterized in that, During the transmission process of the detection device and / or when the detection device is placed in the processing cavity, the semiconductor processing process in the processing cavity is either in a closed state or an open state. When the semiconductor processing is in the on state, the position information recorded by the contact sensing device is also used to determine whether the process will cause the detection device to shift.

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