A thermal management device for a laser and method thereof

Abstract

The application discloses a heat management device for a laser and a method thereof, the heat management device comprising a compressor, a condensing assembly and a direct cooling plate for forming a refrigeration cycle circuit for circulating refrigerant to provide cold energy for heat generating components of the laser, and the direct cooling plate comprising a cold storage unit for storing cold energy before the laser is started or when the temperature of the cold storage unit is greater than a first temperature threshold after the laser is started. In the application, the cold storage unit is additionally arranged to store cold energy in advance, so that the refrigeration capacity of the refrigeration cycle circuit when the laser is started can be improved, and the problem of insufficient cold energy of the existing refrigeration system when the laser is started or the ambient temperature changes sharply can be solved.

Description

Technical Field

[0001] This invention relates to the field of laser technology, and more particularly to a thermal management device and method for lasers. Background Technology

[0002] Water cooling is currently a widely used cooling solution for lasers, and it has a good heat dissipation effect. However, as the power of lasers increases, the heat flux density also increases, and the heat dissipation effect of water cooling systems is gradually unable to meet the heat dissipation requirements of high-power lasers with high heat flux density.

[0003] To achieve better heat dissipation, compressed refrigerant cooling can be used to cool the laser, especially to directly cool the laser pump source.

[0004] However, when the laser is first turned on or the ambient temperature rises sharply due to surrounding factors, the cooling capacity provided by the compressed refrigerant cooling system is insufficient, which makes it impossible to quickly meet the heat dissipation requirements of the laser pump source, thus affecting the laser's output quality. Summary of the Invention

[0005] This invention provides a thermal management device and method for lasers to improve the heat dissipation effect of lasers and solve the problem of insufficient cooling capacity in existing cooling systems when the laser is turned on or when the ambient temperature changes drastically.

[0006] According to one aspect of the present invention, a thermal management device for a laser is provided, the thermal management device comprising a compressor, a condenser assembly, and a direct cooling plate for forming a refrigeration cycle, the refrigeration cycle for supplying refrigerant to provide cooling for the heat-generating components of the laser, the direct cooling plate comprising a cold storage unit, the cold storage unit storing the cooling before the laser is turned on; or, the cold storage unit storing the cooling when the temperature of the cold storage unit is greater than a first temperature threshold after the laser is turned on.

[0007] As a preferred embodiment, the direct cooling plate further includes an evaporation unit, the evaporation unit and the cold storage unit are respectively and independently disposed within the direct cooling plate, and the direct cooling plate is fitted to the heating component.

[0008] As a preferred embodiment, the temperature of the heating element is maintained within the target range by controlling the conduction state of the evaporation unit and / or the conduction state of the cold storage unit.

[0009] As a preferred embodiment, when the evaporation unit is in the conducting state, the direct cooling plate releases the cooling energy generated by the evaporated refrigerant to cool the heating component;

[0010] When the cold storage unit is in the conducting state, the cold storage unit stores the cold energy generated by the evaporating refrigerant;

[0011] When the cold storage unit is in an off state, it can also pre-cool the evaporation unit by releasing the stored cold energy to the heating element, thereby achieving a faster start-up speed.

[0012] As a preferred embodiment, the cold storage unit includes at least a cold storage channel and a first solenoid valve. The first solenoid valve is installed between the output end of the condensation component and the inlet end of the cold storage channel. The cold storage channel includes a first refrigerant pipe and a first phase change material layer filled between the outer wall of the first refrigerant pipe and the inner wall of the cold storage channel.

[0013] The evaporation unit includes at least an evaporation channel and a second solenoid valve; the second solenoid valve is installed between the output end of the condensation assembly and the inlet end of the evaporation channel, and the evaporation channel includes a second refrigerant pipe and a second phase change material layer filled between the outer wall of the second refrigerant pipe and the inner wall of the evaporation channel.

[0014] As another aspect of this application, a thermal management method for a laser is also proposed, applied to the thermal management device as described in any of the preceding claims, wherein the direct cooling plate further includes an evaporation unit, and the thermal management method includes:

[0015] When the laser is in standby mode, the cold storage unit is controlled to store the cold energy, and the cold storage unit is controlled to release the cold energy to the heat-generating component according to the operating temperature of the laser.

[0016] When the laser is turned on, the cold storage unit and the evaporation unit are controlled to release the cold energy;

[0017] When the laser is running stably, the cold storage unit is controlled to store cold energy based on the real-time temperature of the cold storage unit.

[0018] As a preferred embodiment, the cold storage unit includes at least a cold storage channel and a first solenoid valve, wherein the first solenoid valve is installed between the output end of the condensation assembly and the inlet end of the cold storage channel; the thermal management method further includes:

[0019] When the laser is in standby mode, the first solenoid valve is controlled to switch to the open state;

[0020] When the laser is turned on, if the temperature of the cold storage unit is greater than the first temperature threshold, the first solenoid valve is controlled to switch to the open state.

[0021] As a preferred embodiment, the cold storage channel includes a first refrigerant pipe and a first phase change material layer filled between the outer wall of the first refrigerant pipe and the inner wall of the cold storage channel; the thermal management method further includes:

[0022] When the temperature of the first phase change material layer is lower than the second temperature threshold, the first solenoid valve is controlled to switch to the closed state, where the second temperature threshold is lower than the first temperature threshold.

[0023] As a preferred option, it also includes:

[0024] When the laser is turned on, if the heating rate of the first phase change material layer is higher than the cooling rate of the heating component, the first solenoid valve is controlled to switch to the open state.

[0025] As a preferred embodiment, the evaporation unit includes at least an evaporation channel and a second solenoid valve, the second solenoid valve being installed between the output end of the condensation assembly and the inlet end of the evaporation channel; the thermal management method further includes:

[0026] When the laser is in standby mode, the second solenoid valve is controlled to switch to the open state, wherein the opening time of the second solenoid valve is equal to or later than the opening time of the cold storage unit storing the cold energy.

[0027] When the laser is powered on, the second solenoid valve is switched to the open state.

[0028] In this embodiment of the invention, the thermal management device includes a compressor, a condenser assembly, and a direct cooling plate for forming a refrigeration cycle. The refrigeration cycle provides refrigerant to supply cooling for the heat-generating components of the laser. The direct cooling plate includes a cold storage unit that stores cold energy before the laser is turned on; or, the cold storage unit stores cold energy after the laser is turned on when its temperature exceeds a first temperature threshold. By adding a cold storage unit for pre-cooling, this invention increases the cooling capacity of the refrigeration cycle when the laser is turned on, solving the problem of insufficient cooling capacity in existing refrigeration systems when the laser is turned on or when the ambient temperature changes drastically. The direct cooling plate also includes an evaporation unit. By controlling the conduction state of the evaporation unit and / or the cold storage unit, the refrigerant condensed by the condenser assembly flows into the corresponding unit and is evaporated therein. Since the heat-generating components of the laser are mounted on the cooling surface of the direct cooling plate, the temperature of the heat-generating components can be controlled and maintained within the target range. This effectively increases the cooling capacity of the refrigeration cycle, ensuring that the temperature of the heat-generating components and its rate of temperature change remain within an ideal or stable range, thereby consistently guaranteeing the light output quality of the laser.

[0029] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of a thermal management device provided in an embodiment of the present invention;

[0032] Figure 2 yes Figure 1 Schematic diagram of the heating element and the direct cooling plate;

[0033] Figure 3 This is a schematic diagram of a refrigeration cycle circuit provided in an embodiment of the present invention;

[0034] Figure 4 This is a schematic diagram of a direct cooling plate provided in an embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram of another direct cooling plate provided in an embodiment of the present invention;

[0036] Figure 6 This is a schematic diagram of another type of direct cooling plate provided in an embodiment of the present invention;

[0037] Figure 7 This is a schematic diagram of a thermal management method provided in an embodiment of the present invention. Detailed Implementation

[0038] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0040] Figure 1 This is a schematic diagram of a thermal management device for a laser provided in an embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of the heat-generating component and the direct cooling plate. This embodiment is applicable to situations requiring heat dissipation from the laser 101. Figure 1 and Figure 2 As shown, the thermal management device includes a compressor 104, a condenser assembly 105, and a direct cooling plate 106 for forming a refrigeration cycle 103. The refrigeration cycle 103 is used to supply refrigerant to provide cooling for the heat-generating component 101a of the laser 101. The direct cooling plate 106 includes a cold storage unit 108, which stores cold energy before the laser 101 is turned on; or, the cold storage unit 108 stores cold energy after the laser 101 is turned on and its temperature is greater than a first temperature threshold to overcome the problem of insufficient cooling energy at startup and to improve the cooling efficiency of the laser after startup.

[0041] It is understandable that a first temperature threshold is preset in the thermal management device. If the temperature of the cold storage unit 108 is higher than the first temperature threshold, it indicates that the temperature of the cold storage unit 108 is too high, and the amount of cooling it produces is insufficient to effectively dissipate heat from the heat-generating component 101a. Therefore, when the laser 101 is turned on, if the temperature of the cold storage unit 108 is detected to be higher than the first temperature threshold, the refrigerant can be controlled to flow through the cold storage unit 108 to store cooling capacity for use in cooling, achieving intermittent charging of the cold storage unit 108 and thus helping the heat-generating component 101a to effectively dissipate heat. Relevant personnel should design the first temperature threshold reasonably according to the product requirements; details will not be elaborated here.

[0042] The thermal management device of this invention includes a compressor, a condenser assembly, and a direct-cooling plate for forming a refrigeration cycle. The refrigeration cycle is used to supply refrigerant to provide cooling for the heat-generating components of the laser. The direct-cooling plate includes a cold storage unit, which stores cold energy before the laser is turned on; or, the cold storage unit stores cold energy after the laser is turned on when its temperature exceeds a first temperature threshold. By adding a cold storage unit for pre-storage, this invention increases the cooling capacity of the refrigeration cycle when the laser is turned on, solving the problem of insufficient cooling capacity in existing refrigeration systems when the laser is turned on or when the ambient temperature changes drastically.

[0043] Please continue to refer to Figure 1 The direct cooling plate 106 also includes an evaporation unit 107, which and the cold storage unit 108 are independently disposed within the direct cooling plate, and the direct cooling plate is attached to the heating element. This invention controls the temperature of the heating element 101a to remain within the target range by controlling the conduction state of the evaporation unit 107 and / or the cold storage unit 108, allowing the refrigerant condensed by the condensation assembly 105 to flow into the corresponding unit and be evaporated by that unit.

[0044] Specifically, when the evaporation unit 107 is in the conducting state, the direct cooling plate 106 releases the cold energy generated by the evaporated refrigerant to cool the heating component 101a; when the cold storage unit 108 is in the conducting state, the cold storage unit 108 stores the cold energy generated by the evaporated refrigerant; when the cold storage unit 108 is in the non-conducting state, the cold storage unit 108 can also pre-cool the evaporation unit by releasing the stored cold energy to the heating component 101a to achieve a faster start-up speed.

[0045] In this embodiment, the laser 101 is capable of emitting laser light, and the present invention does not specifically limit the type of laser light emitted by the laser 101. For example, a thermal management device can be used in a fiber laser, in which case the laser 101 is capable of emitting fiber laser light. The laser 101 includes at least one heat-generating component 101a, which may be at least one of a pump source and an optical path module, but is not limited thereto. It is understood that the heat-generating component 101a of the laser 101 may also include other functional components in the laser that generate heat and require heat dissipation.

[0046] For some lasers, when they are first turned on or under high-temperature conditions even when not turned on, their heat-generating components require heat dissipation. The technical solution of this application addresses this by addressing the heat dissipation requirements of the evaporation unit.

[0047] Both the heat storage unit and the cold energy storage unit are in a non-conductive state. The heat storage unit can also control the temperature of the heating element by releasing the stored cold energy to it, thus maintaining the temperature within the target range. It should be noted that the high-temperature operating condition of a laser refers to its state in a high-temperature environment. In a high-temperature environment, the laser's light output performance may be affected. For some fiber lasers, the optimal operating temperature range is 18℃~30℃, and the corresponding high-temperature operating condition refers to a state above 30℃ (e.g., 40℃ or 50℃).

[0048] The thermal management device includes a phase change refrigeration assembly 102, which includes at least a compressor 104, a condenser assembly 105, and a direct cooling plate 106. The components in the phase change refrigeration assembly 102 are connected by refrigerant pipes, and the resulting loop is a refrigeration cycle loop 103. That is, the refrigeration cycle loop 103 includes at least a compressor 104, a condenser assembly 105, and a direct cooling plate 106, as well as refrigerant pipes connecting the components. The refrigeration cycle loop 103 is used to supply refrigerant to provide cooling for the heat-generating component 101a of the laser 101, and this cooling can dissipate heat from the heat-generating component 101a of the laser 101. Specifically, the output end of compressor 104 is connected to the input end of condenser assembly 105 via a refrigerant pipe. That is, compressor 104 compresses low-temperature, low-pressure gaseous refrigerant into high-temperature, high-pressure gaseous refrigerant and outputs it to condenser assembly 105. The output end of condenser assembly 105 is connected to the input end of direct cooling plate 106 via a refrigerant pipe. That is, condenser assembly 105 condenses high-temperature, high-pressure gaseous refrigerant into low-temperature, low-pressure gas-liquid two-phase refrigerant and outputs it to direct cooling plate 106. The output end of direct cooling plate 106 is connected to the input end of compressor 104 via a refrigerant pipe. That is, after heat exchange with low-temperature, low-pressure gas-liquid two-phase refrigerant, direct cooling plate 106 outputs the heat-exchanged refrigerant to compressor 104. The refrigeration cycle loop 103 realizes the refrigeration cycle through the flow of refrigerant in various components.

[0049] Figure 3 This is a schematic diagram of a refrigeration cycle circuit provided in an embodiment of the present invention, as shown below. Figure 3As shown, in the refrigeration cycle loop 103, the optional condensing assembly 105 includes at least a condenser 111, a liquid receiver 112, and a throttle valve 113. The condenser 111, the liquid receiver 112, and the throttle valve 113 are connected in series via refrigerant pipes. The input end of the condenser 111 is connected to the output end of the compressor 104 via a refrigerant pipe, and the output end of the throttle valve 113 is connected to the direct cooling plate 106 via a refrigerant pipe. The refrigerant flow path in the refrigeration cycle loop 103 is as follows: Low-temperature, low-pressure gaseous refrigerant is compressed into high-temperature, high-pressure gaseous refrigerant within the compressor 104; the high-temperature, high-pressure gaseous refrigerant flows into the condenser 111 through the refrigerant pipe, where heat exchange cools it into medium-temperature, high-pressure liquid refrigerant; the medium-temperature, high-pressure liquid refrigerant enters the liquid receiver 112; the medium-temperature, high-pressure liquid refrigerant in the liquid receiver 112 reaches the expansion valve 113, where throttling transforms it into low-temperature, low-pressure gas-liquid two-phase refrigerant; the low-temperature, low-pressure gas-liquid two-phase refrigerant enters the direct cooling plate 106; after heat exchange with the low-temperature, low-pressure gas-liquid two-phase refrigerant, the direct cooling plate 106 transforms it into low-temperature, low-pressure gaseous refrigerant and enters the compressor 104. This completes the entire refrigeration cycle. This is understandable. Figure 3 The refrigeration cycle circuit 103 shown is merely an illustration, and the structure of the refrigeration cycle circuit 103 of the thermal management device in this invention is not limited to... Figure 3 As shown.

[0050] The direct cooling plate 106 is bonded to the heat-generating component 101a to cool it. Specifically, the optional laser 101 includes at least two heat-generating components 101a, namely a pump source 101a1 and an optical path module 101a2. The pump source 101a1 and the optical path module 101a2 can be disposed on opposite sides of the direct cooling plate 106 and bonded to it. The direct cooling plate 106 can cool the pump source 101a1 and the optical path module 101a2. In other embodiments, depending on the product requirements, the two heat-generating components can also be disposed on the same side of the direct cooling plate. The present invention does not specifically limit the bonding position or bonding method of multiple heat-generating components with the direct cooling plate. For example, a film layer or other structure that facilitates heat dissipation can also be added between the heat-generating components and the direct cooling plate.

[0051] The direct cooling plate 106 is coupled to the laser 101. Specifically, the direct cooling plate 106 and the laser 101 can be electrically connected through a control component (not shown in the figure). The control component can communicate with the direct cooling plate 106 and the laser 101. The control component can control the operation of the laser 101, and can also control the operation of the direct cooling plate 106 based on the signal from the laser 101. Furthermore, the control component can adjust the operating parameters of the direct cooling plate 106 based on the feedback signal from the direct cooling plate 106. In other embodiments, the control component can be optionally integrated into the direct cooling plate or integrated into the laser. In this case, the direct cooling plate is directly electrically connected to the control component in the laser, or the laser is directly electrically connected to the control component in the direct cooling plate. It should be noted that the thermal management device is equipped with a cooling control component, and the control of each component in the thermal management device can be executed by the cooling control component.

[0052] The evaporation unit 107 and the cold storage unit 108 are each independently disposed within the direct cooling plate 106. The input end of the evaporation unit 107 is connected to the output end of the condenser assembly 105 via a refrigerant pipe, and the input end of the cold storage unit 108 is also connected to the output end of the condenser assembly 105 via a refrigerant pipe. The refrigerant pipe connected to the output end of the condenser assembly 105 can be a T-junction pipe with three ports: one input port and two output ports. The input port of the T-junction pipe connects to the output end of the condenser assembly 105, one output port connects to the input end of the evaporation unit 107, and the other output port connects to the input end of the cold storage unit 108. The refrigerant output from the condenser assembly 105 can enter both the evaporation unit 107 and the cold storage unit 108.

[0053] The output of the evaporator unit 107 is connected to the input of the compressor 104 via a refrigerant pipe, and the output of the cold storage unit 108 is also connected to the input of the compressor 104 via a refrigerant pipe. The refrigerant pipe connected to the input of the compressor 104 can be a T-junction pipe, with its three ports serving as two input ports and one output port. One input port of the T-junction pipe is connected to the output of the evaporator unit 107, the other input port is connected to the output of the cold storage unit 108, and the output port is connected to the input of the compressor 104. The refrigerant output from the evaporator unit 107 and the refrigerant output from the cold storage unit 108 can enter the compressor 104.

[0054] Lasers generally have three states: off, standby, and on. The thermal management device of this application operates according to the state of the laser. It can be understood that when the laser 101 is off, the cooling cycle loop 103 in the thermal management device stops operating; when the laser 101 is in standby or on, the cooling cycle loop 103 operates. The standby state of the laser 101 is the state before the laser 101 is turned on.

[0055] Specifically, in the embodiments of this application, when the laser 101 is in standby mode, the thermal management device is activated, the cooling cycle loop 103 operates to allow refrigerant to circulate, and the refrigerant is controlled to flow through the cold storage unit 108. The cold storage unit 108 evaporates the refrigerant condensed by the condensing component 105 and stores the cold energy generated by the evaporation, that is, the cold storage unit 108 performs pre-cooling. When the laser 101 is in power-on mode, the thermal management device is activated, the cooling cycle loop 103 operates to allow refrigerant to circulate, the evaporation unit 107 / evaporation unit 107 and the cold storage unit 108 evaporate the refrigerant condensed by the condensing component 105 and release the cold energy generated during the evaporation process to the heat-generating component 101a for heat dissipation of the laser 101.

[0056] Specifically, in the standby state of the laser 101, the cooling cycle loop 103 is in operation. By controlling the refrigerant pipeline between the cold storage unit 108 and the condenser assembly 105 to operate, the refrigerant output by the condenser assembly 105 can flow through the cold storage unit 108, and the cold storage unit 108 can store cold energy to achieve cold storage before startup.

[0057] When the laser 101 is powered on, the cooling cycle loop 103 remains operational. By controlling the refrigerant pipe between the evaporation unit 107 and the condensation assembly 105, i.e., controlling the evaporation unit 107 to operate, the refrigerant output from the condensation assembly 105 can flow through the evaporation unit 107, causing the evaporation unit 107 to generate cooling capacity, thus achieving cooling during startup. Clearly, when the laser 101 is powered on, the cold storage unit 108 can participate in cooling, and the refrigerant entering the evaporation unit 107 can also provide cooling. Therefore, the direct cooling plate 106 can provide a large amount of cooling capacity when the laser 101 is powered on, quickly cooling the heat-generating component 101a mounted on the direct cooling plate 106, thereby effectively dissipating heat from the powered-on laser 101 and preventing the laser 101 and its heat-generating component 101a from rapidly increasing in temperature and malfunctioning. The evaporation unit 107 is also used to release cooling energy to the heat-generating component 101a of the laser 101 when the laser 101 is in a high-temperature operating condition, so as to avoid the laser 101 being too hot in the standby state, thereby affecting the startup speed.

[0058] Specifically, when the laser 101 is first powered on, the power of its heat-generating component 101a rises rapidly, and the corresponding power change rate rises rapidly as well. This causes the temperature of the heat-generating component 101a to rise rapidly. Furthermore, the rapid temperature rise of the heat-generating component 101a also causes the surrounding environment to heat up rapidly due to external factors. If the cooling loop 103 is insufficient, the cooling efficiency of the heat-generating component 101a in the laser 101 will be low, causing the temperature of the heat-generating component 101a to rise continuously and rapidly. This will affect the output wavelength of the heat-generating component 101a, such as the pump source, and may even lead to an alarm shutdown due to overheating. Temperature interference with the output wavelength of the heat-generating component 101a, such as the pump source, will also reduce the light output quality of the laser 101. Therefore, the heat dissipation requirement for the heat-generating component 101a is high when the laser 101 is first powered on.

[0059] In this embodiment, by adding a cold storage unit 108 to store cold energy in advance when the laser 101 is in standby mode, the evaporation unit 107 can perform cooling when the laser 101 is turned on. Simultaneously, the cold energy stored in the cold storage unit 108 can also be used for cooling, increasing the cooling capacity of the cooling cycle 103 and rapidly cooling and dissipating heat from the heat-generating component 101a, thereby reducing the heating rate of the laser 101. Furthermore, if the temperature of the cold storage unit 108 is higher than a first temperature threshold when the laser 101 is turned on, it indicates that the cold energy stored in the cold storage unit 108 is insufficient. In this case, the cold storage unit 108 can be controlled to store cold energy again to replenish the cold energy, stabilizing the cooling capacity of the cooling cycle 103 and preventing insufficient cold energy. This rapidly reduces the heating rate of the heat-generating component 101a mounted on the direct cooling plate 106. In this way, the laser 101 and its heat-generating component 101a can be cooled and dissipated more effectively, avoiding the problem of the heat-generating component 101a being too hot and affecting the output wavelength or even causing an alarm shutdown, thus meeting the high heat dissipation requirements of the laser 101.

[0060] In this embodiment of the invention, the refrigeration cycle includes at least a compressor, a condenser assembly, and a direct cooling plate. The heat-generating component of the laser is mounted on the cooling surface of the direct cooling plate, which includes an evaporation unit and a cold storage unit. When the laser is in standby mode, the refrigeration cycle operates, and the cold storage unit can be controlled to store cold energy in advance. When the laser is turned on, the refrigeration cycle operates, and the refrigerant can be controlled to flow through the evaporation unit to cool it. At the same time, the cold energy stored in the cold storage unit can also be used for cooling. In addition, when the laser is turned on, if the temperature of the cold storage unit is greater than a first temperature threshold, the cold storage unit can be controlled to store cold energy multiple times for intermittent cold energy replenishment. This effectively improves the cooling capacity of the refrigeration cycle. In this embodiment of the invention, by adding a cold storage unit to pre-store cold during laser standby and intermittently charging the cold storage unit when the laser is turned on, the cooling capacity of the cooling cycle can be increased, thereby effectively cooling and dissipating heat from the heat-generating components of the laser. In particular, it can quickly reduce the heating rate of the heat-generating components, better stabilize the temperature of the heat-generating components, and thus ensure that the output wavelength of the heat-generating components is not disturbed, improving the light output quality of the laser. This solves the problem of insufficient cooling capacity in existing cooling systems when the laser is turned on, and ensures that the temperature of the heat-generating components and its temperature change rate are always kept within an ideal or stable range, thereby stably guaranteeing the light output quality of the laser.

[0061] Specifically, Figure 4 This is a schematic diagram of a direct cooling plate provided in an embodiment of the present invention, as shown below. Figure 4 As shown, the cold storage unit 108 in the direct cooling plate 106 includes at least a cold storage channel 121 and a first solenoid valve 122. The first solenoid valve 122 is installed between the output end of the condensing assembly 105 and the inlet end of the cold storage channel 121.

[0062] In this embodiment, each flow channel inside the direct cooling plate 106 is a micro-flow channel. The cold storage flow channel 121 of the cold storage unit 108 can be a phase change tank or a micro-pipe. The cold storage flow channel 121 is a refrigerant flow channel.

[0063] The first solenoid valve 122 is controlled to open or close. The first solenoid valve 122 is installed between the output end of the condenser assembly 105 and the inlet end of the cold storage channel 121. When the first solenoid valve 122 is opened, the refrigerant output from the condenser assembly 105 enters the cold storage channel 121; when the first solenoid valve 122 is closed, the refrigerant output from the condenser assembly 105 does not enter the cold storage channel 121.

[0064] The direct cooling plate 106 is used to control the first solenoid valve 122 to switch to the open state when the laser 101 is in standby mode. Then the refrigerant output by the condenser assembly 105 enters the cold storage channel 121, and the cold storage unit 108 enters the working state, that is, the cold storage unit 108 can store cold energy to achieve cold storage before startup.

[0065] When the laser 101 is turned on, the cold energy stored in the cold storage unit 108 can be used for cooling, and the refrigerant entering the evaporation unit 107 can also be used for cooling. Thus, the cooling cycle loop 103 can provide a large amount of cooling capacity when the laser 101 is turned on, which can quickly cool and dissipate heat from the heat-generating component 101a installed on the direct cooling plate 106, thereby effectively dissipating heat from the laser 101 during the turn-on process and avoiding the problem of rapid temperature rise and failure of the laser 101 and its heat-generating components such as the pump source.

[0066] When the laser 101 is powered on, the direct cooling plate 106 can intermittently control the first solenoid valve 122 to open. Specifically, if the temperature of the cold storage unit 108 is higher than the first temperature threshold, it indicates that the cold energy stored in the cold storage unit 108 is too small. In this case, the direct cooling plate 106 can control the first solenoid valve 122 to switch to the open state again, so that the cold storage unit 108 can store cold energy to replenish the cold energy during the power-on process.

[0067] Figure 5 This is a schematic diagram of another direct cooling plate provided in an embodiment of the present invention, as shown below. Figure 5 As shown, the optional cold storage channel 121 includes a first refrigerant pipe 123 and a first phase change material layer 124 filled between the outer wall of the first refrigerant pipe 123 and the inner wall of the cold storage channel 121.

[0068] In this embodiment, a first refrigerant pipe 123 for circulating refrigerant is disposed within the cold storage channel 121. The outer wall of the first refrigerant pipe 123 is wrapped with a first phase change material layer 124. Specifically, the material of the first phase change material layer 124 is filled between the outer wall of the first refrigerant pipe 123 and the inner wall of the cold storage channel 121. This invention does not specifically limit the phase change material constituting the first phase change material layer 124; any phase change material applicable to lasers falls within the protection scope of this invention.

[0069] When the first solenoid valve 122 is opened, the refrigerant output from the condensing assembly 105 enters the first refrigerant pipe 123. Correspondingly, the temperature of the first phase change material layer 124 decreases under the influence of the refrigerant in the first refrigerant pipe 123, thus storing cold energy. When the first solenoid valve 122 is closed, the refrigerant output from the condensing assembly 105 cannot enter the first refrigerant pipe 123. Consequently, the cold energy stored in the cold storage unit 108 gradually decreases, and the temperature of the cold storage unit 108 rises, meaning the temperature of the first phase change material layer 124 gradually increases. Specifically, the first phase change material layer 124 has a phase change temperature threshold, which is the critical temperature at which the phase change material undergoes a phase change. The first temperature threshold can be higher than the phase change temperature threshold. The direct cooling plate 106 is used to control the first solenoid valve 122 to switch to the open state when the temperature of the first phase change material layer 124 is higher than the first temperature threshold, allowing the cold storage unit 108 to store cold energy.

[0070] It should be noted that the cold storage unit 108 may be equipped with a temperature sensor to collect the temperature of the first phase change material layer 124, and there is no specific limitation on the location of the temperature sensor.

[0071] refer to Figure 3 As shown, the optional evaporation unit 107 includes at least an evaporation channel 131 and a second solenoid valve 132, which is installed between the output end of the condensation assembly 105 and the inlet end of the evaporation channel 131.

[0072] In this embodiment, the on / off state of the second solenoid valve 132 is controlled. The second solenoid valve 132 is installed between the output end of the condensing assembly 105 and the inlet end of the evaporation channel 131. When the second solenoid valve 132 is open, the refrigerant output by the condensing assembly 105 enters the evaporation channel 131; when the second solenoid valve 132 is closed, the refrigerant output by the condensing assembly 105 does not enter the evaporation channel 131. The direct cooling plate 106 is used to control the second solenoid valve 132 to switch to the open state when the laser 101 is started, so that the refrigerant output by the condensing assembly 105 enters the evaporation channel 131, and the evaporation unit 107 performs cooling to provide cooling and heat dissipation for the heat-generating component 101a of the laser 101. The evaporation unit 107 and the cold storage unit 108 are relatively independent.

[0073] The optional evaporation channel includes a second refrigerant pipe and a second phase change material layer filled between the outer wall of the second refrigerant pipe and the inner wall of the evaporation channel.

[0074] In this embodiment, a second refrigerant pipe for circulating refrigerant is disposed within the evaporation channel. The outer wall of the second refrigerant pipe is wrapped with a second phase change material layer. Specifically, the material of the second phase change material layer fills the space between the outer wall of the second refrigerant pipe and the inner wall of the evaporation channel. This invention does not specifically limit the phase change material constituting the second phase change material layer; any phase change material applicable to lasers falls within the protection scope of this invention. The phase change materials of the second phase change material layer and the first phase change material layer can be the same or different.

[0075] Figure 6 This is a schematic diagram of another type of direct cooling plate provided in an embodiment of the present invention, as shown below. Figure 6 As shown, the evaporation channels of the evaporation unit 107 and the cold storage channels of the cold storage unit 108 in the direct cooling plate 106 are integrated together, but they can be arranged in staggered layers without interfering with each other. The refrigerant enters from the inlet end 107A of the evaporation channel of the evaporation unit 107, undergoes heat exchange, and then exits from the outlet end 107B of the evaporation channel of the evaporation unit 107. The refrigerant enters from the inlet end 108A of the cold storage channel of the cold storage unit 108, undergoes heat exchange, and then exits from the outlet end 108B of the cold storage channel of the cold storage unit 108.

[0076] Based on the same inventive concept, embodiments of the present invention also provide a thermal management method, which is performed in the standby and power-on states of the laser, and is particularly suitable for heat dissipation of the laser. The thermal management method can be executed by a cooling control component and applied in the thermal management device described in any of the above embodiments. The cooling control component can be implemented in hardware and / or software and can be configured in the thermal management device described in any of the embodiments of the present invention.

[0077] Figure 7 This is a schematic diagram of a thermal management method provided in an embodiment of the present invention, such as... Figure 7 As shown, the thermal management method includes:

[0078] Step 210: When the laser is in standby mode, control the cold storage unit to store cold energy, and control whether the cold storage unit releases cold energy to the heat-generating components according to the laser's operating temperature.

[0079] Step 220: When the laser is turned on, control the cold storage unit and the evaporation unit to release cold energy;

[0080] Step 230: When the laser is running stably, control whether the cold storage unit stores cold energy based on the real-time temperature of the cold storage unit.

[0081] It is understood that in this embodiment, the direct cooling plate includes a cold storage unit and an evaporation unit. In the standby state of the laser, the refrigeration cycle loop is in operation. The direct cooling plate can control the refrigerant pipeline between the cold storage unit and the condensation component, that is, control the refrigerant to flow through the cold storage unit. Then the cold storage unit can store cold energy to achieve cold storage before startup. Furthermore, the cold storage unit can control whether to release cold energy to the heat-generating components according to the laser's operating temperature.

[0082] Specifically, when the laser is operating at high temperatures, the cold storage unit releases the stored cold energy to the heat-generating components. When the laser is operating at normal operating temperature, the cold storage unit only needs to store cold energy without releasing it to the heat-generating components, thus maintaining the temperature of the heat-generating components within the target range.

[0083] When the laser is powered on, the cooling cycle remains operational. The direct cooling plate controls the refrigerant flow between the evaporator and condenser components, allowing the refrigerant to flow through the evaporator and generate cooling capacity. Clearly, when the laser is powered on, the cold storage unit can contribute to cooling, and the refrigerant flowing through the evaporator generates cooling capacity. Thus, the direct cooling plate provides a large amount of cooling capacity when the laser is powered on, quickly cooling the heat-generating components mounted on it.

[0084] When the laser is powered on, if the temperature of the cold storage unit is higher than the first temperature threshold, it means that the cold energy stored in the cold storage unit is too low. The cold storage unit can then be controlled to store cold energy again to replenish the cold energy. In this way, the cold energy of the refrigeration cycle can be replenished through the intermittent charging of the cold storage unit, thus avoiding the problem of insufficient cold energy.

[0085] The thermal management method provided in this invention adds a cold storage unit to the direct cooling plate. When the laser is in standby or on, the cold storage unit stores cold energy, which increases the cooling capacity of the cooling cycle and solves the problem of high laser temperature caused by insufficient cooling. This effectively cools the laser and ensures that the temperature of heat-generating components such as the pump source is always kept within the ideal range, thereby stably ensuring the laser's output quality.

[0086] The optional cold storage unit includes at least a cold storage channel and a first solenoid valve, the first solenoid valve being installed between the output end of the condensation assembly and the inlet end of the cold storage channel; the thermal management method further includes:

[0087] When the laser is in standby mode, the first solenoid valve is switched to the open state.

[0088] When the laser is turned on, if the temperature of the cold storage unit is greater than the first temperature threshold, the first solenoid valve is switched to the open state.

[0089] The optional cold storage channel includes a first refrigerant pipe and a first phase change material layer filled between the outer wall of the first refrigerant pipe and the inner wall of the cold storage channel; the thermal management method further includes:

[0090] When the temperature of the first phase change material layer is lower than the second temperature threshold, the first solenoid valve is controlled to switch to the closed state, and the second temperature threshold is lower than the first temperature threshold.

[0091] Optional thermal management methods also include: when the laser is turned on, if the heating rate of the first phase change material layer is higher than the cooling rate of the heat-generating component, controlling the first solenoid valve to switch to the open state.

[0092] The optional evaporation unit includes at least an evaporation channel and a second solenoid valve, the second solenoid valve being installed between the output end of the condensation assembly and the inlet end of the evaporation channel; the thermal management method also includes:

[0093] When the laser is in standby mode, the second solenoid valve is switched to the open state, wherein the opening time of the second solenoid valve is equal to or later than the opening time of the cold storage unit storing cold energy.

[0094] When the laser is powered on, the second solenoid valve is switched to the open state.

[0095] refer to Figure 3 As shown, the working process of the thermal management method is as follows:

[0096] When the laser is in standby mode, the cooling cycle loop 103 operates; the first solenoid valve 122 of the cold storage unit 108 is opened, and the second solenoid valve 132 of the evaporation unit 107 is closed; the opening of the throttle valve 113 is adjusted to charge the cold storage unit 108; when the temperature of the cold storage unit 108 drops to the preset temperature Ta, i.e., the second temperature threshold, the first solenoid valve 122 can be closed to stop cold storage; when the temperature of the cold storage unit 108 rises to the preset temperature Tb, i.e., the first temperature threshold, the first solenoid valve 122 can be restarted to charge the cold storage unit 108 again; thus, the first solenoid valve 122 is activated intermittently to charge the cold storage unit 108 according to its temperature, which can avoid increasing energy consumption during long-term operation. Here, the second temperature threshold is less than the phase change temperature threshold, and the phase change temperature threshold of the cold storage unit 108 is less than the first temperature threshold.

[0097] If the laser is in standby mode under high-temperature conditions, when the temperature of the cold storage unit 108 drops to the preset temperature Ta (the second temperature threshold), the first solenoid valve 122 can be closed, and then the second solenoid valve 132 can be opened to pre-cool the evaporation unit 107. Thus, when the laser is turned on, under the combined action of the evaporation unit 107 and the cold storage unit 108, the second solenoid valve 132 opens, and the first solenoid valve 122 selectively opens, ensuring that during the full-load start-up phase of the laser under high-temperature conditions, the cooling cycle circuit 103 can provide a large amount of cooling capacity, effectively cooling and dissipating heat from the laser, meeting its heat dissipation requirements.

[0098] If the laser is operating stably, the temperature of the evaporation unit 107 is within a preset range, and the compressor 104 has sufficient speed margin, the decision to open the first solenoid valve 122 can be made based on the temperature of the cold storage unit 108; simultaneously, the compressor 104 speed is increased accordingly to charge the cold storage unit 108. When the temperature of the cold storage unit 108 drops to the preset temperature Ta, the first solenoid valve 122 is closed, and the compressor 104 speed is reduced. This prevents sudden changes in the output power of heat-generating components such as the pump source and better stabilizes the temperature of the pump source.

[0099] The optional cold storage unit includes at least: a cold storage channel and a first solenoid valve; the first solenoid valve is installed between the output end of the condensation component and the inlet end of the cold storage channel; it also includes: when the laser is in standby mode, controlling the first solenoid valve to switch to the open state; when the laser is turned on, if the temperature of the cold storage unit is greater than a first temperature threshold, controlling the first solenoid valve to switch to the open state.

[0100] Specifically, when the laser is in standby mode, the first solenoid valve is switched to the open state, allowing the refrigerant output from the condensation assembly to enter the cold storage channel, enabling the cold storage unit to store cold before power-on. If the temperature of the optional cold storage unit is below the second temperature threshold, it indicates that the cold storage unit has stored a large amount of cold energy; in this case, the first solenoid valve can be closed to reduce power consumption. If the temperature of the cold storage unit is above the first temperature threshold, it indicates that the cold storage unit has stored too little cold energy; in this case, the first solenoid valve can be opened to supplement the cold energy.

[0101] When the laser is powered on, the first solenoid valve is closed. At this time, the large amount of cold energy stored in the cold storage unit works together with the evaporation unit to cool the heat-generating components. If the temperature of the cold storage unit gradually rises above the first temperature threshold, it indicates that the cold energy stored in the cold storage unit is insufficient. In this case, the first solenoid valve can be opened to replenish the cold energy. If the temperature of the cold storage unit is lower than the second temperature threshold after replenishment, it indicates that the cold storage unit has stored a large amount of cold energy. In this case, the first solenoid valve can be closed to reduce power consumption.

[0102] In other embodiments, when the laser is powered on, the first solenoid valve can remain open, allowing the refrigerant output from the condensation assembly to continuously enter the cold storage channel. Correspondingly, the direct cooling plate provides a large amount of cooling capacity immediately upon laser power-on, quickly dissipating heat from heat-generating components such as the pump source mounted on the plate. Thus, even if the cold storage unit stores little cooling capacity during standby, the first solenoid valve remains open, ensuring a continuous flow of refrigerant from the condensation assembly into the cold storage channel upon power-on, guaranteeing the cooling capacity of the refrigeration cycle. After the laser starts up and passes a first time threshold or reaches a steady state, the laser's temperature change rate stabilizes, reducing its heat dissipation demand. At this point, the first solenoid valve can be closed, preventing further refrigerant entry into the cold storage unit. This not only reduces power consumption but also lowers costs.

[0103] The optional cold storage channel includes: a first refrigerant pipe and a first phase change material layer filled between the outer wall of the first refrigerant pipe and the inner wall of the cold storage channel; it also includes: when the temperature of the first phase change material layer is less than a second temperature threshold, controlling the first solenoid valve to switch to a closed state, wherein the second temperature threshold is the first temperature threshold.

[0104] In this embodiment, the temperature of the first phase change material layer will change under the influence of the refrigerant in the first refrigerant pipe. If the cold storage unit has sufficient cold energy, the temperature of the first phase change material layer will be low; if the cold storage unit has insufficient cold energy, the temperature of the first phase change material layer will be high.

[0105] Specifically, the first phase change material layer has a phase change temperature threshold, which is the critical temperature at which the phase change material undergoes a phase change. The second temperature threshold can be lower than or equal to the phase change temperature threshold. When the temperature of the first phase change material layer is lower than the second temperature threshold, it indicates that the cold storage unit has sufficient stored cold energy, and at this time, the first solenoid valve can be controlled to switch to the closed state.

[0106] Regardless of whether the laser is in standby or on-state, if the temperature of the first phase change material layer is lower than the second temperature threshold, it means that the cold storage capacity has reached the preset target. Based on this, when the temperature of the first phase change material layer is lower than the second temperature threshold, the first solenoid valve can be switched to the closed state, which can reduce power consumption and cost.

[0107] Regardless of whether the laser is in standby or on-state, if the temperature of the first phase change material layer is higher than the first temperature threshold, it indicates insufficient cold storage capacity, preventing effective cooling. Therefore, when the temperature of the first phase change material layer exceeds the first temperature threshold, the first solenoid valve is switched to the open state. This allows the refrigerant output from the condensation assembly to enter the first refrigerant pipe, enabling the cold storage unit to store cold and compensate for the low cold storage capacity, until the temperature of the first phase change material layer falls below the second temperature threshold. Those skilled in the art can reasonably design the first and second temperature thresholds according to product requirements; no specific limitations are imposed.

[0108] Optional thermal management methods also include: when the laser is turned on, if the heating rate of the first phase change material layer is higher than the cooling rate of the heat-generating component, controlling the first solenoid valve to switch to the open state.

[0109] In this embodiment, when the laser is powered on, the cooling rate of the heating component is relatively high, indicating that the cooling capacity of the direct cooling plate is sufficient and the heat exchange efficiency between the first phase change material layer and the heating component is high. Conversely, a low cooling rate of the heating component indicates insufficient cooling capacity of the direct cooling plate, resulting in a correspondingly higher temperature for the first phase change material layer.

[0110] If the heating rate of the first phase change material layer is higher than the cooling rate of the heating element, it indicates that the cooling capacity of the direct cooling plate is insufficient to meet the heat dissipation requirements of the heating element. In this case, the cooling capacity needs to be increased to dissipate heat. Based on this, when the heating rate of the first phase change material layer is higher than the cooling rate of the heating element, the first solenoid valve is switched to the open state. The refrigerant output from the condensing assembly then enters the first refrigerant pipe, which can charge the cold storage unit, effectively increasing the cooling capacity and improving the cooling rate of the heating element.

[0111] As described above, a cold storage unit is added to the direct cooling plate. Specifically, a phase change tank is installed in the direct cooling plate, and cold storage pipes are laid in the phase change tank. The inlet and outlet of the cold storage pipes are connected to the condensation assembly and the compressor, respectively. Phase change material is filled on the outside of the cold storage pipes and inside the phase change tank. By adding the cold storage unit, the insufficient cooling capacity of the evaporation unit during laser startup is compensated, accelerating laser startup. During sudden changes in ambient temperature, the cooling capacity supplemented by the cold storage unit can better stabilize the pump source temperature, ensuring stable laser performance.

[0112] The optional evaporation unit includes at least: an evaporation channel and a second solenoid valve; the second solenoid valve is installed between the output end of the condensation assembly and the inlet end of the evaporation channel; it also includes: controlling the second solenoid valve to switch to the open state when the laser is in standby mode, wherein the opening time of the second solenoid valve is equal to or later than the opening time of the cold storage unit storing cold energy; and controlling the second solenoid valve to switch to the open state when the laser is powered on. The optional evaporation channel includes: a second refrigerant pipe and a second phase change material layer filled between the outer wall of the second refrigerant pipe and the inner wall of the evaporation channel.

[0113] In this embodiment, the second solenoid valve is installed between the output end of the condensing assembly and the inlet end of the evaporation channel. The second solenoid valve is controlled to switch between on and off states. A second refrigerant pipe for flowing refrigerant is provided inside the evaporation channel. The outer wall of the second refrigerant pipe is wrapped with a second phase change material layer; specifically, the material of the second phase change material layer fills the space between the outer wall of the second refrigerant pipe and the inner wall of the evaporation channel.

[0114] When the laser is in standby mode, the second solenoid valve can be controlled to open, with the opening time of the second solenoid valve being equal to or later than the opening time of the cold storage unit. The refrigerant output from the condensation assembly then enters the second refrigerant pipe, enabling pre-cooling of the evaporation unit while the laser is in standby mode. During this process, the evaporation unit is reused as another cold storage unit for cold storage. Alternatively, in other embodiments, the second solenoid valve can be controlled to close when the laser is in standby mode to save power.

[0115] When the laser is turned on, the second solenoid valve can be switched to the open state, so that the refrigerant output by the condensation component enters the second refrigerant pipe, which can cool the heat-generating components in time.

[0116] Based on the above thermal management methods, it can be known that the cooling cycle can operate in the following modes during laser standby and power-on:

[0117] The first standby mode is: close the second solenoid valve in the evaporation unit and open the first solenoid valve in the cold storage unit, so that the cold storage unit can store cold in advance;

[0118] The second standby mode is as follows: the second solenoid valve in the evaporation unit is opened for a certain period of time, and the first solenoid valve in the cold storage unit is opened intermittently, so that the cold storage unit and the evaporation unit can store cold in advance.

[0119] The first start-up mode is: open the second solenoid valve in the evaporation unit and close the first solenoid valve in the cold storage unit;

[0120] The second start-up mode is as follows: the second solenoid valve in the evaporator unit is turned on, and the first solenoid valve in the cold storage unit is turned on intermittently, using the cold storage unit and the evaporator unit for cooling.

[0121] The key to the technical solution in this invention lies in adding a cold storage unit to the direct cooling plate. By adding the cold storage unit, the insufficient cooling capacity of the evaporation unit during the laser startup stage is compensated, thus accelerating the laser startup. When the ambient temperature changes abruptly, the cooling capacity supplemented by the cold storage unit can better stabilize the pump source temperature, ensuring the stable performance of the laser.

[0122] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0123] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A thermal management device for a laser, the thermal management device comprising a compressor, a condenser assembly, and a direct cooling plate for forming a refrigeration cycle, the refrigeration cycle for supplying refrigerant to provide cooling for the heat-generating components of the laser, characterized in that, The direct cooling plate includes a cold storage unit and an evaporation unit. The cold storage unit stores the cold energy before the laser is turned on; or, the cold storage unit stores the cold energy when the temperature of the cold storage unit is greater than a first temperature threshold after the laser is turned on. The direct cooling plate is fitted to the heating element; When the laser is in standby mode, the cold storage unit is controlled to store the cold energy, and the cold storage unit is controlled to release the cold energy to the heat-generating component according to the operating temperature of the laser. When the laser is turned on, the cold storage unit and the evaporation unit are controlled to release the cold energy; The cold storage unit includes at least a cold storage channel and a first solenoid valve. The first solenoid valve is installed between the output end of the condensation component and the inlet end of the cold storage channel. The cold storage channel includes a first refrigerant pipe and a first phase change material layer filled between the outer wall of the first refrigerant pipe and the inner wall of the cold storage channel. When the laser is turned on, if the heating rate of the first phase change material layer is higher than the cooling rate of the heating component, the first solenoid valve is controlled to switch to the open state.

2. The thermal management device according to claim 1, characterized in that, The evaporation unit and the cold storage unit are each independently installed inside the direct cooling plate.

3. The thermal management device according to claim 2, characterized in that, By controlling the conduction state of the evaporation unit and / or the conduction state of the cold storage unit, the temperature of the heating element can be maintained within the target range.

4. The thermal management device according to claim 3, characterized in that, When the evaporation unit is in the conducting state, the direct cooling plate releases the cooling energy generated by the evaporated refrigerant to cool the heating component; When the cold storage unit is in the conducting state, the cold storage unit stores the cold energy generated by the evaporating refrigerant; When the cold storage unit is in an off state, it pre-cools the evaporation unit by releasing the stored cold energy to the heating element, thereby achieving a faster start-up speed.

5. The thermal management device according to claim 2, characterized in that, The evaporation unit includes at least an evaporation channel and a second solenoid valve; the second solenoid valve is installed between the output end of the condensation assembly and the inlet end of the evaporation channel, and the evaporation channel includes a second refrigerant pipe and a second phase change material layer filled between the outer wall of the second refrigerant pipe and the inner wall of the evaporation channel.

6. A thermal management method for a laser, characterized in that, Applied to the thermal management device as described in any one of claims 1-5, wherein the direct cooling plate further includes an evaporation unit, and the thermal management method includes: When the laser is in standby mode, the cold storage unit is controlled to store the cold energy, and the cold storage unit is controlled to release the cold energy to the heat-generating component according to the operating temperature of the laser. When the laser is turned on, the cold storage unit and the evaporation unit are controlled to release the cold energy; When the laser is running stably, the cold storage unit is controlled to store cold energy based on the real-time temperature of the cold storage unit.

7. The thermal management method according to claim 6, characterized in that, The cold storage unit includes at least a cold storage channel and a first solenoid valve, wherein the first solenoid valve is installed between the output end of the condensation assembly and the inlet end of the cold storage channel; the thermal management method further includes: When the laser is in standby mode, the first solenoid valve is controlled to switch to the open state; When the laser is turned on, if the temperature of the cold storage unit is greater than the first temperature threshold, the first solenoid valve is controlled to switch to the open state.

8. The thermal management method according to claim 7, characterized in that, The cold storage channel includes a first refrigerant pipe and a first phase change material layer filled between the outer wall of the first refrigerant pipe and the inner wall of the cold storage channel; the thermal management method further includes: When the temperature of the first phase change material layer is lower than the second temperature threshold, the first solenoid valve is controlled to switch to the closed state, where the second temperature threshold is lower than the first temperature threshold.

9. The thermal management method according to claim 8, characterized in that, Also includes: When the laser is turned on, if the heating rate of the first phase change material layer is higher than the cooling rate of the heating component, the first solenoid valve is controlled to switch to the open state.

10. The thermal management method according to claim 6, characterized in that, The evaporation unit includes at least an evaporation channel and a second solenoid valve, the second solenoid valve being installed between the output end of the condensation assembly and the inlet end of the evaporation channel; the thermal management method further includes: When the laser is in standby mode, the second solenoid valve is controlled to switch to the open state, wherein the opening time of the second solenoid valve is equal to or later than the opening time of the cold storage unit storing the cold energy. When the laser is powered on, the second solenoid valve is switched to the open state.

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