Circuit board assembly and method of manufacturing the same

Abstract

The application provides a circuit board assembly, which comprises a first circuit board. The first circuit board comprises a first substrate, a first circuit structure, a first magnetic layer and a connecting column. The first circuit structure is connected to the first substrate. The first magnetic layer is connected to the first circuit structure, and the first magnetic layer is not electrically connected to the first circuit structure. The connecting column is connected to the first circuit structure, the connecting column extends through the first magnetic layer from the first circuit structure to the first magnetic layer, and the connecting column is electrically connected to the first circuit structure. Therefore, the circuit board assembly of the application achieves the connection and positioning with other circuit board assemblies through the adsorption of the magnetic layer, so as to obtain a more flexible configuration mode.

Description

Technical Field

[0001] This application relates to a circuit board assembly and a method for manufacturing the same, and more particularly to a circuit board assembly assembled by magnetic force and a method for manufacturing the same. Background Technology

[0002] With the rapid advancement of technology, printed circuit boards (PCBs) are constantly evolving towards higher density and higher reliability, making interconnection technologies between different PCBs increasingly important. Existing PCB interconnection technologies include anisotropic conductive film (ACF) bonding, hot bar soldering, and board-to-board (BTB) connections. However, these technologies all have certain limitations to meet the future demands of high-density integration. Furthermore, when using anisotropic conductive film bonding, hot bar soldering, and BTB connections, the PCB needs to reserve a certain amount of space for the installation of assembly components, and using assembly components as connectors also introduces limitations and defects to PCB assembly.

[0003] If the above connection technology is used, some conductor layers on the circuit board will be exposed, which are easily damaged by moisture or humidity. Therefore, additional waterproofing processes (such as applying waterproof adhesive) are required to make the circuit board waterproof. In addition, the solder paste used for hot-press soldering or the assembly parts for board-to-board connections contain toxic substances or pollutants, which can easily cause harm to the environment. Summary of the Invention

[0004] One embodiment of this application provides a circuit board assembly including a first circuit board. The first circuit board includes a first substrate, a first circuit structure, a first magnetic layer, and connecting posts. The first circuit structure is connected to the first substrate. The first magnetic layer connects to the first circuit structure and positions the first circuit structure between the first magnetic layer and the first substrate, and the first magnetic layer is not electrically connected to the first circuit structure. The connecting posts connect to the first circuit structure, extending from the first circuit structure toward the first magnetic layer and passing through the first magnetic layer, and the connecting posts are electrically connected to the first circuit structure.

[0005] In some embodiments, the circuit board assembly further includes a second circuit board. The second circuit board includes a second circuit structure, a second magnetic layer, and at least one mounting hole. The second magnetic layer is disposed on the second circuit structure. The mounting hole is formed in the second magnetic layer such that a portion of the second circuit structure is exposed in the mounting hole. An attractive magnetic force is generated between the first and second magnetic layers, and this attractive magnetic force connects the first circuit board to the second circuit board. After the first circuit board is connected to the second circuit board using the attractive magnetic force, a connecting post is inserted into the mounting hole, and the connecting post is electrically connected to the second circuit structure.

[0006] In some embodiments, the second circuit board may further include a conductive layer electrically connected to the second circuit structure, and the conductive layer may be electrically connected to at least one of the side surface and end surface of the connecting post.

[0007] In some embodiments, the materials of the first magnetic layer and the second magnetic layer may include ferromagnetic materials or ferromagnetic materials.

[0008] In some embodiments, the materials of the first magnetic layer and the second magnetic layer may include the ferromagnetic material, the first circuit board may also include a first adhesive layer disposed between the first circuit structure and the first magnetic layer, and the second circuit board may also include a second adhesive layer disposed between the second circuit structure and the second magnetic layer.

[0009] In some embodiments, the second circuit board may further include a second waterproof layer, connecting the second magnetic layer and positioning the second magnetic layer between the second circuit structure and the second waterproof layer.

[0010] In some embodiments, the first circuit board may further include a first waterproof layer, connecting the first magnetic layer and positioning the first magnetic layer between the first waterproof layer and the first circuit structure.

[0011] Another embodiment of this application provides a method for manufacturing a circuit board assembly, comprising the following steps: A first circuit board is provided, the first circuit board comprising a first substrate, a first circuit structure, a first magnetic layer, and connecting posts. The first circuit structure is connected to the first substrate. The first magnetic layer connects to the first circuit structure and positions the first circuit structure between the first magnetic layer and the first substrate, and the first magnetic layer is not electrically connected to the first circuit structure. The connecting posts connect to the first circuit structure, extending from the first circuit structure toward the first magnetic layer and passing through the first magnetic layer, and the connecting posts are electrically connected to the first circuit structure. A second circuit board is provided, the second circuit board comprising a second circuit structure, a second magnetic layer, and at least one assembly hole. The second magnetic layer is disposed on the second circuit structure. The assembly hole is formed in the second magnetic layer such that a portion of the second circuit structure is exposed in the assembly hole. The second circuit board is assembled with the first circuit board using the magnetic attraction force generated between the first magnetic layer and the second magnetic layer, such that the connecting posts are inserted into the assembly hole, and the connecting posts are electrically connected to the second circuit structure.

[0012] In some embodiments, the manufacturing steps of the first circuit board may include the following steps: Providing a first substrate. Fabricating circuitry on the first substrate to obtain the first circuit structure. Attaching a first magnetic layer to one side of the first circuit structure, such that the first circuit structure is located between the first magnetic layer and the first substrate. Attaching a release layer to the first magnetic layer, such that the first magnetic layer is located between the release layer and the first circuit structure. Cutting the first magnetic layer and the release layer to form injection holes. Injecting conductive material into the injection holes to form the connecting posts. After the connecting posts are installed, removing the release layer.

[0013] In some embodiments, the manufacturing steps of the second circuit board may include the following steps: Providing a second substrate; Fabricating circuitry on the second substrate to obtain the second circuit structure; Depositing a second magnetic layer onto the second circuit structure; Cutting the second magnetic layer and the second circuit structure to form the mounting holes. Attached Figure Description

[0014] Figure 1 This is a cross-sectional schematic diagram of a circuit board assembly according to one embodiment of this application;

[0015] Figure 2 for Figure 1 A cross-sectional exploded view of the circuit board assembly;

[0016] Figures 3A to 3LThese are cross-sectional schematic diagrams of the manufacturing steps of the first circuit board in a method for manufacturing a circuit board assembly according to an embodiment of this application, at each process stage; and

[0017] Figures 4A to 4K These are cross-sectional schematic diagrams of the manufacturing steps of the second circuit board in a method for manufacturing a circuit board assembly according to an embodiment of this application, at each process stage. Detailed Implementation

[0018] The following application provides numerous different embodiments or examples for implementing various features of the provided subject matter. Specific examples of elements, values, operations, materials, configurations, and the like are described below to simplify this application. Of course, these are merely examples and are not intended to be limiting. Other elements, values, operations, materials, configurations, and the like should also be considered. For example, in the following description, forming a first feature over a second feature can include embodiments in which the first and second features are formed in direct contact, and can also include embodiments in which an additional feature can be formed between the first and second features such that the first and second features are not in direct contact. Furthermore, reference numerals and / or words may be repeated in various examples. This repetition itself does not indicate a relationship between the various embodiments and / or configurations discussed.

[0019] In the following text, to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of elements (e.g., layers, films, substrates, and regions) in the accompanying drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the size and shape of the elements, but should cover the dimensions, shapes, and deviations thereof caused by actual manufacturing steps and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the drawings of this application are mainly for illustration and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the claims of this application.

[0020] Please refer to Figure 1 and Figure 2 , Figure 1 This is a cross-sectional schematic diagram of a circuit board assembly 100 according to one embodiment of this application. Figure 2 for Figure 1 An exploded cross-sectional view of the circuit board assembly 100. In some embodiments of this application, the circuit board assembly 100 includes a first circuit board 200.

[0021] In detail, the first circuit board 200 includes a first substrate (not labeled), a first circuit structure 210, a first magnetic layer 220, and connecting posts 230. The first circuit structure 210 is connected to the first substrate. The first magnetic layer 220 connects to the first circuit structure 210 and positions the first circuit structure 210 between the first magnetic layer 220 and the first substrate. The first magnetic layer 220 is not electrically connected to the first circuit structure 210, thereby preventing the first magnetic layer 220 from affecting the current transmission of the first circuit structure 210.

[0022] The connecting post 230 is connected to the first circuit structure 210. The connecting post 230 extends from the first circuit structure 210 toward the first magnetic layer 220 and passes through the first magnetic layer 220. The connecting post 230 is electrically connected to the first circuit structure 210. Therefore, in addition to positioning and assembling the first circuit board 200 with other components, the connecting post 230 can also have the function of conducting circuits. The connection structure and circuit type of the first circuit board 200 with other components will be introduced in subsequent paragraphs and will not be repeated here.

[0023] In some embodiments, the circuit board assembly 100 further includes a second circuit board 300, and the first circuit board 200 is connected to the second circuit board 300. The second circuit board 300 includes a second circuit structure 310, a second magnetic layer 320, and at least one mounting hole 330. The second magnetic layer 320 is disposed on the second circuit structure 310, and the mounting hole 330 is formed in the second magnetic layer 320 such that the second circuit structure 310 is partially exposed in the mounting hole 330, that is, the mounting hole 330 can be... Figure 2 As shown, the second magnetic layer 320 extends from the surface away from the second circuit structure 310 toward the second circuit structure 310 and forms a blind hole structure. However, the assembly hole 330 may also have other structures according to assembly requirements, so this application is not limited thereto.

[0024] When assembling the first circuit board 200 and the second circuit board 300, an attractive magnetic force is generated between the first magnetic layer 220 and the second magnetic layer 320, which connects the first circuit board 200 to the second circuit board 300. Thus, the connection and positioning of the first circuit board 200 and the second circuit board 300 can be achieved by relying on the attraction between the first magnetic layer 220 and the second magnetic layer 320. Furthermore, the magnetic force between the first magnetic layer 220 and the second magnetic layer 320 can be greater than the weight of the first circuit board 200 and the second circuit board 300, ensuring that the first circuit board 200 and the second circuit board 300 will not separate without external force.

[0025] After the first circuit board 200 is connected to the second circuit board 300 by the magnetic attraction force, the connecting post 230 is inserted into the assembly hole 330 and electrically connected to the second circuit structure 310. Therefore, the electrical conduction between the first circuit board 200 and the second circuit board 300 can be accomplished by the connecting post 230. The circuit board assembly 100 does not need to be provided with a cover film opening as a reserved opening for mounting area or other electrical connections. Furthermore, the positions of the connecting post 230 and the assembly hole 330 can be adjusted to obtain different circuit layouts, which helps to improve the flexibility of configuration.

[0026] It should be noted that, in Figure 1 and Figure 2 In this illustration, a first circuit board 200 and two second circuit boards 300 are used as examples. Therefore, the connecting posts 230 can extend from both sides of the first circuit board 200, fixing the two second circuit boards 300 to both sides of the first circuit board 200. The first circuit board 200 has two first magnetic layers 220, thereby allowing the two second circuit boards 300 to be respectively attracted to both sides of the first circuit board 200. In other embodiments, the number of first circuit boards 200 and second circuit boards 300 can each be one, and the second circuit boards 300 can be assembled on one side of the first circuit board 200. Alternatively, multiple second circuit boards 300 can be mounted on one side of the first circuit board 200. Therefore, this application is not limited to the number or assembly position of the first circuit board 200 and the second circuit boards 300.

[0027] Furthermore, the second circuit board 300 may also include a conductive layer 340 electrically connected to the second circuit structure 310, and the conductive layer 340 may be electrically connected to at least one of the side surface and end surface of the connecting post 230. Specifically, the conductive layer 340 may be as follows: Figure 2 As shown, the conductive layer 340 is located around the assembly hole 330, has a U-shaped cross-section, or is located only at the end of the assembly hole 330. When the conductive layer 340 is located around the assembly hole 330, the conductive layer 340 can electrically connect to the side of the connecting post 230. When the conductive layer 340 has a U-shaped cross-section, the conductive layer 340 can electrically connect to the side and end face of the connecting post 230. When the conductive layer 340 is located at the end of the assembly hole 330, the conductive layer 340 can electrically connect to the end face of the connecting post 230. This reduces the possibility of poor electrical connection between the connecting post 230 and the second circuit structure 310 due to dimensional errors.

[0028] Furthermore, the conductive layer 340 can be made of conductive silver paste, while the connecting post 230 can be made of copper. Since the conductivity of conductive silver paste is greater than that of copper, the contact resistance when the connecting post 230 is electrically connected to the second circuit structure 310 can be reduced. On the other hand, by providing the conductive layer 340, the distance between the second circuit structure 310 and the connecting post 230 can be shortened, and the length of the connecting post 230 can also be further shortened, thereby reducing the difficulty of manufacturing.

[0029] The first magnetic layer 220 and the second magnetic layer 320 may be made of ferromagnetic or ferromagnetic materials, and may also include polymer materials. The polymer material may be epoxy resin, phenolic resin, or other resin materials, and the polymer material and the ferromagnetic or ferromagnetic material may have a composite structure, such as a core-shell structure (polymer material as the shell, ferromagnetic or ferromagnetic material as the core, or vice versa), a sandwich structure (ferromagnetic or ferromagnetic material located between two layers of polymer material), or a distributed structure (ferromagnetic or ferromagnetic material dispersed within the polymer material). In addition to providing magnetic attraction, the ferromagnetic or ferromagnetic material can also act as electromagnetic signal shielding, preventing mutual interference between electromagnetic signals.

[0030] The ferromagnetic material or the ferrite magnetic material can have a relatively large specific surface area and high surface energy, and can be made of iron, cobalt, nickel or their alloys to obtain sufficient magnetic attraction to combine and fix the first circuit board 200 and the second circuit board 300. It should be noted that the first magnetic layer 220 and the second magnetic layer 320 do not need to be permanent magnets. As long as one of the corresponding two magnetic layers is a permanent magnet and the other magnetic layer can be magnetized to achieve the purpose of magnetic attraction, it is sufficient. In other words, whether the first magnetic layer 220 and the second magnetic layer 320 are both permanent magnets, or only some of them are permanent magnets, they are all within the protection scope of this application.

[0031] When the materials of the first magnetic layer 220 and the second magnetic layer 320 include the ferromagnetic material, the first circuit board 200 may also include a first adhesive layer (not shown) disposed between the first circuit structure 210 and the first magnetic layer 220, and the second circuit board 300 may also include a second adhesive layer 350 disposed between the second circuit structure 310 and the second magnetic layer 320, thereby preventing the ferromagnetic material from interfering with the current transmission between the first circuit structure 210 and the second circuit structure 310.

[0032] The first circuit board 200 may further include a first waterproof layer 240, connecting the first magnetic layer 220 and positioning the first magnetic layer 220 between the first waterproof layer 240 and the first circuit structure 210. The second circuit board 300 may further include a second waterproof layer 360, connecting the second magnetic layer 320 and positioning the second magnetic layer 320 between the second circuit structure 310 and the second waterproof layer 360. The first waterproof layer 240 and the second waterproof layer 360 may be elastic and insulating, and their material may be polypropylene (PP) or polyethylene (PE) with a thickness of less than 50 μm. When the first circuit board 200 and the second circuit board 300 are magnetically combined, the first waterproof layer 240 and the second waterproof layer 360 are sandwiched between the first magnetic layer 220 and the second magnetic layer 320. The clamping force causes deformation, reducing the gap between the first circuit board 200 and the second circuit board 300. This reduces the possibility of liquid or moisture entering between the two circuit boards, thus achieving a waterproof function. Furthermore, the first waterproof layer 240 and the second waterproof layer 360 also act as a buffer between the first circuit board 200 and the second circuit board 300, reducing the possibility of damage during assembly.

[0033] It should be noted that other components may be embedded in the first circuit board 200 and the second circuit board 300. Since the first circuit board 200 and the second circuit board 300 are electrically connected through the connecting post 230, the other components do not need to be exposed outside the circuit board, thus obtaining good protection and extending their service life.

[0034] The second circuit board 300 may further include an insulating layer 370 connecting the second circuit structure 310, with the second circuit structure 310 located between the insulating layer 370 and the second magnetic layer 320. Through magnetic bonding and the placement of the insulating layer 370, the outermost layer of the circuit board assembly 100 can be designed without openings, ensuring the circuit board assembly 100 has waterproof properties and improved reliability. The insulating layer 370 may be made of polyimide (PI), which has acid and alkali resistance and heat resistance. The insulating layer 370 also provides further waterproofing to maintain the stable operation of the circuit board assembly 100, making it suitable for various environments.

[0035] Please refer to Figure 2Another embodiment of this application provides a method for manufacturing a circuit board assembly, which includes the following steps. First, a first circuit board 200 and a second circuit board 300 are provided. The structural features of the first circuit board 200 and the second circuit board 300 are as described in the preceding paragraphs and will not be repeated here.

[0036] Next, utilizing the magnetic attraction between the first magnetic layer 220 and the second magnetic layer 320, the second circuit board 300 is assembled with the first circuit board 200, with the connecting post 230 inserted into the assembly hole 330. The connecting post 230 is electrically connected to the second circuit structure 310. This allows for the connection of multiple circuit boards using magnetic attraction, eliminating the need for existing solder paste soldering, surface mount technology (SMT), or anisotropic conductive film bonding processes, thus saving manufacturing costs and reducing preparation steps and materials. Furthermore, since the first circuit board 200 and the second circuit board 300 are connected magnetically, they can be separated and reconnected after connection, increasing the flexibility in assembly and manufacturing.

[0037] Please refer to Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E , Figure 3F , Figure 3G , Figure 3H , Figure 3I , Figure 3J , Figure 3K and Figure 3L , Figures 3A to 3L These are cross-sectional schematic diagrams at each process stage of the manufacturing steps of the first circuit board 200 in a method for manufacturing a circuit board assembly according to an embodiment of this application. First, as... Figure 3A As shown, a first substrate 400 is provided. The first substrate 400 may include an insulating structure (not labeled) and two copper layers (not labeled), and the insulating structure is sandwiched between the two copper layers. The first substrate 400 may also have other structures, and therefore this application is not limited thereto.

[0038] Next, as Figure 3B and Figure 3C As shown, circuitry is fabricated on the first substrate 400 to obtain the first circuit structure 210. For example, holes can be drilled first in the insulating structure and one of the copper layers of the first substrate 400, and then copper plating can be performed, so that copper metal fills the holes in the first substrate 400 and covers one of the copper layers, thereby forming a circuit structure 210. Figure 3B The structure shown. After copper plating is completed, the two copper layers of the first substrate 400 are then cut to manufacture the structure shown. Figure 3CThe structure shown.

[0039] Next, as Figures 3D to 3H As shown, the first magnetic layer 220 is connected to one side of the first circuit structure 210, such that the first circuit structure 210 is located between the first magnetic layer 220 and the first substrate 400. For example, if there are two first magnetic layers 220, it can be arranged as follows: Figure 3D As shown, firstly, one of the first magnetic layers 220 is connected to one side of the first circuit structure 210, and then a first add-on structure 410 is added to the other side of the first circuit structure 210 to form a structure as shown in the diagram. Figure 3E The structure shown is then subjected to processes such as cutting and copper plating on the first added-layer structure 410 to form a shape as shown. Figure 3F and Figure 3G The structure shown is further modified by connecting another first magnetic layer 220 to the first add-on structure 410, such that the two first magnetic layers 220 are located on opposite sides of the first circuit structure 210, to create a structure as shown. Figure 3H The structure shown.

[0040] It should be noted that after setting the first magnetic layer 220, a first waterproof layer 240 can also be set on the first magnetic layer 220, so that the first magnetic layer 220 is located between the first waterproof layer 240 and the first circuit structure 210. The number of the first waterproof layers 240 can be the same as the number of the first magnetic layers 220. In this embodiment, the number of the first waterproof layers 240 can be two, and can be as follows: Figures 3D to 3H As shown, the first waterproof layer 240 can be set together with the corresponding first magnetic layer 220, or it can be set on the two first magnetic layers 220 after both first magnetic layers 220 have been set. Therefore, this application does not particularly limit the timing of setting the first waterproof layer 240.

[0041] Next, as Figure 3I and Figure 3J As shown, the release layer L is connected to the first magnetic layer 220, with the first magnetic layer 220 located between the release layer L and the first circuit structure 210. Then, the first magnetic layer 220 and the release layer L are cut to form injection holes H. The injection holes H can extend from the release layer L to the first circuit structure 210 or the first add-on structure 410 to ensure that subsequently formed components can be electrically connected to the first circuit structure 210. Similarly, the number of release layers L can be the same as the number of first magnetic layers 220; therefore, this application is not limited to the number of release layers L.

[0042] Next, as Figure 3K and Figure 3LAs shown, conductive material is injected into the injection hole H to form the connecting post 230, and after the connecting post 230 is set, the release layer L is removed to obtain the first circuit board 200.

[0043] Please refer to Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E , Figure 4F , Figure 4G , Figure 4H , Figure 4I , Figure 4J and Figure 4K , Figures 4A to 4K These are cross-sectional schematic diagrams at each process stage of the manufacturing steps of the second circuit board 300 in a method for manufacturing a circuit board assembly according to an embodiment of this application. First, as... Figure 4A As shown, a second substrate 500 is provided, which may include an insulating layer 370 and a copper layer (not labeled), wherein the copper layer is disposed on the insulating layer 370.

[0044] Next, as Figures 4B to 4H As shown, circuitry is fabricated on the second substrate 500 to obtain the second circuit structure 310. More specifically, it can be done as follows: Figure 4B As shown, the copper layer of the second substrate 500 is cut, and then surface mount technology is used to place the mounting element M on the copper layer to form a structure as shown. Figure 4C The structure shown.

[0045] Next, as Figure 4D As shown, conductive silver paste is coated on the copper layer of the second substrate 500 to form a conductive layer 340, and a second add-on structure 510 is formed on the second substrate 500 to manufacture a conductive layer 340. Figure 4E The structure is shown. In this structure, the copper layer of the second substrate 500, the mounting element M, and the conductive layer 340 can all be encapsulated within the second add-on structure 510 to obtain good protection. Next, the second add-on structure 510 undergoes processes such as cutting and copper plating to form a structure as shown. Figures 4F to 4H The structure shown.

[0046] Next, as Figure 4I As shown, the second magnetic layer 320 is disposed on the second circuit structure 310. It should be noted that if the second magnetic layer 320 is made of a non-conductive magnetic material, it can be directly connected to the second circuit structure 310. However, if the second magnetic layer 320 is made of a conductive material, it can be connected as follows: Figure 4IAs shown, the second adhesive layer 350 is first set, and then the second magnetic layer 320 is set on the second adhesive layer 350 to avoid the second magnetic layer 320 interfering with the current transmission of the second circuit structure 310. In addition, other components (such as surface mount components) can be set on the second circuit structure 310 before setting the second magnetic layer 320 or the second adhesive layer 350 to meet the usage requirements.

[0047] Next, as Figure 4J As shown, a second waterproof layer 360 can be first applied to the second magnetic layer 320, and then... Figure 4K As shown, the second magnetic layer 320 and the second circuit structure 310 are cut to form the assembly hole 330, thereby obtaining the second circuit board 300. The end of the assembly hole 330 may be located on the surface of the conductive layer 340, inside the conductive layer 340, or through the conductive layer 340 and located on the surface of the copper layer. That is, the depth of the assembly hole 330 may be adjusted according to the length of the connecting post 230 of the first circuit board 200, and is therefore not limited in this application.

[0048] In summary, the circuit board assembly of this application achieves connection and positioning with other circuit board assemblies through the adsorption effect of the magnetic layer, without relying on existing solder paste soldering or component insertion methods for connection, thereby obtaining a more flexible configuration method. Furthermore, the waterproof effect of the circuit board assembly can be improved by setting waterproof and insulating layers.

[0049] Although this application has been disclosed above with reference to embodiments, it is not intended to limit this application. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the appended claims.

[0050] [Symbol Explanation]

[0051] 100: Circuit board assembly

[0052] 200: First circuit board

[0053] 210: First Circuit Structure

[0054] 220: First magnetic layer

[0055] 230: Connecting Post

[0056] 240: First waterproof layer

[0057] 300: Second circuit board

[0058] 310: Second Circuit Structure

[0059] 320: Second magnetic layer

[0060] 330: Assembly hole

[0061] 340: Conductive layer

[0062] 350: Second adhesive layer

[0063] 360: Second waterproof layer

[0064] 370: Insulation layer

[0065] 400: First substrate

[0066] 410: First layered structure

[0067] 500: Second substrate

[0068] 510: Second layered structure

[0069] L: Release layer

[0070] H: Injection hole

[0071] M: Surface mount component.

Claims

1. A circuit board assembly, characterized by Include: The first circuit board includes: First substrate; A first circuit structure is connected to the first substrate; A first magnetic layer is provided to connect the first circuit structure and to place the first circuit structure between the first magnetic layer and the first substrate, and the first magnetic layer is not electrically connected to the first circuit structure. A connecting post is connected to the first circuit structure. The connecting post extends from the first circuit structure toward the first magnetic layer and passes through the first magnetic layer. The connecting post is electrically connected to the first circuit structure. A first waterproof layer is connected to the first magnetic layer and the first magnetic layer is located between the first waterproof layer and the first circuit structure; The second circuit board includes: Second circuit structure; A second magnetic layer is disposed on the second circuit structure; At least one assembly hole is formed in the second magnetic layer such that a portion of the second circuit structure is exposed in the assembly hole; A conductive layer electrically connects the second circuit structure and at least one of the side surface and end surface of the connecting post; as well as The second waterproof layer connects to the second magnetic layer and positions the second magnetic layer between the second circuit structure and the second waterproof layer. Wherein, the first magnetic layer and the second magnetic layer generate a magnetic attraction force, and the magnetic attraction force enables the first circuit board to be detachably connected to the second circuit board; Wherein, after the first circuit board is connected to the second circuit board by the magnetic attraction force, the connecting post is inserted into the assembly hole and can be detachably electrically connected to the second circuit structure, and the first waterproof layer and the second waterproof layer are sandwiched between the first magnetic attraction layer and the second magnetic attraction layer, so that the first waterproof layer and the second waterproof layer are deformed. When the first circuit board and the second circuit board are separated from each other, the connecting post is separated from the conductive layer, and the first waterproof layer is separated from the second waterproof layer.

2. The circuit board assembly of claim 1, wherein, The materials of the first magnetic layer and the second magnetic layer include ferromagnetic materials or ferromagnetic materials.

3. The circuit board assembly of claim 2, wherein, The first magnetic layer and the second magnetic layer are made of the ferromagnetic material. The first circuit board further includes a first adhesive layer disposed between the first circuit structure and the first magnetic layer, and the second circuit board further includes a second adhesive layer disposed between the second circuit structure and the second magnetic layer.

4. A method for manufacturing a circuit board assembly, characterized in that, Include: A first circuit board is provided, the first circuit board comprising: First substrate; A first circuit structure is connected to the first substrate; A first magnetic layer is provided to connect the first circuit structure and to place the first circuit structure between the first magnetic layer and the first substrate, and the first magnetic layer is not electrically connected to the first circuit structure. and A connecting post is connected to the first circuit structure. The connecting post extends from the first circuit structure toward the first magnetic layer and passes through the first magnetic layer. The connecting post is electrically connected to the first circuit structure. A first waterproof layer is connected to the first magnetic layer and the first magnetic layer is located between the first waterproof layer and the first circuit structure; A second circuit board is provided, comprising: Second circuit structure; A second magnetic layer is disposed on the second circuit structure; and At least one assembly hole is formed in the second magnetic layer such that a portion of the second circuit structure is exposed in the assembly hole; A conductive layer electrically connects the second circuit structure and at least one of the side surface and end surface of the connecting post; as well as The second waterproof layer connects to the second magnetic layer and positions the second magnetic layer between the second circuit structure and the second waterproof layer. The second circuit board is assembled with the first circuit board by utilizing the magnetic attraction between the first magnetic layer and the second magnetic layer, so that the connecting post is inserted into the assembly hole, and the connecting post is detachably electrically connected to the second circuit structure, and the first waterproof layer and the second waterproof layer are sandwiched between the first magnetic layer and the second magnetic layer, so that the first waterproof layer and the second waterproof layer are deformed.

5. The method of manufacturing a circuit board assembly according to claim 4, wherein, The manufacturing steps of the first circuit board include: Provide the first substrate; A circuit is fabricated on the first substrate to obtain the first circuit structure; The first magnetic layer is connected to one side of the first circuit structure, so that the first circuit structure is located between the first magnetic layer and the first substrate. The release layer is connected to the first magnetic layer, so that the first magnetic layer is located between the release layer and the first circuit structure; The first magnetic layer and the release layer are cut to form injection holes; Conductive material is injected into the injection hole to form the connecting post; as well as Once the connecting post has been installed, remove the release layer.

6. The method of manufacturing a circuit board assembly of claim 4, wherein, The manufacturing steps of the second circuit board include: Provide a second substrate; A circuit is fabricated on the second substrate to obtain the second circuit structure; The second magnetic layer is disposed on the second circuit structure; as well as The second magnetic layer and the second circuit structure are cut to form the assembly hole.

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