Wafer polishing machine and method for taking and placing a wafer

Abstract

This invention discloses a wafer grinding machine and a method for picking up and placing wafers. The wafer grinding machine includes several wafer racks, a driving device, a grinding device, a front stage, a rear stage, a transfer device, and a control unit. Each wafer rack has several positioning holes for positioning wafers spaced apart. Each wafer rack has an identification mark for distinguishing each wafer rack, a first positioning mark for identifying the center of each positioning hole, and a hole position mark for identifying each positioning hole. This invention can bind the identification mark and hole position mark corresponding to the wafer, thus creating a grinding record that is beneficial for tracking the wafer's processing history.

Description

Technical Field

[0001] This invention relates to an equipment component used in a wafer grinding process, and more particularly to a wafer grinding machine and a method for picking up and placing wafers. Background Technology

[0002] The wafer grinding equipment includes several wafer racks, a drive unit, a grinding unit, and a transfer unit. Each wafer rack is spaced apart on the drive unit along a circular path. The drive unit drives each wafer rack to circulate in a planetary manner along the circular path, and each wafer rack rotates around its radial center. Each wafer rack has several positioning holes, and each positioning hole is used to position a wafer. The grinding unit has two grinding discs, and each grinding disc grinds two surfaces of each wafer set on each wafer rack. Each surface is located on two opposite sides of the wafer in the thickness direction. The transfer unit is used to transfer each wafer to the positioning holes and, after the grinding process is completed, transfer each wafer away from the wafer rack.

[0003] The transfer device includes a pick-and-place unit, a processing unit, and a robotic arm. The pick-and-place unit is located at the working end of the robotic arm and includes a vacuum suction cup, a lifting mechanism, and an image capture device. The vacuum suction cup is used to attract and release wafers, the lifting mechanism is used to control the lifting and lowering of the vacuum suction cup, and the image capture device is used to capture images of the positioning holes. The processing unit is mainly composed of electronic circuits with microprocessors, which is used to run an image recognition program. The processing unit recognizes the images captured by the image capture device and controls the vacuum suction cup, the lifting mechanism, and the robotic arm based on the recognition results.

[0004] A vacuum chuck attracts the wafer to be ground, and then the robotic arm moves to move the pick-and-place unit above the pre-set positioning hole of the wafer. The image capture device captures the image of the positioning hole, and the processing unit identifies whether the wafer is vertically aligned with the positioning hole based on the image. The processing unit controls the robotic arm to move according to the deviation value between the wafer and the positioning hole, so that the wafer is aligned with the positioning hole. When the processing unit determines that the wafer is vertically aligned with the positioning hole, it controls the lifting mechanism to move the vacuum chuck to descend. When the wafer enters the positioning hole, the vacuum chuck releases the wafer and places the wafer in the selected positioning hole. The above operation is repeated to place multiple wafers one by one in different positioning holes.

[0005] After the grinding process is completed, the transfer device transfers the multiple ground wafers one by one. When each wafer is transferred away from the wafer holder, the transfer device also needs to perform image recognition and alignment so that the vacuum chuck can accurately align and attract the wafer, and the wafer can be transferred away from the wafer holder and placed in the set position for the next process.

[0006] Each wafer needs to have its processing history recorded separately. The wafer grinding process not only needs to record the grinding time of the wafer, but also the wafer rack and positioning hole where the wafer is positioned. The transfer device cannot identify the wafer rack and positioning hole where each wafer is transferred and positioned, which is not conducive to tracking the processing history of each wafer. Summary of the Invention

[0007] The main objective of this invention is to provide a wafer grinding tool and a method for picking up and placing wafers.

[0008] To achieve the aforementioned objectives, the present invention adopts the following technical solution.

[0009] A wafer grinding machine includes several wafer racks, a drive unit, a grinding unit, a front stage, a rear stage, a transfer device, and a control unit. Each wafer rack is spaced apart from the drive unit, and each wafer rack has several positioning holes spaced apart. Each positioning hole is used to position a wafer, and the grinding unit is used to grind each wafer.

[0010] Each wafer rack forms an identification mark, which is used to distinguish and identify each wafer rack. Each wafer rack forms a first positioning mark, which is used to identify the configuration center of each positioning hole. Each wafer rack forms several hole position marks, which are adjacent to each positioning hole and are used to distinguish and identify each positioning hole.

[0011] The front stage forms at least one first configuration structure for setting the wafer to be ground.

[0012] The back stage forms at least one second configuration for setting up the polished wafer.

[0013] The transfer device includes a pick-and-place unit and a robotic arm. The pick-and-place unit is located at the working end of the robotic arm. The pick-and-place unit includes a receiving base, a lifting device, a suction cup module, and an image capture device. The receiving base is connected to the robotic arm, the lifting device is connected to the receiving base, and the suction cup module is connected to the lifting device. The lifting device causes the suction cup module to move up and down to approach or move away from a selected wafer. The suction cup module includes at least one vacuum suction cup for attracting and releasing the wafer. The image capture device is connected to the receiving base for capturing images.

[0014] The control unit is mainly composed of electronic circuits, including a programmable controller, a storage medium and a microprocessor. The programmable controller and the storage medium are electrically connected to the microprocessor. The programmable controller is electrically connected to the pick-and-place unit and the robotic arm. The storage medium is a read-and-write memory medium used to store the grinding records of each wafer. The microprocessor is electrically connected to the image capture device.

[0015] The microprocessor runs an image recognition program to identify the image captured by the image capture device, and controls the robotic arm and pick-and-place unit through a programmable controller based on the recognition results, thereby placing or removing the wafer. The microprocessor also binds the wafer's identification identifier, sets the wafer's identification mark and hole mark, and becomes the corresponding wafer's grinding record.

[0016] A method for picking up and placing wafers, performed using a wafer polishing machine as described above, includes the following steps.

[0017] The pick-and-place unit picks up the wafer: The robotic arm pulls the pick-and-place unit to the space above the front stage. Based on the result of the image captured by the image capture device, the control unit controls the transfer device to calibrate the alignment of the suction cup module with the wafer to be polished, which is pre-configured in the first configuration. Then the suction cup module picks up the wafer.

[0018] Alignment of the pick-and-place unit with the wafer rack: The robotic arm pulls the pick-and-place unit to move to the space above the selected wafer rack. Based on the image captured by the image capture device, the control unit controls the transfer device to calibrate the alignment of the suction cup module with the selected positioning hole, using the first positioning mark as a reference. The control unit records the identification mark of the wafer rack and the hole position mark of the corresponding positioning hole of the wafer.

[0019] The wafer is placed in the pick-and-place unit: the suction cup module releases the wafer into the corresponding positioning hole, which causes the drive device and the grinding device to run, completing the grinding process of the wafer.

[0020] Wafer alignment by pick-and-place unit: After the grinding process is completed, the robotic arm pulls the pick-and-place unit to move to the space above the selected wafer rack. Based on the image captured by the image capture device, the control unit controls the transfer device to calibrate the suction cup module relative to the selected ground wafer. The control unit also records the identification mark of the wafer rack and the hole position mark of the corresponding positioning hole of the wafer.

[0021] The transfer device transfers wafers: the suction cup module attracts the wafers, and then the suction cup module drives the wafers to rise and leave the wafer rack. Then the robotic arm pulls the pick-and-place unit to move above the rear stage. Based on the results of the image captured by the image capture device, the control unit controls the transfer device to calibrate the positioning of the suction cup module relative to the second configuration structure, and the pick-and-place unit releases the polished wafers to the second configuration structure.

[0022] Storing grinding records: The microprocessor binds the wafer's identification identifier, sets the wafer's identification mark and hole mark accordingly, and creates a grinding record for the corresponding wafer. The grinding record is stored in the storage medium.

[0023] The main effect and advantage of this invention is that it can record the identification mark of the wafer rack and the corresponding hole position mark of each wafer, and combine them with the wafer's identification identifier to form a grinding record, which is beneficial for tracking the processing process of each wafer. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of a portion of the wafer grinding machine according to Embodiment 1 of the present invention.

[0025] Figure 2 This is a partial top view of the wafer grinding machine according to Embodiment 1 of the present invention.

[0026] Figure 3 yes Figure 2 The enlarged view shows a portion of the first positioning mark and hole position mark.

[0027] Figure 4 yes Figure 2 The enlarged view shows a portion of the second positioning mark and the first configuration mark.

[0028] Figure 5 yes Figure 2 The enlarged view shows a portion of the third positioning mark and the second configuration mark.

[0029] Figure 6 This is a partial perspective view of the wafer grinding machine according to Embodiment 1 of the present invention, showing another perspective of the pick-and-place unit.

[0030] Figure 7 This is a circuit block diagram of the transfer device according to Embodiment 1 of the present invention.

[0031] Figure 8 This is a flowchart of the method for picking up and placing wafers according to Embodiment 1 of the present invention.

[0032] Figure 9 This is a three-dimensional schematic diagram of the wafer grinding machine according to Embodiment 1 of the present invention, showing the placement of wafers onto the wafer rack.

[0033] Figure 10 This is a three-dimensional schematic diagram of a portion of the wafer grinding machine according to Embodiment 2 of the present invention, showing the robotic arm and transfer device.

[0034] Figure 11 This is a partially enlarged top view of the wafer rack in Embodiment 3 of the present invention. Detailed Implementation

[0035] The figures illustrate embodiments of the present invention, but these embodiments are for illustrative purposes only and are not limited to the present invention in patent applications.

[0036] like Figures 1 to 7As shown, the wafer polishing apparatus includes several wafer racks 10, a drive unit 20, a polishing unit 30, a front stage 40, a rear stage 50, a transfer device 60, and a control unit 70. Each wafer rack 10 is spaced apart from the drive unit 20, which drives each wafer rack 10 to circulate. Each wafer rack 10 rotates during circumferential operation. Each wafer rack 10 has several positioning holes 11 spaced apart. In this example, the positioning holes 11 are arranged at equal intervals. Each positioning hole 11 is used to position a wafer 90. The polishing unit 30 polishes each wafer 90 positioned on each wafer rack 10. The drive unit 20 and the polishing unit 30 are well-known to those skilled in the art, and their technical features are not necessarily related to the present invention. Therefore, the specific configuration of the drive unit 20 and the polishing unit 30 will not be described in detail.

[0037] Each wafer rack 10 forms an identification mark 12, which is used to distinguish and identify each wafer rack 10. Each wafer rack 10 forms a first positioning mark 13, which is used to identify the configuration center of each positioning hole 11. In this example, each first positioning mark 13 is located at the radial center of each wafer rack 10. Each positioning hole 11 is configured around the first positioning mark 13. Each wafer rack 10 forms several hole position marks 14, which are adjacent to each positioning hole 11. Each hole position mark 14 is used to distinguish and identify each positioning hole 11.

[0038] The identification mark 12, the first positioning mark 13, and each hole mark 14 can be selected as numbers, text, graphics, or a combination thereof. Different wafer racks 10 have different identification marks 12. In this example, numbers are selected as identification marks 12. The first positioning mark 13 and the hole mark 14 are selected as holes that penetrate the wafer rack 10, and each hole mark 14 is selected as a hole with a different diameter.

[0039] The front stage 40, in accordance with the number and arrangement of the positioning holes 11 of each wafer rack 10, forms several first configuration structures 41 and several first configuration marks 42, which are used to set the wafers 90 to be ground. Each first configuration mark 42 is used to distinguish and identify each first configuration structure 41. The front stage 40 forms a second positioning mark 43, which is used to identify the configuration center of each first configuration structure 41.

[0040] The number and configuration relationship of the first configuration structure 41 are not limited to the number and configuration relationship of each positioning hole 11. The number of the first configuration structure 41 can be increased or decreased as needed. When the front stage 40 selects to form one first configuration structure 41, the front stage 40 selects not to form the first configuration mark 42 and the second positioning mark 43. When the front stage 40 selects to form several first configuration structures 41, the front stage 40 selects to form each first configuration mark 42 and the second positioning mark 43.

[0041] The rear stage 50, in accordance with the number and arrangement of the positioning holes 11 of each wafer rack 10, forms several second configuration structures 51 at intervals for setting the polished wafers 90. The rear stage 50 forms a third positioning mark 53, which is used to identify the configuration center of each second configuration structure 51.

[0042] The number and arrangement of the second configuration structure 51 are not limited to the number and arrangement of each positioning hole 11. The number of the second configuration structure 51 can be increased or decreased as needed. When the rear stage 50 selects to form one second configuration structure 51, the rear stage 50 selects not to form the second configuration mark 52 and the third positioning mark 53. When the rear stage 50 selects to form several second configuration structures 51, the rear stage 50 selects to form each second configuration mark 52 and the third positioning mark 53.

[0043] The transfer device 60 is used to transfer each wafer 90 between the front stage 40, the wafer rack 10 and the rear stage 50. It includes a pick-and-place unit 61 and a robotic arm 62. The pick-and-place unit 61 is located at the working end 63 of the robotic arm 62. The robotic arm 62 is used to actuate the pick-and-place unit 61 to approach or move away from a selected wafer rack 10.

[0044] The pick-and-place unit 61 includes a connector 64, a lifter 65, a suction cup module 66, and an image capture unit 67. The connector 64 is connected to the robotic arm 62, the lifter 65 is connected to the connector 64, and the suction cup module 66 is connected to the lifter 65. The lifter 65 causes each suction cup module 66 to move up and down, approaching or moving away from a selected wafer 90. The suction cup module 66 includes three vacuum suction cups 662 for attracting and releasing the wafer 90. The number of vacuum suction cups 662 constituting the suction cup module 66 can be increased or decreased as needed, but is limited to each suction cup module 66 having at least one vacuum suction cup 662.

[0045] Image capture device 67 is connected to connector 64 for capturing images. In this example, a camera lens with a photosensitive element (not shown) is selected as image capture device 67. Specific examples of photosensitive elements include charge-coupled device (CCD) and complementary metal-oxide-semiconductor (CMOS).

[0046] The control unit 70 is mainly composed of electronic circuits. The control unit 70 can be selectively set at an appropriate position in the wafer grinding machine. It includes a programmable controller 71, a storage medium 72 and a microprocessor 73. The programmable controller 71 and the storage medium 72 are electrically connected to the microprocessor 73. The programmable controller 71 is electrically connected to the pick-and-place unit 61 and the robotic arm 62. The storage medium 72 is a read-and-write memory medium used to store the grinding records of each wafer 90. The microprocessor 73 is electrically connected to the image capture unit 67.

[0047] The microprocessor 73 runs an image recognition program to recognize the image captured by the image capturer 67, and controls the robotic arm 62 and the pick-and-place unit 61 through the programmable controller 71 based on the recognition result. The wafer 90 to be ground is placed in the selected positioning hole 11 of the selected wafer rack 10, and the ground wafer 90 is taken out from the selected positioning hole 11 of the selected wafer rack 10. The microprocessor 73 binds the identification identifier of the wafer 90 and sets the first configuration mark 42, identification mark 12, hole position mark 14 and second configuration mark 52 of the wafer 90 accordingly, which become the grinding record of the corresponding wafer 90.

[0048] When the front stage 40 does not have the first configuration mark 42, the polishing record formed by the microprocessor 73 does not have the first configuration mark 42; when the rear stage 50 does not have the second configuration mark 52, the polishing record formed by the microprocessor 73 does not have the second configuration mark 52.

[0049] like Figures 8 to 9 As shown, the method for picking up and placing wafers using the aforementioned wafer grinding equipment includes the following steps.

[0050] The pick-and-place unit picks up the wafer: The robotic arm 62 pulls the pick-and-place unit 61 to the space above the front stage 40. Based on the image captured by the image capturer 67 of the front stage 40, the control unit 70 controls the transfer device 60 to calibrate the alignment of the suction cup module 66 with the selected wafer 90 among the several wafers 90 to be ground that are pre-configured in each first configuration structure 41. The microprocessor 73 records and sets the first configuration mark 42 corresponding to the first configuration structure 41 of the wafer 90. Then, the control unit 70 controls each vacuum suction cup 662 of the suction cup module 66 to attract the wafer 90, and the control unit 70 records the first configuration mark 42 corresponding to the wafer 90.

[0051] The alignment process of the transfer device 60 with the chuck module 66 relative to the selected wafer 90 mainly involves the following steps: the robotic arm 62 moves to align the center of the pick-and-place unit 61 with the second positioning mark 43. Then, the control unit 70 uses the second positioning mark 43 as a reference to control the robotic arm 62 to move, causing the pick-and-place unit 61 to move upwards towards the selected wafer 90. Based on the difference in alignment between the wafer 90 and the chuck module 66, the control unit 70 controls the direction and amount of movement of the robotic arm 62 to align the chuck module 66 with the wafer 90.

[0052] When the front stage 40 selects to form a first configuration structure 41 and does not have a second positioning mark 43 and a first configuration mark 42, the control unit 70 controls the robotic arm 62 to move, so that the pick-and-place unit 61 moves above the selected wafer 90. Based on the difference in alignment between the wafer 90 and the suction cup module 66, the control unit 70 controls the moving direction and amount of the robotic arm 62, so that the suction cup module 66 is aligned with the wafer 90.

[0053] Alignment of the pick-and-place unit with the wafer rack: The robotic arm 62 pulls the pick-and-place unit 61 to move to the space above the selected wafer rack 10. The image capture device 67 captures the identification mark 12 of the wafer rack 10. The microprocessor 73 runs the image recognition program to identify and record the wafer rack 10 where each wafer 90 is set. The image capture device 67 captures the image of the first positioning mark 13 of the wafer rack 10. The microprocessor 73 identifies the first positioning mark 13 and, based on the first positioning mark 13, calculates the axial distance deviation between the pick-and-place unit 61 and the selected positioning hole 11. The control unit 70 controls the amount and direction of movement of the robotic arm 62 so that the transfer device 60 can calibrate the alignment of the suction cup module 66 with the selected positioning hole 11. The control unit 70 records the identification mark 12 of the wafer rack 10 and the hole position mark 14 of the positioning hole 11 corresponding to the wafer 90.

[0054] Placement unit for wafers: Control unit 70 controls suction cup module 66 to release wafer 90 into positioning hole 11.

[0055] By repeating the aforementioned steps of picking up wafers by the pick-up and placement unit, aligning the pick-up and placement unit with the wafer holder, and placing the wafers by the pick-up and placement unit, multiple wafers 90 to be polished can be placed one by one into the positioning holes 11 of each wafer holder 10. Accordingly, the drive device 20 and the polishing device 30 can operate to complete the polishing process of each wafer 90.

[0056] Wafer alignment by pick-and-place unit: After the grinding process is completed, the robotic arm 62 pulls the pick-and-place unit 61 to move to the space above the selected wafer rack 10. Based on the image of the wafer rack 10 captured by the image capture device 67, the control unit 70 controls the transfer device 60 to calibrate the alignment of the suction cup module 66 with the selected finished wafer 90. The control unit 70 records the identification mark 12 of the wafer rack 10 and the hole position mark 14 of the positioning hole 11 corresponding to the wafer 90.

[0057] The transfer device transfers wafers: the suction cup module 66 attracts the wafer 90, and then the suction cup module 66 drives the wafer 90 to rise away from the wafer holder 10. Then the robotic arm 62 pulls the pick-and-place unit 61 to move above the rear stage 50. Based on the result of the image captured by the image capture device 67, the control unit 70 controls the transfer device 60 to calibrate the positioning of the suction cup module 66 relative to the second configuration structure 51, and the pick-and-place unit 61 releases the polished wafer 90 to the second configuration structure 51 of the rear stage 50. The control unit 70 also records the second configuration mark 52 corresponding to the second configuration structure 51 on which the wafer 90 is set.

[0058] The alignment process of the transfer device 60 with respect to the second configuration structure 51 mainly involves the following steps: the robotic arm 62 moves to align the center of the pick-and-place unit 61 with the third positioning mark 53. Then, the control unit 70 uses the third positioning mark 53 as a reference to control the robotic arm 62 to move the pick-and-place unit 61 upwards towards the selected second configuration structure 51. Based on the difference in alignment between the second configuration structure 51 and the suction cup module 66, the control unit 70 controls the direction and amount of movement of the robotic arm 62 to align the suction cup module 66 with the second configuration structure 51.

[0059] Storing grinding records: The microprocessor 73 binds the identification identifier of the wafer 90 and sets the first configuration mark 42, identification mark 12, hole mark 14 and second configuration mark 52 of the wafer 90 accordingly, which becomes the grinding record of the corresponding wafer 90, and the storage medium 72 stores the grinding records.

[0060] When the front stage 40 does not have the first configuration mark 42, the polishing record formed by the microprocessor 73 does not have the first configuration mark 42; when the rear stage 50 does not have the second configuration mark 52, the polishing record formed by the microprocessor 73 does not have the second configuration mark 52.

[0061] During the process of placing the wafer 90 on the selected wafer rack 10 and removing the wafer 90 from the wafer rack 10, the transfer device 60 can identify the first configuration structure 41, wafer rack 10, positioning hole 11 and second positioning structure 51 respectively configured for each wafer 90, and record the first configuration mark 42 of the first configuration structure 41 set for each wafer 90, the identification mark 12 corresponding to the wafer rack 10, the hole position mark 14 corresponding to the positioning hole 11 and the second configuration mark 52 corresponding to the second configuration structure 51, and combine them with the identification identifier of each wafer 90 to form a grinding record stored in the storage medium 72, which is beneficial for tracking the processing process of each wafer 90.

[0062] The suction cup module 66 further includes a positioning frame 664, with each vacuum suction cup 662 respectively mounted on the positioning frame 664, and a lifter 65 connected to the positioning frame 664.

[0063] like Figure 10 As shown, the main difference between Embodiment 2 and Embodiment 1 is that the shape of the robotic arm 62 is different.

[0064] like Figure 11 As shown, the main difference between Embodiment 3 and Embodiment 1 is that each hole position mark 14 represents a hole of a different shape.

Claims

1. A wafer grinding machine, characterized in that... It includes several wafer racks, a drive unit, a grinding unit, a front stage, a rear stage, a transfer unit, and a control unit. Each wafer rack is spaced apart from the drive unit, and each wafer rack has several positioning holes spaced apart. Each positioning hole is used to position a wafer. The grinding unit is used to grind each wafer. Each wafer rack forms an identification mark, which is used to distinguish and identify each wafer rack. Each wafer rack forms a first positioning mark, which is used to identify the configuration center of each positioning hole. Each wafer rack forms several hole position marks, which are adjacent to each positioning hole and are used to distinguish and identify each positioning hole. The front stage forms at least one first configuration structure for setting the wafer to be ground; The back stage forms at least one second configuration for setting up the polished wafer; The transfer device includes a pick-and-place unit and a robotic arm. The pick-and-place unit is located at the working end of the robotic arm. The pick-and-place unit includes a receiving base, a lifting device, a suction cup module, and an image capture device. The receiving base is connected to the robotic arm, the lifting device is connected to the receiving base, and the suction cup module is connected to the lifting device. The lifting device causes the suction cup module to move up and down to approach or move away from a selected wafer. The suction cup module includes at least one vacuum suction cup for attracting and releasing the wafer. The image capture device is connected to the receiving base for capturing images. The control unit is mainly composed of electronic circuits, including a programmable controller, a storage medium and a microprocessor. The programmable controller and the storage medium are electrically connected to the microprocessor. The programmable controller is electrically connected to the pick-and-place unit and the robotic arm. The storage medium is a read-and-write memory medium used to store the grinding records of each wafer. The microprocessor is electrically connected to the image capture device. The microprocessor runs an image recognition program to identify the image captured by the image capture device, and controls the robotic arm and pick-and-place unit through a programmable controller based on the recognition results, thereby placing or removing the wafer. The microprocessor also binds the wafer's identification identifier, sets the wafer's identification mark and hole mark, and becomes the corresponding wafer's grinding record.

2. The wafer grinding machine according to claim 1, characterized in that... The front stage, in conjunction with the number and arrangement of the positioning holes of each wafer rack, forms several first configuration structures and several first configuration marks at intervals. Each first configuration mark is used to distinguish and identify each first configuration structure. The front stage forms a second positioning mark, which is used to identify the configuration center of each first configuration structure. The microprocessor binds the identity identifier of each wafer, sets the first configuration mark, identification mark and hole mark of each wafer, and forms multiple grinding records corresponding to each wafer.

3. The wafer grinding machine according to claim 1, characterized in that... The back stage, in conjunction with the number and arrangement of the positioning holes of each wafer rack, forms several second configuration structures at intervals. The back stage forms a third positioning mark, which is used to identify the configuration center of each second configuration structure.

4. The wafer grinding machine according to claim 3, characterized in that... The rear stage forms several second configuration markers, each of which is used to distinguish and identify the second configuration structure. The microprocessor binds the identification identifier of each wafer, sets the identification mark, hole mark and second configuration mark of each wafer, and forms multiple grinding records corresponding to each wafer.

5. A method for picking up and placing wafers, performed using the wafer grinding machine as described in claim 1, characterized in that... Includes the following steps: The pick-and-place unit picks up the wafer: The robotic arm pulls the pick-and-place unit to the space above the front stage. Based on the result of the image captured by the image capture device, the control unit controls the transfer device to calibrate the alignment of the suction cup module with the wafer to be polished, which is pre-configured in the first configuration. Then the suction cup module picks up the wafer. Alignment of the pick-and-place unit with the wafer rack: The robotic arm pulls the pick-and-place unit to move to the space above the selected wafer rack. Based on the image captured by the image capture device, the control unit controls the transfer device to calibrate the alignment of the suction cup module with the selected positioning hole, using the first positioning mark as a reference. The control unit records the identification mark of the wafer rack and the hole position mark of the corresponding positioning hole of the wafer. The wafer is placed in the pick-and-place unit: the suction cup module releases the wafer into the corresponding positioning hole, which causes the drive device and the grinding device to run, completing the grinding process of the wafer; Wafer alignment by pick-and-place unit: After the grinding process is completed, the robotic arm pulls the pick-and-place unit to move to the space above the selected wafer rack. Based on the image captured by the image capture device, the control unit controls the transfer device to calibrate the alignment of the chuck module with the selected ground wafer. The control unit also records the identification mark of the wafer rack and the hole position mark of the corresponding positioning hole of the wafer. The transfer device transfers wafers: the suction cup module attracts the wafers, and then the suction cup module drives the wafers to rise and leave the wafer rack. Then the robotic arm pulls the pick-and-place unit to move above the rear stage. Based on the result of the image captured by the image capture device, the control unit controls the transfer device to calibrate the positioning of the suction cup module relative to the second configuration structure, and the pick-and-place unit releases the polished wafers to the second configuration structure. Storing grinding records: The microprocessor binds the wafer's identification identifier, sets the wafer's identification mark and hole mark accordingly, and creates a grinding record for the corresponding wafer. The grinding record is stored in the storage medium.

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