A boron nitride-containing resin composition and use thereof

By combining modified boron nitride with sintering aids, the problems of low boron nitride fill rate and poor adhesion in copper clad laminates were solved, resulting in copper clad laminate materials with high thermal conductivity and high reliability, possessing excellent heat dissipation performance and interlayer bonding strength.

CN119708811BActive Publication Date: 2026-06-30SHAANXI SHENGYI TECH
View PDF 4 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHAANXI SHENGYI TECH
Filing Date
2024-12-27
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

The lamellar structure of boron nitride in existing copper clad laminate materials prevents it from being filled in large quantities, which weakens its ability to improve thermal conductivity. At the same time, increasing the filling amount will affect adhesion and lead to a decrease in reliability.

Method used

Modified boron nitride was prepared by mixing boron nitride with specific types and amounts of sintering aids, followed by sintering and crushing. This improved the filling ratio of boron nitride in resin materials and optimized the composition, resulting in a boron nitride-containing resin composition with high thermal conductivity and high peel strength.

Benefits of technology

It achieves a comprehensive improvement in high thermal conductivity and high reliability of metal foil laminate, with thermal conductivity ≥5.0W/m·k, peel strength ≥0.75N/mm, and excellent heat dissipation performance and interlayer bonding.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure SMS_1
    Figure SMS_1
  • Figure SMS_2
    Figure SMS_2
  • Figure SMS_3
    Figure SMS_3
Patent Text Reader

Abstract

This invention provides a boron nitride-containing resin composition and its application. The boron nitride-containing resin composition comprises a combination of resin material and modified boron nitride. The modified boron nitride is prepared by a method comprising: mixing boron nitride and a sintering aid, followed by sintering and crushing to obtain modified boron nitride. The sintering aid comprises any one or a combination of at least two of calcium oxide, magnesium oxide, silicon oxide, yttrium oxide, niobium oxide, and potassium feldspar. Through the design of the modification method, this invention enables the modified boron nitride to have a high filling rate in the resin material. The boron nitride-containing resin composition containing it not only has high thermal conductivity but also high peel strength and excellent adhesion properties, thereby achieving excellent overall performance in terms of high thermal conductivity and high reliability for metal-clad laminates.
Need to check novelty before this filing date? Find Prior Art