A semiconductor wafer surface processing apparatus

Abstract

This invention relates to the field of semiconductor device manufacturing technology, and more particularly to a semiconductor wafer surface treatment apparatus, comprising a worktable, a cleaning tank, a spindle, a spindle seat, a material frame, and a separation mechanism. The cleaning tank is fixedly mounted on the worktable, and the spindle is rotatably connected to the cleaning tank. A material frame is rotatably connected to the spindle via the spindle seat. The material frame holds the wafers to be cleaned. A separation mechanism is installed on the worktable. When the separation mechanism is activated, it drives the spindle to rotate slowly. After the wafers in the material frame are cleaned, the separation mechanism drives the material frame to rotate rapidly. In this apparatus, the separation mechanism can keep the spindle rotating slowly, allowing the spindle to immerse the material frame in the cleaning tank for an extended period, ensuring sufficient cleaning time. During cleaning, the material frame remains stationary to prevent splashing of the cleaning solution. When the material frame moves to the top of the spindle, the separation mechanism drives the material frame to rotate rapidly to dry the wafers.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing technology, and in particular to a semiconductor wafer surface treatment device. Background Technology

[0002] Wafers are the basic materials used to manufacture semiconductor devices. They are usually circular thin films made of high-purity silicon. The preparation process involves multiple steps such as slicing, grinding, and polishing. In order to ensure the cleanliness, chemical stability, and physical integrity of the wafer surface, the surface of the wafer needs to be cleaned during the preparation process.

[0003] Currently, wafers are typically placed in a dedicated tray first, then the tray containing the wafers is placed in an ultrasonic cleaning tank for cleaning. After cleaning, the workers remove the tray and place the tray containing the cleaned wafers into a spin dryer for drying.

[0004] Chinese patent publication number CN116230588B discloses a continuous conveying cleaning method for semiconductor silicon wafers. The technical solution of this patent is only used for cleaning wafers.

[0005] Chinese patent publication number CN117410214B discloses a wafer manufacturing cleaning and drying equipment. The technical solution of this patent is only used for drying the cleaned wafers.

[0006] The shortcomings of the existing technology are as follows: when the wafers need to be spun dry after cleaning, the wafers need to be picked up and put away and the work station needs to be transferred, which increases the production process, increases the physical exertion of workers, and may cause secondary contamination or accidents during the transfer process, increasing unknown risks. Summary of the Invention

[0007] This invention provides a semiconductor wafer surface treatment device that overcomes the shortcomings of existing technologies that require wafer handling and station transfer when the wafers need to be spin-dried after cleaning.

[0008] The technical solution of the present invention is as follows: a semiconductor wafer surface treatment device, comprising a worktable, a cleaning tank, a spindle, a bearing, a material frame, and a drive mechanism. The cleaning tank is fixedly connected to the worktable, and the spindle is rotatably connected to the cleaning tank. The material frame is rotatably connected to the spindle through the bearing. The material frame is used to place the wafer to be cleaned. The drive mechanism is installed on the worktable. After the drive mechanism is started, it will drive the spindle to rotate slowly. When the wafer in the material frame is cleaned, the drive mechanism will drive the material frame to rotate rapidly.

[0009] As a preferred embodiment of the present invention, the drive mechanism includes a side support, a motor, a main gear, a secondary gear, a dewatering gear, an external gear, an internal gear, and a water-immersing gear. The side support is fixedly connected to the worktable, and the main gear and the secondary gear are rotatably connected to the side support on the side support. A motor for driving the main gear and the secondary gear to rotate is fixedly connected to the side support. The dewatering gear is fixedly connected to the material frame. During the rotation of the main shaft, the dewatering gear can mesh with the secondary gear to drive the material frame to rotate rapidly. The external gear and the internal gear are also coaxially fixedly connected to the side support. During the rotation of the main gear, the external gear can mesh with the main gear. The water-immersing gear is connected to the main shaft, and the internal gear can mesh with the water-immersing gear to drive the main shaft to rotate slowly.

[0010] As a preferred embodiment of the present invention, both the main gear and the internal gear are toothless gears, and the diameter of the external gear is larger than the diameter of the main gear.

[0011] As a preferred embodiment of the present invention, it further includes a wafer clamping mechanism for fixing the wafer within the material frame. The wafer clamping mechanism includes a wafer clamping plate, a secondary spring, and a wafer clamping block. The wafer clamping plate is slidably connected to the material frame and slides radially. The secondary spring is sleeved on the guide rod of the wafer clamping plate, and the wafer clamping block for fixing the wafer is fixedly connected to the wafer clamping plate.

[0012] As a preferred embodiment of the present invention, it further includes an anti-detachment mechanism to prevent the wafer clamping plate from loosening during wafer spin-drying. The anti-detachment mechanism includes an anti-detachment plate, a side spring, and a stop plate. The anti-detachment plate is slidably connected to the material frame. The anti-detachment plate is used to restrict the sliding of the wafer clamping plate through its protruding structure to prevent the wafer from being loosened. A side spring is sleeved on the guide rod of the anti-detachment plate, and a stop plate is fixedly connected to the side support. During the rotation of the spindle, the stop plate will press the anti-detachment plate to restrict the sliding of the wafer clamping plate.

[0013] As a preferred embodiment of the present invention, it further includes an anti-collision mechanism to prevent collision between the auxiliary gear and the dehydration gear. The anti-collision mechanism includes an anti-collision guide rod, an anti-collision spring, a support shaft, and a locking assembly. Every three shaft seats are slidably connected in the same annular groove on the main shaft, and the anti-collision guide rod is slidably connected to all three shaft seats. An anti-collision spring is sleeved on the anti-collision guide rod to keep the three shaft seats in an annular array distribution. A support shaft is fixedly connected to the main shaft, and the main shaft is rotatably connected to the cleaning tank through the support shaft. The immersion gear is fixedly connected to the support shaft. A locking assembly is installed on the main shaft. The locking assembly restricts the sliding of two of the shaft seats so that the auxiliary gear and the dehydration gear can mesh normally.

[0014] As a preferred embodiment of the present invention, the locking assembly includes a guide seat, a locking block, a small spring, a lock head, an unlocking plate, and an unlocking rod. The main shaft is slidably connected to the locking blocks via the guide seat. Each locking block corresponds to a shaft seat. A small spring is sleeved on the guide rod of the locking block. A lock head is fixedly connected to the shaft seat. The locking block and the lock head engage to restrict the sliding of the shaft seat. An unlocking plate is fixedly connected to the cleaning tank. An unlocking rod is fixedly connected to the locking block. During the rotation of the main shaft, the unlocking plate disengages the locking block and the corresponding lock head by pressing the unlocking rod.

[0015] As a preferred embodiment of the present invention, it further includes a picking mechanism for removing wafers. The picking mechanism includes a front support, a reversing shaft, a slide, a gripping plate, and a handle. The front support is fixedly connected to the worktable, the reversing shaft is rotatably connected to the front support, the slide is fixedly connected to the reversing shaft, the gripping plate is slidably connected to the slide, the gripping plate is equipped with a suction cup for picking up wafers, and a handle for easy gripping is fixedly connected to the guide rod of the gripping plate.

[0016] As a preferred embodiment of the present invention, the material handling mechanism further includes a loosening rod and a pressing rod. The loosening rod is fixedly connected to the clamping plate, and the pressing rod is fixedly connected to the round clamping plate. The loosening rod and the pressing rod press together to drive the round clamping block and the wafer to disengage.

[0017] As a preferred embodiment of the present invention, it also includes an upper support and a carrier plate for easy placement of wafers. The reversing shaft is provided with two sets of slides, a clamping plate and a handle. The upper support is fixedly connected to the front support, and the carrier plate is fixedly connected to the upper support. The carrier plate cooperates with the clamping plate located on the upper side to support and place the wafers to be cleaned.

[0018] Beneficial effects: 1. The split drive mechanism in this equipment can drive the main shaft to rotate slowly, so that the main shaft drives the material frame to be immersed in the cleaning tank for a long time, ensuring sufficient cleaning time. During cleaning, the material frame is stationary to prevent the cleaning liquid from splashing out. When the material frame moves to the top of the main shaft, the split drive mechanism will drive the material frame to rotate quickly to spin dry the wafer, which simplifies the production process and solves the shortcomings of the existing technology that requires picking up and putting down the wafer and transferring the work station when the wafer needs to be spun dry after cleaning. 2. The auxiliary spring prevents the wafer from falling by pushing the clamping plate, which solves the technical difficulty of wires or pneumatic tubes getting tangled when using electric or pneumatic clamping methods in the existing technology, and reduces the installation difficulty of the equipment while achieving the function. 3. The stop plate can squeeze the anti-detachment plate before the auxiliary gear and the dehydration gear mesh, so that the anti-detachment plate is locked on both sides of the clamping plate in advance, to prevent the clamping plate from moving away from the wafer when the material frame rotates quickly, causing the wafer to fall off. This allows the auxiliary spring to be set to a spring with less elasticity, which is convenient for placing the wafer and can prevent the wafer from being pinched and damaged. 4. The unlocking plate allows one of the bearing seats to be switched to a sliding state by pressing the unlocking rod, while the other two bearing seats remain locked. This allows the anti-collision spring to provide a reset force for the bearing seats, thus preventing hard collisions between the auxiliary gear and the dehydration gear, while also ensuring the meshing of the auxiliary gear and the dehydration gear. 5. The gripper plate and carrier plate work together to facilitate the pre-positioning of wafers to be cleaned, and the push-pull gripper plate can quickly remove cleaned wafers and place wafers to be cleaned, making full use of time and improving the efficiency of cleaning the wafer surface. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0020] Figure 2 This is a schematic cross-sectional view of the cleaning tank structure of the present invention.

[0021] Figure 3 This is a schematic diagram showing the positional relationship between the side support and the front support of the present invention.

[0022] Figure 4 This is a schematic diagram showing the positional relationship of the card plate of the present invention.

[0023] Figure 5 This is a schematic diagram of the card round plate structure of the present invention.

[0024] Figure 6 This is a schematic diagram showing the positional relationship of the locking blocks in this invention.

[0025] Figure 7 This is a schematic diagram showing the positional relationship of the lock head in this invention.

[0026] Figure 8 This is a schematic diagram showing the positional relationship of the carriage in this invention.

[0027] The markings in the diagram are as follows: 10-Workbench, 11-Washing box, 12-Main shaft, 13-Shaft seat, 14-Material frame, 20-Side support, 21-Motor, 22-Main gear, 23-Secondary gear, 24-Dehydration gear, 25-External gear, 26-Internal gear, 27-Immersion gear, 30-Clamping plate, 31-Secondary spring, 32-Clamping block, 33-Support plate, 40-Anti-detachment plate, 41-Side spring, 4 2-Support plate, 50-Annular groove, 51-Anti-collision guide rod, 52-Anti-collision spring, 53-Support shaft, 60-Guide seat, 61-Locking block, 62-Small spring, 63-Lock head, 64-Unlocking plate, 65-Unlocking rod, 70-Front support, 71-Reversing shaft, 72-Slide, 73-Clamping plate, 74-Handle, 80-Release rod, 81-Pressure rod, 90-Upper bracket, 91-Carrier plate. Detailed Implementation

[0028] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0029] Example 1: A semiconductor wafer surface treatment device, such as Figure 1 and Figure 2 As shown, the device includes a worktable 10, a cleaning tank 11, a main spindle 12, a shaft seat 13, a material frame 14, and a drive mechanism. The cleaning tank 11 is fixedly connected to the worktable 10. The cleaning tank 11 is an ultrasonic cleaner as described in the prior art. The main spindle 12 is rotatably connected to the cleaning tank 11. Figure 1 From a left-to-right perspective, main shaft 12 can only rotate counterclockwise. Figure 2 It can be seen that two sets of bearing seats 13 are symmetrically installed on the spindle 12. Each set of bearing seats 13 has three bearing seats 13, which are arranged in a ring array. A material frame 14 is rotatably connected to the two opposite bearing seats 13 in the two sets. There are three material frames 14 in total. The material frames 14 are used to place the wafers to be cleaned. A drive mechanism is installed on the worktable 10. After the drive mechanism is started, it will drive the spindle 12 to rotate slowly, so that the wafers in the material frames 14 can be immersed in the cleaning solution in the cleaning tank 11. When the material frames 14 rotate to the upper side of the spindle 12, the drive mechanism will drive the material frames 14 to rotate quickly to spin dry the wafers.

[0030] When the surface of the wafer needs to be cleaned, the wafer is placed in the upper feed frame 14, and then the split drive mechanism is started. The split drive mechanism drives the main shaft 12 to rotate slowly. The main shaft 12 drives the feed frame 14 and the wafer to be immersed in the cleaning solution in the cleaning tank 11 through the bearing 13, thereby cleaning the surface of the wafer by ultrasonic cleaning. When one of the feed frames 14 is about to rotate directly above the main shaft 12, the split drive mechanism will start to drive the feed frame 14 to rotate rapidly, thereby drying the wafer by centrifugal force. At the same time, the split drive mechanism will continue to drive the main shaft 12 to rotate slowly. After the feed frame 14 has rotated for a certain period of time, the split drive mechanism stops driving the feed frame 14 to rotate, and then the wafer that has been dried on the feed frame 14 is taken out and the wafer to be cleaned again is prepared.

[0031] like Figures 1-3 As shown, the drive mechanism includes a side support 20, a motor 21, a main gear 22, a secondary gear 23, a dewatering gear 24, an external gear 25, an internal gear 26, and a water-immersed gear 27. Figure 1 It can be seen that a side support 20 is fixed to the top right side of the workbench 10. The side support 20 is located on the right side of the cleaning tank 11, and a motor 21 is fixed to the side support 20. Figure 3 It can be seen that a main gear 22 and a secondary gear 23 are coaxially rotatably connected on the side support 20. The output shaft of the motor 21 is fixedly connected to the rotating shafts of the main gear 22 and the secondary gear 23. The main gear 22 is a toothed gear. Figure 2It can be seen that a dewatering gear 24 is fixed to the right end of the material frame 14. During the rotation of the main shaft 12, the dewatering gear 24 can mesh with the auxiliary gear 23 to drive the material frame 14 to rotate rapidly. Figure 3 It can be seen that an external gear 25 and an internal gear 26 are coaxially fixed to the side support 20. The internal gear 26 is also a toothed gear. During the rotation of the main gear 22, it can mesh with the external gear 25, and the diameter of the external gear 25 is larger than the diameter of the main gear 22. Figure 2 It can be seen that a water-immersed gear 27 is connected to the right side of the main shaft 12. During the rotation of the internal gear 26, it can mesh with the water-immersed gear 27 to drive the main shaft 12 to rotate slowly.

[0032] Side support 20 is located on the right side, so as to Figure 1 From a left-to-right perspective, when the motor 21 rotates, it drives the main gear 22 and the auxiliary gear 23 to rotate rapidly counterclockwise in sync. Since both the main gear 22 and the internal gear 26 are toothless gears, the main gear 22 drives the main shaft 12 to rotate slowly counterclockwise through the external gear 25, the internal gear 26 and the immersion gear 27. When the material frame 14 is about to rotate directly above the main shaft 12, the auxiliary gear 23 will begin to mesh with the dehydration gear 24, and the auxiliary gear 23 will drive the dehydration gear 24 to rotate rapidly, thereby drying the wafer through centrifugal force. Since the main shaft 12 continues to rotate, the dehydration gear 24 will gradually disengage from the auxiliary gear 23 in order to remove the dried wafer.

[0033] Example 2: Based on Example 1, such as Figure 2 and Figure 4 As shown, it also includes a wafer clamping mechanism for fixing the wafer within the material frame 14. The wafer clamping mechanism is mounted on the material frame 14 and includes a wafer clamping plate 30, a secondary spring 31, a wafer clamping block 32, and a support plate 33. The material frame 14 is formed by two circular plates and two straight rods fixedly connected together. The two circular plates are located on both sides of the straight rods and are rotatably connected to the bearing 13 on the same side. Wafer clamping plates 30 are slidably connected to both straight rods. The two ends of the wafer clamping plates 30 pass through the circular plates of the material frame 14 and extend outwards. Figure 4 It can be seen that the circular plate 30 is located on one side opposite to the two straight rods, and the circular plate 30 slides radially. A secondary spring 31 is sleeved on the guide rod of the circular plate 30. When the two circular plates 30 move in opposite directions, the secondary spring 31 will be compressed. Multiple circular blocks 32 are fixedly connected at equal intervals at the opposite ends of the two circular plates 30. The circular blocks 32 are provided with grooves for accommodating wafers. The two opposing circular blocks 32 cooperate to fix the wafers. A support plate 33 is fixedly connected to both circular plates. The support plate 33 is used to support the wafers for easy placement.

[0034] When placing a wafer into the feed frame 14, first push the two round clamping plates 30 on the same feed frame 14 to move in opposite directions, compressing the secondary spring 31. Then place the wafer between the two round clamping plates 30 and the support plate 33. After placement, release the round clamping plates 30, and the secondary spring 31 will push the round clamping plates 30 to move relative to each other. The round clamping blocks 32 will clamp the wafer on both sides to prevent the wafer from falling or being thrown out during the rotation of the spindle 12 and the feed frame 14. Although there are electric and pneumatic clamping methods in the prior art, they require the arrangement of wires or pneumatic pipes during use. In this invention, the spindle 12 and the feed frame 14 rotate independently, which can cause the wires or pneumatic pipes to become entangled, making actual installation more difficult. Therefore, a round clamping mechanism is needed to restrict the wafer.

[0035] like Figures 1-5 As shown, it also includes an anti-detachment mechanism to prevent the wafer clamping plate 30 from loosening during wafer spin-drying. The anti-detachment mechanism is connected to the material frame 14 and includes an anti-detachment plate 40, a side spring 41, and a stop plate 42, combined with... Figure 2 and Figure 4 It can be seen that an anti-detachment plate 40 is axially slidably connected to the right side of the material frame 14. The rotating shaft on the right side of the material frame 14 passes through the anti-detachment plate 40 and is rotatably connected to the shaft seat 13. Figure 4 and Figure 5 It can be seen that the anti-detachment plate 40 has two protruding structures on the side near the locking plate 30. These protruding structures are used to lock the two locking plates 30 on opposite sides. A side spring 41 is sleeved on the guide rod of the anti-detachment plate 40. When the anti-detachment plate 40 slides towards the locking plate 30, it will compress the side spring 41. Figure 1 and Figure 3 It can be seen that a stop plate 42 is fixedly connected to the side support 20 near the material frame 14, and from Figure 3 As can be seen, one end of the abutment plate 42 is curved. During the rotation of the main shaft 12, the curved surface of the abutment plate 42 will press the anti-detachment plate 40 towards the clamping plate 30.

[0036] To facilitate the opposing movement of the retaining plates 30 for wafer placement and prevent wafer damage, the spring force of the secondary spring 31 cannot be too large. The spring force is only sufficient to prevent the wafer from falling out of the material frame 14 during the slow rotation of the main shaft 12, ensuring proper wafer immersion into the cleaning tank 11. However, if the spring force of the secondary spring 31 is insufficient, the two retaining plates 30 may move away from the wafer under centrifugal force during the rapid rotation of the material frame 14 to dry the wafer, potentially causing the wafer to be ejected. Therefore, an anti-detachment mechanism is required to prevent this mechanism from being installed just before the secondary gear 23 and the dehydration gear 24 mesh. When the auxiliary gear 23 and the dehydration gear 24 are about to mesh, the abutment plate 42 will contact the anti-detachment plate 40, and the abutment plate 42 will press the anti-detachment plate 40 towards the clamping plate 30. The side spring 41 will be compressed, so that the protruding structures on both sides of the anti-detachment plate 40 will block the sides of the clamping plate 30, thereby preventing the clamping plate 30 from moving away from the wafer under the action of centrifugal force. When the dehydration gear 24 and the auxiliary gear 23 disengage, the abutment plate 42 will also gradually disengage from the anti-detachment plate 40, and the side spring 41 will push the anti-detachment plate 40 to reset in the direction away from the clamping plate 30, so as to facilitate the removal of the spun-dry wafer.

[0037] Example 3: Based on Example 2, such as Figure 2 and Figure 6 As shown, it also includes an anti-collision mechanism to prevent the secondary gear 23 and the dehydration gear 24 from colliding. The anti-collision mechanism is connected to the bearing 13. The anti-collision mechanism includes an anti-collision guide rod 51, an anti-collision spring 52, a support shaft 53, and a locking assembly. Annular grooves 50 are provided on both sides of the main shaft 12. Every three bearings 13 slide within one annular groove 50, and the three bearings 13 are slidably connected to the anti-collision guide rod 51. The anti-collision guide rod 51 is circular. An anti-collision spring 52 is provided between each pair of adjacent bearings 13, and the anti-collision springs 52 are all sleeved on the anti-collision guide rod 51. The anti-collision springs 52 are used to maintain the three bearings 13 in a ring array distribution. Figure 2 As can be seen, the two ends of the main shaft 12 are fixedly connected to the support shaft 53. The main shaft 12 is rotatably connected to the cleaning tank 11 through the support shaft 53. The immersion gear 27 is fixedly connected to the outer end of the right support shaft 53. There is a cavity between the support shaft 53 and the main shaft 12 for installing the locking component. The right end of the main shaft 12 is equipped with the locking component. The locking component restricts the sliding of two of the shaft seats 13 so that the auxiliary gear 23 and the dehydration gear 24 can mesh normally.

[0038] like Figure 2 , Figure 6 and Figure 7 As shown, the locking assembly includes a guide seat 60, a locking block 61, a small spring 62, a lock head 63, an unlocking plate 64, and an unlocking lever 65. Figure 6 and Figure 7It can be seen that three guide seats 60 are fixedly connected in a ring array at the right end of the main spindle 12. Each guide seat 60 has a locking block 61 slidably connected to it. The sliding direction of the locking block 61 is perpendicular to the axial direction of the main spindle 12, and each locking block 61 corresponds to a shaft seat 13. A small spring 62 is sleeved on the guide rod of the locking block 61. When the locking block 61 slides away from the shaft seat 13, it compresses the small spring 62. Figure 7 It can be seen that a lock head 63 is fixed to the right end of each shaft seat 13, and the locking block 61 has a groove on the end facing the lock head 63, so that the lock head 63 can be locked in the groove on the locking block 61 to restrict the sliding of the shaft seat 13. Figure 2 It can be seen that an unlocking plate 64 is fixed to the upper side of the cleaning tank 11. Figure 6 The specific shape of the unlocking plate 64 can be seen. Each locking block 61 is fixed with an unlocking rod 65. During the rotation of the main shaft 12, the unlocking plate 64 squeezes the unlocking rod 65 to disengage the locking block 61 from the corresponding lock head 63, thereby allowing the corresponding shaft seat 13 to slide normally.

[0039] Since the secondary gear 23 maintains a relatively high rotational speed, direct hard contact between the dehydration gear 24 and the secondary gear 23 may cause damage. Therefore, an anti-collision mechanism is needed to prevent hard collisions between the secondary gear 23 and the dehydration gear 24, while also ensuring the meshing of the dehydration gear 24 and the secondary gear 23. The small spring 62 is used to push the locking block 61 to lock onto the lock head 63, preventing the corresponding shaft seat 13 from sliding. When the dehydration gear 24 is about to mesh with the secondary gear 23, the unlocking plate 64 will contact one of the unlocking rods 65 corresponding to the dehydration gear 24, and the unlocking plate 64 will push the corresponding locking block 61 away from the lock head 63 by squeezing the unlocking rod 65, thereby allowing the dehydration gear 24 to mesh. One axle seat 13 corresponding to wheel 24 can slide to prevent hard collisions, but the other two axle seats 13 are in a locked state that cannot slide. Therefore, the anti-collision spring 52 can be compressed, and the anti-collision spring 52 applies a reset force to the axle seat 13 through its elasticity, so that the dehydration gear 24 can mesh and rotate with the secondary gear 23. When the dehydration gear 24 and the secondary gear 23 disengage, the unlocking rod 65 will disengage from the unlocking plate 64. At this time, the small spring 62 can push the locking block 61 to reset, and the axle seat 13 will reset under the action of the anti-collision spring 52, so that the reset locking block 61 can be locked on the lock head 63 of the corresponding axle seat 13, thereby continuing to restrict the sliding of the axle seat 13.

[0040] Example 4: Based on Example 3, such as Figure 3 and Figure 8As shown, it also includes a wafer picking mechanism, which is mounted on the worktable 10. The picking mechanism includes a front support 70, a reversing shaft 71, a slide 72, a gripping plate 73, and a handle 74. The front support 70 is fixedly connected to the worktable 10. The reversing shaft 71 is rotatably connected to the front support 70 with damping, preventing the reversing shaft 71 from rotating freely. The slide 72 is fixedly connected to the reversing shaft 71, and the gripping plate 73 is slidably connected to the slide 72. The sliding direction of the gripping plate 73 is perpendicular to the axial direction of the reversing shaft 71. Multiple suction cups for adsorbing wafers are evenly spaced on the gripping plate 73. Figure 8 As can be seen, the gripping plate 73 has multiple protruding structures at equal intervals. This is a schematic chuck structure. In the prior art, commonly used chucks for holding wafers include vacuum chucks, electrostatic chucks, and Bernoulli chucks. Technicians can choose according to the actual situation. The guide rod of the gripping plate 73 is fixed with a handle 74 for easy gripping.

[0041] like Figure 4 and Figure 8 As shown, the material handling mechanism also includes a loosening rod 80 and a pressure rod 81, from... Figure 8 It can be seen that four loosening rods 80 are symmetrically fixed to the clamping plate 73, and the end of the loosening rod 80 away from the clamping plate 73 has an inclined surface. Figure 4 It can be seen that each round plate 30 has two pressure rods 81 symmetrically fixed on it, and the end of the pressure rod 81 away from the round plate 30 is provided with an inclined surface. The release rod 80 is used to squeeze the pressure rod 81 to drive the round block 32 and the wafer to disengage.

[0042] like Figure 3 and Figure 8 As shown, it also includes an upper support 90 and a carrier plate 91 for easy placement of wafers. The reversing shaft 71 is provided with two sets of slides 72, clamping plates 73 and handles 74, and the two sets are symmetrical. The upper support 90 is fixed to the front support 70, and the carrier plate 91 is fixed to the upper support 90. The carrier plate 91 cooperates with the clamping plate 73 located on the upper side to support and place the wafers to be cleaned.

[0043] While the spindle 12 rotates for wafer cleaning, the worker places the wafers to be cleaned onto the upper clamping plate 73. The upper clamping plate 73 and the carrier plate 91 support the wafers, preventing them from falling when the suction cups are not activated. After placement, the suction cups on the clamping plate 73 are controlled to pick up the wafers. When one of the feed frames 14 rotates to face the lower clamping plate 73, the motor 21 is stopped. The worker then pushes the lower clamping plate 73 closer to the feed frame 14 using the handle 74. The release rod 80 presses the pressure rod 81 to both sides, causing the clamping plates 30 to move in opposite directions to loosen the clamping of the wafers. Then, the suction cups on the clamping plate 73 are controlled to pick up the spun-dry wafers in the feed frame 14. Then, the worker pulls back the clamping plate 73 to remove the wafer from the material frame 14. After pulling it back, the worker can position the wafer tray facing the clamping plate 73 so that the suction cups on the clamping plate 73 stop adsorbing and the wafer can fall directly into the tray for transfer or storage. Then, the reversing shaft 71 is rotated 180 degrees clockwise to rotate the wafer placed on the upper side to the lower side. The clamping plate 73 is then pushed towards the material frame 14 to transport the wafer placed on the clamping plate 73 into the material frame 14. During the process of pulling back the clamping plate 73, the release rod 80 will disengage from the pressure rod 81, so that the round plate 30 can be reset under the push of the secondary spring 31 to prevent the wafer from falling out of the material frame 14.

[0044] Those skilled in the art should understand that the above embodiments do not limit the present invention in any way, and all technical solutions obtained by equivalent substitution or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A semiconductor wafer surface treatment apparatus, comprising a worktable (10) and a cleaning tank (11), characterized in that: It also includes a spindle (12), a bearing seat (13), a material frame (14) and a drive mechanism. A cleaning box (11) is fixedly connected to the worktable (10). A spindle (12) is rotatably connected to the cleaning box (11). A material frame (14) is rotatably connected to the spindle (12) through the bearing seat (13). The material frame (14) is used to place the wafers to be cleaned. A drive mechanism is installed on the worktable (10). After the drive mechanism is started, it will drive the spindle (12) to rotate slowly. When the wafers in the material frame (14) are cleaned, the drive mechanism will drive the material frame (14) to rotate quickly. The drive mechanism includes a side support (20), a motor (21), a main gear (22), a secondary gear (23), a dewatering gear (24), an external gear (25), an internal gear (26), and a water-immersing gear (27). The side support (20) is fixedly connected to the worktable (10). The main gear (22) and the secondary gear (23) are coaxially rotatably connected to the side support (20). The motor (21) for driving the main gear (22) and the secondary gear (23) is fixedly connected to the side support (20). The material frame (14) A dewatering gear (24) is fixedly connected to the main shaft (12). During the rotation of the main shaft (12), the dewatering gear (24) can mesh with the auxiliary gear (23) to drive the material frame (14) to rotate quickly. An external gear (25) and an internal gear (26) are also fixedly connected to the side support (20) in a coaxial manner. During the rotation of the main gear (22), it can mesh with the external gear (25). A water-immersing gear (27) is connected to the main shaft (12). The internal gear (26) can mesh with the water-immersing gear (27) to drive the main shaft (12) to rotate slowly.

2. The semiconductor wafer surface treatment equipment as described in claim 1, characterized in that: Both the main gear (22) and the internal gear (26) are toothless gears, and the diameter of the external gear (25) is larger than that of the main gear (22).

3. The semiconductor wafer surface treatment equipment as described in claim 1, characterized in that: It also includes a wafer clamping mechanism for fixing the wafer in the material frame (14). The wafer clamping mechanism includes a wafer clamping plate (30), a secondary spring (31), and a wafer clamping block (32). The wafer clamping plate (30) is slidably connected to the material frame (14), and the wafer clamping plate (30) slides radially. The secondary spring (31) is sleeved on the guide rod of the wafer clamping plate (30), and the wafer clamping block (32) for fixing the wafer is fixed on the wafer clamping plate (30).

4. The semiconductor wafer surface treatment equipment as described in claim 3, characterized in that: It also includes an anti-detachment mechanism to prevent the wafer clamping plate (30) from loosening during wafer spin-drying. The anti-detachment mechanism includes an anti-detachment plate (40), a side spring (41), and a stop plate (42). The anti-detachment plate (40) is slidably connected to the material frame (14). The anti-detachment plate (40) is used to restrict the wafer clamping plate (30) from sliding through the protrusion structure on it to prevent the wafer from being loosened. The side spring (41) is sleeved on the guide rod of the anti-detachment plate (40). The stop plate (42) is fixedly connected to the side support (20). During the rotation of the spindle (12), the stop plate (42) will squeeze the anti-detachment plate (40) to restrict the wafer clamping plate (30) from sliding.

5. The semiconductor wafer surface treatment equipment as described in claim 1, characterized in that: It also includes an anti-collision mechanism to prevent the secondary gear (23) and the dehydration gear (24) from colliding. The anti-collision mechanism includes an anti-collision guide rod (51), an anti-collision spring (52), a support shaft (53), and a locking assembly. Every three shaft seats (13) are slidably connected in the same annular groove (50) opened on the main shaft (12), and the three shaft seats (13) are slidably connected to the anti-collision guide rod (51). The anti-collision guide rod (51) is fitted with an anti-collision spring (52) for keeping the three shaft seats (13) in an annular array distribution. The main shaft (12) is fixedly connected to the support shaft (53), and the main shaft (12) is rotatably connected to the cleaning tank (11) through the support shaft (53). The immersion gear (27) is fixedly connected to the support shaft (53). The locking assembly is installed on the main shaft (12). The locking assembly allows the secondary gear (23) and the dehydration gear (24) to mesh normally by restricting the sliding of two of the shaft seats (13).

6. The semiconductor wafer surface treatment apparatus as described in claim 5, characterized in that: The locking assembly includes a guide seat (60), a locking block (61), a small spring (62), a lock head (63), an unlocking plate (64), and an unlocking rod (65). The main shaft (12) is slidably connected to the locking blocks (61) via the guide seat (60). Each locking block (61) corresponds to a shaft seat (13). A small spring (62) is sleeved on the guide rod of the locking block (61). A lock head (63) is fixedly connected to the shaft seat (13). The locking block (61) and the lock head (63) engage to restrict the sliding of the shaft seat (13). An unlocking plate (64) is fixedly connected to the cleaning tank (11). An unlocking rod (65) is fixedly connected to the locking block (61). During the rotation of the main shaft (12), the unlocking plate (64) squeezes the unlocking rod (65) to disengage the locking block (61) and the corresponding lock head (63).

7. The semiconductor wafer surface treatment equipment as described in claim 2, characterized in that: It also includes a pick-up mechanism for removing wafers. The pick-up mechanism includes a front support (70), a reversing shaft (71), a carriage (72), a gripping plate (73), and a handle (74). The front support (70) is fixedly connected to the worktable (10). The reversing shaft (71) is rotatably connected to the front support (70). The carriage (72) is fixedly connected to the reversing shaft (71). The gripping plate (73) is slidably connected to the carriage (72). The gripping plate (73) is equipped with a suction cup for picking up wafers. The guide rod of the gripping plate (73) is fixedly connected with a handle (74) for easy gripping.

8. The semiconductor wafer surface treatment apparatus as described in claim 7, characterized in that: The material handling mechanism also includes a release rod (80) and a pressure rod (81). The release rod (80) is fixed on the clamping plate (73), and the pressure rod (81) is fixed on the round plate (30). The release rod (80) and the pressure rod (81) press together to drive the round block (32) and the wafer to disengage.

9. The semiconductor wafer surface treatment apparatus as described in claim 8, characterized in that: It also includes an upper support (90) and a carrier plate (91) for easy placement of wafers. The reversing shaft (71) is provided with two sets of slides (72), a clamping plate (73) and a handle (74). The upper support (90) is fixedly connected to the front support (70), and the carrier plate (91) is fixedly connected to the upper support (90). The carrier plate (91) cooperates with the clamping plate (73) located on the upper side to support and place the wafer to be cleaned.

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