A power electronic component substrate packaging device

Abstract

This invention provides a power electronic component substrate packaging device, relating to the technical field of substrate packaging equipment. The power electronic component substrate packaging device includes support feet, with a support plate fixedly connected to the top of multiple support feet. A clamping and positioning mechanism is disposed at the center of the interior of the multiple support feet, and a pushing mechanism is disposed at the bottom of the clamping and positioning mechanism. A packaging mechanism is disposed at the top of the support plate, and the clamping and positioning mechanism includes a base plate. First motors are disposed on both sides of the outer wall of the base plate. This power electronic component substrate packaging device can automatically package substrates for power components, eliminating the need for manual packaging, thus improving efficiency. It also features heating of the adhesive to prevent condensation and dripping, and a function for rapid air drying of the packaged substrate, further improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of substrate packaging equipment technology, specifically to a substrate packaging device for power electronic components. Background Technology

[0002] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper-clad laminate. Single-sided and double-sided PCBs are manufactured by selectively processing the copper-clad laminate (CCL) with hole machining, chemical copper plating, electroplating, etching, etc., to obtain the desired circuit pattern. Another type of PCB, multilayer PCBs, also uses a thin copper-clad laminate as a base, and alternately laminates conductive pattern layers with prepreg to form three or more interconnected conductive pattern layers. It has the functions of conductivity, insulation, and support. The performance, quality, processability, manufacturing cost, and manufacturing level of a PCB largely depend on the substrate material. During the substrate encapsulation process, adhesives are often used for substrate encapsulation.

[0003] Most existing power component substrate packaging methods rely on manual dispensing of adhesive, which is slow, prone to adhesive drip misalignment, and susceptible to failure to dispense adhesive due to its condensation properties, thus impacting substrate production efficiency. Therefore, those skilled in the art have provided a power electronic component substrate packaging apparatus to address the problems described in the background. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a power electronic component substrate packaging device that can automatically package power component substrates, eliminating the need for manual packaging, thus improving efficiency. It also features heating of the adhesive to prevent condensation and dripping, and rapid air drying of the packaged substrate, further enhancing production efficiency.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solution: a power electronic component substrate packaging device, including support feet, a support plate fixedly connected to the top of a plurality of support feet, a clamping and positioning mechanism disposed inside the plurality of support feet near the center, a pushing mechanism disposed at the bottom end of the clamping and positioning mechanism, and a packaging mechanism disposed at the top end of the support plate.

[0008] The clamping and positioning mechanism includes a base plate, and a first motor is provided on both sides of the outer wall of the base plate. A rotating rod is fixedly connected to the output end of each of the first motors. A driving wheel is fixedly connected to one side of the outer wall of each of the two rotating rods. A toothed belt is engaged on the outer wall of each of the two driving wheels. A driven wheel is engaged on the inner wall of each of the two toothed belts at the end away from the driving wheel.

[0009] The above technical solution involves a first motor driving the drive wheel to rotate, which in turn causes the toothed belt to rotate. The toothed belt then drives the driven wheel to rotate, causing both the driven wheel and the drive wheel to slide along the transmission block.

[0010] Preferably, threaded rods are fixedly connected to one side of the outer wall of both driving wheels and driven wheels, and transmission blocks are threadedly connected to the outer wall of multiple threaded rods, with a limit block rotatably connected to one end of each threaded rod.

[0011] The above technical solution uses a sliding transmission block to drive the clamping plate to slide, clamping the substrate and facilitating subsequent glue encapsulation, preventing misalignment from affecting the glue coating.

[0012] Preferably, a connecting frame is fixedly connected to one side of the plurality of transmission blocks, two spring rods are fixedly connected to one side of the two connecting frames, and a clamping plate is fixedly connected to the end of the plurality of spring rods away from the connecting frame;

[0013] The above technical solution uses a clamping plate to fix the substrate.

[0014] Preferably, the packaging mechanism includes a controller fixed to the top of the support plate. Two transmission lines are fixedly connected to one side of the outer wall of the controller. A heating shell is fixedly connected to the end of the two transmission lines away from the controller and a vent is passed through them. A heating coil is fixedly connected to the inner wall of the heating shell. A heat-conducting pipe is fixedly connected to the inner wall of the heating coil. A heat-conducting head is fixedly connected to one end of the heat-conducting pipe, and a heat-conducting terminal is fixedly connected to the other end of the heat-conducting pipe. A vent is passed through one end of the heat-conducting head.

[0015] The above technical solution involves controlling the current transmitted to the heating coil via a controller, which then heats the heat pipe and heat-conducting head. This prevents the adhesive inside the heat pipe from condensing due to temperature changes, thus avoiding any impact on subsequent adhesive application and encapsulation. The heat-conducting head is then used to apply the adhesive and encapsulate the substrate.

[0016] Preferably, a compression pump is fixedly connected to the top of the support plate on the side away from the controller, a transmission duct is fixedly connected to the output end of the compression pump, an air guide is fixedly connected to the end of the transmission duct away from the compression pump, and multiple air outlets are fixedly connected to the bottom end of the air guide, and the multiple air outlets are located on the outer wall of the heat conduction head.

[0017] The above technical solution uses a compressor to compress outside air, which is then transmitted through a transmission duct to the air vent. The compressed air is then distributed through the air vent and discharged through multiple air outlets to air dry the substrate after the adhesive is applied. This accelerates the production efficiency of the substrate and prevents adhesive from dripping and affecting the appearance of the substrate.

[0018] Preferably, a fixing plate is fixedly connected to the outer wall of the air guide, and a plurality of connecting feet are fixedly connected to the outer wall of the fixing plate, with the ends of the plurality of connecting feet away from the fixing plate fixedly connected to the base plate;

[0019] The above technical solution uses a fixing plate to fix the air vent.

[0020] Preferably, the pushing mechanism includes a box, a second motor is fixedly connected to the inner bottom end face of the box, and a transmission rod is fixedly connected to the output end of the second motor;

[0021] The above technical solution involves placing the power electronic component substrate onto a pusher plate, and using a second motor to drive the transmission rod to rotate, allowing the pusher plate to slide up and down.

[0022] Preferably, a sliding rod is threadedly connected to the end of the transmission rod away from the second motor, a pusher plate is fixedly connected to the top of the sliding rod, and a plurality of limiting rods are fixedly connected to the bottom of the pusher plate;

[0023] The above technical solution involves placing the power electronic component substrate onto a pusher plate, and then using a second motor to drive a transmission rod to rotate. This causes the transmission rod to move the sliding rod and the pusher plate up and down, allowing the substrate to be mounted upwards for encapsulation.

[0024] Preferably, in step S1: the power electronic component substrate is placed on the pusher plate, and the transmission rod is rotated by the second motor, so that the transmission rod drives the sliding rod and the pusher plate to slide up and down, so that the substrate can be upward for packaging.

[0025] S2: The first motor drives the drive wheel to rotate, which in turn drives the toothed belt to rotate. The toothed belt drives the driven wheel to rotate, and both the driven wheel and the drive wheel drive the transmission block to slide, thereby driving the clamping plate to slide and clamp the substrate. This facilitates subsequent glue encapsulation and prevents misalignment from affecting the glue coating.

[0026] S3: The controller controls the current to be transmitted to the heating coil, which heats the heat pipe and the heat head, preventing the adhesive in the heat pipe from condensing due to temperature and affecting subsequent adhesive application and encapsulation. The heat head is used to apply the adhesive and encapsulate the substrate.

[0027] S4: The compressor pump compresses outside air and transmits it to the air duct through the air duct. The compressed air is then distributed through the air duct and discharged through multiple air outlets to air dry the substrate after the adhesive is applied. This speeds up the substrate production process and prevents adhesive from dripping and affecting the appearance of the substrate.

[0028] Working Principle: This device places the power electronic component substrate onto a pusher plate. A second motor drives a transmission rod to rotate, causing the transmission rod to slide up and down along a sliding rod and the pusher plate, thus lifting the substrate for encapsulation. A first motor drives a drive wheel to rotate, which in turn drives a toothed belt. The toothed belt drives a driven wheel to rotate, causing both the driven and drive wheels to slide along a transmission block, which in turn drives a clamping plate to clamp the substrate. A controller controls the current transmission to a heating coil, which heats the heat pipe and heat-conducting head. Adhesive is applied to the heat-conducting head to encapsulate the substrate. A compressor pump compresses outside air and transmits it through a transmission duct to an air vent. The compressed air is then distributed through multiple outlets to dry the substrate after adhesive application.

[0029] (III) Beneficial Effects

[0030] This invention provides a power electronic component substrate packaging device. It has the following advantages:

[0031] 1. The present invention provides a power electronic component substrate packaging device. A first motor drives the drive wheel to rotate, thereby causing the toothed belt to rotate. The toothed belt drives the driven wheel to rotate, so that both the driven wheel and the drive wheel drive the transmission block to slide, thereby causing the clamping plate to slide and clamp the substrate, which facilitates subsequent glue encapsulation and prevents misalignment from affecting the glue coating.

[0032] 2. This invention provides a power electronic component substrate packaging device. The controller controls the current transmission to the heating coil, which heats the heat pipe and the heat-conducting head. This prevents the adhesive in the heat pipe from condensing due to temperature, which would affect subsequent adhesive application and packaging. The heat-conducting head is used to apply adhesive and package the substrate.

[0033] 3. The present invention provides a power electronic component substrate packaging device, which uses a compressor pump to compress outside air and transmits it to the air guide through a transmission duct. The compressed air is then diverted through the air guide and discharged through multiple air outlets to air dry the substrate after it has been coated with adhesive. This speeds up the production efficiency of the substrate and prevents adhesive from dripping and affecting the appearance of the substrate. Attached Figure Description

[0034] Figure 1 This is an isometric view of the present invention;

[0035] Figure 2 This is a schematic diagram of the clamping and positioning mechanism of the present invention;

[0036] Figure 3 This is a schematic diagram of the feeding mechanism of the present invention;

[0037] Figure 4 This is a schematic diagram of the packaging mechanism of the present invention;

[0038] Figure 5 This is a schematic diagram of the air outlet connection structure of the present invention;

[0039] Figure 6 This is a schematic diagram of the controller connection structure of the present invention;

[0040] Figure 7 This is a schematic diagram of the heating coil connection structure of the present invention.

[0041] The components include: 1. Support foot; 11. Support plate; 2. Clamping and positioning mechanism; 21. Base plate; 22. First motor; 23. Rotating rod; 24. Driving wheel; 25. Toothed belt; 26. Driven wheel; 27. Threaded rod; 28. Transmission block; 29. ​​Limiting block; 210. Connecting frame; 211. Spring rod; 212. Clamping plate; 3. Packaging mechanism; 31. Controller; 32. Transmission line; 33. Heating shell; 34. Heat-conducting terminal; 35. Heat-conducting head; 36. Compression pump; 37. Transmission duct; 38. Air vent; 39. Air outlet; 310. Fixing plate; 311. Connecting foot; 312. Heating coil; 313. Heat-conducting pipe; 4. Pushing mechanism; 41. Box body; 42. Second motor; 43. Transmission rod; 44. Sliding rod; 45. Pushing plate; 46. Limiting rod. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. In the description of this application, it should be noted that the terminology used herein is only for describing specific implementations and is not intended to limit the exemplary implementations according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings indicate similar items, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0043] Example 1:

[0044] like Figure 1-5 As shown, this embodiment of the invention provides a power electronic component substrate packaging device, including support feet 1, a support plate 11 fixedly connected to the top of multiple support feet 1, a clamping and positioning mechanism 2 arranged inside the multiple support feet 1 near the center, a pushing mechanism 4 arranged at the bottom end of the clamping and positioning mechanism 2, and a packaging mechanism 3 arranged at the top end of the support plate 11.

[0045] The clamping and positioning mechanism 2 includes a base plate 21. A first motor 22 is provided on both sides of the outer wall of the base plate 21. A rotating rod 23 is fixedly connected to the output end of each first motor 22. A drive wheel 24 is fixedly connected to one side of the outer wall of each of the two rotating rods 23. A toothed belt 25 is meshed on the outer wall of each of the two drive wheels 24. A driven wheel 26 is meshed on the inner wall of each of the two toothed belts 25 away from the drive wheel 24. The first motor 22 drives the drive wheel 24 to rotate, thereby causing the toothed belt 25 to rotate. The toothed belt 25 drives the driven wheel 26 to rotate, so that both the driven wheel 26 and the drive wheel 24 drive the transmission block 28 to slide.

[0046] Example 2: Threaded rods 27 are fixedly connected to one side of the outer walls of the two driving wheels 24 and the driven wheel 26. Transmission blocks 28 are threadedly connected to the outer walls of multiple threaded rods 27, and one end of each threaded rod 27 is rotatably connected to a limit block 29. By sliding the transmission blocks 28, the clamping plate 212 is driven to slide, clamping the substrate for subsequent adhesive encapsulation and preventing misalignment from affecting adhesive application. Connecting frames 210 are fixedly connected to one side of each transmission block 28. Two spring rods 211 are fixedly connected to one side of each connecting frame 210. The clamping plate 212 is fixedly connected to the end of each spring rod 211 away from the connecting frame 210. The clamping plate 212 fixes the substrate. (Encapsulation mechanism 3 packages) The system includes a controller 31 fixed to the top of the support plate 11. Two transmission lines 32 are fixedly connected to one side of the outer wall of the controller 31. A heating shell 33 is fixedly connected to the end of each transmission line 32 away from the controller 31, and an air duct 38 passes through it. A heating coil 312 is fixedly connected to the inner wall of the heating shell 33. A heat-conducting pipe 313 is fixedly connected to the inner wall of the heating coil 312. A heat-conducting head 35 is fixedly connected to one end of the heat-conducting pipe 313, and an air duct 38 passes through one end of the heat-conducting head 35. A heat-conducting terminal 34 is fixedly connected to the other end of the heat-conducting pipe 313. The controller 31 controls the current transmission to the heating coil 312, which heats the heat-conducting pipe 313 and the heat-conducting head 35, preventing the glue inside the heat-conducting pipe 313 from becoming sticky. Condensation due to temperature can affect subsequent adhesive application and encapsulation. Adhesive is applied through the heat-conducting head 35 for substrate encapsulation. A compressor pump 36 is fixedly connected to the top of the support plate 11, away from the controller 31. A transmission duct 37 is fixedly connected to the output end of the compressor pump 36. An air guide 38 is fixedly connected to the end of the transmission duct 37 away from the compressor pump 36. Multiple air outlets 39 are fixedly connected to the bottom of the air guide 38, located on the outer wall of the heat-conducting head 35. The compressor pump 36 compresses outside air, which is then transmitted through the transmission duct 37 to the air guide 38. The compressed air is then distributed through the air guide 38 and discharged through the multiple air outlets 39 to dry the substrate after adhesive application, thus improving substrate production efficiency. To speed up the process and prevent glue dripping that could affect the substrate's appearance, a fixing plate 310 is fixedly connected to the outer wall of the air guide 38. Multiple connecting feet 311 are fixedly connected to the outer wall of the fixing plate 310. The ends of the connecting feet 311 furthest from the fixing plate 310 are fixedly connected to the base plate 21. The fixing plate 310 secures the air guide 38. The pushing mechanism 4 includes a housing 41. A second motor 42 is fixedly connected to the inner bottom surface of the housing 41. A transmission rod 43 is fixedly connected to the output end of the second motor 42. The power electronic component substrate is placed on the pushing plate 45. The second motor 42 drives the transmission rod 43 to rotate, causing the pushing plate 45 to slide up and down. A sliding rod 44 is threadedly connected to the end of the transmission rod 43 furthest from the second motor 42.A pusher plate 45 is fixedly connected to the top of the sliding rod 44, and multiple limiting rods 46 are fixedly connected to the bottom of the pusher plate 45. The power electronic component substrate is placed on the pusher plate 45. A second motor 42 drives a transmission rod 43 to rotate, causing the transmission rod 43 to slide the sliding rod 44 and the pusher plate 45 up and down, thus allowing the substrate to face upwards for encapsulation. S1: The power electronic component substrate is placed on the pusher plate 45. A second motor 42 drives a transmission rod 43 to rotate, causing the transmission rod 43 to slide the sliding rod 44 and the pusher plate 45 up and down, thus allowing the substrate to face upwards for encapsulation.

[0047] S2: The first motor 22 drives the drive wheel 24 to rotate, which in turn drives the toothed belt 25 to rotate. The toothed belt 25 drives the driven wheel 26 to rotate, so that both the driven wheel 26 and the drive wheel 24 drive the transmission block 28 to slide, thereby driving the clamping plate 212 to slide and clamp the substrate, which facilitates subsequent glue encapsulation and prevents misalignment from affecting the glue coating.

[0048] S3: The controller 31 controls the current to be transmitted to the heating coil 312. The heating coil 312 heats the heat pipe 313 and the heat head 35, so that the glue in the heat pipe 313 will not condense due to temperature and affect the subsequent glue application and encapsulation. The glue is applied through the heat head 35 to encapsulate the substrate.

[0049] S4: The outside air is compressed by the compressor pump 36 and transmitted to the air guide 38 through the transmission air duct 37. The compressed air is then diverted through the air guide 38 and discharged through multiple air outlets 39 to air dry the substrate after the glue is applied. This speeds up the production efficiency of the substrate and prevents glue from dripping and affecting the appearance of the substrate.

[0050] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A power electronic component substrate packaging device, comprising support feet (1), characterized in that: A support plate (11) is fixedly connected to the top of a plurality of support feet (1). A clamping and positioning mechanism (2) is provided at the center of the interior of the plurality of support feet (1). A pushing mechanism (4) is provided at the bottom of the clamping and positioning mechanism (2). A sealing mechanism (3) is provided at the top of the support plate (11). The clamping and positioning mechanism (2) includes a base plate (21). A first motor (22) is provided on both sides of the outer wall of the base plate (21). A rotating rod (23) is fixedly connected to the output end of the first motor (22). A drive wheel (24) is fixedly connected to one side of the outer wall of the two rotating rods (23). A toothed belt (25) meshes with the outer wall of the two drive wheels (24). The inner wall of the two toothed belts (25) is far from the inner wall of the two drive wheels (24). A driven wheel (26) meshes with one end of the driving wheel (24). A threaded rod (27) is fixedly connected to one side of the outer wall of both driving wheels (24) and driven wheels (26). A transmission block (28) is threadedly connected to the outer wall of each of the threaded rods (27), and a limit block (29) is rotatably connected to one end of each threaded rod (27). A connecting frame (210) is fixedly connected to one side of each of the transmission blocks (28). Two spring rods (211) are fixedly connected to one side of each of the two connecting frames (210). A clamping plate (212) is fixedly connected to one end of each of the spring rods (211) away from the connecting frame (210). The encapsulation mechanism (3) includes a controller (31) fixed to the top of the support plate (11). Two transmission lines (32) are fixedly connected to one side of the outer wall of the controller (31). The ends of the two transmission lines (32) away from the controller (31) are fixedly connected to a heating shell (33) and have air vents (38) passing through them. A heating coil (312) is fixedly connected to the inner wall of the heating shell (33). A heat pipe (313) is fixedly connected to the inner wall of the heating coil (312). A heat pipe (313) is fixedly connected to one end of the heat pipe (313) and to the other end of the heat pipe (313). An air vent (38) passes through one end of the heat pipe (35). A compressor pump (36) is fixedly connected to the top of the support plate (11) on the side away from the controller (31). The output end of the compressor (36) is fixedly connected to a transmission air duct (37). The end of the transmission air duct (37) away from the compressor (36) is fixedly connected to an air guide (38). The bottom end of the air guide (38) is fixedly connected to multiple air outlets (39), and the multiple air outlets (39) are located on the outer wall of the heat conduction head (35). The outer wall of the air guide (38) is fixedly connected to a fixing plate (310). The outer wall of the fixing plate (310) is fixedly connected to multiple connecting feet (311). The end of the multiple connecting feet (311) away from the fixing plate (310) is fixedly connected to the bottom plate (21). The pushing mechanism (4) includes a housing (41). The inner bottom end face of the housing (41) is fixedly connected to a second motor (42).A transmission rod (43) is fixedly connected to the output end of the second motor (42). A sliding rod (44) is threadedly connected to the end of the transmission rod (43) away from the second motor (42). A pusher plate (45) is fixedly connected to the top end of the sliding rod (44), and multiple limiting rods (46) are fixedly connected to the bottom end of the pusher plate (45).

2. The power electronic component substrate packaging device according to claim 1, characterized in that: The packaging steps of this power electronic component substrate packaging device are as follows: Step 1: Place the power electronic component substrate on the pusher plate (45), and drive the transmission rod (43) to rotate through the second motor (42), so that the transmission rod (43) drives the sliding rod (44) and the pusher plate (45) to slide up and down, so that the substrate can be encapsulated upwards; Step 2: The first motor (22) drives the drive wheel (24) to rotate, which in turn drives the toothed belt (25) to rotate. The toothed belt (25) drives the driven wheel (26) to rotate, so that both the driven wheel (26) and the drive wheel (24) drive the transmission block (28) to slide, thereby driving the clamping plate (212) to slide and clamp the substrate, which facilitates subsequent glue encapsulation and prevents misalignment from affecting the glue coating. Step 3: The controller (31) controls the current to be transmitted to the heating coil (312). The heating coil (312) heats the heat pipe (313) and the heat head (35) so that the glue in the heat pipe (313) will not condense due to temperature and affect the subsequent glue coating and encapsulation. The glue is applied through the heat head (35) to encapsulate the substrate. Step 4: The outside air is compressed by the compressor pump (36) and transmitted to the air guide (38) through the transmission air pipe (37). The compressed air is then diverted through the air guide (38) and discharged through multiple air outlets (39) to air dry the substrate after the glue is applied. This speeds up the production efficiency of the substrate and prevents glue from dripping and affecting the appearance of the substrate.

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