A circuit board and a manufacturing method thereof

Abstract

The application discloses a circuit board and a manufacturing method thereof, and relates to the technical field of electronic circuit additive manufacturing. The manufacturing method comprises the following steps: preparing a first insulating layer; printing a first printed circuit pattern and electroplating a first plated circuit pattern; mutually adhering a surface on which the first plated circuit pattern on the first insulating layer is located to a second insulating layer; opening a first blind hole and a second blind hole; printing a second printed circuit pattern, a third printed circuit pattern, a first conductive column and a second conductive column; electroplating a second plated circuit pattern on the second printed circuit pattern and electroplating a third plated circuit pattern on the third printed circuit pattern. The circuit board is manufactured by using the additive process of printing and electroplating, so that the problems of low production efficiency, serious environmental pollution, high waste cost and high pollution treatment cost of traditional circuit board process can be effectively solved.

Description

Technical Field

[0001] This invention belongs to the field of additive manufacturing technology for electronic circuits, and particularly relates to a circuit board and its manufacturing method. Background Technology

[0002] Most double-sided or multi-layer circuit boards on the market are manufactured using chemical etching technology. Although this technology is mature and can meet the requirements for producing high-precision circuit patterns, it results in low production efficiency and high waste and pollution treatment costs. Summary of the Invention

[0003] In view of this, one objective of the present invention is to provide a circuit board and a method for manufacturing the same, thereby solving the problems of low production efficiency, high environmental pollution, and high waste and pollution treatment costs associated with traditional circuit board manufacturing processes.

[0004] In some illustrative embodiments, the method of manufacturing the circuit board includes: preparing a first insulating layer; forming a first printed circuit pattern on a first surface of the first insulating layer using a conductive paste, and electroplating a first plated circuit pattern on the first printed circuit pattern; preparing a second insulating layer; bonding the second insulating layer with the surface containing the first plated circuit pattern on the first insulating layer; opening a first blind via penetrating the first insulating layer and the first printed circuit pattern to the first plated circuit pattern, and a second blind via penetrating the second insulating layer to the first plated circuit pattern; forming a second printed circuit pattern on a second surface of the first insulating layer using a conductive paste, and filling the first blind via to achieve a first conductive post for conductive interconnection between the second printed circuit pattern and the first plated circuit pattern; forming a third printed circuit pattern on a surface of the second insulating layer away from the first plated circuit pattern using a conductive paste, and filling the second blind via to achieve a second conductive post for conductive interconnection between the third printed circuit pattern and the first plated circuit pattern; electroplating a second plated circuit pattern on the second printed circuit pattern, and electroplating a third plated circuit pattern on the third printed circuit pattern.

[0005] In some alternative embodiments, prior to applying the conductive paste, the method further includes: forming a base coating on the substrate of the conductive paste, wherein the conductive paste is applied on the base coating; wherein the base coating is used to enhance the adhesion of the conductive paste to the substrate.

[0006] In some alternative embodiments, the undercoat includes: a first undercoat between the first insulating layer and the first printed circuit pattern, a second undercoat between the first insulating layer and the second printed circuit pattern, and a third undercoat between the second insulating layer and the third printed circuit pattern.

[0007] In some alternative embodiments, after the second printed circuit pattern is electroplated to form the second plated circuit pattern and the third printed circuit pattern is electroplated to form the third plated circuit pattern, the method further includes: forming a cover layer on the second plated circuit pattern and / or the third plated circuit pattern; the cover layer obscuring part or all of the second plated circuit pattern and / or the third plated circuit pattern.

[0008] In some optional embodiments, after the second printed circuit pattern is electroplated to form the second plated circuit pattern, and after the third printed circuit pattern is electroplated to form the third plated circuit pattern, the method further includes: repeating the following steps one or more times: preparing a third insulating layer; bonding the third insulating layer with the surface of the second plated circuit pattern on the first insulating layer or the surface of the third plated circuit pattern on the second insulating layer; opening a third blind via penetrating the corresponding insulating layer and reaching the corresponding plated circuit pattern; forming a fourth printed circuit pattern on the side of the third insulating layer away from the plated circuit pattern using conductive paste, and filling the third blind via to achieve a third conductive post for conductive interconnection between the fourth printed circuit pattern and the opposite plated circuit pattern; and electroplating the fourth printed circuit pattern to form the fourth plated circuit pattern.

[0009] Another object of the present invention is to provide a circuit board to solve the problems in the prior art.

[0010] In some illustrative embodiments, the circuit board is obtained by any of the manufacturing methods described above.

[0011] In some illustrative embodiments, the circuit board is characterized by comprising: a third plated circuit pattern, a third printed circuit pattern, a second insulating layer, a first plated circuit pattern, a first printed circuit pattern, a first insulating layer, a second printed circuit pattern, and a second plated circuit pattern stacked sequentially; wherein the first plated circuit pattern is formed on the first printed circuit pattern, the second plated circuit pattern is formed on the second printed circuit pattern, and the third plated circuit pattern is formed on the third printed circuit pattern; the second printed circuit pattern is interconnected with the first plated circuit pattern via a first conductive post, and the third printed circuit pattern is interconnected with the first plated circuit pattern via a second conductive post.

[0012] In some preferred embodiments, the circuit board is characterized by further comprising: a first base coating layer between the first insulating layer and the first printed circuit pattern, a second base coating layer between the first insulating layer and the second printed circuit pattern, and a third base coating layer between the second insulating layer and the third printed circuit pattern.

[0013] In some alternative embodiments, the circuit board is characterized by further comprising: a cover layer formed on the second plated circuit pattern and / or the third plated circuit pattern; the cover layer obscuring part or all of the second plated circuit pattern and / or the third plated circuit pattern.

[0014] Compared with the prior art, this application has the following advantages:

[0015] This invention manufactures circuit boards using an additive process of printing and electroplating, which can effectively reduce the problems of low production efficiency, high environmental pollution, and high waste and pollution treatment costs associated with traditional circuit board manufacturing processes. Attached Figure Description

[0016] Figure 1 This is a flowchart example of the circuit board manufacturing method in an embodiment of the present invention;

[0017] Figure 2 This is a process example of the circuit board manufacturing method in the embodiments of the present invention. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] It should be noted that, where there is no conflict, the various technical features in the embodiments of the present invention can be combined with each other.

[0020] This invention discloses a method for manufacturing a circuit board, specifically, as follows: Figure 1-2 As shown, Figure 1 This is a flowchart example of the circuit board manufacturing method in an embodiment of the present invention; Figure 2 This is a process example of a circuit board manufacturing method according to an embodiment of the present invention. The circuit board manufacturing method includes:

[0021] Step S11: Prepare the first insulating layer 110;

[0022] The first insulating layer can be made of rigid board or flexible board. Rigid board includes, but is not limited to: FR-4, CEM-1, 22F, CEM-3, wood, glass, plastic, PMMA (acrylic), etc.; flexible board includes, but is not limited to PET, PVC, PU, ​​PC, PP, PA, PI, CPI (transparent PI), TPE, TPU, TPV, etc.

[0023] Step S12: A first printed circuit pattern 310 is formed on the first surface of the first insulating layer 110 using conductive paste, and a first plated circuit pattern 410 is formed on the first printed circuit pattern 310 by electroplating.

[0024] The conductive paste in this embodiment of the invention refers to a composite conductive paste mainly composed of conductive fillers, resin binders and solvents. After the paste is fully cured, the solvent will evaporate, thereby transforming it into a conductive film in which the conductive fillers are bound by the resin film-forming material.

[0025] The conductive filler is not limited to one or more of the following: metal particles, graphene, conductive carbon black, carbon nanotubes, and conductive particles with core-shell structures; the metal particles are not limited to one or more of the following: gold, silver, copper, iron, nickel, zinc, and silver-coated copper powder; the resin binder may be any commercially available resin, including but not limited to one or more of the following: epoxy resin, acrylic resin, naphthalene-containing epoxy resin, polyaromatic epoxy resin, multifunctional epoxy resin, bismaleimide resin, and polyimide resin. This application does not restrict the selection of solvents.

[0026] The curing method of the low-temperature conductive paste in the embodiments of the present invention is not limited to thermosetting, photocuring, electromagnetic irradiation or other curing methods.

[0027] The main function of the plated circuit pattern (the first plated circuit pattern, and the second, third, and fourth plated circuit patterns referred to below) is to improve one or more of the following properties of the printed circuit pattern: conductivity, stability, solderability, oxidation resistance, and surface properties.

[0028] Step S13: Prepare the second insulating layer 12;

[0029] The first insulating layer can be made of rigid board or flexible board. Rigid board includes, but is not limited to: FR-4, CEM-1, 22F, CEM-3, wood, glass, plastic, PMMA (acrylic), etc.; flexible board includes, but is not limited to PET, PVC, PU, ​​PC, PP, PA, PI, CPI (transparent PI), TPE, TPU, TPV, etc.

[0030] Step S14: The surface of the first plated circuit pattern 410 on the first insulating layer 110 is bonded to the second insulating layer 120.

[0031] The two can be bonded together by the adhesive layer 810.

[0032] Step S15: Open a first blind hole 610 that penetrates the first insulating layer 110 and the first printed circuit pattern 310 and reaches the first plated circuit pattern 410, and a second blind hole 620 that penetrates the second insulating layer 1120 and reaches the first plated circuit pattern 410.

[0033] The first blind hole 610 and / or the second blind hole 620 are not limited to being achieved by mechanical drilling or laser drilling.

[0034] Optionally, after the first blind hole 610 and / or the second blind hole 620 are processed, the process may further include: using a plasma generator to clean the inside of the blind hole, thereby removing the residual first insulating layer 110 and / or second insulating layer 120, exposing the complete metal surface at the bottom of the blind hole as much as possible, so as to improve the reliability of subsequent conductive interconnection and reduce contact resistance.

[0035] Preferably, the temperature of the first insulating layer and / or the second insulating layer can be controlled to reach the glass transition temperature of the material, and then surface treatment can be performed by plasma, which can effectively improve the removal effect of residual impurities.

[0036] Step S16: Form a second printed circuit pattern 320 on the second surface of the first insulating layer 110 using conductive paste, and fill the first blind hole 610 to realize the first conductive post 510 for conductive interconnection between the second printed circuit pattern 320 and the first plated circuit pattern 410.

[0037] Step S17: A third printed circuit pattern 330 is formed on the side of the second insulating layer 120 away from the first plated circuit pattern 410 using conductive paste, and the second conductive post 520 is filled into the second blind hole 620 to achieve conductive interconnection between the third printed circuit pattern 330 and the first plated circuit pattern 410.

[0038] Step S18: Electroplating the second printed circuit pattern 320 to form a second plated circuit pattern 420, and electroplating the third printed circuit pattern 330 to form a third plated circuit pattern 430.

[0039] This invention manufactures circuit boards using an additive process of printing and electroplating, which can effectively reduce the problems of low production efficiency, high environmental pollution, and high waste and pollution treatment costs associated with traditional circuit board manufacturing processes.

[0040] In some embodiments, prior to applying the conductive paste, the method further includes: forming a base coating on the substrate of the conductive paste, wherein the conductive paste is applied on the base coating; wherein the base coating is used to enhance the adhesion of the conductive paste to the substrate.

[0041] In some embodiments, the undercoating layer includes: a first undercoating layer 710 between the first insulating layer 110 and the first printed circuit pattern 310, a second undercoating layer 720 between the first insulating layer 110 and the second printed circuit pattern 320, and a third undercoating layer 730 between the second insulating layer 120 and the third printed circuit pattern 330.

[0042] In some embodiments, after the second printed circuit pattern is electroplated to form the second plated circuit pattern, and after the third printed circuit pattern is electroplated to form the third plated circuit pattern, the method further includes:

[0043] A cover layer is formed on the second and / or third plated circuit patterns; the cover layer covers part or all of the second and / or third plated circuit patterns.

[0044] In some embodiments, after the second printed circuit pattern is electroplated to form the second plated circuit pattern, and after the third printed circuit pattern is electroplated to form the third plated circuit pattern, the method further includes:

[0045] Repeat the following steps once or multiple times:

[0046] Prepare the third insulation layer;

[0047] The second plated circuit pattern on the first insulating layer or the third plated circuit pattern on the second insulating layer is bonded to the third insulating layer.

[0048] A third blind hole is made that penetrates the corresponding insulation layer and extends directly to the corresponding plated circuit pattern;

[0049] A fourth printed circuit pattern is formed on the side of the third insulating layer away from the plated circuit pattern using conductive paste, and a third conductive post is formed by filling the third blind via to achieve conductive interconnection between the fourth printed circuit pattern and the opposite plated circuit pattern.

[0050] A fourth plated circuit pattern is formed by electroplating on the fourth printed circuit pattern.

[0051] This invention discloses a circuit board that can be obtained by any of the manufacturing methods described above.

[0052] This invention discloses a circuit board comprising: a third plated circuit pattern 430, a third printed circuit pattern 330, a second insulating layer 120, a first plated circuit pattern 410, a first printed circuit pattern 310, a first insulating layer 110, a second printed circuit pattern 320, and a second plated circuit pattern 420, stacked sequentially; wherein the first plated circuit pattern 410 is formed on the first printed circuit pattern 310, the second plated circuit pattern 420 is formed on the second printed circuit pattern 320, and the third plated circuit pattern 430 is formed on the third printed circuit pattern 330; the second printed circuit pattern 320 is interconnected with the first plated circuit pattern 410 via a first conductive post 510, and the third printed circuit pattern 330 is interconnected with the first plated circuit pattern 410 via a second conductive post 520.

[0053] In some embodiments, the system further includes: a first base coat layer between the first insulating layer and the first printed circuit pattern, a second base coat layer between the first insulating layer and the second printed circuit pattern, and a third base coat layer between the second insulating layer and the third printed circuit pattern.

[0054] In some embodiments, the method further includes: a cover layer formed on the second plated circuit pattern and / or the third plated circuit pattern; the cover layer obscuring part or all of the second plated circuit pattern and / or the third plated circuit pattern.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a circuit board, characterized in that, include: Prepare the first insulating layer; A first printed circuit pattern is formed on a first surface of the first insulating layer using a conductive paste, and a first plated circuit pattern is formed by electroplating on the first printed circuit pattern. Prepare the second insulation layer; The first plated circuit pattern on the first insulating layer is bonded to the second insulating layer. A first blind hole is formed that penetrates the first insulating layer and the first printed circuit pattern and reaches the first plated circuit pattern, and a second blind hole is formed that penetrates the second insulating layer and reaches the first plated circuit pattern; A second printed circuit pattern is formed on the second surface of the first insulating layer using conductive paste, and a first conductive post is filled into the first blind hole to achieve conductive interconnection between the second printed circuit pattern and the first plated circuit pattern. A third printed circuit pattern is formed on the side of the second insulating layer away from the first plated circuit pattern using conductive paste, and a second conductive post is filled with the second blind via to achieve conductive interconnection between the third printed circuit pattern and the first plated circuit pattern. A second plated circuit pattern is formed by electroplating on the second printed circuit pattern, and a third plated circuit pattern is formed by electroplating on the third printed circuit pattern.

2. The manufacturing method according to claim 1, characterized in that, Before applying the conductive paste, the method further includes: forming a base coating on the substrate of the conductive paste, and applying the conductive paste onto the base coating; wherein the base coating is used to improve the adhesion of the conductive paste to the substrate.

3. The manufacturing method according to claim 2, characterized in that, The base coating includes: a first base coating between the first insulating layer and the first printed circuit pattern, a second base coating between the first insulating layer and the second printed circuit pattern, and a third base coating between the second insulating layer and the third printed circuit pattern.

4. The manufacturing method according to claim 1, characterized in that, After electroplating a second plated circuit pattern on the second printed circuit pattern and electroplating a third plated circuit pattern on the third printed circuit pattern, the method further includes: A cover layer is formed on the second and / or third plated circuit patterns; the cover layer covers part or all of the second and / or third plated circuit patterns.

5. The manufacturing method according to claim 1, characterized in that, After electroplating a second plated circuit pattern on the second printed circuit pattern and electroplating a third plated circuit pattern on the third printed circuit pattern, the method further includes: Repeat the following steps once or multiple times: Prepare the third insulation layer; The second plated circuit pattern on the first insulating layer or the third plated circuit pattern on the second insulating layer is bonded to the third insulating layer. A third blind hole is made that penetrates the corresponding insulation layer and extends directly to the corresponding plated circuit pattern; A fourth printed circuit pattern is formed on the side of the third insulating layer away from the plated circuit pattern using conductive paste, and a third conductive post is formed by filling the third blind via to achieve conductive interconnection between the fourth printed circuit pattern and the opposite plated circuit pattern. A fourth plated circuit pattern is formed by electroplating on the fourth printed circuit pattern.

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