Display module and display device

Abstract

This disclosure provides a display module and a display device. The display module includes a display panel, a touch structure, a first organic insulating layer, a light filter layer, and a second organic insulating layer. The display panel includes a bonding area. The touch structure is located on one side of the display panel. The light filter layer is located on the side of the touch structure opposite to the display panel. Within the bonding area, the second organic insulating layer is located on the side of the first organic insulating layer opposite to the display panel, and at least one of the first and second organic insulating layers has a first groove. At the boundary extending towards the first groove, the first and second organic insulating layers are alternately arranged with the first sidewall of the first organic insulating layer facing the first groove and its orthographic projection onto the display panel interleaving with the second sidewall of the second organic insulating layer facing the first groove. In this display module, the problem of product yield being affected by the newly added second organic insulating layer is improved.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] With the rapid development of OLED (Organic Light-Emitting Diode) display panels, consumers have increasingly higher requirements for the size and integration of OLED display devices. COE (Chip On Encapsulation) technology has been applied to display panels. Display devices using color filters are 110μm thinner and 23% brighter than those using polarizers. This not only improves the mechanical performance of the product but also reduces power consumption by 20%. Therefore, the widespread adoption of COE products has become an industry trend. Consequently, further improving the process yield of COE products is particularly important. Summary of the Invention

[0003] This disclosure provides a display module and a display device. By staggering the first organic insulating layer and the second organic insulating layer at the boundary of the bonding area in the display module, the risk of stress concentration at the boundary of the two organic insulating layers is reduced, thereby reducing the risk of module cracking or detachment during the bonding process of COE products and improving the process yield of COE products.

[0004] This disclosure provides a display module. The display module includes a display panel, a touch structure, a first organic insulating layer, a light filter layer, and a second organic insulating layer. The display panel includes a bonding area. The touch structure is located on one side of the display panel. The light filter layer is located on the side of the touch structure opposite to the display panel. The first organic insulating layer is located between the touch structure and the light filter layer. The second organic insulating layer is located on the side of the light filter layer opposite to the touch structure. Within the bonding area, the second organic insulating layer is located on the side of the first organic insulating layer opposite to the display panel. At least one of the first and second organic insulating layers has a first groove. At the boundary extending towards the first groove, the first organic insulating layer and the second organic insulating layer are alternately arranged with the first sidewall of the first organic insulating layer facing the first groove in the orthographic projection on the display panel and the second sidewall of the second organic insulating layer facing the first groove in the orthographic projection on the display panel.

[0005] In the above solution, the technical solution of setting the first sidewall and the second sidewall at the boundary of the first groove extension direction, i.e. the bonding position, can reduce the risk of stress concentration problems at the boundary of the two upper and lower films of the first organic insulating layer and the second organic insulating layer during the bonding process, thereby improving the product process yield.

[0006] In one specific embodiment of the first aspect of this disclosure, the display module further includes a chip to be bonded disposed within a first recess, and the distance from the first sidewall to the chip to be bonded is less than the distance from the second sidewall to the chip to be bonded. For example, further, a stepped structure is formed between the second sidewall and the first sidewall.

[0007] In the above scheme, the cross-section between the first and second sidewalls in the direction perpendicular to the display panel is designed as a non-straight surface. By preventing stress concentration at a specific point or area, the stress concentration between the first and second sidewalls is reduced, thereby improving the reliability of the display module. Furthermore, the stepped structure design can effectively improve the stress concentration problem between the first and second sidewalls in the display module.

[0008] In one specific embodiment of the first aspect of this disclosure, the first sidewall is the lower sidewall of the first groove near the display panel, and the second sidewall is the upper sidewall of the first groove away from the display panel, the upper sidewall being an inclined surface, and / or the lower sidewall being an inclined surface.

[0009] In the above scheme, at least part of the sidewall of the first groove is designed as an inclined surface. The inclined surface disperses the stress, so that the stress generated during the bonding process is not concentrated at the corners or edges of the first groove, thereby reducing the risk of stress concentration.

[0010] In one specific embodiment of the first aspect of this disclosure, the display module further includes a chip to be bonded disposed within a first recess, and the distance from the first sidewall to the chip to be bonded is greater than the distance from the second sidewall to the chip to be bonded. For example, further, the second sidewall forms a ramp structure and covers the first sidewall.

[0011] In the above scheme, the design scheme in which the second sidewall covers the first sidewall and forms a sloping structure not only uses the sloping structure to disperse stress and reduce the risk of stress concentration, but also increases the applicability of the design scheme disclosed herein.

[0012] In one specific embodiment of the first aspect of this disclosure, the display module includes a substrate, a first metal layer, and a second metal layer. The first metal layer is located on the substrate, and a portion of the first metal layer extending to a bonding region forms a first pin. The first pin includes a cap-shaped structure, comprising a cap portion and an extension portion located around the cap portion. A second metal layer is located on the side of the first metal layer facing away from the substrate and is insulated from the first metal layer. A portion of the second metal layer extending to the bonding region forms a second pin, and the second pin covers the surface of the extension portion facing away from the substrate. Further, the display module also includes an inorganic insulating layer located between the first metal layer and the second metal layer.

[0013] In the above scheme, the second pin covers the surface of the extension of the cap-shaped structure of the first pin, reducing the size of the abrupt cross section between the first pin and the second pin, thereby improving the stress concentration problem between the first pin and the second pin.

[0014] In one specific embodiment of the first aspect of this disclosure, the second pin covers the sidewall of the cap. For example, further, the first pin is a driving pin and the second pin is a touch pin.

[0015] In the above scheme, the design of the second pin covering the side wall of the cap of the first pin effectively improves the stress concentration problem between the first pin and the second pin by eliminating the discontinuity or abrupt cross section between the first pin and the second pin.

[0016] In one specific embodiment of the first aspect of this disclosure, the display module further includes a support film located on the side of the display panel away from the touch structure, and corresponding to the bonding area, the support film has a plurality of second grooves on the side facing the display panel.

[0017] In the above scheme, the multiple second grooves on the support film can reduce the risk of stress concentration at the chip bonding site by dispersing or transferring stress.

[0018] In one specific embodiment of the first aspect of this disclosure, the display module further includes an anisotropic conductive film that covers the surface of the second organic insulating layer away from the display panel and fills the gap between the first groove and the chip to be bonded.

[0019] In the above solution, the electrical connection between the chip to be bonded and the display module is achieved by using anisotropic conductive adhesive film, which can eliminate the slight height difference between the chip to be bonded and the display module and improve the stability of the connection between the chip to be bonded and the display module.

[0020] In one specific embodiment of the first aspect of this disclosure, the display module further includes an elastic support structure disposed in the first groove, wherein the chip to be bonded is placed on the side of the elastic support structure away from the display panel.

[0021] In the above solution, the chip to be bonded is fixed in the first groove of the display module by using an elastic support structure. This not only improves the stability of the electrical connection of the chip to be bonded by reducing production errors and unevenness, but also improves the impact and vibration resistance of the chip to be bonded by its own ability to absorb and buffer stress.

[0022] A second aspect of this disclosure provides a display device that includes the display module described in the first aspect. Attached Figure Description

[0023] Figure 1 This is a cross-sectional schematic diagram of a display module provided in one embodiment of the present disclosure.

[0024] Figure 2 This is a cross-sectional schematic diagram of a display module provided in one embodiment of the present disclosure.

[0025] Figure 3 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present disclosure.

[0026] Figure 4 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present disclosure.

[0027] Figure 5 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present disclosure.

[0028] Figure 6 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present disclosure.

[0029] Figure 7 This is a cross-sectional schematic diagram of another display module provided in an embodiment of the present disclosure.

[0030] Figure 8 This is a cross-sectional schematic diagram of a display module provided for another embodiment of this disclosure.

[0031] Figure 9 This is a cross-sectional schematic diagram of a display module provided in one embodiment of the present disclosure.

[0032] Figure 10 Provided for an embodiment of this disclosure Figure 9 Enlarged view of point A in the image.

[0033] Figure 11 Provided for another embodiment of this disclosure Figure 9 Enlarged view of point A in the image.

[0034] Figure 12 This is a cross-sectional schematic diagram of a display module provided in one embodiment of the present disclosure.

[0035] Figure 13 This is a cross-sectional schematic diagram of a display module provided in one embodiment of the present disclosure.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100 - Display module; NA - Non-display area; BB - Bonding area;

[0038] 110 Display panel; 111 Substrate; 112 First metal layer; 113 First pin; 114 Cap structure; 114a Cap portion; 114b Extension portion;

[0039] 120 - Touch structure; 121 - Second metal layer; 122 - Second pin; 130a - Inorganic insulating layer;

[0040] 130 - First organic insulating layer; 131 - First sidewall;

[0041] 140-Filter Layer;

[0042] 150 - Second organic insulating layer; 151 - Second sidewall;

[0043] 160 - First groove; 161 - Upper sidewall; 162 - Lower sidewall;

[0044] 170 - Chip to be bonded; L1 - First distance; L2 - Second distance;

[0045] 180 - Support membrane; 181 - Second groove;

[0046] 190a - Anisotropic conductive adhesive film; 190b - Elastic support structure. Detailed Implementation

[0047] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0048] like Figure 1As shown, compared to conventional polarizer products, COE (Chip On Encapsulation) products do not require bonding to the display panel; instead, the filter layer is directly fabricated on the thin-film encapsulation structure of the display panel. COE fabrication involves an additional organic insulating layer located on the side of the filter layer facing away from the touch structure. This additional layer aims to improve the flatness of the filter layer in subsequent COE processes, enhance the viewing angle polarization performance, and facilitate the fabrication of subsequent film layers. However, based on the existing organic insulating layer (located between the touch structure and the filter layer to improve the flatness of the touch structure and facilitate subsequent filter layer fabrication), the added organic insulating layer increases the risk of cracks in the display module. For example, in products using COP (Chip On Plastic) technology, the COP location, which is the bonding location (usually located at the edge of the display module), forms a stress concentration point at the boundary between the newly added organic insulating layer and the original organic insulating layer (including but not limited to the organic insulating layer between the touch structure and the filter layer). This makes it easy for the display module to crack or fall off during the bonding process of the chip to be bonded.

[0049] In view of this, embodiments of the present disclosure provide a display module and a display device, which reduce the risk of cracking or peeling of the display module during the bonding process by staggering the first organic insulating layer and the second organic insulating layer in the display module at the boundary of the COP position, thereby improving the yield of COE product manufacturing process.

[0050] This disclosure provides a display module. The display module includes a display panel, a touch structure, a light filter layer, a first organic insulating layer, and a second organic insulating layer. The display panel includes a bonding area. The touch structure is located on one side of the display panel. The light filter layer is located on the side of the touch structure opposite to the display panel. The first organic insulating layer is located between the touch structure and the light filter layer. The second organic insulating layer is located on the side of the light filter layer opposite to the touch structure. Within the bonding area, the second organic insulating layer is located on the side of the first organic insulating layer opposite to the display panel. At least one of the first and second organic insulating layers has a first groove. At the boundary extending towards the first groove, the first sidewall of the first organic insulating layer facing the first groove in the orthographic projection on the display panel and the second sidewall of the second organic insulating layer facing the first groove in the orthographic projection on the display panel are alternately arranged. Thus, in the process of bonding the chip to be bonded into the first groove, since the first organic insulating layer and the second organic insulating layer are staggered at the boundary of the first groove, i.e. the boundary of the COP position, and the staggered arrangement of the two forms a stepped structure or a slope structure rather than a right angle structure, the risk of stress concentration problems at the boundary between the two can be reduced, thereby improving the product yield in the COE process of the display module.

[0051] The following describes a display module and display device according to at least one embodiment of the present disclosure, with reference to the accompanying drawings.

[0052] In a display module 100 provided in one embodiment of this disclosure, such as Figure 1 As shown, the display module 100 includes a display panel 110, a touch structure 120, a first organic insulating layer 130, a light filter layer 140, and a second organic insulating layer 150 stacked in sequence.

[0053] Display panel 110 includes a display area and a non-display area NA, and the non-display area NA includes a bonding area BB. Display panel 110 can be an LCD (Liquid Crystal Display), an LED (Light Emitting Diode Panel), or an OLED (Organic Light-Emitting Diode) display panel. Furthermore, display panel 110 can be a flexible display panel that can be bent, or a rigid display panel that cannot be bent. Correspondingly, the substrate 111 included in display panel 110 can be a flexible substrate that can be bent, or a rigid substrate that cannot be bent. Flexible substrates can be made of polymer materials such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compounds (PAR), and / or glass fiber reinforced plastic (FRP). Rigid substrates can be made of materials such as glass.

[0054] This disclosure does not limit the structure of the display panel 110, especially the film layer structure corresponding to the display area of ​​the display panel 110, which can be designed according to actual needs. For example, taking an OLED display panel as an example, the display area of ​​the OLED display panel may include a driving circuit layer, an OLED device layer, and an encapsulation layer stacked on the substrate 111. The encapsulation layer encapsulates the OLED device layer to prevent external moisture and oxygen from entering the OLED device layer. The driving circuit layer includes an insulating layer, which is formed not only in the display area of ​​the substrate 111 but also extends to the bonding area BB of the substrate 111. The insulating layer includes, but is not limited to, a buffer layer, a gate insulating layer, and an interlayer dielectric layer formed on the substrate 111.

[0055] Continue to refer to Figure 1 It is known that the touch structure 120 is located on one side of the display panel 110, such as the light-emitting side of the display panel 110. From the perspective of improving the flatness of the touch structure 120, a first organic insulating layer 130 is provided on the side of the touch structure 120 away from the display panel 110, and the first organic insulating layer 130 extends from the display area of ​​the display panel 110 to the bonding area BB of the display panel 110.

[0056] The filter layer 140 is located on the side of the first organic insulating layer 130 away from the touch structure 120. From the perspective of improving the flatness of the filter layer 140, a second organic insulating layer 150 is provided on the side of the filter layer 140 away from the touch structure 120. The second organic insulating layer 150 extends from the display area of ​​the display panel 110 to the bonding area BB of the display panel 110.

[0057] Within the bonding area BB of the display module 100, a first organic insulating layer 130 and a second organic insulating layer 150 are stacked together, i.e., the second organic insulating layer 150 is located on the side of the first organic insulating layer 130 facing away from the display panel 110. Considering the requirement to improve the accuracy of the bonding chip position, a first groove 160 adapted to the shape and size of the chip 170 to be bonded is provided on the first organic insulating layer 130 and the second organic insulating layer 150. The first groove 160 can help fix the position and orientation of the chip 170 to be bonded. That is, when bonding the chip, the chip 170 to be bonded is accurately placed in the first groove 160, which can improve the accuracy of the bonding process. At the bonding position, i.e., at the boundary facing the first groove 160, on the same side of the first groove 160, the first sidewall 131 of the first organic insulating layer 130 facing the first groove 160 in the orthographic projection on the display panel 110 and the second sidewall 151 of the second organic insulating layer 150 facing the first groove 160 in the orthographic projection on the display panel 110 are staggered. The staggered arrangement of the first sidewall 131 and the second sidewall 151 forms the sidewall of the first groove 160. The staggered arrangement of the two reduces the risk of stress concentration at the sidewall of the first groove 160, thereby reducing the risk of cracks or detachment of the display module 100 caused by stress and improving the yield of COE products.

[0058] It should be noted that the structure of the display module 100 disclosed herein is not limited to the examples above. For example, the first organic insulating layer 130 and the second organic insulating layer 150 may be fabricated separately, rather than being formed in the same process as a portion of the insulating layer in the display area of ​​the display module 100, i.e., not simultaneously with the film layers present in the display panel 110 itself. For example, the light filter layer 140 may include a plurality of color resist units and a black matrix located between different color resist units, wherein the color resist units correspond to pixel units in the display panel 110, such as red pixel units, green pixel units, and blue pixel units, respectively, and the black matrix corresponds to the non-light-emitting areas between the pixel units. For example, the insulating layer in the display panel 110 may be formed of resin, silicon oxide, silicon nitride, silicon oxynitride, and / or other suitable materials. For example, the first organic insulating layer 130 and the second organic insulating layer 150 can be OC (overcoat, photoresist) layers, mainly serving the functions of planarization, insulation, and protection. The material of this OC layer is one or a mixture of two or more of polymethyl methacrylate (PMMA), polyimide (PI), polyvinyl alcohol (PVA), and polyvinylphenol. All of these can be designed according to the requirements of module 100, and will not be elaborated upon here.

[0059] Based on the display module 100 in the above embodiments, this disclosure will now describe the specific scheme of the alternating arrangement of the first sidewall 131 of the first organic insulating layer 130 and the second sidewall 151 of the second organic insulating layer 150 in the display module 100, as detailed below.

[0060] In a display module 100 provided in one embodiment of the present disclosure, the display module 100 further includes a chip 170 to be bonded placed in a first recess 160, and the distance from the first sidewall 131 to the chip 170 to be bonded is less than the distance from the second sidewall 151 to the chip 170 to be bonded.

[0061] For example, such as Figure 2 , Figure 3 and Figure 4 As shown, in the display module 100, the chip to be bonded 170 is placed in the first recess 160, and there are first sidewalls 131 of two first organic insulating layers 130 and second sidewalls 151 of two second organic insulating layers 150 on both sides of the chip to be bonded in the horizontal direction. Regarding the first sidewall 131 and the second sidewall 151 located on the same side of the chip to be bonded 170, the first distance L1 from the first sidewall 131 to the chip to be bonded 170 is less than the second distance L2 from the second sidewall 151 to the chip to be bonded 170.

[0062] It should be noted that the first distance L1 and the second distance L2 in this embodiment can refer to the average distance, or the maximum distance and / or the minimum distance. Simultaneously, the first distance from the first sidewall 131 of the first organic insulating layer 130 located on opposite sides of the chip to be bonded to the chip 170 can be equal, approximately equal, or unequal, and / or the second distance from the second sidewall 151 of the second organic insulating layer 150 located on opposite sides of the chip to be bonded to the chip 170 can be equal, approximately equal, or unequal. Furthermore, the first distance L1 or the second distance L2 can be the distance from the first sidewall 131 to the same location on the chip to be bonded, such as the same side, center point, or central axis. These can be designed according to actual needs and will not be elaborated upon here.

[0063] Based on the above embodiments, since the first distance L1 corresponding to the first sidewall 131 is less than the second distance L2 corresponding to the second sidewall 151, this disclosure further defines the structural relationship between the first sidewall 131 and the second sidewall 151 located on the same side of the chip to be bonded 170, and the specific solution is as follows.

[0064] In the display module 100 provided in at least one embodiment of this disclosure, a stepped structure is formed between the second sidewall 151 and the first sidewall 131. The stepped design of the first sidewall 131 and the second sidewall 151 can distribute stress and deformation across different step levels. Specifically, compared to a right-angled groove, the stepped structure corresponding to the inner sidewall of the first groove 160 can alleviate stress concentration problems, reduce the risk of module cracks or detachment caused by stress, and thus play a certain role in suppressing the adverse effects caused by the taper angle.

[0065] For example, such as Figure 2 As shown, in this display module 100, on the same side as the chip 170 to be bonded, the first distance L1 from the first sidewall 131 to the chip 170 to be bonded is less than the second distance L2 from the second sidewall 151 to the chip 170 to be bonded. Correspondingly, on the same side as the chip 170 to be bonded, a stepped structure is formed at the first sidewall 131 of the first organic insulating layer 130 and the second sidewall 151 of the second organic insulating layer 150. That is, the width of the opening of the first groove 160 corresponding to the two first sidewalls 131 is less than the width of the opening of the first groove 160 corresponding to the two second sidewalls 151. Thus, the stepped structure formed between the first sidewall 131 and the second sidewall 132 can buffer and disperse the stress and deformation in the bonding process of the chip 170 to be bonded or in other subsequent processes, thereby improving the product yield.

[0066] In another embodiment of the display module 100 provided in this disclosure, the first sidewall 131 is the lower sidewall 162 of the first groove 160 near the display panel 110, and the second sidewall 151 is the upper sidewall 161 of the first groove 160 away from the display panel 110. The upper sidewall 161 is a slope, and / or the lower sidewall 162 is a slope. Thus, in the design scheme where the upper sidewall 161 and / or the lower sidewall 162 of the first groove 160 are sloped, the sloped surfaces make the stress distribution on the sidewall of the first groove 160 more uniform, rather than concentrated at the right-angle transition point, thereby reducing the risk of stress concentration.

[0067] For example, such as Figure 3 As shown, different Figure 2 The structure of the display module 100 shown in the diagram is such that, in the case where the first distance L1 (e.g., average distance) corresponding to the first sidewall 131 is less than the second distance L2 (e.g., average distance) corresponding to the second sidewall 151, with the direction closer to the display panel 110 as down and the direction farther from the display panel 110 as up, the first sidewall 131 forms the lower sidewall 162 of the first groove 160, and the second sidewall 151 forms the upper sidewall 161 of the first groove 160. The planes corresponding to the first sidewall 131 and the second sidewall 151 are inclined planes, and the two are ultimately a single plane, that is, the included angle between the two is a straight angle.

[0068] For example, such as Figure 4 As shown, in this display module 100, a stepped structure is formed between the first sidewall 131 of the first organic insulating layer 130 and the second sidewall 151 of the second organic insulating layer 150. The first sidewall 131 forms the lower sidewall 162 of the first groove 160 near the display panel 110, and the second sidewall 151 forms the upper sidewall 161 of the first groove 160 away from the display panel 110. Both the first sidewall 131 and the second sidewall 151 are inclined surfaces. Furthermore, the included angle between the two inclined surfaces of the first sidewall 131 and the second sidewall 151 can be 180° or an obtuse angle.

[0069] For example, such as Figure 5 and Figure 6 As shown, in this display module 100, the lower sidewall 162 of the first groove 160 corresponding to the first sidewall 131 is not a slope, while the upper sidewall 161 of the first groove 160 corresponding to the second sidewall 151 is a slope, and the included angle between the two surfaces is an obtuse angle. Furthermore, see specific reference... Figure 6 In the display module 100, a stepped structure can also be formed between the first sidewall 131 and the second sidewall 151. For a related introduction to the stepped structure, please refer to the above example, which will not be repeated here.

[0070] For example, such as Figure 7 As shown, in the display module 100, a stepped structure is formed between the first sidewall 131 and the second sidewall 151, and the lower sidewall 162 of the first groove 160 corresponding to the first sidewall 131 is an inclined surface, while the upper sidewall 161 of the first groove 160 corresponding to the second sidewall 151 is not an inclined surface.

[0071] It should be noted that, in this embodiment, the specific parameters of the included angle between the planes containing the lower sidewall 162 of the first groove 160 formed by the first sidewall 131 and the upper sidewall 161 of the first groove 160 formed by the second sidewall 151 are not limited. This can be designed according to the requirements of the display module 100, and will not be elaborated here.

[0072] In another embodiment of the display module 100 provided in this disclosure, the display module 100 further includes a chip 170 to be bonded disposed within a first recess 160, and the distance from the first sidewall 131 to the chip 170 to be bonded is greater than the distance from the second sidewall 151 to the chip 170 to be bonded. In at least one embodiment of the display module 100 provided in this disclosure, the second sidewall 151 forms a ramp structure and covers the first sidewall 131.

[0073] For example, such as Figure 8As shown, in the display module 100, a chip 170 to be bonded is disposed in the first groove 160 on the first organic insulating layer 130 and the second organic insulating layer 150. The first distance L1 from the first sidewall 131 of the first organic insulating layer 130 to the chip 170 to be bonded is greater than the second distance L2 from the first sidewall 131 of the first organic insulating layer 130 to the chip 170 to be bonded. At this time, in the bonding area BB of the display module 100, on the same side as the chip 170 to be bonded, the boundary of the second organic insulating layer 150 on the side of the first organic insulating layer 130 away from the display panel 110, i.e., the second sidewall 151, covers the boundary of the first organic insulating layer 130 on the first groove 160, i.e., the first sidewall 131, and the sidewall of the first groove 160 corresponding to the second sidewall 151 is a slope, i.e., the second sidewall 151 forms a slope structure.

[0074] In the display module 100 of this disclosure, after the second sidewall 151 covers the surface and side of the first sidewall 131, the portion forming the sloping structure can also be provided with a stepped structure, that is, a stepped structure is provided on the sidewall of the first groove 160. In this way, the problem of stress concentration can be more effectively improved.

[0075] In the bonding process of the chip 170 to be bonded in the display module 100, the pins on the chip 170 to be bonded can be matched with multiple pins in the bonding area BB of the display module 100, so that the chip 170 to be bonded can be electrically connected to functional circuits such as driving circuits and / or touch circuits through multiple pins. However, there is a stress concentration problem at multiple pins in the display module 100. Therefore, the present disclosure embodiment next designs the structure of the pins in the display module 100, and the specific solution is as follows.

[0076] In at least one embodiment of the display module 100 provided in this disclosure, such as Figure 9 and Figure 10 As shown, the display module 100 includes a substrate 111, a first metal layer 112, and a second metal layer 121. The first metal layer 112 is located on the substrate 111, and the portion of the first metal layer 112 extending to the bonding region BB forms a first pin 113. The first pin 113 includes a cap-shaped structure 114, which includes a cap portion 114a and an extension portion 114b located around the cap portion 114a. The second metal layer 121 is located on the side of the first metal layer 112 facing away from the substrate 111 and is insulated from the first metal layer 112. The portion of the second metal layer 121 extending to the bonding region BB forms a second pin 122, and the second pin 122 covers the surface of the extension portion 114b facing away from the substrate 111.

[0077] In at least one embodiment of the display module 100 provided in this disclosure, such as Figure 10 and Figure 11As shown, the display module also includes an inorganic insulating layer 130a, which is located between the first metal layer 112 and the second metal layer 121, and covers the surface of the first metal layer 112 facing away from the substrate 111. The inorganic insulating layer 130a can be any one of a silicon dioxide (SiO2) layer or a silicon nitride (Si3N4) layer.

[0078] In the display module 100 provided in at least one embodiment of this disclosure, the first pin 113 is a driving pin and the second pin 122 is a touch pin.

[0079] For example, such as Figure 9 and Figure 10 As shown, the display panel 110 in the display module 100 includes a substrate 111 and a first metal layer 112 located on the substrate 111. The first metal layer 112 may be a metal layer forming the source and drain electrodes in the display panel 110 or a metal layer forming part of the signal lines in the driving circuit. The touch structure 120 includes a second metal layer 121, which may be a metal layer used to form a touch function. During the fabrication of the display module 100, while forming the source and drain electrodes or part of the signal lines in the driving circuit, a first pin 113 located in the bonding region BB is formed in the same process. The first pin 113 is a cap-shaped structure 114, including a cap portion 114a protruding away from the substrate 111 and an extension portion 114b located around the cap portion 114a, which is similar to a "brim" structure. In the process of fabricating the touch structure 120 with touch function, a second pin 122 located in the bonding region BB is formed in the same process, and the second pin 122 completely covers the extension 114b of the first pin 113 away from the surface of the substrate 111. In this way, by reducing the size of the step or abrupt cross section between the first pin 113 and the second pin 122, the problem of stress concentration between the first pin 113 and the second pin 122 is improved.

[0080] In the display module 100 provided in at least one embodiment of this disclosure, the second pin 122 covers the sidewall of the cap 114a.

[0081] For example, such as Figure 9 and Figure 11 As shown, based on the above embodiment, the second pin 122 covers the sidewall of the cap 114a of the first pin 113 and is flush with the surface of the cap 114a of the first pin 113 away from the substrate 111. This eliminates the step difference between the first pin 113 and the second pin 122, eliminates stress concentration points, and effectively improves the problem of stress concentration between the first pin 113 and the second pin 122.

[0082] It should be noted that the structure of the display module 100 in this embodiment is not limited to the examples above. Figure 9 , Figure 10 and Figure 11 The structure is as follows. For example, in this display module 100, different metal layers are insulated from each other, that is, an insulating layer is provided between adjacent metal layers. For example, in this display module 100, the second metal layer 121 may include a multi-layered, insulated metal layer forming different touch electrodes or a bridge structure connecting different touch electrodes. For example, in the display panel 110, in addition to including the first metal layer 112, it also includes other metal layers located between the first metal layer 112 and the substrate 111, such as at least two metal layers forming different signal lines or storage capacitors.

[0083] Based on the structure of the display module 100 in the above embodiments, this disclosure describes the electrical connection method between the chip to be bonded 170 and the first pin 113 and the second pin 122 in the chip bonding process. The specific solution is as follows.

[0084] In at least one embodiment of the display module 100 provided in this disclosure, such as Figure 9 As shown, the display module 100 also includes an anisotropic conductive film 190a (ACF) covering the surface of the second organic insulating layer 150 facing away from the display panel 110. This anisotropic conductive film 190a fills the gap between the first groove 160 and the chip 170 to be bonded. The ACF is a thin film in which conductive particles are dispersed in an insulating adhesive, enabling electrical connections between the pins of the chip 170 to be bonded and multiple pins, such as drive pins and touch pins.

[0085] In addition to reducing the impact of stress concentration on product yield by designing the bonding positions and pins in the display module 100, this disclosure also considers other aspects to further improve product yield.

[0086] In at least one embodiment of the display module 100 provided in this disclosure, the display module 100 further includes a support film 180 located on the side of the display panel 110 away from the touch structure 120 and corresponding to the position of the bonding area BB. The support film 180 is provided with a plurality of second grooves 181, and the openings of the second grooves 181 face the display panel 110.

[0087] For example, such as Figure 12As shown, the display module 100 includes a support film 180, a display panel 110, a touch structure 120, a first organic insulating layer 130, a light filter layer 140, and a second organic insulating layer 150 stacked sequentially. The support film 180, located on the backlight side of the display module 100, provides mechanical support for other film layers in the display module 100 and buffers against external impacts, reducing the risk of deformation, bending, wrinkling, or cracking of other film layers due to external forces. Simultaneously, corresponding to the bonding area BB of the display module 100, a plurality of second grooves 181 are provided on the support film 180, with the openings of the second grooves 181 facing the display panel 110. Without the second grooves 181, the stress generated during the bonding process of the chip 170 to be bonded might be concentrated in the support film 180 portion corresponding to the bonding area BB, resulting in excessive stress in that area. The second grooves 181 disperse the stress to the area surrounding the second grooves 181, making the stress distribution more uniform and improving the overall stability of the display module 100. Furthermore, by setting the distribution direction and layout of multiple second grooves 181, the stress generated during the bonding process of the chip 170 to be bonded can be transmitted along the direction away from the bonding area BB, thereby reducing the stress level at the chip bonding point, improving the bonding reliability, and further improving the yield of the display module 100.

[0088] It should be noted that the specific arrangement of the second groove 181 in this embodiment can be set according to actual needs. For example, the depth of the second groove 181 in the direction perpendicular to the display panel 110, the shape of the cross-section of the second groove 181, the width of the second groove 181, the spacing between adjacent second grooves 181, and the horizontal arrangement of the second grooves 181 on the support film 180 are all set, and will not be elaborated here.

[0089] During the bonding process of the chip 170 to be bonded, whether it is hot-press bonding or other connection methods, a certain stress will be generated. Therefore, in the display module 100 provided in at least one embodiment of this disclosure, the display module 100 also includes an elastic support structure 190b disposed in the first groove 160, and the chip 170 to be bonded is placed on the side of the elastic support structure 190b away from the display panel 110.

[0090] For example, such as Figure 13As shown, the display module 100 includes a support film 180, a display panel 110, a touch structure 120, a first organic insulating layer 130, a light filter layer 140, and a second organic insulating layer 150, which are stacked sequentially. The first organic insulating layer 130 and the second organic insulating layer 150 extend into the bonding area BB of the display module 100, and the second organic insulating layer 150 is located on the side of the first organic insulating layer 130 facing away from the display panel 110. The first groove 160 for fixing and limiting the bonding chip 170 is located on the first organic insulating layer 130 and the second organic insulating layer 150 within the bonding area BB. An elastic support structure 190b is provided at the bottom of the first groove 160. This elastic support structure 190b not only absorbs and buffers stress, preventing stress concentration from damaging the bonding chip 170, but also provides elastic support, making the connection between the bonding chip 170 and the display panel 110 tighter and more stable. It also compensates for dimensional errors and surface unevenness during the manufacturing process of the first groove 160, thereby improving the stability and reliability of electrical signal transmission. Furthermore, the elastic support structure 190b can improve the impact and vibration resistance of the bonding chip 170, reducing the risk of damage to the bonding chip 170 due to external forces, thereby extending the lifespan of the display module 100.

[0091] It should be noted that the embodiments disclosed herein do not limit the specific structure or location of the elastic support structure 190b. For example, the elastic support structure 190b can be a structure with elastic extension and contraction, such as a spring, or a structure made of elastic materials such as rubber or elastic foam. For example, the elastic support structure 190b can be located at the corner of the first groove 160 or at the center of the first groove 160, depending on actual needs. All of the above can be designed according to actual needs, and will not be elaborated here.

[0092] This disclosure also provides a display device, which includes the display module described in the above embodiments.

[0093] In embodiments of this disclosure, the display device may further include the display module described in the above embodiments and a protective layer located on the light-emitting side of the display module, i.e., the side of the second organic insulating layer facing away from the display panel. The protective layer protects the light filter layer and serves to prevent water oxidation. Furthermore, the protective layer may be a single-piece structure or comprise multiple sub-units, with different sub-units positioned in different areas of the display module, such as the display area and bending area, as needed. These design considerations can be tailored to specific requirements and will not be elaborated upon here.

[0094] In the embodiments of this disclosure, the display device may be an organic light-emitting diode display device, a liquid crystal display device, an electronic paper display device, etc.

[0095] For example, the display device in the embodiments of this disclosure can be any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator.

[0096] It should be noted that the embodiments disclosed herein do not describe all the structures of the display device. To achieve the necessary functions of the display device, those skilled in the art can configure other structures according to specific application scenarios.

[0097] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Any modifications or equivalent substitutions made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A display module, characterized in that, include: Display panel, including the bonding area; A touch-sensitive structure is located on one side of the display panel; A filter layer is located on the side of the touch structure opposite to the display panel; A first organic insulating layer is located between the touch structure and the filter layer; as well as A second organic insulating layer is located on the side of the filter layer opposite to the touch structure. In the bonding area, the second organic insulating layer is located on the side of the first organic insulating layer opposite to the display panel. At least one of the first organic insulating layer and the second organic insulating layer is provided with a first groove. Wherein, at the boundary extending toward the first groove, the first organic insulating layer and the second organic insulating layer are arranged alternately in the orthographic projection of the first sidewall of the first organic insulating layer toward the first groove onto the display panel and the orthographic projection of the second sidewall of the second organic insulating layer toward the first groove onto the display panel. The display module also includes a chip to be bonded, which is placed in the first recess.

2. The display module according to claim 1, characterized in that, The distance from the first sidewall to the chip to be bonded is less than the distance from the second sidewall to the chip to be bonded.

3. The display module according to claim 2, characterized in that, A stepped structure is formed between the second sidewall and the first sidewall.

4. The display module according to claim 1 or 2, characterized in that, The first sidewall is the lower sidewall of the first groove near the display panel, and the second sidewall is the upper sidewall of the first groove away from the display panel. Wherein, the upper sidewall is an inclined plane, and / or the lower sidewall is an inclined plane.

5. The display module according to claim 1, characterized in that, It also includes a chip to be bonded, wherein the chip to be bonded is placed in the first recess, and the distance from the first sidewall to the chip to be bonded is greater than the distance from the second sidewall to the chip to be bonded.

6. The display module according to claim 5, characterized in that, The second sidewall forms a sloping structure and covers the first sidewall.

7. The display module according to claim 1, characterized in that, The display module includes: Substrate; A first metal layer is located on the substrate, and a portion of the first metal layer extending into the bonding region forms a first pin. The first pin includes a cap-shaped structure, the cap-shaped structure including a cap portion and an extension located around the periphery of the cap portion; and A second metal layer is located on the side of the first metal layer away from the substrate and is insulated from the first metal layer. The portion of the second metal layer extending into the bonding region forms a second pin. The second pin covers the surface of the extension that is away from the substrate.

8. The display module according to claim 7, characterized in that, The display module further includes an inorganic insulating layer, which is located between the first metal layer and the second metal layer.

9. The display module according to claim 7, characterized in that, The second pin covers the sidewall of the cap.

10. The display module according to claim 9, characterized in that, The first pin is a driving pin, and the second pin is a touch pin.

11. The display module according to claim 1, characterized in that, It also includes a support film, wherein the support film is located on the side of the display panel away from the touch structure and corresponds to the position of the bonding area, and the side of the support film facing the display panel has a plurality of second grooves.

12. The display module according to claim 1, characterized in that, It also includes an anisotropic conductive film, wherein the anisotropic conductive film covers the surface of the second organic insulating layer opposite to the display panel and fills the gap between the first groove and the chip to be bonded.

13. The display module according to claim 1, characterized in that, It also includes an elastic support structure, wherein the elastic support structure is disposed in the first groove, and the chip to be bonded is placed on the side of the elastic support structure away from the display panel.

14. A display device, characterized in that, The display module includes any one of claims 1-13.

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