Component mounting machine and component presence determination method

Abstract

A component mounting apparatus that picks up and mounts a component from a component supply member capable of accommodating the component in an accommodating portion, the component mounting apparatus being provided with: a distance measurement device capable of measuring a distance to an object; a control unit that executes a distance measurement process for controlling the distance measurement device so that the distance measurement device measures the distance from a plurality of measurement points that are different from each other in the housing unit; and a determination unit that executes a component presence / absence determination process for determining the presence / absence of a component in the housing unit on the basis of a plurality of measurement values for the plurality of measurement points measured by the distance measurement device.

Description

Technical Field

[0001] This specification discloses a component mounting machine and a component presence determination method. Background Art

[0002] In the past, there is a known component mounting machine that can confirm whether there are components in a receiving section when taking out components from a component receiving part that respectively receives components in a plurality of receiving sections. For example, Patent Documents 1 and 2 disclose the following: a laser displacement meter provided on a head is used to measure the distance from a measurement point determined in the receiving section, the height in the receiving section is calculated based on the distance from the measurement point, and the presence or absence of the component in the receiving section is determined based on whether the calculated height converges within a predetermined range relative to the height of the component.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 11-298191

[0006] Patent Document 2: International Publication No. 2021 / 166179 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in the above-mentioned device, for example, if light is diffusely reflected in the receiving section, the distance measured by the laser displacement meter is shorter than the actual distance, and the height in the receiving section is calculated to be higher than the original height, although there is no component in the receiving section, so it is possible to judge that there is a component. In addition, conversely, although there is a component in the receiving section, it is also possible to judge that there is no component in the receiving section. Furthermore, in the above-mentioned device, the judgment of the presence or absence of the component is performed based on the distance from a measuring point set in the receiving section. Therefore, in the above-mentioned device, when the distance measured by the laser displacement meter is an abnormal value, it is impossible to accurately judge the presence or absence of the component in the receiving section. Such a problem is not only a problem with the laser displacement meter, but also applies to the case of using other measuring devices to measure the distance to the object.

[0009] A main object of the present disclosure is to enable a component mounting machine that determines whether a component is in a storage section to more accurately determine whether a component is in a storage section.

[0010] In the present disclosure, the following means are adopted to achieve the above-mentioned main object.

[0011] Means for solving problems

[0012] The component mounting machine disclosed in the present invention picks up components from a component supply part capable of housing components in a housing section and mounts them, and its main purpose is to include: a distance measuring device capable of measuring the distance to an object; and a control section that controls the distance measuring device so that the distance measuring device measures the distances to a plurality of different measuring points in the housing section, and performs a component presence or absence judgment process for judging whether there are components in the housing section based on a plurality of measurement values ​​for the plurality of measurement points measured by the distance measuring device.

[0013] In the component mounting machine, the presence or absence of components in the receiving section is determined based on a plurality of measurement values ​​for the plurality of measurement points measured by a distance measuring device. Thus, even if some of the plurality of measurement values ​​contain abnormal values, as long as some of the plurality of measurement values ​​contain normal values, the presence or absence of components can be accurately determined.

[0014] The component presence judgment method disclosed in the present invention is applied to a component mounting machine, which picks up components from a component supply unit that can accommodate components in a accommodating portion and mounts them, and is equipped with a distance measuring device that can measure the distance to an object. The main purpose of the component presence judgment method is to control the distance measuring device so that the distance measuring device measures the distances to a plurality of different measuring points in the accommodating portion, and judge whether there is a component in the accommodating portion based on a plurality of measurement values ​​for the plurality of measurement points measured by the distance measuring device.

[0015] This component presence / absence determination method can achieve the same effects as those of the component mounting machine of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a perspective view of the component mounting machine 10 .

[0017] Figure 2A It is an explanatory diagram showing a state of distance measurement in a state where the component P exists in the cavity 31 a.

[0018] Figure 2B It is an explanatory diagram showing a state of distance measurement in a state where there is no component P in the cavity 31 a.

[0019] Figure 3 It is an explanatory diagram of the component supply belt 31 at the component supply position.

[0020] Figure 4 It is a schematic structural diagram of the head lifting device 19.

[0021] Figure 5 It is a block diagram showing the electrical connection relationship of the component mounting machine 10.

[0022] Figure 6This is a flowchart showing an example of a component mounting process routine.

[0023] Figure 7 This is a flowchart showing an example of a measurement point determination processing subroutine.

[0024] Figure 8 This is a flowchart showing an example of a component presence determination processing subroutine.

[0025] Fig.9A 1 is an explanatory diagram showing an example of a method of determining the first to fifth measurement points O1 to O5 when the outer shape of the component P is a rectangle.

[0026] Fig. 9B 1 is an explanatory diagram showing an example of a method of determining the first to fifth measurement points O1 to O5 when the outer shape of the component P is a square.

[0027] Fig.10 It is an explanatory diagram showing an example of the height calculation data 54a.

[0028] Fig.11 It is an explanatory diagram showing a modified example of the method of eliminating outliers. DETAILED DESCRIPTION

[0029] Next, a mode for carrying out the present disclosure will be described with reference to the drawings. Figure 1 It is a perspective view of the component mounting machine 10 . Figure 2A It is an explanatory diagram showing a state of distance measurement in a state where the component P exists in the cavity 31 a. Figure 2B It is an explanatory diagram showing a state of distance measurement in a state where there is no component P in the cavity 31 a. Figure 3 It is an explanatory diagram of the component supply belt 31 at the component supply position. Figure 4 It is a schematic structural diagram of the head lifting device 19. Figure 5 1 is a block diagram showing the electrical connection relationship of the component mounting machine 10. Figure 1 and Figure 3 In the diagram, the left-right direction is set as the X-axis direction, the front-back direction is set as the Y-axis direction, and the up-down direction is set as the Z-axis direction.

[0030] The component mounting machine 10 is a device for mounting the component P supplied from the feeder 30 on the substrate S. Figure 1 As shown, the component mounting machine 10 includes: a substrate transport device 12 for transporting a substrate S; a mounting head 13 for picking up a component P supplied to a component supply position by a feeder 30 and mounting it on the substrate S; a head moving device 14 for moving the mounting head 13; a head lifting device 19 for lifting the mounting head 13; and a control device 50 (see Figure 5). The component mounting machine 10 also includes a parts camera 23, a mark camera 24, a laser displacement meter 25, and the like.

[0031] The mounting head 13 is a component that holds the suction nozzle 13a that adsorbs the component P. The mounting head 13 is arranged in a housing 11a installed on a base 11b. The mounting head 13 has a nozzle lifting device (not shown) that raises and lowers the suction nozzle 13a through a ball screw mechanism, a linear motor, etc. In addition, the suction nozzle 13a is selectively connected to one of the vacuum pump and the air piping via a solenoid valve not shown. In order to make the suction nozzle 13a adsorb the component P, the solenoid valve is controlled so that the vacuum pump and the suction nozzle 13a are connected. Thereby, negative pressure acts on the front end of the suction nozzle 13a, and the component P is adsorbed on the front end of the suction nozzle 13a. On the other hand, in order to release the adsorption of the component P, the solenoid valve is controlled in such a way that the air piping is connected to the suction nozzle 13a. Thereby, positive pressure acts on the front end of the suction nozzle 13a, and the adsorption of the component P is released.

[0032] The head moving device 14 is a device that moves the mounting head 13 in the front-to-back direction and the left-to-right direction (XY direction). The head moving device 14 is arranged in a housing 11a provided on a base 11b. The head moving device 14 has an X-axis slide 15 and a Y-axis slide 16. The X-axis slide 15 holds the mounting head 13 in a detachable manner. The X-axis slide 15 is mounted on the lower surface of the Y-axis slide 16. The Y-axis slide 16 is slidably mounted on a pair of left and right Y-axis guide rails 17, 17 extending in the front-to-back direction. A pair of front and rear X-axis guide rails 18, 18 extending in the left-to-right direction are provided on the lower surface of the Y-axis slide 16. The X-axis slide 15 is slidably mounted on the X-axis guide rails 18, 18. The mounting head 13 moves in the left-to-right direction as the X-axis slide 15 moves in the left-to-right direction, and moves in the front-to-back direction as the Y-axis slide 16 moves in the front-to-back direction. In addition, the X-axis slide 15 and the Y-axis slide 16 are driven by drive motors 15a and 16a, respectively (see Figure 5 )drive.

[0033] like Figure 4 As shown, the head lifting device 19 is provided on the X-axis slide 15. The head lifting device 19 includes a Zs-axis motor 20, a ball screw 21, and a movable body 22. The ball screw 21 is screwed with a ball nut (not shown) fixed to the movable body 22. Therefore, by driving the ball screw 21 to rotate by the Zs-axis motor 20, the movable body 22 is lifted and lowered in the up and down direction. In addition, the movable body 22 holds the mounting head 13. Therefore, the head lifting device 19 moves the movable body 33 up and down by driving the Zs-axis motor 20, thereby moving the mounting head 13 up and down.

[0034] like Figure 1As shown, the part camera 23 is disposed adjacent to the substrate transport device 12, and photographs the component P from below when the suction nozzle 13a with the component P adsorbed passes above the part camera 23. The photographed image is used to determine the adsorption error of the component P not adsorbed by the suction nozzle 13a, the position deviation amount of the component P adsorbed by the suction nozzle 13a, the adsorption error of the component P, etc.

[0035] like Figure 1 As shown, the mark camera 24 and the laser displacement meter 25 are mounted on the X-axis slide 15, and are moved in the XY direction by the head moving device 14. In addition, the mark camera 24 and the laser displacement meter 25 may also be mounted on the mounting head 13. The mark camera 24 captures the reference mark attached to the substrate S from above. The captured image is used to confirm the position of the substrate S in the XY direction that is carried into the machine by the substrate transport device 12.

[0036] like Figure 2A , 2B As shown in FIG. 1 , the laser displacement meter 25 is a reflective type laser displacement meter having a light-emitting portion 25a for emitting light downward and a light-receiving portion 25b for receiving reflected light. The laser displacement meter 25 is disposed at the lower portion of the mounting head 13. The laser displacement meter 25 is used to measure the distance from the surface of the substrate S (the position in the Z direction) or to confirm that the component of the feeder 30 has run out. In the confirmation of the component running out, the laser displacement meter 25 measures the distance from the measuring point O at the component supply position of the feeder 30. The control device 50 (see FIG. 1 ) Figure 5 ) The height at the measuring point O (hereinafter referred to as the measuring point height H) is calculated based on the measured value D of the distance from the measuring point O measured by the laser displacement meter 25. Then, the control device 50 determines the presence or absence of the component P at the component supply position based on the measuring point height H. When there is a component P at the component supply position, the measuring point height H of the object is calculated to be higher by the thickness of the component P compared to the case where there is no component P at the component supply position. Therefore, the measured value of the laser displacement meter 25 can be used to determine the presence or absence of the component P at the component supply position, and it can be confirmed that the component of the feeder 30 is exhausted. In the present embodiment, a plurality of measuring points O are used to calculate the measuring point height H at the component supply position. In addition, the details thereof will be described later.

[0037] The control device 50 is composed of a well-known CPU 51, RAM 52, ROM 53, memory (such as HDD, SSD) 54, etc. The control device 50 inputs image signals from the marking camera 24 and the part camera 23, detection signals from the laser displacement meter 25, etc. In addition, the control device 50 outputs control signals to the substrate conveying device 12, the mounting head 13, the head moving device 14 (drive motors 15a, 16a), the part camera 23, the marking camera 24, the feeder 30, etc.

[0038] The feeder 30 is a rectangular cassette tape feeder having a tape reel and a tape feeding mechanism. The tape reel is wound with a component supply tape 31. Figure 3 As shown, chambers 31a and guide gear holes 31b are formed on the component supply tape 31 at predetermined intervals along the length direction thereof. Components P are accommodated in each chamber 31a. These components P are protected by a film covering the surface of the component supply tape 31. A hole G is formed on the mounting surface of each chamber 31a on which the components P are mounted. The hole G is used to exhaust air from the chamber 31a when the component supply tape 31 is bonded to the film. The guide gear holes 31b are used when the component supply tape 31 is fed out. The guide gear holes 31b are arranged at equal intervals in the component supply tape 31. The tape feed mechanism pulls the component supply tape 31 out from the tape reel and feeds it to the component supply position. The tape feed mechanism includes: a guide gear having an engaging claw engaged with the guide gear hole 31b; and a motor for driving the guide gear to rotate. The tape feeding mechanism rotates the tape guide gear by a motor while the engagement claw is engaged with the tape guide gear hole 31b, thereby feeding the component supply tape 31 a predetermined amount at a time. The components P stored in the component supply tape 31 are exposed at the component supply position by peeling off the film before the component supply position, and are sucked by the suction nozzle 13a. When the feeder 30 is set on the feeder setting table 40, it is connected to the control device 50 so as to be communicable.

[0039] Next, use Figure 6~Figure 10 The operation of each component mounting machine 10 will be described. Figure 6 1 is a flowchart showing an example of a component mounting process routine. This process is executed by the CPU 51 of the control device 50 after receiving task information together with mounting instructions from a management device (not shown). The task information includes, for example, the ID of the feeder 30, the type of component P possessed by the feeder 30, the component shape, the component size, the number of remaining components d, the mounting position, the number of substrates produced, and the like.

[0040] When starting this routine, CPU51 first refers to the operation information to obtain the data of the type of component P to be installed next by the machine and the data of the component installation position (S100). Then, CPU51 sets the value of the adsorption error counter c corresponding to the component type to 0 (S105). Then, CPU51 controls the drive motors 15a and 16a to move the suction nozzle 13a to the component supply position of the feeder 30 that supplies the component P to be installed next in the machine (S110). Then, CPU51 performs the adsorption action of component P (S115). Specifically, the nozzle lifting device is controlled in a manner to lower the suction nozzle 13a, and the solenoid valve not shown is controlled in a manner to connect the suction nozzle 13a to the vacuum pump. As a result, negative pressure is applied to the front end of the suction nozzle 13a to adsorb the component P. In this state, CPU51 controls the suction nozzle lifting device to raise the suction nozzle 13a.

[0041] Next, CPU51 controls the drive motors 15a and 16a to move the suction nozzle 13a toward the top of the part camera 23 (S120). Then, CPU51 controls the part camera 23 to capture an image from the bottom side of the suction nozzle 13a (S125). Next, CPU51 determines whether a suction error of component P has occurred in the image captured by the part camera 23 (S130). Here, the suction error refers to, for example, a state in which the suction nozzle 13a does not adsorb component P. The suction error is caused, for example, by a defective suction nozzle, a defective component, a control error, or a component running out. In addition, CPU51 detects the suction deviation and suction posture together with the suction error. For example, it detects a state in which the component P is offset or tilted relative to the suction nozzle 13a beyond the allowable range.

[0042] If an adsorption error of component P is detected from the image of the parts camera 23, the CPU 51 determines that the suction nozzle 13a does not adsorb the component and makes a negative judgment. On the other hand, if an adsorption error of component P is not detected from the image of the parts camera 23, the CPU 51 determines that the suction nozzle 13a adsorbs component P and makes a positive judgment. If a negative judgment is made in S130, the CPU 51 refers to the job information and determines whether the component type obtained in S100 is a component type that requires a component presence judgment (S135). Here, the component type that requires a component presence judgment refers to, for example, a component P whose remaining number d included in the job information obtained when starting this routine is less than the number of components installed in this machine (the number obtained by multiplying the number of components P required to produce one substrate S by the number of substrates S produced). If the remaining number d of components included in the task information is greater than the number of components installed in this machine, the CPU 51 determines that the component P is a component type that does not require a component presence judgment and makes a negative judgment. If the remaining number d of components included in the job information is less than the number of components mounted on the machine, the CPU 51 determines that the component P is a component type that requires component presence determination and makes an affirmative determination. If a negative determination is made in S135, the CPU 51 proceeds to S160.

[0043] On the other hand, if a positive determination is made in S135, the CPU 51 increases the value of the adsorption error counter c by 1 (S140). Next, the CPU 51 determines whether the value of the adsorption error counter c is greater than a predetermined number α (S145). The predetermined number α is a value between 2 and 6, for example, 3. If the value of the adsorption error counter c is less than the predetermined number α, the CPU 51 determines that the adsorption errors of the predetermined number α have not occurred continuously, and makes a negative determination. On the other hand, if the value of the adsorption error counter c is greater than the predetermined number α, the CPU 51 determines that the adsorption errors of the predetermined number α have occurred continuously, and makes a positive determination. If a negative determination is made in S145, the CPU 51 proceeds to S160.

[0044] On the other hand, if a positive determination is made in S145, the CPU 51 obtains the operation information from the management device (not shown) and obtains the remaining number of components d with reference to the operation information (S150). In addition, the remaining number of components d is updated by the management device as follows. That is, when the management device receives a signal from the CPU 51 indicating that the installation of all components P installed by the machine for one substrate S has been completed, the management device updates the remaining number of components d by subtracting the number of components P used in the component mounting machine 10 from the remaining number of components d before the update. Next, the CPU 51 determines whether the remaining number of components d is less than the predetermined number β (S155). The predetermined number β is, for example, 0 or a number slightly larger than 0.

[0045] If the remaining number of components d is greater than the predetermined number β, the CPU 51 determines that it is unlikely that the components will run out, and makes a negative judgment. On the other hand, if the remaining number of components d is less than the predetermined number β, the CPU 51 determines that there is a possibility that the components will run out, and makes a positive judgment. After the negative judgment is made in S135, after the negative judgment is made in S145, or after the negative judgment is made in S155, the CPU 51 controls the tape feed mechanism of the feeder 30 in a manner that the component supply tape 31 is sent out. After S160, the CPU 51 returns to S110 again.

[0046] On the other hand, if a positive determination is made in S155, the CPU 51 controls the tape feed mechanism of the feeder 30 so as to deliver the component supply tape 31 (S165). Next, the CPU 51 executes Figure 7 The measurement point determination processing subroutine (S170) is shown.

[0047] The measurement point determination process is a process for determining the measurement point O. The measurement point O is a point in the cavity 31a when the measurement value D of the distance from the laser displacement meter 25 to the cavity 31a is obtained in S420 of the component presence judgment process subroutine described later. In this embodiment, the measurement point determination process is described by taking the case where the outer shape of the component P is a rectangle and five measurement points O (first measurement point O1 to fifth measurement point O5) are determined in the cavity 31a as an example.

[0048] When the measurement point determination processing subroutine is started, the CPU 51 determines the center point of the cavity 31a as the first measurement point O1 (S300). This processing is performed, for example, as follows. That is, first, the CPU 51 controls the mark camera 24 to capture an image of the component supply position. Then, the CPU 51 detects the edge of the cavity 31a from the image. Then, the CPU 51 detects the center of the area surrounded by the detected edge as the center point of the cavity 31a. Then, the CPU 51 determines the center point of the cavity 31a obtained in this way as the first measurement point O1.

[0049] Next, the CPU 51 refers to the operation information to obtain the size of the component P (S305). Next, the CPU 51 calculates the length a obtained by dividing the length L1N of the long side of the component P into equal parts (N is an integer of 5 to 10, for example, 8) (S310). Next, the CPU 51 calculates the length b obtained by dividing the length L2N of the short side of the component P into equal parts (S315). Fig.9A As shown, the CPU 51 sets an ellipse with the first measurement point O1 (the center point of the chamber 31a) as the center, the major radius as the length a, and the minor radius as the length b as the measurement point configuration curve C (S320). The measurement point configuration curve C is a curve for determining the positions of the second measurement point O2 to the fifth measurement point O5 in S325 of this subroutine described later. Fig. 9B As shown, when the outer shape of the component P is a square with one side of length L3, length a and length b are the same length, so the CPU 51 sets a circle with a radius of length a (or length b) with the first measurement point O1 as the center as the measurement point arrangement curve C. Fig.9A , 9B In FIG. 1 , for convenience of explanation, the element P is represented by a dashed line, and the measurement point arrangement curve C is represented by a dotted line.

[0050] After S320, the CPU 51 determines the second measurement point O2 to the fifth measurement point O5 on the measurement point arrangement curve C so as to form a predetermined angle interval (S325). Fig.9A , 9B As shown in FIG. 1 , the CPU 51 determines the second measurement point O2 to the fifth measurement point O5 on the measurement point arrangement curve C so that the central angle is 360 / (the number of measurement points O-1) [°] (90° in this embodiment). After S325, the CPU 51 ends the measurement point determination processing subroutine and returns to Figure 6 S175 of the component mounting processing routine shown.

[0051] Next, CPU 51 executes Figure 8 The component presence judgment processing subroutine (S175) shown in the figure. When the component presence judgment processing subroutine is started, the CPU 51 controls the Zs-axis motor 20 to move the mounting head 13 to a predetermined height h (S400). Here, the predetermined height h is, for example, a height as follows. That is, the predetermined height h is a height at which the distance from the upper surface of the component P can be measured by the laser displacement meter 25 when a component P of the type of component to be mounted next exists in the chamber 31a. For example, it is a height at which the distance between the laser displacement meter 25 and the upper surface of the component P is as close as possible. In the present embodiment, the predetermined height h is the same height as the height when the component P is mounted on the substrate S in S190 of the component mounting processing routine.

[0052] Next, the CPU 51 sets the variable i to a value of 1 (S405). Next, the CPU 51 controls the drive motors 15a and 16a to move the laser displacement meter 25 to the upper side of the i-th measurement point Oi of the chamber 31a to which the component P to be mounted next in the machine is supplied (S410). Then, the CPU 51 obtains the i-th measurement value Di, which is the measurement value of the distance from the laser displacement meter 25 to the i-th measurement point Oi (S415). In addition, in the present embodiment, when it is not particularly distinguished which measurement point O the measurement value is for, it is simply referred to as the measurement value D.

[0053] Next, the CPU 51 calculates the relative height of the i-th measurement point Oi with respect to the reference height, that is, the measurement point height Hi (S420). Here, the reference height is, for example, a height that is a distance Df downward from the laser displacement meter 25. Specifically, the CPU 51 calculates the difference between the distance Df from the laser displacement meter 25 to the reference height and the i-th measurement value Di obtained from the laser displacement meter 25 in S410 as the measurement point height Hi (=Df-Di). The distance Df from the laser displacement meter 25 to the reference height is pre-stored in the memory 54. In addition, in the present embodiment, when the measurement point height of a measurement point O is not particularly distinguished, it is simply referred to as the measurement point height H.

[0054] Next, CPU51 stores the i-th measuring point Oi and the measuring point height Hi of the i-th measuring point Oi in correspondence in the memory 54 (S425). In the present embodiment, the data storing the measuring point O and the measuring point height H at the measuring point O in correspondence is referred to as the height calculation data 54a. Then, CPU51 increases the value of the variable i by 1 (S430). Next, CPU51 determines whether the value of the variable i is greater than the number of measuring points O (5 in the present embodiment) (S435). If the value of the variable i is less than the number of measuring points O, CPU51 determines that there are still measuring points O for which the measuring point height H must be calculated, and makes a negative judgment. On the other hand, if the value of the variable i is greater than the number of measuring points O, CPU51 determines that the measuring point height H has been calculated for all measuring points O, and makes an affirmative judgment. Here, Fig.10 An example of the height calculation data 54 a obtained by the CPU 51 repeatedly executing the processes of S405 to S435 is shown.

[0055] If a negative determination is made in S435, the CPU 51 returns to S405 again. On the other hand, if a positive determination is made in S435, the CPU 51 excludes the maximum value and the minimum value (in Fig.10 In the example shown, the measurement point height H1 at the first measurement point O1 is 532 [μm] and the measurement point height H3 at the third measurement point O3 is −126 [μm]) (S440).

[0056] Next, the CPU 51 calculates representative values ​​of the measurement point heights H at the remaining measurement points O (S445). Specifically, the CPU 51 calculates the average value Av of the measurement point heights H at the remaining measurement points O. This can reduce the influence of the deviation of the measurement point heights H at the remaining measurement points O on the judgment of the presence or absence of components in the chamber 31a. In this embodiment, the CPU 51 calculates the average value of the measurement point height H2 at the second measurement point O2, the measurement point height H4 at the fourth measurement point O4, and the measurement point height H5 at the fifth measurement point O5. Fig.10 In the example shown, the average value Av is 46 [μm].

[0057] Next, the CPU 51 determines whether the representative value (average value Av) is greater than the threshold value T (S450). If the representative value (average value Av) is greater than the threshold value T, the CPU 51 determines that the component P exists in the chamber 31a and makes a positive determination. On the other hand, if the representative value (average value Av) is less than the threshold value T, the CPU 51 determines that the component P does not exist in the chamber 31a and makes a negative determination. That is, the threshold value T is the height of the bottom surface of the chamber 31a plus half the height of the component P. In this way, the threshold value T is determined based on the component size (height) included in the operation information.

[0058] In the laser displacement meter 25, since light is diffusely reflected on the upper surface of the component P and the bottom surface of the chamber 31a, the measured value D may become a value that is not normally possible. For example, regardless of whether the component P is in the chamber 31a, the measured value D may be too large compared to the distance from the laser displacement meter 25 to the bottom surface of the chamber 31a, or too small compared to the distance from the laser displacement meter 25 to the upper surface of the component P. The measurement point height H calculated based on such a measurement value D becomes a value that is not normally possible (hereinafter referred to as an outlier). If the measurement point height H that becomes such an outlier is used to determine whether a component is in the chamber 31a, the determination of whether a component is in the chamber 31a cannot be made accurately. In contrast, in the present embodiment, the maximum value and the minimum value of the measurement point height H at the plurality of measurement points O are excluded. Therefore, the outlier value among the measurement point heights H at the plurality of measurement points O can be excluded. Therefore, the determination of whether a component is in the chamber 31a using the measurement point height H that is an outlier can be prevented. Therefore, the presence or absence of a component in the cavity 31 a can be determined more accurately.

[0059] If a positive determination is made in S450, the CPU 51 determines that the component P exists in the cavity 31a (S455). On the other hand, if a negative determination is made in S450, the CPU 51 determines that the component P does not exist in the cavity 31a (S460). After S455 or S460, the CPU 51 returns to Figure 6S180 of the component mounting processing routine is shown.

[0060] Next, the CPU 51 determines whether it is determined that there is no component P in the chamber 31a in the component presence judgment processing subroutine (S180). In the component presence judgment processing subroutine, if it is determined that there is a component in the chamber 31a (S455), the CPU 51 makes a negative judgment. On the other hand, in the component presence judgment processing subroutine, if it is determined that there is no component in the chamber 31a (S460), the CPU 51 makes a positive judgment. If a negative judgment is made in S180, the CPU 51 returns to S110 again. On the other hand, if a positive judgment is made in S180, the CPU 51 determines that the component is exhausted (S185) and ends this routine.

[0061] Here, the processing in the case where a negative judgment is made in S130 is described. If a negative judgment is made in S130, the CPU 51 installs the component P adsorbed on the suction nozzle 13a to the installation position of the substrate S (S190). Specifically, the CPU 51 controls the drive motors 15a and 16a to move the suction nozzle 13a adsorbing the component P above the installation position of the substrate S, controls the nozzle lifting device to lower the suction nozzle 13a, and controls the solenoid valve not shown to connect the suction nozzle 13a to the air piping. As a result, the supply of negative pressure to the front end of the suction nozzle 13a is released and positive pressure is supplied, and the component P is installed on the substrate S.

[0062] Next, the CPU 51 sets the value of the suction error counter c to 0 (S195). Then, the CPU 51 determines whether all the components P installed by this machine are installed (S200). If a negative determination is made in S200, the CPU 51 returns to S100 again. On the other hand, if a positive determination is made in S200, the CPU 51 ends this routine.

[0063] Here, the correspondence between the main elements of the embodiment and the main elements of the present disclosure is described. That is, the feeder 30 is equivalent to the component supply part, the laser displacement meter 25 is equivalent to the distance measuring device, the head moving device 14 is equivalent to the moving device, the CPU 51 that executes the processing of S405 to S465 of the component presence judgment processing subroutine is equivalent to the control unit, and the CPU 51 that executes the processing of S400 of the component presence judgment processing subroutine is equivalent to the component type acquisition unit. In addition, the head lifting device 19 is equivalent to the head lifting device. In addition, the CPU 51 that executes the processing of S305 of the measurement point determination processing subroutine is equivalent to the size acquisition unit.

[0064] In the component mounting machine 10 described in detail above, the presence or absence of a component in the chamber 31a is determined based on the measurement point heights H1 to H5 relative to the first measurement point O1 to the fifth measurement point O5 measured by the laser displacement meter 25. Thus, even if it is assumed that some of the measurement point heights H at the plurality of measurement points O include abnormal values, as long as some of the measurement point heights H at the plurality of measurement points O include normal values, the presence or absence of a component can be accurately determined.

[0065] In addition, in the component mounting machine 10, outliers are excluded from the measurement point heights H1 to H5 relative to the plurality of measurement points O measured by the laser displacement meter 25, and the presence or absence of a component in the storage section is determined based on the remaining measurement values. Thus, even if a portion of the measurement point heights H1 to H5 includes outliers, the presence or absence of a component can be accurately determined.

[0066] In addition, in the component mounting machine 10, the control device 50 excludes the minimum value and the maximum value from the measurement point heights H1 to H5, and determines the presence or absence of a component in the chamber 31a based on the remaining measurement point heights H at the measurement point O. Therefore, it is easy to sufficiently exclude measurement point heights that become outliers among the measurement point heights H at the plurality of measurement points O, and it is possible to sufficiently accurately determine the presence or absence of a component.

[0067] In addition, the component mounting machine 10 includes the mounting head 13 holding the laser displacement meter 25 and the head lifting device 19 for lifting and lowering the mounting head 13. The CPU 51 controls the head lifting device 19 and the laser displacement meter 25 so that the laser displacement meter 25 obtains the measured value D of the distance to the inside of the cavity 31a at the first measurement point O1 to the fifth measurement point O5 when the mounting head 13 is positioned at a predetermined height h. Thus, the distance from the laser displacement meter 25 to the inside of the cavity 31a can be set to a distance within the measurement range of the laser displacement meter 25, and the presence or absence of the component in the cavity 31a can be judged more accurately.

[0068] In the component mounting machine 10, the type of component P stored in the cavity 31a is obtained, and whether to execute the component presence determination processing subroutine is determined based on the type of the previous component. Thus, component presence determination can be performed only for component types that require component presence determination.

[0069] In the component mounting machine 10, the control device 50 obtains the size of the component P, and the measurement point O includes the center point (first measurement point O1) of the cavity 31a and one or more points that are separated from the first measurement point O1 by a distance determined according to the size of the component P. Thus, when the component P exists in the cavity 31a, the measurement value D of the distance from the measurement point O is more likely to become a normal value, and in a state where the component P is accommodated in the cavity 31a, the judgment of the presence or absence of the component is less likely to be erroneous.

[0070] In addition, in the component mounting machine 10, after a positive determination is made in S145 and S155 of the component mounting processing routine, it is determined that the component is expected to be exhausted, and the component presence determination processing subroutine is executed. Thus, in the feeder 30, it is possible to determine whether the component has been exhausted based on the component presence determination result in the cavity 31a.

[0071] In the component mounting machine 10, a hole G is formed on the mounting surface of the chamber 31a on which the component P is mounted. Light is easily diffusely reflected at the edge of the hole G, and the measurement point height H (measurement value D) often becomes an outlier. Therefore, it is of great significance to exclude outliers from the measurement point heights H (measurement value D) at a plurality of measurement points O and to determine whether or not a component is present in the chamber 31a based on the measurement point heights H (measurement value D) at the remaining measurement points O.

[0072] In addition, the present disclosure is not limited to the above-mentioned embodiment at all, and can be implemented in various forms as long as it belongs to the technical scope of the present disclosure.

[0073] In the above-mentioned embodiment, the CPU 51 excludes the maximum and minimum values ​​of the measurement point heights H at the plurality of measurement points O in S440 of the component presence judgment processing routine, and judges the presence or absence of the component in the chamber 31a based on the measurement point heights H at the remaining measurement points O. However, the CPU 51 may also exclude the measurement point heights H at the plurality of measurement points O that are outside the predetermined range (for example, within the predetermined range) from the measurement point heights H at the plurality of measurement points O in S440. Fig.11 The measuring point height H located in the shaded area is excluded, and the presence or absence of a component in the chamber 31a is determined based on the measuring point height H at the remaining measuring point O. In this case, as in the above-mentioned embodiment, the representative value of the measuring point height H at the remaining measuring point O can be calculated, and the presence or absence of a component in the chamber 31a can be determined by comparing the calculated representative value with the threshold value T. Here, the predetermined range is a range between the lower limit height and the upper limit height determined as follows. The lower limit height is a height that is lower than the bottom surface height of the chamber 31a by half the height of the component P. The upper limit height is a height that is higher than the bottom surface height of the chamber 31a by 1.5 times the height of the component P. In addition, if any measuring point height H is not within the predetermined range, the CPU 51 causes a display device (not shown) provided on the component mounting machine 10 to display an error message, etc., to notify the operator of the error.

[0074] In the above-described embodiment, as a representative value of the measurement point heights H at the remaining measurement points O after excluding the maximum value and the minimum value from the measurement point heights H at the plurality of measurement points O, the average value Av of the measurement point heights H at the remaining measurement points O is calculated. However, as a representative value of the measurement point heights H at the remaining measurement points O, a representative value other than the average value, such as a median value, a mode, etc. may be calculated.

[0075] In the above-mentioned embodiment, the CPU 51 uses the measurement point height H at the plurality of measurement points O to determine whether there is a component in the chamber 31a. However, the CPU 51 may directly use the measurement values ​​D at the plurality of measurement points O to determine whether there is a component in the chamber 31a. In this case, as in the above-mentioned embodiment, the maximum value and the minimum value of the measurement value D may be excluded, and a representative value of the remaining measurement value D may be calculated, and the representative value may be compared with the threshold value U. If the representative value is larger than the threshold value U, it is determined that there is no component P in the chamber 31a, and if the representative value is smaller than the threshold value U, it is determined that there is a component P in the chamber 31a. The threshold value U is, for example, a value obtained by subtracting half the height of the component P from the designed distance from the laser displacement meter 25 to the bottom surface of the chamber 31a.

[0076] In the above-mentioned embodiment, the representative value of the measurement point height H at the remaining measurement points O is calculated, and the presence or absence of the component in the chamber 31a is determined by comparing the representative value with the threshold value T. However, the CPU 51 may not calculate the representative value. In this case, if the measurement point height H at at least one of the remaining measurement point heights O exceeds the threshold value T, the CPU 51 may determine that the component P exists in the chamber 31a, and if the measurement point height H at any measurement point O does not exceed the threshold value T, the CPU 51 may determine that the component P does not exist in the chamber 31a.

[0077] In the above-mentioned embodiment, the feeder 30 is a cassette-type tape feeder. However, the feeder 30 may be a tray feeder. The tray feeder stores trays containing components P mounted on the substrate S in a stacked state and supplies the components P together with the trays. The tray has a concave receiving portion for receiving the components P.

[0078] In the above embodiment, the first measurement point O1 is set at the center point of the chamber 31 a , and the second to fifth measurement points O2 to O5 are arranged on the measurement point arrangement curve C. However, the center point of the chamber 31 a may not be set as the measurement point O.

[0079] In the above-mentioned embodiment, the number of measurement points O is set to 5. However, the number of measurement points O may be 4 or more. The reason for setting 4 or more measurement points O is to be able to calculate a representative value (average value Av) after excluding the maximum value and the minimum value from the plurality of measurement point heights H. In these cases, one of the plurality of measurement points O may be set to the center point of the chamber 31a, or all of the plurality of measurement points O may be set to locations other than the center of the chamber 31a. In this case, if the representative value is not calculated, and the presence or absence of a component in the chamber 31a is determined by determining whether the measurement point height H at at least one of the remaining measurement points O exceeds the threshold value T, the number of measurement points O may be set to 3.

[0080] In the above-mentioned embodiment, the maximum value and the minimum value are excluded from the measurement point heights H at the plurality of measurement points O. However, only one of the maximum value and the minimum value may be excluded from the measurement point heights H at the plurality of measurement points O. In this case, the number of measurement points O may be set to three or more. This is to calculate a representative value based on the measurement point heights H at the remaining measurement points O. In addition, in this case, if the representative value is not calculated, and the presence or absence of a component in the chamber 31a is determined by determining whether the measurement point height H at at least one of the remaining measurement points O exceeds the threshold value T, or the presence or absence of a component in the chamber 31a is determined by calculating the average value of the measurement point heights H and determining whether the average value exceeds the threshold value T, the number of measurement points O may be set to two.

[0081] In the above-mentioned embodiment, after a positive determination is made in S145 and S155 of the component installation processing routine, the CPU 51 determines that there is a possibility of component exhaustion and executes the component existence judgment processing subroutine. However, if a positive determination is made in either S145 or S155 of the component installation processing routine, the CPU 51 may also determine that there is a possibility of component exhaustion and execute the component existence judgment processing subroutine. Alternatively, the component existence judgment processing subroutine may be executed after a new feeder 30 is set to the component installation machine 10. Alternatively, the CPU 51 may also execute the component existence judgment processing subroutine each time before the component adsorption action (S120).

[0082] In the above-mentioned embodiment, the present disclosure has been described as the component mounting machine 10, but it may also be a component presence determination method.

[0083] Furthermore, in this specification, the technical idea of ​​changing the "component mounting machine described in Technical Solution 2" to the "component mounting machine described in Technical Solution 2 or 3" in Technical Solution 4 at the time of application is also disclosed. Furthermore, in this specification, the technical idea of ​​changing the "component mounting machine described in any one of Technical Solutions 1 to 4" to the "component mounting machine described in any one of Technical Solutions 1 to 6" in Technical Solution 7 at the time of application is also disclosed. Furthermore, in this specification, the technical idea of ​​changing the "component mounting machine described in any one of Technical Solutions 1 to 4" to the "component mounting machine described in any one of Technical Solutions 1 to 7" in Technical Solution 8 at the time of application is also disclosed. Furthermore, in this specification, the technical idea of ​​changing the "component mounting machine described in any one of Technical Solutions 1 to 4" to the "component mounting machine described in any one of Technical Solutions 1 to 8" in Technical Solution 9 at the time of application is also disclosed. Furthermore, in this specification, the technical idea of ​​changing the "component mounting machine described in any one of Technical Solutions 1 to 4" to the "component mounting machine described in any one of Technical Solutions 1 to 9" in Technical Solution 10 at the time of application is also disclosed. In addition, this specification also discloses a technical idea of ​​changing "the component mounting machine according to any one of claims 1 to 4" in claim 11 of the original application to "the component mounting machine according to any one of claims 1 to 10".

[0084] Industrial Applicability

[0085] The present disclosure can be utilized in the manufacturing industry of component mounting machines and component mounting systems, and the like.

[0086] Description of Reference Numerals

[0087] 10 component mounting machine, 11a housing, 11b base, 12 substrate transport device, 13 mounting head, 13a nozzle, 14 head moving device, 15X axis slide, 15a drive motor, 16Y axis slide, 16a drive motor, 17 axis guide, 18 axis guide, 19 head lifting device, 20Zs axis motor, 21 ball screw, 22 movable body, 23 parts camera, 24 marking camera, 25 laser displacement meter, 25a light projecting unit, 25b light receiving unit, 30 feeder, 31 component supply tape, 31a chamber, 31b guide gear hole, 40 feeder setting table, 50 control device, 51 CPU, 52 RAM, 53 ROM, 54 memory, 54a height calculation data, Av average value, D measurement value, Df distance, G hole, H, H1~H5 measuring point heights, O measuring point, O1 first measuring point, O2 second measuring point, O3 third measuring point, O4 fourth measuring point, O5 fifth measuring point, P element, S substrate, T, U threshold.

Claims

1. A component mounting machine that picks up components from a component supply component that can accommodate components in a accommodating portion and mounts the components, wherein: The component mounting machine comprises: a distance measuring device capable of measuring the distance to an object; and The control unit controls the distance measuring device so that the distance measuring device measures the distances to a plurality of different measuring points in the storage unit, and performs a component presence determination process for determining whether a component is present in the storage unit based on a plurality of measurement values ​​for the plurality of measuring points measured by the distance measuring device.

2. The component mounting machine according to claim 1, wherein The control unit excludes outliers from the plurality of measured values ​​and determines whether or not a component is in the storage unit based on the remaining measured values.

3. The component mounting machine according to claim 2, wherein The control unit excludes at least one of a minimum value and a maximum value among the plurality of measured values, and determines whether or not a component is present in the storage unit based on the remaining measured values.

4. The component mounting machine according to claim 2, wherein The control unit excludes measurement values ​​outside a predetermined range from among the plurality of measurement values, and determines whether or not a component is present in the storage unit based on the remaining measurement values.

5. The component mounting machine according to any one of claims 1 to 4, wherein The component mounting machine includes a moving device that moves the distance measuring device relative to the component supplying means.

6. The component mounting machine according to claim 5, wherein The control unit controls the moving device so that the distance measuring device measures distances to a plurality of different measurement points in the storage unit.

7. The component mounting machine according to any one of claims 1 to 4, wherein The component mounting machine has: head, holding distance measuring device; and A head lifting device is used to lift the head. The control unit controls the head lifting device and the distance measuring device so that the distance measuring device measures the distances to the plurality of measurement points in a state where the head is positioned at the predetermined height.

8. The component mounting machine according to any one of claims 1 to 4, wherein The component mounting machine includes a component type acquisition unit that acquires the type of the component accommodated in the accommodation unit. The control unit determines whether to execute the component presence / absence determination process according to the type of the component.

9. The component mounting machine according to any one of claims 1 to 4, wherein The component mounting machine includes a dimension acquisition unit that acquires the dimension of the component. The plurality of measurement points include a plurality of points determined according to a size of the component.

10. The component mounting machine according to any one of claims 1 to 4, wherein The control unit executes the component presence / absence determination process when it is predicted that a component is exhausted.

11. The component mounting machine according to any one of claims 1 to 4, wherein A hole is formed on a placement surface of the housing portion on which the component is placed.

12. A method for determining the presence or absence of a component, suitable for a component mounting machine, wherein the component mounting machine picks up a component from a component supply component capable of accommodating the component in an accommodating portion and mounts the component, and is provided with a distance measuring device capable of measuring the distance to an object, wherein: controlling the distance measuring device so that the distance measuring device measures distances to a plurality of different measuring points in the storage unit, The presence or absence of a component in the storage section is determined based on a plurality of measurement values ​​for the plurality of measurement points measured by the distance measuring device.

Images