Injection molding machine parameter adjusting method and device for injection mold transfer

Abstract

The invention discloses an injection molding machine parameter adjusting method and device for injection mold transfer. The method comprises the steps that a standard capacitance data curve is obtained; after the injection mold is transferred from the old injection molding machine to the new injection molding machine, mold rotating capacitance data of the new injection molding machine in the injection molding process are collected; generating a mode conversion capacitance data curve according to the mode conversion capacitance data; and according to the data difference between the standard capacitance data curve and the rotary mold capacitance data curve, the technological parameters of the new injection molding machine are adjusted, so that the data difference between the rotary mold capacitance data curve and the standard capacitance data curve meets a preset curve error threshold value. Whether the technological parameters of the new injection molding machine need to be adjusted or not after mold rotation can be rapidly judged, so that the efficiency and accuracy of parameter adjustment are improved, the production efficiency is improved, meanwhile, quality fluctuation caused by mold transfer can be reduced, the rejection rate caused by improper parameters can be reduced, the product quality is improved, and the production cost is reduced. The invention can be widely applied to the technical field of injection molding machines.

Description

Technical Field

[0001] The present application relates to the technical field of injection molding machines, and in particular to a method and device for adjusting parameters of injection molding machines for injection mold transfer. Background Art

[0002] In the field of injection molding, the injection molding process is a typical process belonging to the polymer molding process, which usually includes a series of steps such as mold closing, injection, pressure holding, plasticization, cooling and mold opening, which are carried out periodically. Injection mold transfer is the process of transferring the mold from one injection molding machine to another during the injection molding production process. However, after the mold is transferred, since the performance indicators of the new injection molding machine are different from those of the original injection molding machine, it is necessary to re-adjust the parameters. However, the current parameter adjustment method requires high labor costs and a long adjustment time, and the accuracy of the parameter adjustment is low.

[0003] In summary, the technical problems existing in the relevant technologies need to be improved. Summary of the invention

[0004] The embodiments of the present application aim to solve at least one of the technical problems in the related art to a certain extent. To this end, the main purpose of the embodiments of the present application is to propose an injection molding machine parameter adjustment method and device for injection mold transfer, which can improve the efficiency and accuracy of parameter adjustment, and at the same time, can reduce the quality fluctuation caused by mold transfer, reduce the scrap rate caused by improper parameters, thereby improving product quality and production efficiency.

[0005] To achieve the above-mentioned purpose, one aspect of an embodiment of the present application provides an injection molding machine parameter adjustment method for injection mold transfer, the method comprising the following steps:

[0006] Obtain standard capacitance data curve;

[0007] After the injection mold is transferred from the old injection molding machine to the new injection molding machine, collecting the transfer mold capacitance data of the new injection molding machine during the injection molding process;

[0008] Generating a transfer capacitance data curve according to the transfer capacitance data;

[0009] The process parameters of the new injection molding machine are adjusted according to the data difference between the standard capacitance data curve and the rotary capacitance data curve, so that the data difference between the rotary capacitance data curve and the standard capacitance data curve meets a preset curve error threshold.

[0010] In some embodiments, adjusting the process parameters of the new injection molding machine according to the data difference between the standard capacitance data curve and the transfer capacitance data curve includes:

[0011] Performing data extraction processing on the standard capacitance data curve to obtain standard capacitance characteristic quantities; wherein the standard capacitance characteristic quantities include standard sampling time, standard injection section slope, standard switching point capacitance value, standard pressure holding section maximum capacitance value, standard pressure holding section capacitance integral value, and standard cooling section slope;

[0012] The transfer mold capacitance data curve is subjected to data extraction processing to obtain transfer mold capacitance characteristic quantities; wherein the transfer mold capacitance characteristic quantities include transfer mold sampling time, transfer mold injection section slope, transfer mold switching point capacitance value, transfer mold holding section maximum capacitance value, transfer mold holding section capacitance integral value, and transfer mold cooling section slope;

[0013] The data difference between the standard capacitance characteristic quantity and the rotational capacitance characteristic quantity is calculated to obtain a capacitance data difference result, and the process parameters of the new injection molding machine are adjusted according to the capacitance data difference result.

[0014] In some embodiments, calculating the data difference between the standard capacitance characteristic quantity and the rotational capacitance characteristic quantity to obtain a capacitance data difference result, and adjusting the process parameters of the new injection molding machine according to the capacitance data difference result, includes:

[0015] The injection speed in the process parameters of the new injection molding machine is adjusted according to the sampling time difference between the standard sampling time and the mold rotation sampling time; wherein the injection speed is a process parameter of the injection section;

[0016] Confirming whether the injection speed in the process parameters has been adjusted according to the injection slope difference between the standard injection section slope and the rotational mold injection section slope;

[0017] If it is confirmed that the injection speed adjustment is completed, the switching point position in the process parameters of the new injection molding machine is adjusted according to the switching point capacitance difference between the standard switching point capacitance value and the mold rotation switching point capacitance value; wherein the switching point position is the position where the injection section switches to the pressure holding section;

[0018] After adjusting the switching point position, confirming whether the process parameters of the injection section are adjusted according to a first mean square error between the standard capacitance data curve and the rotational capacitance data curve in the first injection time period;

[0019] If it is confirmed that the adjustment of the process parameters of the injection section is completed, the holding pressure in the process parameters of the new injection molding machine is adjusted according to the maximum capacitance difference between the maximum capacitance value of the standard holding section and the maximum capacitance value of the rotation holding section; wherein the holding pressure is the process parameter of the holding section;

[0020] After adjusting the holding pressure, adjusting the holding time in the process parameters of the new injection molding machine according to the capacitance integral difference between the capacitance integral value of the standard holding section and the capacitance integral value of the rotary holding section; wherein the holding time is a process parameter of the holding section;

[0021] After adjusting the holding time, confirming whether the process parameters of the holding section are adjusted according to a second mean square error between the standard capacitance data curve and the rotational capacitance data curve in the second injection molding time period;

[0022] If it is confirmed that the process parameter adjustment of the holding section is completed, the mold temperature in the process parameter of the new injection molding machine is adjusted according to the cooling slope difference between the standard cooling section slope and the rotational cooling section slope; wherein the mold temperature is the process parameter of the cooling section;

[0023] After adjusting the mold temperature, confirming whether the process parameters of the cooling section are adjusted according to a third mean square error between the standard capacitance data curve and the rotational capacitance data curve in a third injection time period;

[0024] If it is confirmed that the process parameter adjustment of the cooling section is completed, the process parameter adjustment of the new injection molding machine is terminated.

[0025] In some embodiments, the step of confirming whether the injection speed in the process parameters is adjusted according to the injection slope difference between the standard injection section slope and the rotary mold injection section slope comprises:

[0026] Calculating the injection slope difference between the standard injection section slope and the rotational mold injection section slope to obtain an injection slope difference result;

[0027] If the injection slope difference result is within the injection slope error threshold, confirming that the injection speed adjustment in the process parameters is completed;

[0028] If the injection slope difference result exceeds the injection slope error threshold, it is confirmed that the injection speed adjustment in the process parameters is not completed, and the step of adjusting the injection speed in the process parameters of the new injection molding machine according to the sampling time difference between the standard sampling time and the mold rotation sampling time is returned to execute until the injection slope difference result is within the injection slope error threshold.

[0029] In some embodiments, after adjusting the switching point position, confirming whether the process parameters of the injection section are adjusted according to a first mean square error between the standard capacitance data curve and the rotational capacitance data curve in the first injection time period includes:

[0030] After adjusting the switching point position, calculating a first mean square error between the standard capacitance data curve and the rotational capacitance data curve in a first injection time period according to a first mean square error formula;

[0031] If the first mean square error is within a first preset mean square error threshold, it is confirmed that the process parameter adjustment of the injection section is completed;

[0032] If the first mean square error exceeds the first preset mean square error threshold, the process returns to execute the step of adjusting the switching point position in the process parameters of the new injection molding machine according to the switching point capacitance difference between the standard switching point capacitance value and the mold rotation switching point capacitance value if it is confirmed that the injection speed adjustment is completed, until the first mean square error is within the first preset mean square error threshold.

[0033] In some embodiments, after adjusting the holding time, confirming whether the process parameters of the holding section are adjusted according to a second mean square error between the standard capacitance data curve and the rotational capacitance data curve in the second injection molding time period includes:

[0034] After adjusting the holding time, calculating a second mean square error between the standard capacitance data curve and the rotational capacitance data curve in a second injection molding time period according to a second mean square error formula;

[0035] If the second mean square error is within a second preset mean square error threshold, it is confirmed that the process parameter adjustment of the pressure holding section is completed;

[0036] If the second mean square error exceeds the second preset mean square error threshold, return to execute the step of adjusting the holding time in the process parameters of the new injection molding machine according to the capacitance integral difference between the standard holding section capacitance integral value and the rotational holding section capacitance integral value after adjusting the holding pressure, until the second mean square error is within the second preset mean square error threshold.

[0037] In some embodiments, after adjusting the mold temperature, confirming whether the process parameters of the cooling section are adjusted according to a third mean square error between the standard capacitance data curve and the rotational capacitance data curve in a third injection time period includes:

[0038] After adjusting the mold temperature, calculating a third mean square error between the standard capacitance data curve and the rotational capacitance data curve in a third injection time period according to a third mean square error formula;

[0039] If the third mean square error is within a third preset mean square error threshold, it is confirmed that the process parameter adjustment of the cooling section is completed;

[0040] If the third mean square error exceeds the third preset mean square error threshold, return to execute the step of adjusting the mold temperature in the process parameters of the new injection molding machine according to the cooling slope difference between the standard cooling section slope and the rotational cooling section slope if it is confirmed that the process parameter adjustment of the holding section is completed, until the third mean square error is within the third preset mean square error threshold.

[0041] To achieve the above-mentioned purpose, another aspect of the embodiment of the present application provides an injection molding machine parameter adjustment device for injection mold transfer, the device comprising the following modules:

[0042] A standard capacitance data curve acquisition module is used to acquire a standard capacitance data curve;

[0043] A transfer mold capacitance data acquisition module, used to collect transfer mold capacitance data of the new injection molding machine during the injection molding process after the injection mold is transferred from the old injection molding machine to the new injection molding machine;

[0044] A transfer capacitance data curve generating module, used for generating a transfer capacitance data curve according to the transfer capacitance data;

[0045] The process parameter adjustment module is used to adjust the process parameters of the new injection molding machine according to the data difference between the standard capacitance data curve and the transfer capacitance data curve, so that the data difference between the transfer capacitance data curve and the standard capacitance data curve meets the preset curve error threshold.

[0046] To achieve the above-mentioned purpose, another aspect of an embodiment of the present application provides an electronic device, the electronic device comprising a memory and a processor, the memory storing a computer program, and the processor implementing the above-mentioned method when executing the computer program.

[0047] To achieve the above objective, another aspect of an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described above is implemented.

[0048] The embodiments of the present application include at least the following beneficial effects: the present application provides an injection molding machine parameter adjustment method and device for injection mold transfer, the scheme is through obtaining a standard capacitance data curve; after the injection mold is transferred from the old injection molding machine to the new injection molding machine, collecting the mold transfer capacitance data of the new injection molding machine during the injection molding process; based on the mold transfer capacitance data, generating a mold transfer capacitance data curve; according to the data difference between the standard capacitance data curve and the mold transfer capacitance data curve, adjusting the process parameters of the new injection molding machine, so that the data difference between the mold transfer capacitance data curve and the standard capacitance data curve meets the preset curve error threshold. The embodiment of the present application uses the standard capacitance data curve as a reference, and can quickly determine whether the new injection molding machine needs to adjust the process parameters after the mold transfer, thereby improving the efficiency and accuracy of parameter adjustment, thereby improving production efficiency, and reducing labor costs. At the same time, the process parameters of the new injection molding machine are adjusted according to the data difference between the standard capacitance data curve and the mold transfer capacitance data curve, so that the quality of the products produced on the new injection molding machine is highly consistent with the quality of the products produced on the old injection molding machine, reducing the quality fluctuations caused by mold transfer, and reducing the scrap rate caused by improper parameters, thereby improving product quality; and the in-mold capacitance sensor is more sensitive to changes in the properties of the melt in the mold. By collecting capacitance sensor data to adjust the process parameters, the accuracy and efficiency of the process parameter adjustment can be further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a flowchart of the steps of the injection molding machine parameter adjustment method for injection mold transfer provided in an embodiment of the present application;

[0050] Figure 2 is a schematic diagram of a standard signal curve provided in an embodiment of the present application;

[0051] Figure 3 It is a schematic diagram of the structure of a device for collecting capacitive sensor signals provided in an embodiment of the present application;

[0052] Figure 4 is a schematic diagram of an initial mode conversion signal curve provided in an embodiment of the present application;

[0053] Figure 5 is a schematic diagram of the curve distribution of the characteristic values ​​of capacitance data provided by an embodiment of the present application;

[0054] Figure 6 It is a schematic diagram of a mold rotation signal curve after the injection speed setting is completed provided in an embodiment of the present application;

[0055] Figure 7 It is a schematic diagram of a mold transfer signal curve after the parameter adjustment of the injection molding stage is completed provided in an embodiment of the present application;

[0056] Figure 8It is a schematic diagram of a mold rotation signal curve after the holding pressure setting is completed provided in an embodiment of the present application;

[0057] Fig. 9 It is a schematic diagram of a mold transfer signal curve after the global process parameter setting is completed according to an embodiment of the present application;

[0058] Fig.10 It is a structural schematic diagram of an injection molding machine parameter adjustment device for injection mold transfer provided in an embodiment of the present application;

[0059] Fig.11 It is a schematic diagram of the hardware structure of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0060] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the embodiments of the present application. They are only examples of devices and methods consistent with some aspects of the embodiments of the present application as detailed in the attached claims.

[0061] It is understood that the terms "first", "second", etc. used in this application can be used to describe various concepts in this article, but unless otherwise specified, these concepts are not limited by these terms. These terms are only used to distinguish one concept from another concept. For example, without departing from the scope of the embodiment of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the words "if" and "if" as used herein can be interpreted as "at the time of" or "when" or "in response to determination".

[0062] The terms "at least one", "multiple", "each", "any", etc. used in this application, at least one includes one, two or more, multiple includes two or more, each refers to each of the corresponding multiple, and any refers to any one of the multiple.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0064] In the field of injection molding, the injection molding process is a typical process belonging to the polymer molding process, which usually includes a series of steps such as mold closing, injection, pressure holding, plasticization, cooling and mold opening, which are carried out periodically. Injection mold transfer is the process of transferring the mold from one injection molding machine to another during the injection molding production process. The significance of injection mold transfer includes: improving production flexibility, switching to produce different products, reducing production costs, coordinating the reuse of the same set of molds on various production lines, and quickly resuming production after a failure. However, after the mold is transferred, since the performance indicators of the new injection molding machine are different from those of the original injection molding machine, it is necessary to re-adjust the parameters. However, the current parameter adjustment method requires high labor costs and a long time for parameter adjustment, and the accuracy of the parameter adjustment is low. For example, there are two main methods for parameter adjustment at present. The first is to hire a machine adjuster to re-test the mold, adjust the machine parameters and check the molding effect, and then start production after confirming that the molding process is normal. This method requires high labor costs and a long time for parameter adjustment; the second is to quickly adjust the parameters based on the signal of the in-mold pressure sensor, and the accuracy of the parameter adjustment of this method is low.

[0065] In view of this, an embodiment of the present application provides an injection molding machine parameter adjustment method and device for injection mold transfer. The scheme obtains a standard capacitance data curve; after the injection mold is transferred from the old injection molding machine to the new injection molding machine, the mold transfer capacitance data of the new injection molding machine during the injection molding process is collected; based on the mold transfer capacitance data, a mold transfer capacitance data curve is generated; based on the data difference between the standard capacitance data curve and the mold transfer capacitance data curve, the process parameters of the new injection molding machine are adjusted so that the data difference between the mold transfer capacitance data curve and the standard capacitance data curve meets the preset curve error threshold. The embodiment of the present application uses the standard capacitance data curve as a reference, and can quickly determine whether the new injection molding machine needs to adjust the process parameters after the mold transfer, thereby improving the efficiency and accuracy of parameter adjustment, thereby improving production efficiency, and reducing labor costs. At the same time, the process parameters of the new injection molding machine are adjusted according to the data difference between the standard capacitance data curve and the mold transfer capacitance data curve, so that the quality of the products produced on the new injection molding machine is highly consistent with the quality of the products produced on the old injection molding machine, reducing the quality fluctuations caused by mold transfer, and reducing the scrap rate caused by improper parameters, thereby improving product quality; and the in-mold capacitance sensor is more sensitive to changes in the properties of the melt in the mold. By collecting capacitance sensor data to adjust the process parameters, the accuracy and efficiency of the process parameter adjustment can be further improved.

[0066] The injection molding machine parameter adjustment method for injection mold transfer provided in the embodiment of the present application relates to the technical field of injection molding machines. The injection molding machine parameter adjustment method for injection mold transfer provided in the embodiment of the present application can be applied to a terminal, can also be applied to a server, and can also be software running in a terminal or a server. In some embodiments, the terminal can be a smart phone, a tablet computer, a laptop computer, a desktop computer, a smart speaker, a smart watch, and a car terminal, etc., but is not limited to this; the server side can be configured as an independent physical server, or it can be configured as a server cluster or a distributed system composed of multiple physical servers, and can also be configured to provide cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN (Content Delivery Network, content distribution network) and big data and artificial intelligence platforms and other basic cloud computing services. The cloud server, the server can also be a node server in the blockchain network; the software can be an application that implements the injection molding machine parameter adjustment method for injection mold transfer, etc., but is not limited to the above forms.

[0067] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld devices or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronic devices, network PCs (personal computers), minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, etc. The present application can be described in the general context of computer executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments, in which tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0068] See also Figure 1 , Figure 1 is an optional step flow chart of the method for adjusting injection molding machine parameters for injection mold transfer provided in an embodiment of the present application, Figure 1 The method may include but is not limited to steps S101 to S104.

[0069] Step S101, obtaining a standard capacitance data curve;

[0070] The standard capacitance data curve is a curve within one injection molding cycle, and the curves of different products and molds will be different. During injection molding production, the machine operator adjusts the parameters for stable production. After determining that the injection molded product is qualified, the corresponding curve can be set to the standard signal curve, that is, the standard capacitance data curve of the embodiment of the present application. During continuous production, it is also compared with this standard capacitance data curve to determine whether there are any abnormalities in the production process. It can be understood that the standard capacitance data curve is a pre-set standard parameter curve. If a mold transfer is encountered in subsequent production, it is only necessary to repeat this standard capacitance data curve to ensure the quality of the product to the greatest extent. Please refer to Figure 2 , Figure 2 is a schematic diagram of a standard signal curve provided in the embodiment of the present application; Figure 2 As shown, in the subsequent process of adjusting the process parameters, the process parameters of the new injection molding machine can be adjusted by reproducing the standard capacitance data curve of the in-mold capacitance sensor of the original injection molding machine.

[0071] Step S102, after the injection mold is transferred from the old injection molding machine to the new injection molding machine, collecting the transfer mold capacitance data of the new injection molding machine during the injection molding process;

[0072] In the embodiment of the present application, the focus is on the adjustment of process parameters during the transfer of the injection mold, and the data used to determine whether the process parameters need to be adjusted and the adjustment threshold is the in-mold capacitive sensor data, that is, the embodiment of the present application is based on the capacitive sensor data collected by the in-mold capacitive sensor for data comparison. Among them, the in-mold capacitive sensor is more sensitive to changes in the properties of the melt in the mold, and can achieve real-time measurement of the molten state. The stability of the sensor signal is significantly helpful for reliable product quality monitoring. By collecting capacitive sensor data to adjust the process parameters, the accuracy and efficiency of the process parameter adjustment can be further improved.

[0073] Among them, the injection mold is a mold used for the injection molding process. The old injection molding machine refers to the injection molding machine used to produce the product before, on which a set of process parameters suitable for the product has been set. The old injection molding machine also uses the data in the standard capacitance data curve to set the process parameters; among them, the old injection molding machine can be the original injection molding machine, that is, the injection molding machine used to set the standard capacitance data curve. When the mold needs to be transferred to the new injection molding machine, the original injection molding machine is the old injection molding machine; at the same time, the old injection molding machine can also be the injection molding machine used for production after the standard capacitance data curve set during production is used to set the parameters, that is, the injection molding machine after the mold has been transferred from the original injection molding machine or other injection molding machines used for production before. Similarly, when the mold needs to be transferred to the new injection molding machine, these injection molding machines are the old injection molding machines. The new injection molding machine refers to the injection molding machine that will take over the production task from the old injection molding machine. Since the performance of the new injection molding machine and the old injection molding machine may be different, it is necessary to adjust the process parameters of the new injection molding machine to adapt to the mold and production requirements.

[0074] The injection molding process is a typical process of polymer molding, which usually includes a series of steps such as mold closing, injection, pressure holding, plasticization, cooling, and mold opening, which are performed periodically. For the specific implementation process and implementation principle of the injection molding process, reference can be made to the technical content in the relevant technology, and the embodiments of this application will not be described in detail here.

[0075] Among them, the transfer mold capacitance data refers to the capacitance sensor data collected by the in-mold capacitance sensor during the injection molding production process on the new injection molding machine after the injection mold is transferred from the old injection molding machine to the new injection molding machine, reflecting the state and changes of the molten plastic in the mold.

[0076] See also Figure 3 , Figure 3 is a schematic diagram of the structure of a device for collecting capacitive sensor signals provided in an embodiment of the present application; Figure 3 As shown, Figure 3The injection molding machine acquisition control system is used to collect capacitance sensor data. The injection molding machine acquisition control system includes sensor probes, signal transmitters, I / O acquisition modules, and system industrial computers. Among them, the sensor probe is used to monitor various parameters (such as temperature, pressure, position, etc.) during the injection molding process; the signal transmitter is used to process the data monitored by the sensor probe, and finally send it to the system industrial computer through serial communication; the I / O acquisition module is responsible for collecting and transmitting the input / output signals between the injection molding machine and external devices, and transmitting the data to the system industrial computer through network communication; and the system industrial computer is the core of the entire injection molding machine acquisition control system, responsible for processing and analyzing the data collected from the signal transmitter and I / O acquisition module, and the system industrial computer can extract feature points in real time and draw them into capacitance data curves, thereby realizing the automation and efficient operation of the injection molding process. In summary, based on the acquisition control system of the injection molding machine to collect capacitance sensor signals, and transmit the capacitance sensor signals to the system industrial computer for recording, feature points can be extracted in real time and drawn into capacitance data curves.

[0077] In a specific implementation, after the injection mold is transferred from the old injection molding machine to the new injection molding machine, the mold transfer capacitance data of the new injection molding machine during the injection molding process is collected.

[0078] Step S103, generating a transfer capacitance data curve according to the transfer capacitance data;

[0079] For the transfer mold capacitance data curve, it is a curve drawn based on the transfer mold capacitance data of the new injection molding machine during the injection molding process after the injection mold is transferred from the old injection molding machine to the new injection molding machine. Figure 4 , Figure 4 is a schematic diagram of the initial mold transfer signal curve provided in the embodiment of the present application; after the mold transfer, when the same process parameters are used for production, the new sensor curve is as follows Figure 4 As shown in the transfer mode curve, the horizontal axis represents time, the vertical axis represents capacitance, the blue curve is the transfer mode curve (i.e. the transfer mode capacitance data curve), and the green curve is the standard curve (i.e. the standard capacitance data curve). Figure 4 It can be seen that there are certain differences between the transferred-mold capacitance data curve and the standard capacitance data curve. By comparing the parameter differences between the two curves and adjusting the relevant process parameters based on the parameter differences, the transferred-mold capacitance data curve and the standard capacitance data curve can be highly overlapped, thereby reducing the quality fluctuation caused by mold transfer and the scrap rate caused by improper parameters, thereby improving product quality.

[0080] Step S104 , adjusting the process parameters of the new injection molding machine according to the data difference between the standard capacitance data curve and the transfer capacitance data curve, so that the data difference between the transfer capacitance data curve and the standard capacitance data curve meets a preset curve error threshold.

[0081] In the embodiment of the present application, the process parameters include the process parameters of the injection section, the process parameters of the pressure holding section, and the process parameters of the cooling section. Among them, the process parameters of the injection section include the injection speed and the switching point position, and the switching point position is the position where the injection section switches to the pressure holding section; the process parameters of the pressure holding section include the pressure holding pressure and the pressure holding time; the process parameters of the cooling section include the mold temperature.

[0082] For the preset curve error threshold, which is the difference threshold between the converted-mode capacitance data curve and the standard capacitance data curve, the setting of the threshold in the embodiment of the present application should be controlled to be as small as possible so that the converted-mode capacitance data curve and the standard capacitance data curve are basically overlapped.

[0083] In some embodiments, step S104 may include: performing data extraction processing on the standard capacitance data curve to obtain a standard capacitance characteristic quantity; wherein the standard capacitance characteristic quantity includes a standard sampling time, a standard injection section slope, a standard switching point capacitance value, a standard holding section maximum capacitance value, a standard holding section capacitance integral value, and a standard cooling section slope; performing data extraction processing on the mold transfer capacitance data curve to obtain a mold transfer capacitance characteristic quantity; wherein the mold transfer capacitance characteristic quantity includes a mold transfer sampling time, a mold transfer injection section slope, a mold transfer switching point capacitance value, a mold transfer holding section maximum capacitance value, a mold transfer holding section capacitance integral value, and a mold transfer cooling section slope; calculating the data difference between the standard capacitance characteristic quantity and the mold transfer capacitance characteristic quantity to obtain a capacitance data difference result, and adjusting the process parameters of the new injection molding machine according to the capacitance data difference result.

[0084] In a specific implementation, for a capacitance data curve, characteristic values ​​as shown in Table 1 are extracted from all collected data points, wherein Table 1 is the characteristic values ​​collected from the capacitance data curve. As shown in Table 1, it is necessary to extract from the capacitance data curve: the time point of the first effective (>0.01pF) capacitance data, the linear fitting slope of the capacitance signal in the injection section, the capacitance value corresponding to the V / P switching point, the maximum capacitance value in the holding section, the capacitance integral value from the V / P switching point to the end of the holding section, and the linear fitting slope of the capacitance signal in the cooling section.

[0085] Serial number Feature Item 1 The time point of the first valid (>0.01pF) capacitance data 2 Linear fitting slope of the injection segment capacitance signal 3 Capacitance value corresponding to V / P switching point 4 Maximum capacitance value during voltage holding period 5 Capacitance integral value from V / P switching point to the end of pressure holding 6 Linear fitting slope of capacitance signal in cooling section

[0086] Table 1: Characteristic values ​​collected from capacitance data curves

[0087] See also Figure 5 , Figure 5is a schematic diagram of the curve distribution of the characteristic values ​​of capacitance data provided by the embodiment of the present application; Figure 5 As shown in the figure, the time point of the first effective (>0.01pF) capacitance data is point A, and the V / P switching point is point B. Point A to point B can be linearly fitted with the slope of the capacitance signal in the injection section, point C is the maximum capacitance value in the pressure holding section, point D is the time point when the pressure holding ends, point E is the time point when the mold is opened, and point D to point E can be linearly fitted with the slope of the capacitance signal in the cooling section.

[0088] For the standard capacitance characteristic quantity, it is the data obtained by data extraction and processing of the standard capacitance data curve. Among them, the standard capacitance characteristic quantity includes the standard sampling time, the standard injection section slope, the standard switching point capacitance value, the standard pressure holding section maximum capacitance value, the standard pressure holding section capacitance integral value, and the standard cooling section slope. Among them, the standard sampling time corresponds to the time point of the first effective (>0.01pF) capacitance data of the standard capacitance data curve; the standard injection section slope corresponds to the linear fitting slope of the injection section capacitance signal of the standard capacitance data curve; the standard switching point capacitance value corresponds to the capacitance value corresponding to the V / P switching point of the standard capacitance data curve; the standard pressure holding section maximum capacitance value corresponds to the pressure holding section maximum capacitance value of the standard capacitance data curve; the standard pressure holding section capacitance integral value corresponds to the capacitance integral value from the V / P switching point to the end of the pressure holding time point of the standard capacitance data curve; the standard cooling section slope corresponds to the linear fitting slope of the cooling section capacitance signal of the standard capacitance data curve.

[0089] In an embodiment of the present application, the characteristic quantity of the time point (i.e., the standard sampling time) of the first effective (>0.01pF) capacitance data corresponding to the standard capacitance data curve is set to T1, the characteristic quantity of the linear fitting slope of the injection segment capacitance signal (i.e., the standard injection segment slope) is set to K1, the characteristic quantity of the capacitance value corresponding to the V / P switching point (i.e., the standard switching point capacitance value) is set to C1, the characteristic quantity of the maximum capacitance value of the pressure holding segment (i.e., the standard pressure holding segment maximum capacitance value) is set to C2, the characteristic quantity of the capacitance integral value from the V / P switching point to the end of the pressure holding segment (i.e., the standard pressure holding segment capacitance integral value) is set to C3, and the linear fitting slope of the cooling segment capacitance signal (i.e., the standard cooling segment slope) is set to K2.

[0090] For the characteristic quantity of mold transfer capacitance, it is the data obtained by data extraction and processing of the mold transfer capacitance data curve. Among them, the characteristic quantity of mold transfer capacitance includes mold transfer sampling time, mold transfer injection section slope, mold transfer switching point capacitance value, mold transfer pressure holding section maximum capacitance value, mold transfer pressure holding section capacitance integral value, and mold transfer cooling section slope. Among them, the mold transfer sampling time corresponds to the time point of the first effective (>0.01pF) capacitance data of the mold transfer capacitance data curve; the mold transfer injection section slope corresponds to the linear fitting slope of the injection section capacitance signal of the mold transfer capacitance data curve; the mold transfer switching point capacitance value corresponds to the capacitance value corresponding to the V / P switching point of the mold transfer capacitance data curve; the maximum capacitance value of the mold transfer pressure holding section corresponds to the maximum capacitance value of the pressure holding section of the mold transfer capacitance data curve; the mold transfer pressure holding section capacitance integral value corresponds to the capacitance integral value from the V / P switching point to the end of the pressure holding time point of the mold transfer capacitance data curve; the mold transfer cooling section slope corresponds to the linear fitting slope of the cooling section capacitance signal of the mold transfer capacitance data curve.

[0091] In an embodiment of the present application, the characteristic quantity of the time point (i.e., the mold transfer sampling time) of the first effective (>0.01pF) capacitance data corresponding to the mold transfer capacitance data curve is set to T1r, the characteristic quantity of the linear fitting slope of the injection section capacitance signal (i.e., the slope of the mold transfer injection section) is set to K1r, the characteristic quantity of the capacitance value corresponding to the V / P switching point (i.e., the capacitance value at the mold transfer switching point) is set to C1r, the characteristic quantity of the maximum capacitance value in the holding section (i.e., the maximum capacitance value in the mold transfer holding section) is set to C2r, the characteristic quantity of the capacitance integral value from the V / P switching point to the end of the holding section (i.e., the capacitance integral value in the mold transfer holding section) is set to C3r, and the linear fitting slope of the capacitance signal in the cooling section (i.e., the slope of the mold transfer cooling section) is set to K2r.

[0092] Among them, after extracting the data of the capacitance data curve, it is also necessary to calculate the average standard deviation of all data points from time zero to the V / P switching time point, the mean square error of all data points from time zero to the end of the pressure holding time point, and the average standard deviation of all data points from time zero to the mold opening time point. These three errors represent the errors between the standard curve and the mold transfer curve, as shown in Table 2, which is the error characteristic items between the standard curve and the mold transfer curve.

[0093] Serial number Feature Item Feature quantity 1 Average standard deviation of all data points from time zero to V / P switching time S1 2 The mean square error of all data points from time zero to the end of pressure holding S2 3 Average standard deviation of all data points from time zero to mold opening time S3

[0094] Table 2: Error characteristic terms between standard curve and transfer curve

[0095] In an embodiment of the present application, the characteristic quantity of the average standard deviation of all data points from time zero to the V / P switching time point between the transfer capacitance data curve and the standard capacitance data curve is set to S1, the characteristic quantity of the mean square error of all data points from time zero to the end of the pressure holding time point is set to S2, and the characteristic quantity of the average standard deviation of all data points from time zero to the mold opening time point is set to S3.

[0096] As for the capacitance data difference result, it reflects the data difference between the standard capacitance feature quantity and the converted capacitance feature quantity.

[0097] In some specific embodiments, the data difference between the standard capacitance characteristic quantity and the mold-rotating capacitance characteristic quantity is calculated to obtain the capacitance data difference result, and the process parameters of the new injection molding machine are adjusted according to the capacitance data difference result, which may include: adjusting the injection speed in the process parameters of the new injection molding machine according to the sampling time difference between the standard sampling time and the mold-rotating sampling time; wherein the injection speed is the process parameter of the injection section; confirming whether the injection speed in the process parameters has been adjusted according to the injection slope difference between the standard injection section slope and the mold-rotating injection section slope; if it is confirmed that the injection speed adjustment has been completed, then adjusting the switching point position in the process parameters of the new injection molding machine according to the switching point capacitance difference between the standard switching point capacitance value and the mold-rotating switching point capacitance value; wherein the switching point position is the position where the injection section switches to the holding section; after adjusting the switching point position, confirming whether the process parameters of the injection section have been adjusted according to the first mean square error of the standard capacitance data curve and the mold-rotating capacitance data curve in the first injection time period; if it is confirmed that the process parameters of the injection section have been adjusted, then adjusting the switching point position according to the maximum capacitance value of the standard holding section and the maximum capacitance value of the mold-rotating holding section The holding pressure in the process parameters of the new injection molding machine is adjusted according to the maximum capacitance difference between the values; wherein the holding pressure is the process parameter of the holding section; after the holding pressure is adjusted, the holding time in the process parameters of the new injection molding machine is adjusted according to the capacitance integral difference between the standard holding section capacitance integral value and the transfer mold holding section capacitance integral value; wherein the holding time is the process parameter of the holding section; after the holding time is adjusted, the process parameters of the holding section are confirmed according to the second mean square error between the standard capacitance data curve and the transfer mold capacitance data curve in the second injection time period. Whether the parameter adjustment is completed; if it is confirmed that the process parameter adjustment of the pressure holding section is completed, the mold temperature in the process parameters of the new injection molding machine is adjusted according to the cooling slope difference between the standard cooling section slope and the transfer cooling section slope; wherein the mold temperature is the process parameter of the cooling section; after adjusting the mold temperature, confirm whether the process parameter adjustment of the cooling section is completed according to the third mean square error of the standard capacitance data curve and the transfer capacitance data curve in the third injection time period; if it is confirmed that the process parameter adjustment of the cooling section is completed, the process parameter adjustment of the new injection molding machine is terminated.

[0098] In some specific embodiments, confirming whether the injection speed in the process parameters has been adjusted based on the injection slope difference between the standard injection section slope and the rotational mold injection section slope can include: calculating the injection slope difference between the standard injection section slope and the rotational mold injection section slope to obtain an injection slope difference result; if the injection slope difference result is within the injection slope error threshold, confirming that the injection speed adjustment in the process parameters has been completed; if the injection slope difference result exceeds the injection slope error threshold, confirming that the injection speed adjustment in the process parameters has not been completed, and returning to execute the step of adjusting the injection speed in the process parameters of the new injection molding machine based on the sampling time difference between the standard sampling time and the rotational mold sampling time, until the injection slope difference result is within the injection slope error threshold.

[0099] In some specific embodiments, after adjusting the switching point position, confirming whether the process parameters of the injection section have been adjusted is based on the first mean square error of the standard capacitance data curve and the transfer mold capacitance data curve within the first injection time period, including: after adjusting the switching point position, calculating the first mean square error of the standard capacitance data curve and the transfer mold capacitance data curve within the first injection time period according to the first mean square error formula; if the first mean square error is within the first preset mean square error threshold, confirming that the process parameters of the injection section have been adjusted; if the first mean square error exceeds the first preset mean square error threshold, returning to execute the step of adjusting the switching point position in the process parameters of the new injection molding machine according to the switching point capacitance difference between the standard switching point capacitance value and the transfer mold switching point capacitance value if the injection speed adjustment is confirmed to be complete, until the first mean square error is within the first preset mean square error threshold.

[0100] In some specific embodiments, after the holding time is adjusted, whether the process parameters of the holding section are adjusted is confirmed according to the second mean square error of the standard capacitance data curve and the transfer capacitance data curve in the second injection time period, including: after the holding time is adjusted, the second mean square error of the standard capacitance data curve and the transfer capacitance data curve in the second injection time period is calculated according to the second mean square error formula; if the second mean square error is within the second preset mean square error threshold, it is confirmed that the adjustment of the process parameters of the holding section is completed; if the second mean square error exceeds the second preset mean square error threshold, it returns to execute the step of adjusting the holding time in the process parameters of the new injection molding machine according to the capacitance integral difference between the standard holding section capacitance integral value and the transfer holding section capacitance integral value after the holding pressure is adjusted, until the second mean square error is within the second preset mean square error threshold.

[0101] In some specific embodiments, after adjusting the mold temperature, confirming whether the process parameters of the cooling section have been adjusted is based on a third mean square error between the standard capacitance data curve and the transfer mold capacitance data curve within a third injection time period, including: after adjusting the mold temperature, calculating the third mean square error between the standard capacitance data curve and the transfer mold capacitance data curve within the third injection time period according to a third mean square error formula; if the third mean square error is within a third preset mean square error threshold, confirming that the process parameters of the cooling section have been adjusted; if the third mean square error exceeds the third preset mean square error threshold, returning to execute the step of adjusting the mold temperature in the process parameters of the new injection molding machine according to the difference in cooling slope between the standard cooling section slope and the transfer mold cooling section slope if the adjustment of the process parameters of the holding section has been confirmed, until the third mean square error is within the third preset mean square error threshold.

[0102] Among them, the first mean square error of the standard capacitance data curve and the transfer capacitance data curve in the first injection molding time period is the average standard deviation S1 of all data points from the zero moment to the V / P switching moment between the aforementioned transfer capacitance data curve and the standard capacitance data curve, and the average standard deviation S1 of all data points from the zero moment to the V / P switching moment is used to determine whether the process parameters of the injection section are adjusted. Among them, the first injection molding time period refers to the time period from the zero moment to the V / P switching moment.

[0103] In a specific implementation, after adjusting the switching point position, the first mean square error of the standard capacitance data curve and the rotational mold capacitance data curve within the first injection time period is calculated according to the first mean square error formula; if the first mean square error is within the first preset mean square error threshold, it is confirmed that the process parameter adjustment of the injection section is completed; if the first mean square error exceeds the first preset mean square error threshold, the process returns to execute the step of adjusting the switching point position in the process parameters of the new injection molding machine according to the switching point capacitance difference between the standard switching point capacitance value and the rotational mold switching point capacitance value if the injection speed adjustment is confirmed to be completed, until the first mean square error is within the first preset mean square error threshold.

[0104] The second mean square error of the standard capacitance data curve and the transfer capacitance data curve in the second injection time period is the mean square error S2 of all data points from the zero moment to the end of the pressure holding period between the transfer capacitance data curve and the standard capacitance data curve, which is used to determine whether the process parameters of the pressure holding period are adjusted. The second injection time period refers to the time period from the zero moment to the end of the pressure holding period.

[0105] In a specific implementation, after the holding time is adjusted, the second mean square error of the standard capacitance data curve and the rotational capacitance data curve within the second injection time period is calculated according to the second mean square error formula; if the second mean square error is within the second preset mean square error threshold, it is confirmed that the adjustment of the process parameters of the holding section is completed; if the second mean square error exceeds the second preset mean square error threshold, the step of adjusting the holding time in the process parameters of the new injection molding machine according to the capacitance integral difference between the standard holding section capacitance integral value and the rotational holding section capacitance integral value after the holding pressure is adjusted is returned to be executed until the second mean square error is within the second preset mean square error threshold.

[0106] The third mean square error between the standard capacitance data curve and the transfer capacitance data curve in the third injection molding time period is the average standard deviation S3 of all data points from the zero moment to the mold opening moment between the transfer capacitance data curve and the standard capacitance data curve, which is used to determine whether the process parameters of the cooling section are adjusted. The third injection molding time period refers to the time period from the zero moment to the mold opening moment.

[0107] In a specific implementation, after adjusting the mold temperature, the third mean square error of the standard capacitance data curve and the rotational mold capacitance data curve within the third injection time period is calculated according to the third mean square error formula; if the third mean square error is within the third preset mean square error threshold, it is confirmed that the process parameter adjustment of the cooling section is completed; if the third mean square error exceeds the third preset mean square error threshold, the process returns to execute if it is confirmed that the process parameter adjustment of the holding section is completed, then the step of adjusting the mold temperature in the process parameters of the new injection molding machine according to the cooling slope difference between the standard cooling section slope and the rotational mold cooling section slope, until the third mean square error is within the third preset mean square error threshold.

[0108] In the embodiment of the present application, the rotary mold capacitance data curve of the new injection molding machine is adjusted step by step according to the order of parameters to be adjusted. All process parameters to be adjusted and the order of process parameter adjustment and the characteristic items corresponding to these process parameters to be adjusted are shown in Table 3 below. Table 3 is the order of process parameters to be adjusted. Specifically, Table 3 is as follows:

[0109]

[0110] Table 3: Order of process parameters to be adjusted

[0111] As shown in Table 3, in the first step, the injection speed of the injection section of the new injection molding machine is adjusted according to the time point of the first valid (>0.01 pF) capacitance data; in the second step, it is judged whether the injection speed adjustment is completed according to the linear fitting slope of the capacitance signal in the injection section; in the third step, the V / P switching position of the injection section of the new injection molding machine is adjusted according to the capacitance value corresponding to the V / P switching point; in the fourth step, it is judged whether the V / P switching position is adjusted completed according to the mean square error of all data points from the zero moment to the V / P switching moment, that is, it is judged whether the process parameters of the injection section are adjusted completed; in the fifth step, the holding pressure of the holding pressure section of the new injection molding machine is adjusted according to the maximum capacitance value in the holding pressure section; in the sixth step, the holding time of the holding pressure section of the new injection molding machine is adjusted according to the capacitance integral value from the V / P switching point to the end of the holding pressure moment; in the seventh step, it is judged whether the holding time of the holding pressure section of the new injection molding machine is adjusted completed according to the mean square error of all data points from the zero moment to the end of the holding pressure moment, that is, it is judged whether the process parameters of the holding pressure section of the new injection molding machine are adjusted completed; in the eighth step, the mold temperature of the cooling section is adjusted according to the linear fitting slope of the capacitance signal in the cooling section; in the ninth step, it is judged whether the mold temperature of the cooling section is adjusted completed according to the mean square error of all data points from the zero moment to the mold opening moment, that is, it is judged whether the process parameters of the cooling section are adjusted completed. If the process parameters of the cooling section are adjusted completed, the adjustment of the process parameters of the new injection molding machine is completed, and the situation where the transfer mold capacitance data curve and the standard capacitance data curve basically coincide can be obtained.

[0112] Specifically, the specific adjustment process of each parameter to be adjusted is as follows (from the first step to the ninth step):

[0113] In the first step, first adjust the injection speed of the injection section of the new injection molding machine according to the time point of the first valid (>0.01 pF) capacitance data;

[0114] In a specific implementation, the injection speed in the process parameters of the new injection molding machine is adjusted according to the sampling time difference between the standard sampling time and the transfer mold sampling time; among them, the characteristic quantity of the time point (i.e., the standard sampling time) of the first valid (>0.01 pF) capacitance data corresponding to the standard capacitance data curve is T1, and the characteristic quantity of the time point (i.e., the transfer mold sampling time) of the first valid (>0.01 pF) capacitance data corresponding to the transfer mold capacitance data curve is T1 r.

[0115] Specifically, the injection speed of the new injection molding machine in the injection section is initially adjusted according to the value of (T1 r - T1), and the adjustment of the injection speed specifically follows the following logic:

[0116] (1) When (T1 r - T1) > e1, increase the injection speed;

[0117] (2) When (T1 r - T1) < e2, decrease the injection speed;

[0118] (3) When |T1r - T1| < e3, jump to the next step (comparing the linear fitting slope error of the capacitance signal in the injection section).

[0119] Among them, e1, e2, and e3 are respectively error thresholds determined according to different actual application situations. It should be noted that the error thresholds corresponding to increasing or decreasing the injection speed can be set according to the actual situation. Similarly, the adjustment thresholds set for the increase or decrease amount of the injection speed can also be set according to the actual situation, and the embodiments of the present application do not limit this.

[0120] Step 2: Determine whether the injection speed adjustment is completed according to the linear fitting slope of the capacitance signal in the injection section;

[0121] In a specific implementation, it is determined whether the injection speed in the process parameters is adjusted completed according to the injection slope difference between the standard injection section slope and the transfer mold injection section slope; specifically, calculate the injection slope difference between the standard injection section slope and the transfer mold injection section slope to obtain the injection slope difference result; if the injection slope difference result is within the injection slope error threshold, it is confirmed that the injection speed in the process parameters is adjusted completed; if the injection slope difference result exceeds the injection slope error threshold, it is confirmed that the injection speed in the process parameters is not adjusted completed, and return to execute Step 1 (the step of adjusting the injection speed) until the injection slope difference result is within the injection slope error threshold.

[0122] Among them, the characteristic quantity of the linear fitting slope of the capacitance signal in the injection section corresponding to the standard capacitance data curve (i.e., the standard injection section slope) is K1, and the characteristic quantity of the linear fitting slope of the capacitance signal in the injection section corresponding to the transfer mold capacitance data curve (i.e., the transfer mold injection section slope) is K1r. By comparing the difference between K1 and K1r with the injection slope error threshold, it is determined whether the injection speed adjustment is completed.

[0123] Exemplarily, perform least squares linear fitting on all data points between the first valid capacitance value A point and the V / P switching point B point in Figure 5 corresponding to the standard capacitance data curve, and the fitting slope K1 of the capacitance signal in the injection section of the standard curve can be obtained; perform least squares linear fitting on all data points between the first valid capacitance value A point and the V / P switching point B point in Figure 5 corresponding to the transfer mold capacitance data curve, and the fitting slope K1r of the capacitance signal in the injection section of the transfer mold curve can be obtained. If the error between K1 and K1r exceeds the injection slope error threshold, it means that the injection speed adjustment is not completed, and return to Step 1 to adjust the injection speed; if the error between K1 and K1r is within the range of the injection slope error threshold, it means that the injection speed adjustment is completed, and enter the next step (Step 3).

[0124] Please refer to Figure 6 , Figure 6 It is a schematic diagram of the transfer mold signal curve after the injection speed setting is completed provided by the embodiment of the present application; Figure 6 It is a schematic diagram of the curve after adjusting the injection speed of the new injection molding machine. As Figure 6 shown, compared with Figure 4 the initial transfer mold capacitor data curve shown, after adjusting the injection speed of the new injection molding machine, Figure 6 the transfer mold capacitor data curve shown gradually starts to fit the standard capacitor data curve.

[0125] Step 3: Adjust the V / P switching position of the injection section of the new injection molding machine according to the capacitance value corresponding to the V / P switching point;

[0126] In a specific implementation, if it is confirmed that the injection speed adjustment is completed, the switching point position in the process parameters of the new injection molding machine is adjusted according to the switching point capacitance difference between the standard switching point capacitance value and the transfer mold switching point capacitance value; among them, the moment of V / P switching is taken as T2, the capacitance sensor signal value at the moment T2 is C1, the characteristic quantity of the capacitance value corresponding to the V / P switching point of the standard curve (i.e., the standard switching point capacitance value) is set as C1, and the characteristic quantity of the capacitance value corresponding to the V / P switching point of the transfer mold curve (i.e., the transfer mold switching point capacitance value) is set as C1 r.

[0127] Specifically, the injection hold pressure switching position (V / P switching point position) of the injection molding machine is adjusted according to the value of (C1 r - C1). The adjustment of the injection hold pressure switching position specifically follows the following logic:

[0128] (1) When (C1 r - C1) > e1, adjust the injection hold pressure switching position further backward (away from the nozzle direction);

[0129] (2) When (C1 r - C1) < e2, adjust the injection hold pressure switching position further forward (toward the nozzle direction);

[0130] (3) When |C1 r - C1| < e3, perform the next step (Step 4).

[0131] Among them, e1, e2, and e3 are respectively error thresholds determined according to different actual application situations. It should be noted that the error thresholds corresponding to the forward or backward of the injection hold pressure switching position can be set according to the actual situation. Similarly, the adjustment thresholds set for the forward or backward of the injection hold pressure switching position can also be set according to the actual situation. The embodiment of the present application does not limit this.

[0132] Step 4: Determine whether the V / P switching position is adjusted completed according to the mean square error of all data points from the zero moment to the V / P switching moment point, that is, determine whether the process parameters of the injection section are adjusted completed;

[0133] In a specific implementation, after adjusting the switching point position, it is confirmed whether the process parameters of the injection section have been adjusted according to the first mean square error of the standard capacitance data curve and the mold transfer capacitance data curve in the first injection time period. Specifically, after adjusting the switching point position, the first mean square error of the standard capacitance data curve and the mold transfer capacitance data curve in the first injection time period is calculated according to the first mean square error formula; if the first mean square error is within the first preset mean square error threshold, it is confirmed that the process parameters of the injection section have been adjusted; if the first mean square error exceeds the first preset mean square error threshold, it is returned to execute the step of adjusting the switching point position in the process parameters of the new injection molding machine according to the switching point capacitance difference between the standard switching point capacitance value and the mold transfer switching point capacitance value if the injection speed adjustment is confirmed to be completed, until the first mean square error is within the first preset mean square error threshold.

[0134] Among them, the first mean square error refers to the mean square error of all data points from time zero to the V / P switching time point. The first mean square error is calculated to verify whether the mold transfer curve of the injection section deviates from the standard curve from the numerical calculation. The first mean square error formula for calculating the first mean square error is as follows:

[0135]

[0136] Where n1 represents the number of all data sampling points from time zero to the V / P switching time point, C i1 It is expressed as the capacitance value of the i-th conversion capacitance data curve from time zero to the V / P switching time point, C std_i1 It is expressed as the capacitance value of the i-th standard capacitance data curve between the zero moment and the V / P switching moment.

[0137] Specifically, the error judgment of the first mean square error S1 is: when the first mean square error S1 exceeds the first preset mean square error threshold, it indicates that the V / P switching point position adjustment is not completed, that is, the injection section parameter adjustment is not completed, and returns to the step of adjusting the V / P switching position (i.e., step 3) until the first mean square error is within the first preset mean square error threshold, wherein the first preset mean square error threshold can be set according to actual conditions, and the embodiment of the present application does not limit this; when the first mean square error S1 is within the first preset mean square error threshold, it indicates that the V / P switching point position adjustment is completed, that is, the injection section parameter adjustment is completed, and then proceeds to the next step (i.e., step 5).

[0138] See also Figure 7 , Figure 7 It is a schematic diagram of a mold transfer signal curve after the parameter adjustment of the injection molding stage is completed provided in an embodiment of the present application; Figure 7 This is a curve diagram after adjusting the V / P switching point position of the new injection molding machine, that is, a curve diagram after completing the injection section parameter adjustment. Figure 7As shown, compared with Figure 6 the transfer mold capacitance data curve after the completion of the injection speed adjustment shown, after adjusting the position of the V / P switching point of the new injection molding machine, Figure 7 the schematic transfer mold capacitance data curve is closer to the standard capacitance data curve.

[0139] Step 5: Adjust the holding pressure of the holding pressure section of the new injection molding machine according to the maximum capacitance value of the holding pressure section;

[0140] In a specific implementation, if it is confirmed that the adjustment of the process parameters in the injection section is completed, then the holding pressure of the process parameters of the new injection molding machine is adjusted according to the maximum capacitance difference between the maximum capacitance value of the standard holding pressure section and the maximum capacitance value of the transfer mold holding pressure section. Among them, the characteristic quantity of the maximum capacitance value of the holding pressure section corresponding to the standard capacitance data curve (i.e., the maximum capacitance value of the standard holding pressure section) is set as C2, and the characteristic quantity of the maximum capacitance value of the holding pressure section corresponding to the transfer mold capacitance curve (i.e., the maximum capacitance value of the transfer mold holding pressure section) is set as C2r.

[0141] Specifically, the holding pressure of the injection molding machine in the holding pressure section is adjusted according to the value of (C2r - C2), and the adjustment of the holding pressure follows the following calculation logic:

[0142] (1) When (C2r - C2) > e1, reduce the holding pressure;

[0143] (2) When (C2r - C2) < e2, increase the holding pressure;

[0144] (3) When |C2r - C2| < e3, it is considered that the adjustment of the holding pressure is completed, and enter the next parameter adjustment step (i.e., Step 6).

[0145] Among them, e1, e2, and e3 are respectively error thresholds determined according to different actual application situations. It should be noted that the error thresholds corresponding to increasing or decreasing the holding pressure can be set according to the actual situation. Similarly, the adjustment thresholds set for increasing or decreasing the holding pressure can also be set according to the actual situation. The embodiments of the present application do not limit this.

[0146] Please refer to Figure 8 , Figure 8 which is a schematic diagram of the transfer mold signal curve after the completion of the holding pressure setting provided by the embodiment of the present application; Figure 8 is a schematic diagram of the curve after adjusting the holding pressure of the new injection molding machine in the holding pressure section. As Figure 8 shown, compared with Figure 7 the transfer mold capacitance data curve after the adjustment of the process parameters in the injection section shown, after adjusting the holding pressure of the new injection molding machine in the holding pressure section, Figure 8 the schematic transfer mold capacitance data curve is closer to the standard capacitance data curve.

[0147] Step 6: Adjust the holding pressure time of the holding pressure section of the new injection molding machine according to the capacitance integral value from the V / P switching point to the end of the holding pressure moment point;

[0148] In a specific implementation, after adjusting the holding pressure, the holding pressure time in the process parameters of the new injection molding machine is adjusted according to the capacitance integration difference between the standard holding pressure section capacitance integral value and the transfer mold holding pressure section capacitance integral value. Take the moment of V / P switching as T2 and the moment when the holding pressure stage is completed as T3. The capacitance sensor signal value at time t is C(t). Take the following integral values for the standard capacitance data curve and the transfer mold capacitance data curve C int , C int When denoted as C3, it represents the capacitance integral value from the V / P switching point to the end of the holding pressure moment point corresponding to the standard capacitance curve (i.e., the standard holding pressure section capacitance integral value), C int When denoted as C3r, it represents the capacitance integral value from the V / P switching point to the end of the holding pressure moment point corresponding to the transfer mold capacitance curve (i.e., the transfer mold holding pressure section capacitance integral value). The integral value C int The calculation formula is as follows:

[0149]

[0150] Among them, C int represents the capacitance integral value from the V / P switching moment T2 to the end of the holding pressure moment T3; C(t) represents the capacitance sensor signal value at time t; d represents the differential element, and dt represents the tiny change in time.

[0151] Specifically, after obtaining the standard holding pressure section capacitance integral value C3 and the transfer mold holding pressure section capacitance integral value C3r, adjust the holding pressure time of the injection molding machine in the holding pressure section according to the value of (C3r - C3). The adjustment of the holding pressure time follows the following calculation logic:

[0152] (1) When (C3r - C3) > e1, reduce the holding pressure time;

[0153] (2) When (C3r - C3) < e2, increase the holding pressure time;

[0154] (3) When |C3r - C3| < e3, perform the next step (i.e., Step 7).

[0155] Among them, e1, e2, and e3 are respectively the error thresholds determined according to different actual application situations. It should be noted that the error thresholds corresponding to reducing the holding pressure time or increasing the holding pressure time can be set according to the actual situation. Similarly, the adjustment thresholds set for reducing the holding pressure time or increasing the holding pressure time can also be set according to the actual situation. The embodiments of the present application do not limit this.

[0156] Step 7: judging whether the holding time of the holding section of the new injection molding machine is adjusted according to the mean square error of all data points from time zero to the end of holding time, that is, judging whether the process parameters of the holding section of the new injection molding machine are adjusted;

[0157] In a specific implementation, after the holding time is adjusted, the second mean square error of the standard capacitance data curve and the transfer capacitance data curve in the second injection time period is used to confirm whether the process parameters of the holding section have been adjusted. Specifically, after the holding time is adjusted, the second mean square error of the standard capacitance data curve and the transfer capacitance data curve in the second injection time period is calculated according to the second mean square error formula; if the second mean square error is within the second preset mean square error threshold, it is confirmed that the process parameters of the holding section have been adjusted; if the second mean square error exceeds the second preset mean square error threshold, the step of adjusting the holding time in the process parameters of the new injection molding machine according to the capacitance integral difference between the standard holding section capacitance integral value and the transfer holding section capacitance integral value after the holding pressure is adjusted is returned until the second mean square error is within the second preset mean square error threshold.

[0158] Among them, the second mean square error refers to the mean square error of all data points from time zero to the end of the pressure holding period. The second mean square error is calculated to verify whether the mold transfer capacitance data curve of the pressure holding period deviates from the standard capacitance data curve from the numerical calculation. The second mean square error formula for calculating the second mean square error is as follows:

[0159]

[0160] Where n2 represents the number of all data sampling points from time zero to the end of pressure holding, C i2 It is expressed as the capacitance value of the i-th transfer capacitance data curve from time zero to the end of the pressure holding time point, C std_i2 It is expressed as the capacitance value of the i-th standard capacitance data curve between time zero and the end time of pressure holding.

[0161] Specifically, the error judgment of the second mean square error S2 is: when the second mean square error S2 exceeds the second preset mean square error threshold, it indicates that the pressure holding time adjustment is not completed, that is, the pressure holding section parameter adjustment is not completed, and returns to the step of adjusting the pressure holding time (i.e., step 6) until the second mean square error is within the second preset mean square error threshold, wherein the second preset mean square error threshold can be set according to actual conditions, and the embodiment of the present application does not limit this; when the second mean square error S2 is within the second preset mean square error threshold, it indicates that the pressure holding time adjustment is completed, that is, the pressure holding section parameter adjustment is completed, and then proceeds to the next step (i.e., step 8).

[0162] Step 8, adjusting the mold temperature of the cooling section according to the linear fitting slope of the cooling section capacitance signal;

[0163] In a specific implementation, if it is confirmed that the process parameter adjustment of the holding pressure stage is completed, the mold temperature in the process parameters of the new injection molding machine is adjusted according to the cooling slope difference between the standard cooling stage slope and the transfer mold cooling stage slope. Among them, the linear fitting slope of the cooling stage capacitance signal corresponding to the standard capacitance data curve (i.e., the standard cooling stage slope) is set as K2, and the linear fitting slope of the cooling stage capacitance signal corresponding to the transfer mold capacitance data curve (i.e., the transfer mold cooling stage slope) is set as K2r. Specifically, after setting the process parameters of the holding pressure stage, compare the cooling stage signals, and perform the least squares linear fitting on all data points between the holding pressure end time point D and the mold opening time point E in Figure 5 the standard capacitance data curve, and the linear fitting slope K2 of the cooling stage capacitance signal of the standard capacitance data curve can be obtained; perform the least squares linear fitting on all data points between the holding pressure end time point D and the mold opening time point E in Figure 5 the transfer mold capacitance data curve, and the linear fitting slope K2r of the cooling stage capacitance signal of the transfer mold capacitance data curve can be obtained.

[0164] Specifically, adjust the mold temperature of the injection molding machine in the cooling stage according to the value of (K2r - K2), and the adjustment of the mold temperature follows the following calculation logic:

[0165] (1) When (K2r - K2) > e1, raise the mold temperature;

[0166] (2) When (K2r - K2) < e2, lower the mold temperature;

[0167] (3) When |K2r - K2| < e3, perform the next step (i.e., step 9).

[0168] Among them, e1, e2, and e3 are respectively error thresholds determined according to different actual application situations. It should be noted that the error thresholds corresponding to raising or lowering the mold temperature can be set according to the actual situation. Similarly, the adjustment thresholds set for raising or lowering the mold temperature can also be set according to the actual situation, and the embodiments of the present application do not limit this.

[0169] In step 9, judge whether the mold temperature adjustment of the cooling stage is completed according to the mean square error of all data points from the zero moment to the mold opening time point, that is, judge whether the process parameter adjustment of the cooling stage is completed. If the process parameter adjustment of the cooling stage is completed, the process parameter adjustment of the new injection molding machine is completed, and a situation where the transfer mold capacitance data curve and the standard capacitance data curve are basically coincident can be obtained.

[0170] In a specific implementation, after adjusting the mold temperature, the third mean square error between the standard capacitance data curve and the transfer mold capacitance data curve in the third injection time period is used to confirm whether the process parameters of the cooling section have been adjusted; if it is confirmed that the process parameters of the cooling section have been adjusted, the process parameter adjustment of the new injection molding machine is terminated. Specifically, after adjusting the mold temperature, the third mean square error between the standard capacitance data curve and the transfer mold capacitance data curve in the third injection time period is calculated according to the third mean square error formula; if the third mean square error is within the third preset mean square error threshold, the process parameter adjustment of the cooling section is confirmed to be completed; if the third mean square error exceeds the third preset mean square error threshold, the execution returns to the step of adjusting the mold temperature in the process parameters of the new injection molding machine according to the difference in cooling slope between the standard cooling section slope and the transfer mold cooling section slope, until the third mean square error is within the third preset mean square error threshold.

[0171] Among them, the third mean square error refers to the mean square error of all data points from time zero to the mold opening time point. The third mean square error is calculated to verify whether the mold transfer capacitance data curve of the cooling section deviates from the standard capacitance data curve from the numerical calculation. The third mean square error formula for calculating the third mean square error is as follows:

[0172]

[0173] Where n3 represents the number of all data sampling points from time zero to the mold opening time point, C i3 It is expressed as the capacitance value of the i-th conversion capacitance data curve from time zero to the mold opening time point, C std_i3 It is expressed as the capacitance value of the i-th standard capacitance data curve between time zero and the mold opening time point.

[0174] Specifically, the error judgment of the third mean square error S3 is: when the third mean square error S3 exceeds the third preset mean square error threshold, it indicates that the mold temperature adjustment is not completed, that is, the cooling section parameter adjustment is not completed, and returns to the step of adjusting the mold temperature (that is, step 8) until the third mean square error is within the third preset mean square error threshold, wherein the third preset mean square error threshold can be set according to actual conditions, and the embodiment of the present application does not limit this; when the third mean square error S3 is within the third preset mean square error threshold, it indicates that the mold temperature adjustment is completed, that is, the cooling section parameter adjustment is completed, and it also indicates that all parameters to be adjusted of the new injection molding machine are adjusted.

[0175] After completing the adjustment of all controlled process parameters, the obtained transfer mold introduction data curve will basically coincide with the standard capacitance data curve on the original injection molding machine. Fig. 9 , Fig. 9is a schematic diagram of a mold transfer signal curve after the global process parameter setting is completed according to an embodiment of the present application; Fig. 9 As shown, Fig. 9 This is a curve diagram after all parameters to be adjusted are adjusted, such as Fig. 9 As shown in Figure 1, after adjusting the cooling section of the new injection molding machine, Fig. 9 The illustrated transfer capacitance data curve substantially coincides with the standard capacitance data curve.

[0176] In the embodiment of the present application, the in-mold capacitance sensor can directly contact the injection molded product, is more sensitive to changes in the properties of the melt in the mold, and can monitor the melt condition in real time. By reproducing the standard capacitance data curve, the quality indicators of the original production line products can be quickly reproduced on machines of different models after the mold is transferred, thereby realizing the rapid reproduction of the production process on the new injection molding machine. The consistency of the curve monitored by the capacitance sensor ensures the consistency of product quality, which saves a lot of time and cost for mold transfer and reproduction, and also has a significant effect on the monitoring of the stability of the subsequent injection molding process.

[0177] The embodiment of the present application provides an injection molding machine parameter adjustment method and device for injection mold transfer. The scheme obtains a standard capacitance data curve; after the injection mold is transferred from the old injection molding machine to the new injection molding machine, collects the mold transfer capacitance data of the new injection molding machine during the injection molding process; generates a mold transfer capacitance data curve based on the mold transfer capacitance data; and adjusts the process parameters of the new injection molding machine based on the data difference between the standard capacitance data curve and the mold transfer capacitance data curve, so that the data difference between the mold transfer capacitance data curve and the standard capacitance data curve meets the preset curve error threshold. The embodiment of the present application uses the standard capacitance data curve as a reference, and can quickly determine whether the new injection molding machine needs to adjust the process parameters after the mold transfer, thereby improving the efficiency and accuracy of parameter adjustment, thereby improving production efficiency, and reducing labor costs. At the same time, the process parameters of the new injection molding machine are adjusted according to the data difference between the standard capacitance data curve and the mold transfer capacitance data curve, so that the quality of the products produced on the new injection molding machine is highly consistent with the quality of the products produced on the old injection molding machine, reducing the quality fluctuations caused by mold transfer, and reducing the scrap rate caused by improper parameters, thereby improving product quality; and the in-mold capacitance sensor is more sensitive to changes in the properties of the melt in the mold. By collecting capacitance sensor data to adjust the process parameters, the accuracy and efficiency of the process parameter adjustment can be further improved.

[0178] See also Fig.10 The embodiment of the present application also provides an injection molding machine parameter adjustment device 1000 for injection mold transfer, which can implement the above-mentioned injection molding machine parameter adjustment method for injection mold transfer. The device includes the following modules:

[0179] A standard capacitance data curve acquisition module 1001 is used to acquire a standard capacitance data curve;

[0180] The transfer mold capacitance data acquisition module 1002 is used to collect the transfer mold capacitance data of the new injection molding machine during the injection molding process after the injection mold is transferred from the old injection molding machine to the new injection molding machine;

[0181] A transfer capacitance data curve generating module 1003 is used to generate a transfer capacitance data curve according to the transfer capacitance data;

[0182] The process parameter adjustment module 1004 is used to adjust the process parameters of the new injection molding machine according to the data difference between the standard capacitance data curve and the transfer capacitance data curve, so that the data difference between the transfer capacitance data curve and the standard capacitance data curve meets the preset curve error threshold.

[0183] It can be understood that the contents of the above method embodiments are all applicable to the present device embodiments, the functions specifically implemented by the present device embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0184] The embodiment of the present application also provides an electronic device, the electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the above-mentioned injection molding machine parameter adjustment method for injection mold transfer when executing the computer program. The electronic device can be any smart terminal including a tablet computer, a car computer, etc.

[0185] It can be understood that the contents of the above method embodiments are all applicable to the present device embodiments, the functions specifically implemented by the present device embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0186] See also Fig.11 , Fig.11 The hardware structure of an electronic device of another embodiment is illustrated, and the electronic device includes:

[0187] The processor 1101 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0188] The memory 1102 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 1102 can store an operating system and other application programs. When the technical solution provided in the embodiments of this specification is implemented by software or firmware, the relevant program code is stored in the memory 1102, and the processor 1101 calls and executes the injection molding machine parameter adjustment method for injection mold transfer in the embodiments of this application;

[0189] Input / output interface 1103, used to implement information input and output;

[0190] The communication interface 1104 is used to realize the communication interaction between the device and other devices. The communication can be realized through a wired manner (such as USB, network cable, etc.) or a wireless manner (such as mobile network, WI FI, Bluetooth, etc.);

[0191] A bus 1105 that transmits information between various components of the device (e.g., the processor 1101, the memory 1102, the input / output interface 1103, and the communication interface 1104);

[0192] The processor 1101 , the memory 1102 , the input / output interface 1103 and the communication interface 1104 are connected to each other in communication within the device via the bus 1105 .

[0193] An embodiment of the present application further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the above-mentioned injection molding machine parameter adjustment method for injection mold transfer is implemented.

[0194] It can be understood that the contents of the above method embodiments are all applicable to the present storage medium embodiments, the functions specifically implemented by the present storage medium embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0195] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0196] The embodiments of the present application provide an injection molding machine parameter adjustment method for injection mold transfer and an injection molding machine parameter adjustment device for injection mold transfer, which obtain a standard capacitance data curve; after the injection mold is transferred from the old injection molding machine to the new injection molding machine, collect the mold transfer capacitance data of the new injection molding machine during the injection molding process; generate a mold transfer capacitance data curve based on the mold transfer capacitance data; and adjust the process parameters of the new injection molding machine based on the data difference between the standard capacitance data curve and the mold transfer capacitance data curve, so that the data difference between the mold transfer capacitance data curve and the standard capacitance data curve meets the preset curve error threshold. The embodiment of the present application uses the standard capacitance data curve as a reference, and can quickly determine whether the new injection molding machine needs to adjust the process parameters after the mold transfer, thereby improving the efficiency and accuracy of parameter adjustment, thereby improving production efficiency, and reducing labor costs. At the same time, the process parameters of the new injection molding machine are adjusted according to the data difference between the standard capacitance data curve and the mold transfer capacitance data curve, so that the quality of the products produced on the new injection molding machine is highly consistent with the quality of the products produced on the old injection molding machine, reducing the quality fluctuations caused by mold transfer, and reducing the scrap rate caused by improper parameters, thereby improving product quality; and the in-mold capacitance sensor is more sensitive to changes in the properties of the melt in the mold. By collecting capacitance sensor data to adjust the process parameters, the accuracy and efficiency of the process parameter adjustment can be further improved.

[0197] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0198] Those skilled in the art will appreciate that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0199] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0200] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0201] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0202] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0203] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0204] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0205] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0206] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.

[0207] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A method for adjusting injection molding machine parameters for injection mold transfer, characterized in that: The method comprises the following steps: Obtain standard capacitance data curve; After the injection mold is transferred from the old injection molding machine to the new injection molding machine, collecting the transfer mold capacitance data of the new injection molding machine during the injection molding process; Generating a transfer capacitance data curve according to the transfer capacitance data; The process parameters of the new injection molding machine are adjusted according to the data difference between the standard capacitance data curve and the rotary capacitance data curve, so that the data difference between the rotary capacitance data curve and the standard capacitance data curve meets a preset curve error threshold.

2. The method according to claim 1, characterized in that The step of adjusting the process parameters of the new injection molding machine according to the data difference between the standard capacitance data curve and the rotational capacitance data curve comprises: Performing data extraction processing on the standard capacitance data curve to obtain standard capacitance characteristic quantities; wherein the standard capacitance characteristic quantities include standard sampling time, standard injection section slope, standard switching point capacitance value, standard pressure holding section maximum capacitance value, standard pressure holding section capacitance integral value, and standard cooling section slope; The transfer mold capacitance data curve is subjected to data extraction processing to obtain transfer mold capacitance characteristic quantities; wherein the transfer mold capacitance characteristic quantities include transfer mold sampling time, transfer mold injection section slope, transfer mold switching point capacitance value, transfer mold holding section maximum capacitance value, transfer mold holding section capacitance integral value, and transfer mold cooling section slope; The data difference between the standard capacitance characteristic quantity and the rotational capacitance characteristic quantity is calculated to obtain a capacitance data difference result, and the process parameters of the new injection molding machine are adjusted according to the capacitance data difference result.

3. The method according to claim 2, characterized in that The calculating the data difference between the standard capacitance characteristic quantity and the rotational capacitance characteristic quantity to obtain a capacitance data difference result, and adjusting the process parameters of the new injection molding machine according to the capacitance data difference result, comprises: The injection speed in the process parameters of the new injection molding machine is adjusted according to the sampling time difference between the standard sampling time and the mold rotation sampling time; wherein the injection speed is a process parameter of the injection section; Confirming whether the injection speed in the process parameters has been adjusted according to the injection slope difference between the standard injection section slope and the rotational mold injection section slope; If it is confirmed that the injection speed adjustment is completed, the switching point position in the process parameters of the new injection molding machine is adjusted according to the switching point capacitance difference between the standard switching point capacitance value and the mold rotation switching point capacitance value; wherein the switching point position is the position where the injection section switches to the pressure holding section; After adjusting the switching point position, confirming whether the process parameters of the injection section are adjusted according to a first mean square error between the standard capacitance data curve and the rotational capacitance data curve in the first injection time period; If it is confirmed that the adjustment of the process parameters of the injection section is completed, the holding pressure in the process parameters of the new injection molding machine is adjusted according to the maximum capacitance difference between the maximum capacitance value of the standard holding section and the maximum capacitance value of the rotation holding section; wherein the holding pressure is the process parameter of the holding section; After adjusting the holding pressure, adjusting the holding time in the process parameters of the new injection molding machine according to the capacitance integral difference between the capacitance integral value of the standard holding section and the capacitance integral value of the rotary holding section; wherein the holding time is a process parameter of the holding section; After adjusting the holding time, confirming whether the process parameters of the holding section are adjusted according to a second mean square error between the standard capacitance data curve and the rotational capacitance data curve in the second injection molding time period; If it is confirmed that the process parameter adjustment of the holding section is completed, the mold temperature in the process parameter of the new injection molding machine is adjusted according to the cooling slope difference between the standard cooling section slope and the rotational cooling section slope; wherein the mold temperature is the process parameter of the cooling section; After adjusting the mold temperature, confirming whether the process parameters of the cooling section are adjusted according to a third mean square error between the standard capacitance data curve and the rotational capacitance data curve in a third injection time period; If it is confirmed that the process parameter adjustment of the cooling section is completed, the process parameter adjustment of the new injection molding machine is terminated.

4. The method according to claim 3, characterized in that The step of confirming whether the injection speed in the process parameters has been adjusted according to the injection slope difference between the standard injection section slope and the rotary mold injection section slope includes: Calculating the injection slope difference between the standard injection section slope and the rotational mold injection section slope to obtain an injection slope difference result; If the injection slope difference result is within the injection slope error threshold, confirming that the injection speed adjustment in the process parameters is completed; If the injection slope difference result exceeds the injection slope error threshold, it is confirmed that the injection speed adjustment in the process parameters is not completed, and the step of adjusting the injection speed in the process parameters of the new injection molding machine according to the sampling time difference between the standard sampling time and the mold rotation sampling time is returned to execute until the injection slope difference result is within the injection slope error threshold.

5. The method according to claim 3, characterized in that: After adjusting the switching point position, confirming whether the process parameters of the injection section are adjusted according to a first mean square error between the standard capacitance data curve and the rotational capacitance data curve in the first injection time period includes: After adjusting the switching point position, calculating a first mean square error between the standard capacitance data curve and the rotational capacitance data curve in a first injection time period according to a first mean square error formula; If the first mean square error is within a first preset mean square error threshold, it is confirmed that the process parameter adjustment of the injection section is completed; If the first mean square error exceeds the first preset mean square error threshold, the process returns to execute the step of adjusting the switching point position in the process parameters of the new injection molding machine according to the switching point capacitance difference between the standard switching point capacitance value and the mold rotation switching point capacitance value if it is confirmed that the injection speed adjustment is completed, until the first mean square error is within the first preset mean square error threshold.

6. The method according to claim 3, characterized in that After adjusting the holding time, confirming whether the process parameters of the holding section are adjusted according to a second mean square error between the standard capacitance data curve and the rotational capacitance data curve in the second injection time period includes: After adjusting the holding time, calculating a second mean square error between the standard capacitance data curve and the rotational capacitance data curve in a second injection molding time period according to a second mean square error formula; If the second mean square error is within a second preset mean square error threshold, it is confirmed that the process parameter adjustment of the pressure holding section is completed; If the second mean square error exceeds the second preset mean square error threshold, return to execute the step of adjusting the holding time in the process parameters of the new injection molding machine according to the capacitance integral difference between the standard holding section capacitance integral value and the rotational holding section capacitance integral value after adjusting the holding pressure, until the second mean square error is within the second preset mean square error threshold.

7. The method according to claim 3, characterized in that After adjusting the mold temperature, confirming whether the process parameters of the cooling section are adjusted according to a third mean square error between the standard capacitance data curve and the rotational capacitance data curve in a third injection time period includes: After adjusting the mold temperature, calculating a third mean square error between the standard capacitance data curve and the rotational capacitance data curve in a third injection time period according to a third mean square error formula; If the third mean square error is within a third preset mean square error threshold, it is confirmed that the process parameter adjustment of the cooling section is completed; If the third mean square error exceeds the third preset mean square error threshold, return to execute the step of adjusting the mold temperature in the process parameters of the new injection molding machine according to the cooling slope difference between the standard cooling section slope and the rotational cooling section slope if it is confirmed that the process parameter adjustment of the holding section is completed, until the third mean square error is within the third preset mean square error threshold.

8. An injection molding machine parameter adjustment device for injection mold transfer, characterized in that: The device comprises the following modules: A standard capacitance data curve acquisition module is used to acquire a standard capacitance data curve; A transfer mold capacitance data acquisition module, used to collect transfer mold capacitance data of the new injection molding machine during the injection molding process after the injection mold is transferred from the old injection molding machine to the new injection molding machine; A transfer capacitance data curve generating module, used for generating a transfer capacitance data curve according to the transfer capacitance data; The process parameter adjustment module is used to adjust the process parameters of the new injection molding machine according to the data difference between the standard capacitance data curve and the transfer capacitance data curve, so that the data difference between the transfer capacitance data curve and the standard capacitance data curve meets the preset curve error threshold.

9. An electronic device, characterized in that: The electronic device comprises a memory and a processor, the memory stores a computer program, and the processor implements the method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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