Resin composition and preparation method thereof, prepreg, laminated board and printed circuit board
By using a specific proportion of phthalene-capped polybutadiene and bismaleimide benzooxazine prepolymer in the resin composition, the resin self-polymerization is promoted to form a specific ring structure, and the problem of insufficient glass transition temperature and thermal decomposition temperature in existing resins in integrated circuit applications is solved, and higher performance indicators are achieved.
Patent Information
- Application Number
- CN202411915768.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2044-12-24
AI Technical Summary
In large-scale integrated circuit applications, existing hydrocarbon resins have problems such as low glass transition temperature and insufficient initial thermal decomposition temperature, which affects the performance of their copper clad plates.
A resin composition is provided, including a specific proportion of phthalene-capped polybutadiene and bismaleimide benzooxazine prepolymer, through the interaction of these components, to promote the self-polymerization of the resin to form indole rings, phthalocyanine rings and triazine rings, thereby increasing the glass transition temperature and initial thermal decomposition temperature.
The resin composition has a high glass transition temperature and initial thermal decomposition temperature, which enhances its peel strength, reduces water absorption, improves elastic modulus, improves flame retardancy and dielectric properties, and is suitable for high-performance printed circuit boards.