Backlight module and display panel

Abstract

The backlight module comprises a circuit board and a plurality of light-emitting units arranged uniformly on the circuit board; the light-emitting unit comprises a plurality of light-emitting diode chips and a fluorescent layer covering the plurality of light-emitting diode chips, the plurality of light-emitting diode chips comprise blue light-emitting diode chips and violet light-emitting diode chips, the number of the blue light-emitting diode chips is greater than or equal to the number of the violet light-emitting diode chips, and the fluorescent layer is a yellow fluorescent layer. The blue light-emitting diode chips and the violet light-emitting diode chips are electrically connected with the circuit board to excite the yellow fluorescent layer to form white light, the spectral energy of the blue light is weakened after passing through the backlight module, the photochemical damage to the retina and the oxidative damage to the cells in the macular area caused by the blue light are effectively reduced, the harm to the user's vision is reduced, and the display device using the backlight module has an eye protection effect.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a backlight module and a display panel. Background Technology

[0002] A backlight module is a device that provides a light source in a display device.

[0003] The related technology provides a backlight module, which includes a circuit board and multiple light-emitting units, all of which are electrically connected to the circuit board. Each light-emitting unit includes a blue light-emitting diode chip and phosphor, thereby emitting white light.

[0004] According to related technologies, the blue light emitted by the aforementioned backlight module has a higher energy, which can cause photochemical damage to the retina, accelerate oxidative damage to macular cells, and cause harm to the user's vision. Summary of the Invention

[0005] This disclosure provides a backlight module and a display panel that can reduce the spectral energy of blue light, thus protecting the eyes. The technical solution is as follows:

[0006] On one hand, a backlight module is provided, the backlight module comprising:

[0007] A circuit board and multiple light-emitting units, wherein the multiple light-emitting units are evenly spaced on the circuit board;

[0008] The light-emitting unit includes multiple light-emitting diode chips and a fluorescent layer covering the multiple light-emitting diode chips. The multiple light-emitting diode chips include blue light-emitting diode chips and violet light-emitting diode chips, and the number of blue light-emitting diode chips is greater than or equal to the number of violet light-emitting diode chips. The fluorescent layer is a yellow fluorescent layer.

[0009] Optionally, the light-emitting unit further includes a bracket, bracket pins, and wires;

[0010] The light-emitting diode (LED) chips are electrically connected to the bracket pins on the bracket, and the LED chips are electrically connected to each other through the wires. The LED chips located on both sides are electrically connected to the bracket pins through the wires. The fluorescent layer is located inside the bracket and covers the LED chips.

[0011] Optionally, the blue light-emitting diode chip has an emission wavelength of 457.5–465 nm.

[0012] Optionally, the emission wavelength of the ultraviolet light-emitting diode chip is 400-410 nm.

[0013] Optionally, the fluorescent layer is a mixture of phosphor and adhesive, wherein the phosphor is a yellow phosphor with an emission wavelength of 545-555 nm.

[0014] Optionally, the wire connecting two adjacent LED chips in the light-emitting unit is an M-shaped arc, and the wire connecting the LED chip and the bracket pin is a J-shaped arc.

[0015] Optionally, the spectral energy ratio of the violet light-emitting diode chip and the blue light-emitting diode chip is 4 to 5:1.

[0016] Optionally, the backlight module further includes a light guide plate and a diffuser plate;

[0017] The plurality of light-emitting units are located on the side of the light guide plate, and the diffuser plate is located on the light-emitting surface of the light guide plate.

[0018] Optionally, the backlight module further includes a diffuser plate; the plurality of light-emitting units are located between the diffuser plate and the circuit board.

[0019] On the other hand, a display panel is provided, the display panel comprising:

[0020] A backlight module and a liquid crystal panel; the liquid crystal panel is located on the light-emitting surface of the backlight module.

[0021] The beneficial effects of the technical solutions provided in this disclosure are:

[0022] In this embodiment, multiple light-emitting units are arranged on a circuit board as a backlight module. Each light-emitting unit includes a blue light-emitting diode chip and a violet light-emitting diode chip, and then emits white light after passing through a yellow phosphor layer. Compared with the related technology that uses a blue light-emitting diode chip and a phosphor layer to form white light, the above structure reduces the spectral energy of blue light in the emitted white light by adding a violet light-emitting diode chip. This effectively reduces the photochemical damage to the retina and the oxidative damage to macular cells caused by blue light, thus reducing harm to the user's vision and making the display device using this backlight module eye-protecting. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a backlight module provided in an embodiment of this disclosure;

[0025] Figure 2 This is a schematic diagram of the structure of the light-emitting unit provided in the embodiments of this disclosure;

[0026] Figure 3 This is a top view of the structure of a side-lit backlight module provided in an embodiment of this disclosure;

[0027] Figure 4 This is a top view of the structure of a direct-lit backlight module provided in an embodiment of this disclosure;

[0028] Figure 5 This is a schematic diagram of a display panel provided in an embodiment of this disclosure;

[0029] Figure 6 This is a flowchart of a backlight module manufacturing method provided in an embodiment of the present disclosure;

[0030] Figure 7 This is a flowchart of another backlight module fabrication method provided in this embodiment;

[0031] Figure 8 This is a structural schematic diagram of the backlight module manufacturing process provided in the embodiments of this disclosure;

[0032] Figure 9 This is a structural schematic diagram of the backlight module manufacturing process provided in the embodiments of this disclosure;

[0033] Figure 10 This is a spectral diagram of a light-emitting unit provided in an embodiment of this disclosure;

[0034] Figure 11 This is a spectrum of light emitted from a light-emitting unit after passing through a light guide plate, according to an embodiment of this disclosure.

[0035] Figure 12 This is a spectrum of light emitted from a light-emitting unit after passing through a light guide plate and a diffuser plate, according to an embodiment of this disclosure.

[0036] Figure 13 This is a spectrum diagram of light emitted from a light-emitting unit after passing through a light guide plate, a diffuser plate, and a liquid crystal panel, according to an embodiment of this disclosure.

[0037] Figure 14 It is a spectrum diagram of light emitted from a light-emitting unit after passing through a light guide plate, a diffuser plate, and a liquid crystal panel, provided by related technologies.

[0038] The attached figures are labeled as follows:

[0039] 101: Backplate; 102: Circuit board; 103: Light-emitting unit; 104: Light guide plate; 105: Diffuser plate; 106: Reflective layer;

[0040] 201: Support; 202: Support pin; 203: Light-emitting diode chip; 204: Wire; 205: Phosphor layer;

[0041] 2031: Blue LED chip; 2032: Purple LED chip;

[0042] 10: Backlight module; 20: LCD panel. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0044] In related technologies, LEDs with traditional structures use blue light chips with wavelengths of 447.5–455 nm, which are excited by phosphors to form white light. Blue light with wavelengths of 447.5–455 nm is quite harmful to the human eye.

[0045] Figure 1 This is a schematic diagram of the structure of a backlight module provided in an embodiment of this disclosure. See also... Figure 1 The backlight module includes a circuit board 102 and multiple light-emitting units 103, which are evenly spaced on the circuit board 102.

[0046] Figure 2 This is a schematic diagram of the structure of the light-emitting unit provided in an embodiment of this disclosure. See also... Figure 2 The light-emitting unit 103 includes a plurality of light-emitting diode chips 203 and a fluorescent layer 205 covering the plurality of light-emitting diode chips 203. The plurality of light-emitting diode chips 203 include blue light-emitting diode chips 2031 and violet light-emitting diode chips 2032, and the number of blue light-emitting diode chips 2031 is greater than or equal to the number of violet light-emitting diode chips 2032. The fluorescent layer 205 is a yellow fluorescent layer.

[0047] In this embodiment, multiple light-emitting units are arranged on a circuit board as a backlight module. Each light-emitting unit includes a blue light-emitting diode chip and a violet light-emitting diode chip, and then emits white light after passing through a yellow phosphor layer. Compared with the related technology that uses a blue light-emitting diode chip and a phosphor layer to form white light, the above structure reduces the spectral energy of blue light in the emitted white light by adding a violet light-emitting diode chip. This effectively reduces the photochemical damage to the retina and the oxidative damage to macular cells caused by blue light, thus reducing harm to the user's vision and making the display device using this backlight module eye-protecting.

[0048] In this embodiment of the disclosure, the circuit board 102 can be a flexible printed circuit (FPC).

[0049] In this embodiment of the disclosure, the light-emitting unit 103 further includes a bracket 201, a bracket pin 202, and a wire 204;

[0050] The light-emitting diode chip 203 is electrically connected to the bracket pin 202 on the bracket pin 202. The light-emitting diode chips 203 are electrically connected to each other through wires 204. The light-emitting diode chips 203 located on both sides are electrically connected to the bracket pin 202 through wires 204. The fluorescent layer 205 is located inside the bracket 201 and covers the light-emitting diode chips 203.

[0051] In this implementation, the light-emitting unit can set up multiple light-emitting diode chips together through a bracket, and can also protect the light-emitting diodes; it is electrically connected through pins and wires to form good electrical conductivity.

[0052] In this embodiment of the disclosure, the stent 201 may be made of composite polymer materials such as PPA, PCT, EMC and SMC.

[0053] For example, the material of the support 201 is PPA.

[0054] In this embodiment of the disclosure, the bracket 201 is shaped like a circular bowl.

[0055] In this embodiment of the disclosure, the diameter of the cup in the support 201 can be 0.5 to 0.7 mm.

[0056] For example, the diameter of the cup in the support 201 is 0.6 mm.

[0057] In this embodiment, the support pin 202 can be made of metal such as iron, copper, or steel, with a layer of nickel, silver, or gold plated on the surface.

[0058] For example, the support pin 202 can be made of copper metal with a layer of nickel plated on it.

[0059] In this embodiment, the blue light-emitting diode chip 2031 emits light at a wavelength of 457.5–465 nm. Using this wavelength, the blue light-emitting diode chip can excite phosphors with a violet light-emitting diode chip to form white light, thus weakening the spectral energy of the blue light and protecting the eyes. Furthermore, the 457.5–465 nm blue light reduces the harmful effects of blue light compared to the 447.5–455 nm wavelength in related technologies.

[0060] In this embodiment, the emission wavelength of the violet light-emitting diode chip 2032 can be 400–410 nm. Using a violet light-emitting diode chip with the aforementioned wavelength can reduce the spectral energy of the blue light emitted by the blue light-emitting diode chip, thus protecting the eyes.

[0061] In this embodiment, a light-emitting unit is obtained by combining the aforementioned violet light-emitting diode chip 2032 and blue light-emitting diode chip 2031. The energy ratio of the violet light spectrum to the blue light spectrum emitted by the light-emitting unit is 4 to 5:1. With the above ratio, most of the blue light in the backlight is absorbed and reduced to less than one-fifth of the spectrum, thus playing a role in protecting the eyes.

[0062] For example, the energy ratio of the violet light spectrum to the blue light spectrum emitted by the light-emitting unit is 5:1.

[0063] In this embodiment, the fluorescent layer 205 is a mixture of phosphor and adhesive, with the phosphor accounting for 2-15%. Using the above-mentioned proportion of phosphor ensures both normal backlight brightness and a purer color of emitted white light.

[0064] For example, the phosphor content is 8%.

[0065] In this embodiment, the phosphor can be a yellow phosphor with an emission wavelength of 545–555 nm. Using a yellow phosphor with the above wavelength can achieve white light output and reduce blue light spectral energy, thus meeting the requirements for eye protection.

[0066] In this embodiment of the disclosure, the conductor 204 can be a metal conductor such as silver, gold, copper or an alloy.

[0067] For example, conductor 204 is a copper metal conductor.

[0068] In this embodiment, the wire 204 connecting the two LED chips 203 is an M-shaped arc. The M-shaped arc can effectively improve the fracture resistance of the wire between the two LED chips and improve the yield of the LEDs.

[0069] In this embodiment, the wire 204 connecting the LED chip 203 and the bracket pin 202 is a J-shaped arc. The J-shaped arc can effectively improve the fracture resistance of the wire between the LED chip and the bracket pin, thereby improving the yield of the LED.

[0070] Optionally, the J-shaped arc is soldered to the bracket pin by placing the end of the wire to ground, thus increasing the soldering area between the J-shaped arc and the bracket pin. This ground-tight connection increases the contact area between the wire and the bracket pin, improving the stability of the LED.

[0071] For example, the diameter of the solder joint between the J-shaped arc and the bracket pin is 40 to 70 mm, such as 55 mm.

[0072] Figure 3 This is a top view of the structure of a side-lit backlight module provided in an embodiment of this disclosure. See also... Figure 3The backlight module may also include a light guide plate 104 and a diffuser plate 105;

[0073] In this configuration, multiple light-emitting units 103 are located on the side of the light guide plate 104, and a diffuser plate 105 is located on the light-emitting surface of the light guide plate 104.

[0074] By using the aforementioned side-entry structured light emitted from the side, the thickness of the backlight module can be reduced, enabling its application in tablets, mobile phones, learning machines, educational machines, displays, and other fields.

[0075] In this embodiment of the disclosure, the light guide plate 104 may be made of polymethyl methacrylate, polycarbonate or polystyrene.

[0076] For example, the light guide plate 104 can be a light guide plate made of polymethyl methacrylate.

[0077] Figure 4 This is a top view of the structure of a direct-lit backlight module provided in an embodiment of this disclosure. See also... Figure 4 The backlight module may also include a diffuser plate 105;

[0078] Multiple light-emitting units 103 are located between the diffuser plate 105 and the circuit board 102.

[0079] By adopting the above-mentioned direct-lit structure, since there is no light guide plate, the energy loss during the light refraction process is reduced.

[0080] In this embodiment, the diffuser plate 105 may be made of materials such as silicone, epoxy resin, or acrylic.

[0081] For example, the diffuser plate 105 is made of silicone.

[0082] See you again Figure 4 The backlight module may also include a backplate 101 and a reflective layer 106, with a circuit board 102 on the backplate 101 and the reflective layer covering the backplate 101 and the circuit board 102.

[0083] In this embodiment of the disclosure, the back plate 101 can be a metal back plate, such as a metal back plate that can be stamped by a punching die.

[0084] Figure 5 This is a schematic diagram of a display panel provided in an embodiment of this disclosure. See also... Figure 5 The display panel includes a backlight module 10 and a liquid crystal panel 20; the liquid crystal panel 20 is located on the light-emitting surface of the backlight module 10. The backlight module 10 can be... Figures 1 to 4 The backlight module 10 shown in any of the images.

[0085] Figure 6This is a flowchart illustrating a backlight module fabrication method according to an embodiment of this disclosure. See also... Figure 6 The method includes the following steps:

[0086] S11. Make multiple light-emitting units.

[0087] S12. The plurality of light-emitting units are mounted on a circuit board. The plurality of light-emitting units include a plurality of light-emitting diode chips and a fluorescent layer covering the plurality of light-emitting diode chips. The plurality of light-emitting diode chips include blue light-emitting diode chips and violet light-emitting diode chips, and the number of blue light-emitting diode chips is greater than or equal to the number of violet light-emitting diode chips. The fluorescent layer is a yellow fluorescent layer.

[0088] In this embodiment, multiple light-emitting units are arranged on a circuit board as a backlight module. Each light-emitting unit includes a blue light-emitting diode chip and a violet light-emitting diode chip, and then emits white light after passing through a yellow phosphor layer. Compared with the related technology that uses a blue light-emitting diode chip and a phosphor layer to form white light, the above structure reduces the spectral energy of blue light in the emitted white light by adding a violet light-emitting diode chip. This effectively reduces the photochemical damage to the retina and the oxidative damage to macular cells caused by blue light, thus reducing harm to the user's vision and making the display device using this backlight module eye-protecting.

[0089] Figure 7 This is a flowchart of another backlight module fabrication method provided in this disclosure. See also... Figure 7 The method includes the following steps:

[0090] S21, Provide a bracket.

[0091] In this embodiment of the disclosure, the stent may be made of composite polymer materials such as PPA, PCT, EMC and SMC.

[0092] For example, the material of the support is PPA.

[0093] In this embodiment of the disclosure, the support is shaped like a circular bowl.

[0094] In this embodiment of the disclosure, the diameter of the support bowl can be 0.5 to 0.7 mm.

[0095] For example, the diameter of the support bowl is 0.6 mm.

[0096] In this embodiment of the disclosure, the support is obtained by grooving the carrier material with a laser to obtain a circular bowl-shaped structure.

[0097] S22. Fabricate bracket pins on the bracket.

[0098] In this embodiment, the support pins can be made of metals such as iron, copper, and steel, with a layer of nickel, silver, or gold plated on the surface.

[0099] For example, the support pins can be made of copper metal with a layer of nickel plated on the surface.

[0100] S23. Install the LED chip, and electrically connect the LED chip to the bracket pins.

[0101] Figure 8 This is a structural schematic diagram illustrating the manufacturing process of the backlight module provided in this embodiment. Figure 8 As shown. The light-emitting diode chip 203 includes a blue light-emitting diode chip 2031 and a purple light-emitting diode chip 2032. The light-emitting diode chip 203 is electrically connected to the bracket pin 202 on the bracket pin 202.

[0102] In this embodiment, the emission wavelength of the blue light-emitting diode chip can be 457.5–465 nm. Using a blue light-emitting diode chip with this wavelength can excite phosphors with a violet light-emitting diode chip to form white light, thus weakening the spectral energy of the blue light and providing eye protection. Furthermore, the 457.5–465 nm blue light reduces the harmful effects of blue light compared to the 447.5–455 nm wavelength in related technologies.

[0103] In this embodiment, the emission wavelength of the violet light-emitting diode chip can be 400–410 nm. Using a violet light-emitting diode chip with the above wavelength can reduce the spectral energy of the blue light emitted by the blue light-emitting diode chip, thus protecting the eyes.

[0104] In this embodiment, a light-emitting unit is obtained by combining the aforementioned violet light-emitting diode chip and blue light-emitting diode chip. The energy ratio of the violet light spectrum to the blue light spectrum emitted by the light-emitting unit is 4 to 5:1. With the backlight using the above ratio, most of the blue light is absorbed and reduced to less than one-fifth of the spectrum after passing through the light guide plate, diffuser plate, and liquid crystal screen, thus playing a role in eye protection.

[0105] For example, the energy ratio of the violet light spectrum to the blue light spectrum emitted by the light-emitting unit is 5:1.

[0106] For example, the light-emitting diode chip is fixed to the bracket pin by a eutectic method using spot flux.

[0107] S24. Make wires. The LED chips are electrically connected to each other through wires. The LED chips on both sides are electrically connected to the bracket pins through wires.

[0108] Figure 9 This is a structural schematic diagram illustrating the manufacturing process of the backlight module provided in this embodiment. Figure 9 As shown. The light-emitting diode chips 203 located on both sides are electrically connected to the bracket pins 202 via wires 204; the phosphor layer 205 is located inside the bracket 201 and covers the light-emitting diode chips 203.

[0109] In this embodiment of the disclosure, a wire bonding machine is used to bond metal wires to chip electrodes and a substrate under the action of temperature, pressure, and ultrasound.

[0110] In this embodiment of the disclosure, the conductor can be a metal wire such as silver, gold, copper or an alloy.

[0111] For example, the conductor is a copper wire.

[0112] In this embodiment, the wire connecting the two LED chips is an M-shaped arc. The M-shaped arc can effectively improve the fracture resistance of the wire between the two LED chips, thereby improving the yield of the LEDs.

[0113] In this embodiment, the wire connecting the LED chip and the bracket pin is a J-shaped arc. The J-shaped arc can effectively improve the fracture resistance of the wires connecting the LED chip and the bracket pin, thereby improving the yield of the LED.

[0114] Optionally, the J-shaped arc is soldered to the bracket pin by placing the end of the wire to ground, thus increasing the soldering area between the J-shaped arc and the bracket pin. This ground-tight connection increases the contact area between the wire and the bracket pin, improving the stability of the LED.

[0115] For example, the diameter of the solder joint between the J-shaped arc and the bracket pin is 40 to 70 mm, such as 55 mm.

[0116] S25. Fabricate a fluorescent layer, which is located inside the support and covers the light-emitting diode chip.

[0117] In this embodiment, the fluorescent layer is a mixture of phosphor and adhesive, with the phosphor accounting for 2-15%. Using the above-mentioned proportion of phosphor ensures both normal backlight brightness and a purer color of emitted white light.

[0118] For example, the phosphor content is 8%.

[0119] In this embodiment, the phosphor can be a yellow phosphor with an emission wavelength of 545–555 nm. Using a yellow phosphor with the above wavelength can achieve white light output and reduce blue light spectral energy, thus meeting the requirements for eye protection.

[0120] S26. Connect the light-emitting unit to the circuit board to form an electrical path.

[0121] For example, step S26 may include:

[0122] The first step is to place an appropriate amount of conductive material on the pins of the circuit board.

[0123] In the embodiments disclosed herein, the conductive material may be silver paste, solder paste, etc.

[0124] For example, the conductive material can be solder paste.

[0125] In this embodiment of the disclosure, an appropriate amount of conductive material is placed on the mounting position of the circuit board by means of printing or dispensing / spraying the valve body.

[0126] For example, an appropriate amount of conductive material is placed on the mounting position of the circuit board by printing.

[0127] The second step involves high-temperature curing to form an electrical pathway.

[0128] In this embodiment of the disclosure, the light-emitting unit is fixed to the mounting position on the circuit board by a pick-and-place machine or a die bonder.

[0129] For example, the light-emitting unit is fixed to the mounting position on the circuit board by a pick-and-place machine.

[0130] In other embodiments, the light-emitting unit can also be formed on a circuit board using a chip-on-board (COP) method.

[0131] The third step is to perform reflow soldering.

[0132] In this embodiment of the disclosure, the mounted light-emitting unit is fixed to the circuit board by soldering with solder paste.

[0133] S27. Assemble the light guide plate and diffuser plate.

[0134] Multiple light-emitting units are located on the side of the light guide plate, and a diffuser plate is located on the light-emitting surface of the light guide plate.

[0135] In this embodiment of the disclosure, the light guide plate may be made of polymethyl methacrylate, polycarbonate or polystyrene.

[0136] For example, the light guide plate can be a light guide plate made of polymethyl methacrylate.

[0137] In this embodiment, the diffuser plate can be made of silicone, epoxy resin, acrylic, or other materials. Silicone diffuser plates have excellent weather resistance and flexibility; epoxy resin diffuser plates have good mechanical strength and electrical insulation; acrylic diffuser plates have high light transmittance and are easy to process, and can be adjusted according to the uniformity of light emission.

[0138] For example, the diffuser plate is made of silicone.

[0139] Figure 10 This is a spectral diagram of a light-emitting unit provided in an embodiment of this disclosure; Figure 11 This is a spectrum of light emitted from a light-emitting unit after passing through a light guide plate, according to an embodiment of this disclosure. Figure 12 This is a spectrum of light emitted from a light-emitting unit after passing through a light guide plate and a diffuser plate, according to an embodiment of this disclosure. Figure 13 This is a spectrum diagram of light emitted from a light-emitting unit after passing through a light guide plate, a diffuser plate, and a liquid crystal panel, according to an embodiment of this disclosure. Figure 14 It is a spectrum diagram of light emitted from a light-emitting unit after passing through a light guide plate, a diffuser plate, and a liquid crystal panel, provided by related technologies.

[0140] refer to Figures 10-14 The horizontal axis represents wavelength in nanometers; the vertical axis represents spectral efficiency. It is evident that the backlight module provided in this embodiment, compared to backlight modules provided by related technologies, exhibits a significant decrease in blue light spectral efficiency after passing through the light guide plate, diffuser plate, and liquid crystal panel. This weakens the spectral energy of blue light, effectively reducing photochemical damage to the retina and oxidative damage to macular cells caused by blue light, thus minimizing harm to the user's vision.

[0141] This backlight module provides eye protection for display devices and can be used in tablets, laptops, monitors, and televisions.

[0142] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A backlight module, characterized in that, The backlight module includes: a circuit board (102) and a plurality of light-emitting units (103), wherein the plurality of light-emitting units (103) are evenly spaced on the circuit board (102); The light-emitting unit (103) includes a plurality of light-emitting diode chips (203) and a fluorescent layer (205) covering the plurality of light-emitting diode chips (203). The plurality of light-emitting diode chips (203) includes blue light-emitting diode chips (2031) and violet light-emitting diode chips (2032), and the number of blue light-emitting diode chips (2031) is greater than or equal to the number of violet light-emitting diode chips (2032). The fluorescent layer (205) is a yellow fluorescent layer. The fluorescent layer (205) is a mixture of phosphor and adhesive, wherein the phosphor is a yellow phosphor with an emission wavelength of 545~555nm, and the proportion of the phosphor is 2~15%. The spectral energy ratio of the violet light-emitting diode chip (2032) and the blue light-emitting diode chip (2031) is 4~5:1; The blue light-emitting diode chip (2031) has an emission wavelength of 457.5~465nm; The light-emitting unit (103) also includes a bracket (201), bracket pins (202), and wires (204). The light-emitting diode (LED) chip (203) is electrically connected to the bracket pin (202) on the bracket pin (202), and the LED chips (203) are electrically connected to each other through the wire (204). The LED chips (203) located on both sides are electrically connected to the bracket pin (202) through the wire (204); the fluorescent layer (205) is located inside the bracket (201) and covers the LED chips (203). The wire (204) connecting two adjacent light-emitting diode chips (203) in the light-emitting unit (103) is an M-shaped arc, and the wire (204) connecting the light-emitting diode chip (203) and the bracket pin (202) is a J-shaped arc; The J-shaped arc is welded to the bracket pin (202) by means of the end of the line touching the ground; the diameter of the welding point between the J-shaped arc and the bracket pin (202) is 40~70mm.

2. The backlight module according to claim 1, characterized in that, The emission wavelength of the violet light-emitting diode chip (2032) is 400~410nm.

3. The backlight module according to claim 1, characterized in that, The backlight module also includes a light guide plate (104) and a diffuser plate (105). The plurality of light-emitting units (103) are located on the side of the light guide plate (104), and the diffuser plate (105) is located on the light-emitting surface of the light guide plate (104).

4. The backlight module according to claim 1, characterized in that, The backlight module also includes a diffuser plate (105). The plurality of light-emitting units (103) are located between the diffuser plate (105) and the circuit board (102).

5. A display panel, characterized in that, The display panel includes a backlight module (10) and a liquid crystal panel (20); the liquid crystal panel (20) is located on the light-emitting surface of the backlight module (10); The backlight module (10) is the backlight module according to any one of claims 1 to 4.

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