LED device and LED packaging method

Abstract

The invention is suitable for the technical field of LED packaging, and provides an LED device and an LED packaging method.The LED device comprises a substrate, an LED chip, a box dam, a light window and a sealing element, the box dam is provided with a first end, a second end and a side wall, the side wall defines a cavity, the box dam is installed on the substrate through the first end, the LED chip is arranged in the cavity and packaged on the substrate, and the light window is arranged in the cavity. The light window is connected to the second end to cover the cavity, the sealing piece is arranged between the light window and the second end, the box dam is further provided with an installation space, and the installation space is configured to horizontally extend from the inner end and the outer end of the second end of the box dam to the two sides to an area defined when the included angle alpha between the installation space and the connecting line of the inner end and the outer end of the first end is smaller than or equal to 70 degrees. The light window is fixedly connected with the box dam through the buckle structure, and after the light window is fixedly connected to the box dam, the buckle structure is located in the installation space. According to the invention, the defects of semi-inorganic and full-inorganic packaging processes in the market are overcome, the air tightness of the product can be ensured, and the packaging efficiency and the service life of the LED device are greatly improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED packaging, and in particular relates to an LED device and an LED packaging method. Background Art

[0002] Light-emitting diode (LED) is a semiconductor light source with high light efficiency and long life. In order to expand the application range of LED, ultraviolet light-emitting diode (UV-LED) lamp came into being. Today, UV-LED lamps have begun to be used in biomedicine, anti-counterfeiting identification, purification and other fields, and the technology of UV-LED lamps is still in continuous development.

[0003] The packaging of UV-LED is usually composed of chip + ceramic substrate + glass lens, among which the tightness of the glass lens and the ceramic substrate is the key to ensure the airtightness of the product. The airtightness of the product is a major factor affecting the life of the product. If the airtightness of the product is not good, the water vapor in the environment will enter the product during use, thereby reducing the service life of the LED and even causing the LED to fail. At present, the mainstream technology for combining glass lenses and ceramic substrates on the market is to use organic glue to bond the glass lens to the ceramic substrate, commonly known as semi-inorganic packaging process; or, after metal is inlaid around the glass lens or the bottom is metallized, the metal is welded to the ceramic substrate, commonly known as full inorganic packaging process.

[0004] The semi-inorganic and fully inorganic packaging processes currently on the market have the following defects:

[0005] 1. The defects of semi-inorganic packaging on the market are:

[0006] ①. During the use of the product, ultraviolet light will irradiate the glue. Organic glue will age and fail under UV irradiation for a long time, thus causing the glass lens to fall off;

[0007] ②. The bonding of glass requires coating with glue first, and after covering with glass, the glue needs to be baked and cured at high temperature. Not only are the steps cumbersome, but the high temperature will also cause secondary damage to the chip (the primary damage is that the chip needs to experience high temperature to weld the chip to the substrate when it is solidified).

[0008] 2. The defects of all-inorganic packaging on the market are:

[0009] ①. There are usually two types of fully inorganic packaging. One is to metallize the bottom of the glass lens and then use reflow soldering to solder the glass lens to the ceramic substrate. The disadvantage of this fully inorganic packaging is that the entire product is heated during reflow soldering, and the high temperature will also cause secondary damage to the chip.

[0010] ② Another method is to use a TO-type metal tube shell light window and weld the tube shell light window to the ceramic substrate through laser welding. This is the mainstream all-inorganic packaging form on the market. Although this all-inorganic packaging form is locally heated, the local temperature will not cause secondary damage to the chip, but the disadvantages are: the efficiency of laser welding is slow, the steps are cumbersome, and the cost is high. Summary of the invention

[0011] The present invention aims to solve at least one of the above-mentioned technical problems and provides an LED device and an LED packaging method, which overcome the defects of semi-inorganic and fully inorganic packaging processes on the market, and can ensure the airtightness of the product, thereby greatly improving the packaging efficiency and life of the LED device.

[0012] The technical solution of the present invention is: an LED device, comprising a substrate, an LED chip, a dam, a light window and a sealing member, the dam having a first end and a second end opposite to each other and a side wall extending between the first end and the second end, the side wall defining a chamber, the dam being mounted on the substrate through the first end, the LED chip being arranged in the chamber and encapsulated on the substrate, the light window being connected to the second end to cover the chamber, the sealing member being arranged between the light window and the second end, the dam further having an installation space, the installation space being defined as: an area extending horizontally from the inner edge and the outer edge of the second end of the dam to both sides respectively, and enclosed within a range where the angle α formed by the line connecting the inner edge and the outer edge of the first end of the dam does not exceed 70°, the light window being connected and fixed to the dam through a snap-fit ​​structure, wherein when the light window is connected and fixed to the dam, the snap-fit ​​structure is located in the installation space.

[0013] Optionally, the buckle structure includes at least one group of relatively arranged buckle components, the buckle components include a buckle portion and a slot portion, the light window is provided with the buckle portion, and the dam is provided with the slot portion.

[0014] Optionally, the slot portion is located on the side wall and is recessed relative to a surface on the side wall.

[0015] Optionally, the buckle portion includes an extension section, a connecting section and a barb, the extension section extends along a first direction and is connected to the light window, the first direction is parallel to the light window, the connecting section extends along a second direction, the second direction is the direction of the second end toward the first end, and one end of the connecting section is connected to the extension section, and the other end is connected to the barb, and the barb can be snapped into the slot portion.

[0016] Optionally, the side wall is provided with a guide groove extending along the second direction, the guide groove passes through the second end and is connected with the slot portion, wherein the connecting section is penetrated by the guide groove so that the barb is engaged with the slot portion.

[0017] Optionally, the inner side of the second end is concave to form a step structure, the light window is installed on the step structure, and the slot portion is located below the step structure.

[0018] Optionally, the step structure has a step surface, which is lower than the end surface of the second end, and the side wall is provided with a guide groove extending along the second direction, and the guide groove passes through the step surface and is connected to the slot portion, wherein the connecting section is penetrated by the guide groove so that the barb is engaged with the slot portion.

[0019] Optionally, the number of the barbs is two, the two barbs are arranged relative to the connecting section, and the barbs are elastically deformed when pressed.

[0020] Optionally, the seal is a flexible member, and has a minimum thickness H1 after being deformed by pressure, and the first thickness H1 is defined as: H1≤H2-H3-H4, wherein H2 is the length of the connecting section, H3 is the length of the barb, and H4 is the distance from the slot to the step surface of the step structure.

[0021] The present invention also provides an LED packaging method for packaging the above-mentioned LED device, comprising the following steps:

[0022] preparing a substrate;

[0023] Encapsulating LED chips on the substrate;

[0024] A dam is prepared, wherein the dam has a first end and a second end opposite to each other and a side wall extending from the first end and the second end, wherein the side wall defines a cavity, wherein the dam is mounted on the substrate through the first end, and the LED chip is arranged in the cavity, and the dam further has an installation space, wherein the installation space is defined as an area extending horizontally from the inner edge and the outer edge of the second end of the dam to both sides respectively, and within a range where an angle α formed by a line connecting the inner edge and the outer edge of the first end of the dam does not exceed 70°;

[0025] A sealing member is provided on the second end, a light window is placed on the sealing member, and a force is applied to the light window from the second end toward the first end, so that the light window is connected and fixed to the dam through a snap-fit ​​structure, wherein after the light window is connected and fixed to the dam, the snap-fit ​​structure is located in the installation space.

[0026] Optionally, preparing a substrate comprises:

[0027] A nickel layer and a gold layer are plated in sequence on the surface of a ceramic substrate to obtain the substrate, wherein the thickness of the nickel layer is greater than 3 um, and the thickness of the gold layer is greater than 0.05 um.

[0028] Optionally, packaging an LED chip on a substrate includes:

[0029] The LED chip is a flip chip, which is soldered to the surface of the substrate through a eutectic furnace. During the soldering process, at least one temperature zone of the eutectic furnace is maintained between 280°C and 340°C.

[0030] Optionally, during the welding process, the eutectic furnace is kept in a vacuum state, or an inert gas is filled into the eutectic furnace.

[0031] Optionally, preparing a substrate comprises:

[0032] A nickel layer, a palladium layer and a gold layer are plated in sequence on the surface of a ceramic substrate to obtain a substrate, wherein the thickness of the nickel layer is greater than 3um, the thickness of the palladium layer is greater than 0.05um, and the thickness of the gold layer is greater than 0.05um.

[0033] Optionally, packaging an LED chip on a substrate includes:

[0034] The LED chip is selected as an upright chip or a vertical chip, and a bonding glue is set on the surface of the substrate. The upright chip or the vertical chip is then placed on the bonding glue and baked to solidify the bonding glue, so that the upright chip or the vertical chip is combined with the substrate, and then the electrodes of the upright chip or the vertical chip are welded to the circuits of the substrate by welding equipment to condense.

[0035] Optionally, the buckle structure includes at least one group of relatively arranged buckle components, the buckle components include a buckle portion and a slot portion, the light window is provided with the buckle portion, and the dam is provided with the slot portion.

[0036] Optionally, the slot portion is located on the side wall and is recessed relative to a surface on the side wall.

[0037] Optionally, the buckle portion includes an extension section, a connecting section and a barb, the extension section extends along a first direction and is connected to the light window, the first direction is parallel to the light window, the connecting section extends along a second direction, the second direction is the direction of the second end toward the first end, and one end of the connecting section is connected to the extension section, and the other end is connected to the barb, and the barb can be snapped into the slot portion.

[0038] Optionally, the side wall is provided with a guide groove extending along the second direction, the guide groove passes through the second end and is connected with the slot portion, wherein the connecting section is penetrated by the guide groove so that the barb is engaged with the slot portion.

[0039] Optionally, the inner side of the second end is concave to form a step structure, the light window is installed on the step structure, and the slot portion is located below the step structure.

[0040] Optionally, the step structure has a step surface, which is lower than the end surface of the second end, and the side wall is provided with a guide groove extending along the second direction, and the guide groove passes through the step surface and is connected to the slot portion, wherein the connecting section is penetrated by the guide groove so that the barb is engaged with the slot portion.

[0041] Optionally, the number of the barbs is two, the two barbs are arranged relative to the connecting section, and the barbs are elastically deformed when pressed.

[0042] Optionally, the seal is a flexible member, and has a minimum thickness H1 after being deformed by pressure, and the first thickness H1 is defined as: H1≤H2-H3-H4, wherein H2 is the length of the connecting section, H3 is the length of the barb, and H4 is the distance from the slot to the step surface of the step structure.

[0043] The LED device and LED packaging method provided by the present invention use a snap-fit ​​structure to achieve the connection and fixation between the light window and the dam by mechanical snap-fitting; and the airtightness of the LED device packaging is ensured by a seal provided between the light window and the second end of the dam; at the same time, after the light window is connected and fixed to the dam, the snap-fit ​​structure is located in the installation space to reduce the influence of the snap-fit ​​structure on the light path of the LED chip and ensure the light-emitting effect of the LED device. Compared with the semi-inorganic packaging and full-inorganic packaging methods in the prior art, the present invention eliminates the process of bonding or welding, simplifies the packaging process, and makes the packaging process more concise and efficient; at the same time, since the LED device of the present invention will not cause secondary high-temperature damage to the LED chip during the packaging process, the life of the LED device is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0045] Figure 1is a cross-sectional view of an LED device provided by an embodiment of the present invention;

[0046] Figure 2 yes Figure 1 A cross-sectional view after omitting the light window and the buckle portion;

[0047] Figure 3 It is a partial structural schematic diagram of the positional relationship between the buckle portion and the slot portion in the LED device provided by the embodiment of the present invention;

[0048] Figure 4 It is a partial structural schematic diagram of the positional relationship between the buckle portion and the slot portion when a slot is provided on the side wall of the LED device provided by an embodiment of the present invention;

[0049] Figure 5 is a schematic structural diagram of a buckle portion in an LED device provided by an embodiment of the present invention;

[0050] Figure 6 is another structural schematic diagram of a buckle portion in an LED device provided by an embodiment of the present invention;

[0051] Figure 7 is another structural schematic diagram of a slot portion in an LED device provided by an embodiment of the present invention;

[0052] Figure 8 This is another structural schematic diagram of the slot portion in the LED device provided by an embodiment of the present invention.

[0053] Fig. 9 It is a schematic diagram of packaging the light window of an LED device provided by an embodiment of the present invention to a surrounding dam;

[0054] Fig.10 is a cross-sectional view of an LED device provided by an embodiment of the present invention when a guide groove is provided on the side wall;

[0055] Fig.11 yes Fig.10 Cross-sectional view with the light window and snap-fit ​​portion omitted.

[0056] Fig.12 is another cross-sectional view of an LED device provided by an embodiment of the present invention when a guide groove is provided on the side wall;

[0057] Fig.13 is another cross-sectional view of an LED device provided by an embodiment of the present invention when a guide groove is provided on the side wall;

[0058] Fig.14 This is a schematic diagram of the installation space in the LED device provided in an embodiment of the present invention.

[0059] 1-substrate, 2-LED chip, 3-dam, 31-first end, 32-second end, 33-side wall, 34-chamber, 4-light window, 5-seal, 6-clamp assembly, 61-clamp portion, 611-extension section, 612-connecting section, 613-hook, 62-slot portion, 7-step structure, 71-step surface, 72-chamfer, 8-solder, 9-auxiliary part, 10-guide groove, 11-first circuit, 12-second circuit, 13-conductive hole, 14-installation space. DETAILED DESCRIPTION

[0060] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0061] It should be noted that the terms "setting" and "connecting" should be understood in a broad sense. For example, it can be directly setting, installing, and connecting, or it can be indirectly setting and connecting through a central component or a central structure.

[0062] In addition, in the embodiments of the present invention, if there are directions or positional relationships indicated by "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., they are based on the directions or positional relationships shown in the drawings or the conventional placement state or use state, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure, feature, device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0063] The various specific technical features and embodiments described in the specific implementation methods can be combined in any suitable manner unless there is any contradiction. For example, different implementation methods can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features / embodiments in the present invention will not be described separately.

[0064] like Figure 1 , Figures 10 to 13As shown, the LED device of the present invention comprises a substrate 1, an LED chip 2, a dam 3, a light window 4 and a sealing member 5, wherein the light window 4 is defined as being able to allow light emitted by the LED chip 2 to pass through, the dam 3 has a first end 31 and a second end 32 opposite to each other, and a side wall 33 extending between the first end 31 and the second end 32, the side wall 33 defines a chamber 34, specifically, the side wall 33 surrounds a chamber 34, the dam 3 is mounted on the substrate 1 through the first end 31, the LED chip 2 is disposed in the chamber 34 and packaged on the substrate 1, the light window 4 is covered at the second end 32, the substrate 1 and the light window 4 surround the chamber 34 to form a sealed cavity, the sealing member 5 is disposed between the light window 4 and the second end 32, and the dam 3 also has an installation space 14 (such as Fig.14 As shown), the installation space 14 is defined as: an area extending horizontally from the inner edge and the outer edge of the second end 32 of the dam 3 to both sides respectively, and within a range where the angle α formed by the line connecting the inner edge and the outer edge of the first end 31 of the dam 3 does not exceed 70°, and the light window 4 is connected and fixed to the dam 3 by a snap-fit ​​structure, wherein when the light window 4 is connected and fixed to the dam 3, the snap-fit ​​structure 6 is located in the installation space 14.

[0065] The LED device provided by the present invention uses a snap-fit ​​structure to achieve the connection and fixation between the light window 4 and the dam 3 by adopting a mechanical snap-fit ​​method, eliminating the process of bonding or welding required in the prior art, making the package more concise and efficient, and effectively improving the packaging efficiency; and the airtightness of the LED device package is ensured by the seal 5 provided between the light window 4 and the second end 32 of the dam 3. At the same time, after the light window 4 is connected and fixed to the dam 3, the snap-fit ​​structure is located in the installation space 14. This design reduces the influence of the snap-fit ​​structure on the light-emitting path of the LED chip 2, and ensures the light-emitting effect of the LED device. The LED device package provided by the present invention is simple, efficient, and reliable.

[0066] Specifically, see Fig.14 The inner edge of the first end 31 refers to the endpoint A where the first end 31 intersects with the inner surface of the side wall 33, the outer edge of the first end 31 refers to the endpoint B where the first end 31 intersects with the outer surface of the side wall 33, the inner edge of the second end 32 refers to the endpoint C where the second end 32 intersects with the inner surface of the side wall 33, and the outer edge of the second end 32 refers to the endpoint D where the second end 32 intersects with the outer surface of the side wall 33. Endpoint C is obtained by horizontally extending a distance S inward from endpoint C. ′ , endpoint C ′ Connect the line segment L1 with the endpoint A, and extend the line segment S horizontally from the endpoint D to the outside to get the endpoint D. ′ , endpoint D ′ The line segment L2 is connected to the endpoint B, and the angle α between the line segment L1 and the line segment L2 is ≤ 70°. At this time, the installation space 14 refers to the line segment L2 formed by the endpoints A, B, and D.′ and endpoint C ′ When the light window 4 is connected and fixed to the dam 3, the buckle portion 61 and the slot portion 62 are both located between the end point A, the end point B, and the end point D. ′ and endpoint C ′ within the enclosed area.

[0067] In some embodiments, the installation space 14 is defined as: an area extending horizontally from the inner edge and the outer edge of the second end 32 of the dam 3 to both sides, and enclosed within a range where the angle α formed by the line connecting the inner edge and the outer edge of the first end 31 of the dam 3 does not exceed 40°, that is, the angle α between the line segment L1 and the line segment L2 is ≤40°.

[0068] Specifically, Figure 1 , Figures 11 to 13 As shown, the substrate 1 of the present invention is a ceramic substrate, and a first circuit 11 is provided on the front of the ceramic substrate for connecting with the LED chip 2. Preferably, a second circuit 12 may be provided on the back of the substrate 1 for electrically connecting with the PCB board. The substrate 1 is provided with a conductive hole 13 running through the front and back, and the first circuit 11 and the second circuit 12 can be conductively connected through the conductive hole 13, thereby realizing the connection between the LED chip 2, the first circuit 11 and the second circuit 12. In a specific application, the first circuit 11 and the second circuit 12 set on the ceramic substrate can be realized by a DPC (direct copper plating technology-Direct Plating copper) process.

[0069] In some embodiments, when observing the dam 3 in a direction perpendicular to the light window 4, the cross section of the chamber 34 defined by the side wall 33 of the dam 3 may be one of square, rectangular or circular. In this embodiment, the cross section of the chamber 34 defined by the side wall 33 of the dam 3 is rectangular, and the dam 3 is a metal part. Specifically, the dam 3 is made of copper, that is, a copper dam, and the first end 31 of the copper dam is welded to the substrate 1 to achieve the connection and fixation between the dam 3 and the substrate 1, or the copper dam and the substrate 1 can be integrally formed by the DPC process. Specifically, the seal 5 is annular, and the shape of the seal 5 is the same as the cross-sectional shape of the dam 3.

[0070] In some embodiments, the buckle structure may include at least one group of relatively arranged buckle components 6, and the stability of the connection between the light window 4 and the dam 3 is ensured by at least two buckle components 6. The buckle components 6 can be arranged into two groups, three groups, four groups, etc. as needed, and the two buckle components 6 in each group of buckle components 6 are relatively spaced in a direction parallel to the plane where the light window 4 is located. The line connecting the two buckle components 6 in each group of buckle components 6 is defined as a first line segment, and the relationship between two adjacent first line segments is: parallel to each other or intersecting. In the present invention, when the number of buckle components 6 exceeds two groups, the arrangement of the multiple first line segments is not limited, as long as the connection strength between the light window 4 and the dam 3 can be ensured.

[0071] In some embodiments, Figure 1 , Figure 3 , Figure 4 , Figures 10 to 13 As shown, the snap assembly 6 may include a snap portion 61 and a slot portion 62, wherein the light window 4 may be provided with the snap portion 61, and the dam 3 may be provided with the slot portion 62, and the light window 4 is connected and fixed to the dam 3 by snapping together the snap portion 61 and the slot portion 62.

[0072] Optionally, the relationship among the dam 3, the light window 4, the buckle portion 61 and the slot portion 62 includes at least the following two structures:

[0073] The first structure: Figure 3 As shown in FIG. 2 b, the slot portion 62 is disposed on the inner side of the side wall 33, and the buckle portion 61 is coupled to the light window 4. When the light window 4 is covered on the second end 32 of the dam 3, the buckle portion 61 extends into the chamber 34 and is connected with the slot portion 62 by buckling.

[0074] The second structure, such as Figure 3 As shown in a, the slot portion 62 is disposed on the outer side of the side wall 33, and the buckle portion 61 is coupled to the light window 4. When the light window 4 is covered on the second end 32 of the dam 3, the buckle portion 61 is located outside the chamber 34 and is connected to the slot portion 62.

[0075] In some embodiments, the slot portion 611 is located on the side wall 33 and is recessed relative to the surface of the side wall 33, for example. Figure 3 As shown in FIG. 1 , the slot portion 62 is located on the side wall 33 and may be recessed relative to the outer surface of the side wall 33 toward the inner surface of the side wall 33, or as shown in FIG. Figure 3 As shown in FIG. 2( b ), the slot portion 62 is located on the side wall 33 and may be recessed relative to the inner surface of the side wall 33 toward the outer surface of the side wall 33. The depth of the recess is less than the distance between the inner surface and the outer surface of the side wall 33. By arranging the slot portion 62 on the surface of the side wall 33, processing is facilitated.

[0076] In some embodiments, Figure 5As shown, the buckle portion 61 includes an extension section 611, a connecting section 612 and a barb 613. The extension section 611 extends along a first direction and is connected and fixed to the light window 4. The first direction is parallel to the light window 4. One end of the connecting section 612 is connected to the extension section 611 and extends along a second direction. The second direction is the direction from the second end 32 to the first end 31. The other end of the connecting section 612 is connected to the barb 613. The barb 613 faces the slot portion 62, so that the barb 613 can be snapped into the slot portion 62. By providing the extension section 611 extending along the first direction, the contact area between the buckle portion 61 and the light window 4 is increased, thereby ensuring the connection strength between the buckle portion 61 and the light window 4.

[0077] Specifically, Figure 5 As shown, the connecting section 612 can be connected to the end of the extending section 611. At this time, the extending section 611 and the connecting section 612 are connected to form an L-shape.

[0078] Optionally, the extension section 611 may be connected and fixed to the light window 4 by bonding, welding, locking connection, etc.

[0079] Optionally, the light window 4 is a glass piece, the buckle part 61 is a metal piece, and the buckle part 61 is made by a stamping process. For example, the buckle part 61 is preferably made of Kovar alloy, and a solder 8 is provided between the buckle part 61 and the light window 4, see Figure 1 The buckle portion 61 and the light window 4 are welded together by brazing, and the extension section 611 is located above the step surface 71, and the extension section 611 serves as a welding area for the buckle portion 61 to be combined with the light window 4. Kovar alloy can achieve a tight mechanical connection between the two materials within a certain temperature range, so that it can be well combined with the light window 4. In the present invention, the specific material of the light window 4 is not limited, as long as it can achieve the light transmission effect.

[0080] Alternatively, if Figure 5 As shown, the included angle β between the extension section 611 and the connection section 612 is less than 90°, that is, the end of the connection section 612 away from the extension section 611 is inclined toward the side wall 33, so that when the barb 613 is engaged with the slot portion 62, it will not easily fall out of the slot portion 62, further ensuring the reliability of the LED device packaging. In practical applications, the included angle β between the extension section 611 and the connection section 612 can also be 90°.

[0081] Alternatively, if Figure 2 and Fig. 9 As shown, the inner edge of the step surface 71 may be provided with a chamfer 72. Since the angle β between the extension section 611 and the connection section 612 is less than 90°, by providing the chamfer 72, when the external force F pushes the light window 4 close to the second end 32, the chamfer 72 can guide the barb 613, so that the barb 613 can smoothly enter the chamber 34.

[0082] In some embodiments, Figure 2 and Fig. 9 As shown, the inner side of the second end 32 (i.e., the side close to the chamber 34) can be concave to form a step structure 7, and the step structure 7 has a step surface 71, and the step surface 71 is lower than the end surface of the second end 32, so that the step surface 71 forms a height difference with the end surface of the second end 32, and the light window 4 can be installed on the step structure 7 by embedding, and the card groove portion 61 is located below the step structure 7. By setting the step structure 7, on the one hand, it can play a positioning role, and the light window 4 can be accurately packaged on the dam 3; on the other hand, after the light window 4 is embedded in the step structure 7, the step structure 7 can be used to effectively protect the light window 4 to prevent the edge of the light window 4 from being accidentally damaged or collapsed.

[0083] When the light window 4 is embedded in the step structure 7, the buckle portion 61 and the slot portion 62 are both located in the cavity 34, which prevents the connection between the buckle portion 61 and the slot portion 62 from being affected by the external environment, thereby ensuring the reliability of the LED device packaging. At the same time, the buckle portion 61 and the slot portion 62 are hidden in the cavity 34, which can also ensure that the appearance of the LED device is neat and not complicated. Among them, the structure of the slot portion 62 arranged on the inner side of the side wall 33 can be as follows: Figure 2 , Figure 7 and Figure 8 In the present invention, the specific structure of the slot portion 62 is not limited, as long as the barb 613 can be engaged with the slot portion 62 .

[0084] Preferably, if Figure 1 , Fig.10 , Fig.12 and Fig.13 As shown, the height difference between the step surface 71 and the end surface of the second end 32 is defined as: when the light window 4 is installed on the step structure 7, the upper surface of the light window 4 is flush with the end surface of the second end 32, thereby ensuring the consistency of the appearance of the LED device. In practical applications, when the light window 4 is installed on the step structure 7, the upper surface of the light window 4 may also be lower than the end surface of the second end 32, or the upper surface of the light window 4 may also be higher than the end surface of the second end 32. In the present invention, as long as it is ensured that the light window 4 can be installed on the step structure 7, the height difference between the step surface 71 and the end surface of the second end 32 is not limited.

[0085] Alternatively, if Figure 1 , Fig.10 , Fig.12 and Fig.13 As shown, the seal 5 can be located between the step surface 71 and the extension section 611. The seal 5 is made of elastic material, such as silicone resin, epoxy resin, Teflon, etc., so that the seal 5 has resilience after molding. Fig.10After the light window 4 is sealed at the second end 32, an external force F from the second end 32 toward the first end 31 needs to be applied to the light window 4. In this process, the seal 5 is elastically deformed under pressure until the light window 4 is connected and fixed to the dam 3 through the snap-fit ​​structure (i.e., the barb 613 is snapped into the snap-fitting groove 62). After the external force F is removed, the seal 5 has a tendency to return to its original state. The light window 4 is moved in a direction away from the step surface 71 by the seal 5, and the snap-fitting groove 61 also moves with the light window 4, so that the barb 613 is tightly snapped into the snap-fitting groove 62, further ensuring the stability of the connection between the light window 4 and the dam 3. At the same time, the seal 5 has a tendency to return to its original state and will be fully filled between the light window 4 and the step surface 71 to ensure the airtightness of the LED device, so as to prevent the water vapor in the environment from entering the LED device during use.

[0086] Optionally, the seal 5 has a minimum thickness H1 after being deformed by pressure, and the minimum thickness H1 is defined as: H1≤H2-H3-H4, wherein H2 is the length of the connecting section 612, H3 is the length of the barb 613, and H4 is the distance from the slot portion 62 to the step surface 71 (see Figure 2 and Figure 5 ). The length of the barb 613 is specifically the length between the position of the barb 613 closest to the first end 31 and the position of the barb 613 closest to the second end 32. By defining the relationship between H1, H2, H3, and H4, it is ensured that when the seal 5 is compressed and deformed to the minimum thickness H1, the barb 613 can be engaged with the slot 62.

[0087] In some embodiments, Figure 4 As shown, the side wall 33 may be provided with a guide groove 10 extending along the second direction, the guide groove 10 passes through the second end 32 and communicates with the slot portion 62, wherein the connecting section 612 passes through the guide groove 10 so that the barb 613 is engaged with the slot portion 62. During packaging, the buckle portion 61 needs to be aligned with the guide groove 10. When the light window 4 covers the second end 32, the connecting section 612 of the buckle portion 61 can pass through the guide groove 10, and the barb 613 is engaged with the slot portion 62. By providing the guide groove 10, the extension section 612 and the barb 613 of the buckle portion 61 are hidden in the dam 3, so that the overall appearance of the LED device after packaging is consistent.

[0088] Specifically, the position of the guide groove 10 is determined by the position of the slot portion 62, for example, Figure 4 As shown in c, the slot portion 62 is located on the side wall 33 and is recessed relative to the outer surface of the side wall 33 toward the inner surface of the side wall 33. At this time, the guide groove 10 is located on the side of the side wall 33 close to the outer surface; Figure 4As shown in d, the slot portion 62 is located on the side wall 33 and is recessed relative to the inner surface of the side wall 33 toward the outer surface of the side wall 33. At this time, the guide groove 10 is located on the side of the side wall 33 close to the inner surface.

[0089] Specifically, when the guide groove 10 is provided on the side wall 33, the seal 5 is provided with an avoidance hole (not shown in the figure) at a position corresponding to the guide groove 10, so that the connecting section 612 of the buckle portion 61 first passes through the avoidance hole and then enters the guide groove 10. In this way, the buckle portion 61 can be used to limit the seal 5, ensuring that the seal 5 is always kept in the correct position during the packaging process.

[0090] In some embodiments, for example, the inner side of the second end 32 (ie, the side close to the chamber 34) is concave to form a step structure 7, such as Figures 10 to 13 As shown, the side wall 33 can also be provided with a guide groove 10 extending along the second direction. In this case, the guide groove 10 passes through the step surface 71 and is connected to the card slot portion 62. During packaging, it is necessary to align the snap portion 61 with the guide groove 10. When the light window 4 is installed on the step structure 7, the connecting section 612 of the snap portion 61 just passes through the guide groove 10, and the barb 613 is snapped into the card slot portion 62. By providing the guide groove 10, the extension section 612 and the barb 613 of the snap portion 61 are hidden inside the dam 3, so that the overall appearance consistency of the LED device after packaging is good. In view of the situation where the step structure 7 is formed by a depression on the inner side of the second end 32 (i.e., the side close to the chamber 34), the seal 5 can also be provided with an avoidance hole at a position corresponding to the guide groove 10.

[0091] In some embodiments, Figure 4 E, Figure 6 , Fig.12 and Fig.13 As shown, when a guide groove 10 is provided on the side wall 33, that is, whether the guide groove 10 passes through the second end 32 and is connected to the slot portion 62, or the guide groove 10 passes through the step surface 71 and is connected to the slot portion 62, the number of the barbs 613 can be two, the two barbs 613 are arranged relative to the connecting section 612, and the barbs 613 will produce elastic deformation after being compressed. It can be understood that in order to ensure the stability of the engagement between the barb 613 and the slot portion 62, when no elastic deformation occurs, the maximum distance between the two barbs 613 should be greater than the slot width of the guide slot 10. Since the barbs 613 will produce elastic deformation after being compressed, during the process of inserting the buckle portion 61 into the guide slot 10, the two barbs 613 are elastically deformed by the slot wall of the guide slot 10, and the maximum distance between the two barbs 613 becomes smaller, so that the two barbs can smoothly penetrate into the guide slot 10, and after passing through the guide slot 10, the two barbs 613 return to their original state, and at this time, the two barbs 613 are just engaged with the slot portion 62.

[0092] Specifically, Figure 4 E, Figure 6 , Fig.12 and Fig.13 As shown, when the number of the barbs 613 is two, the connecting section 613 can be connected to the middle of the extension section 611. At this time, the shape of the connecting section 612 after the extension section 611 and the connecting section 612 are connected is T-shaped. It can be understood that the number of the barbs 613 can also be three, four, five, etc. When the number of the barbs 613 is more than three, the multiple barbs 613 are all connected to the end of the connecting section 612 and are distributed at intervals along the circumference of the connecting section 612.

[0093] In practical applications, such as Fig.13 As shown, by reducing the size of the extension section 611 of the buckle portion 61, it is not easy to find the extension section 611 below the light window when looking down at the LED device, further improving the overall appearance consistency of the LED device. At the same time, the number of buckle components is increased to ensure the connection strength between the buckle portion 61 and the light window 4.

[0094] In some embodiments, the LED chip 2 is packaged on the substrate 1 in at least one of the following ways: flip-chip, face-mounted or vertical packaging. That is, when the LED chip 2 is a flip-chip, the LED chip 2 can be packaged on the substrate 1 through a eutectic process, or, when the LED chip 2 is a face-mounted chip or a vertical chip, the LED chip 2 can be packaged on the substrate 1 through a wire bonding process. The type of the LED chip 2 can be selected according to actual needs and is not specifically limited here.

[0095] The present invention also provides an LED packaging method for packaging the above-mentioned LED device, comprising the following steps:

[0096] preparing a substrate 1;

[0097] Encapsulating an LED chip 2 on a substrate 1;

[0098] A dam 3 is prepared, wherein the dam 3 has a side wall 33 extending from the first end 31 to the second end 32 and from the first end 31 to the second end 32, wherein the side wall 33 defines a cavity 34, wherein the dam 3 is mounted on the substrate 1 through the first end 31, and the LED chip 2 is disposed in the cavity 34, and the dam 3 also has an installation space 14, wherein the installation space 14 is configured to extend horizontally from the inner and outer ends of the second end 32 of the dam 3 to both sides to the area enclosed when the angle α is ≤ 70° with the line connecting the inner and outer ends of the first end 31;

[0099] A seal 4 is provided on the second end 32 , the light window 4 is placed on the seal 5 , a force is applied to the light window 4 from the second end 32 toward the first end 31 , the light window 4 is connected and fixed to the dam 3 via a snap-fit ​​structure, and when the light window 4 is connected and fixed to the dam 3 , the snap-fit ​​structure is located in the installation space 14 .

[0100] The packaging method uses a snap-fit ​​structure to achieve the connection and fixation between the light window 4 and the dam 3 by mechanical snap-fitting, eliminating the bonding or welding process required in the prior art, making the packaging more concise and efficient, and effectively improving the packaging efficiency; and the airtightness of the LED device packaging is ensured by the seal 5 provided between the light window 4 and the second end 32 of the dam 3. At the same time, after the light window 4 is connected and fixed to the dam 3, the snap-fit ​​structure is just located in the installation space 14. This design reduces the influence of the snap-fit ​​structure on the light path of the LED chip 2, and ensures the light-emitting effect of the LED device. The LED device packaging provided by the present invention is simple, efficient, and the product is reliable.

[0101] In some embodiments, preparing the substrate 1 includes:

[0102] A ceramic substrate is provided, and the front and back sides of the ceramic substrate can be respectively provided with a first circuit 11 and a second circuit 12 for connecting to the LED chip 2. The first circuit 11 and the second circuit 12 can be provided by a DPC (direct copper plating technology) process. In addition, the substrate 1 is provided with a through conductive hole 13, and the first circuit 11 and the second circuit 12 are connected through the conductive hole 13, so that the conductive connection between the LED chip 2, the first circuit 11 and the second circuit 12 can be achieved, thereby facilitating the electrical connection of the LED chip 2. A nickel layer and a gold layer are plated on the first circuit 11 and the second circuit 12 in sequence to obtain the substrate 1, wherein the purpose of plating the nickel layer and the gold layer is to improve the conductivity and anti-oxidation performance. Further, the thickness of the nickel layer is greater than 3um, and the thickness of the gold layer is greater than 0.05um, so as to ensure the conductive and anti-oxidation effects.

[0103] Optionally, encapsulating the LED chip 2 on the substrate 1 includes:

[0104] The LED chip 2 is a flip chip, which is soldered to the surface of the substrate 1 through a eutectic furnace. During the soldering process, at least one temperature zone of the eutectic furnace is kept at a temperature between 280°C and 340°C. Since the solder pad of the flip chip is a gold-tin alloy, and the melting point of the gold-tin alloy is 280°C, the temperature of at least one temperature zone of the eutectic furnace is kept between 280°C and 340°C to ensure that the flip chip is firmly bonded to the substrate 1.

[0105] Optionally, the flip chip and the surface of the substrate 1 may be provided with flux, and the flux is used as a medium for eutectic bonding, so that the flip chip and the substrate 1 have better bonding during eutectic bonding. Specifically, the flux may be rosin and a metal mixture thereof.

[0106] Optionally, the soldering flux can be applied to the surface of the substrate 110 by spot coating, and then the LED chip 2 is placed on the soldering flux. It is understandable that the soldering flux can be applied to the surface of the substrate 110 by manual or mechanical means, for example, an intelligent manipulator is provided to evenly apply a certain amount of soldering flux, thereby further improving the welding effect.

[0107] Optionally, during the welding process, the eutectic furnace is kept in a vacuum state, or an inert gas is filled into the eutectic furnace. Through vacuum or inert gas protection, the welding void rate of the LED chip 2 can be reduced and the high temperature oxidation of the electrode of the LED chip 2 can be prevented. Specifically, nitrogen can be selected as the inert gas.

[0108] In some embodiments, preparing the substrate 1 includes:

[0109] A ceramic substrate is provided, and the front and back sides of the ceramic substrate can be respectively provided with a first circuit 11 and a second circuit 12 for connecting to an LED chip 2. The first circuit 11 and the second circuit 12 can be provided by a DPC (direct copper plating technology) process. In addition, the substrate 1 is provided with a through conductive hole 13, and the first circuit 11 and the second circuit 12 are connected through the conductive hole, so that the conductive connection between the LED chip 2, the first circuit 11 and the second circuit 12 can be achieved, thereby facilitating the electrical connection of the LED chip 2. A nickel layer, a palladium layer and a gold layer are plated on the first circuit 11 and the second circuit 12 in sequence to obtain the substrate 1. The purpose of plating the nickel layer, the palladium layer and the gold layer is to ensure welding, conductivity and anti-oxidation effects. Further, the thickness of the nickel layer is greater than 3um, the thickness of the palladium layer is greater than 0.05um, and the thickness of the gold layer is greater than 0.05um.

[0110] Optionally, encapsulating the LED chip 2 on the substrate 1 includes:

[0111] The LED chip 2 is a positive chip or a vertical chip, and a bonding adhesive is set at a corresponding position on the surface of the substrate 1. The positive chip or the vertical chip is placed on the bonding adhesive, and high-temperature baking is performed to solidify the bonding adhesive, so that the positive chip or the vertical chip is combined with the substrate 1, and then the electrodes of the positive chip or the vertical chip are connected to the circuits of the substrate 1 by welding wires through welding equipment. Among them, the bonding adhesive can make the bonding of the positive chip or the vertical chip and the substrate 1 more firmly. The bonding adhesive can be selected from insulating glue, silver glue, or solder paste.

[0112] For other effects of the LED packaging method provided by the present invention, please refer to the above description for details, which will not be described here again to avoid repetition.

[0113] The LED device and LED packaging method provided by the present invention have a snap-fit ​​portion on the light window and a slot portion on the dam, and the light window and the dam are connected and fixed by mechanical snap-fitting; and the airtightness of the LED device packaging is ensured by a seal provided between the light window and the second end of the dam; at the same time, after the light window is connected and fixed to the dam, the snap-fit ​​structure is located in the installation space to reduce the influence of the snap-fit ​​structure on the light path of the LED chip and ensure the light-emitting effect of the LED device. Compared with the semi-inorganic packaging and full-inorganic packaging methods in the prior art, the present invention eliminates the process of bonding or welding, simplifies the packaging process, and makes the packaging process more concise and efficient; at the same time, since the LED device of the present invention will not cause secondary high-temperature damage to the LED chip during the packaging process, the life of the LED device is greatly improved.

[0114] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED device, characterized in that: The invention comprises a substrate, an LED chip, a dam, a light window and a sealing member, wherein the dam has a first end and a second end opposite to each other and side walls extending between the first end and the second end, wherein the side walls define a chamber, the dam is mounted on the substrate through the first end, the LED chip is arranged in the chamber and packaged on the substrate, the light window is connected to the second end to cover the chamber, the sealing member is arranged between the light window and the second end, and the dam further comprises an installation space, wherein the installation space is defined as an area extending horizontally from the inner edge and the outer edge of the second end of the dam to both sides respectively, and enclosed within a range where the angle α formed by the line connecting the inner edge and the outer edge of the first end of the dam does not exceed 70°, the light window is connected and fixed to the dam through a snap-fit ​​structure, wherein when the light window is connected and fixed to the dam, the snap-fit ​​structure is located in the installation space.

2. The LED device according to claim 1, characterized in that The buckle structure comprises at least one group of buckle components arranged relatively to each other, wherein the buckle components comprise a buckle portion and a slot portion, the light window is provided with the buckle portion, and the dam is provided with the slot portion.

3. The LED device according to claim 2, characterized in that The clamping groove is located on the side wall and is recessed relative to the surface of the side wall.

4. The LED device according to claim 2, characterized in that The buckle portion includes an extension section, a connecting section and a barb, the extension section extends along a first direction and is connected to the light window, the first direction is parallel to the light window, the connecting section extends along a second direction, the second direction is the direction of the second end toward the first end, and one end of the connecting section is connected to the extension section, and the other end is connected to the barb, and the barb can be snapped into the slot portion.

5. The LED device according to claim 4, characterized in that The side wall is provided with a guide groove extending along the second direction, the guide groove passes through the second end and is connected with the clamping groove portion, wherein the connecting section passes through the guide groove so that the barb is clamped in the clamping groove portion.

6. The LED device according to claim 4, characterized in that The inner side of the second end is concave to form a step structure, the light window is installed on the step structure, and the slot portion is located below the step structure.

7. The LED device according to claim 6, characterized in that The step structure has a step surface, which is lower than the end surface of the second end. The side wall is provided with a guide groove extending along the second direction, and the guide groove passes through the step surface and is connected with the slot portion, wherein the connecting section is penetrated by the guide groove so that the barb is engaged with the slot portion.

8. The LED device according to claim 5 or 7, characterized in that The number of the barbs is two, the two barbs are arranged opposite to each other with respect to the connecting section, and the barbs are elastically deformed when pressed.

9. The LED device according to claim 6, characterized in that The seal is a flexible member, and has a minimum thickness H1 after being deformed by pressure. The first thickness H1 is defined as: H1≤H2-H3-H4, wherein H2 is the length of the connecting section, H3 is the length of the barb, and H4 is the distance from the slot to the step surface of the step structure.

10. A LED packaging method, characterized in that: For packaging an LED device according to any one of claims 1 to 9, comprising the following steps: preparing a substrate; Encapsulating LED chips on the substrate; A dam is prepared, wherein the dam has a first end and a second end opposite to each other and a side wall extending from the first end and the second end, wherein the side wall defines a cavity, wherein the dam is mounted on the substrate through the first end, and the LED chip is arranged in the cavity, and the dam further has an installation space, wherein the installation space is defined as an area extending horizontally from the inner edge and the outer edge of the second end of the dam to both sides respectively, and within a range where an angle α formed by a line connecting the inner edge and the outer edge of the first end of the dam does not exceed 70°; A sealing member is provided on the second end, a light window is placed on the sealing member, and a force is applied to the light window from the second end toward the first end, so that the light window is connected and fixed to the dam through a snap-fit ​​structure, wherein after the light window is connected and fixed to the dam, the snap-fit ​​structure is located in the installation space.

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