Display module, electronic device and method for manufacturing display module

Abstract

The present application discloses a display module, an electronic device and a method for preparing the display module. The display module includes a display panel, a driving chip, a flexible circuit board and a sealing layer. The display panel includes a display part and a binding part connected to the display part. The binding part is located on the non-display side of the display part. The binding part includes a front side, and the front side faces away from the display part. The flexible circuit board includes a first surface, a second surface arranged opposite to the first surface, and a mounting groove penetrating the first surface and the second surface. The flexible circuit board and the binding part are stacked, the second surface is opposite to and connected to the front side, and the flexible circuit board is bound and conductive to the binding part; the driving chip is accommodated in the mounting groove and connected to the front side; the sealing layer encapsulates the driving chip on the flexible circuit board, and the sealing layer encapsulates the flexible circuit board and the binding part. The present invention improves the binding accuracy and electrical connection reliability of the flexible circuit board while reducing the thickness of the display module.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module, an electronic device, and a method for preparing the display module. Background Art

[0002] With the development of electronic equipment technology such as mobile phones, thinness and large screens have become the main development trend of electronic equipment. As a result, products such as foldable phones have gradually become popular, but the thickness and size of foldable products will affect the user experience. Therefore, saving the internal space of foldable products to reduce the thickness is an urgent problem to be solved in the field of foldable product technology. Summary of the invention

[0003] The present application provides a display module, an electronic device and a method for manufacturing the display module, which solves the problem of large thickness of the electronic device by reducing the overall thickness of the flexible board and the driving chip of the display module.

[0004] The present application provides a display module, the display module comprising a display panel, a driving chip, a flexible circuit board and a sealing layer, the display panel comprising a display portion and a binding portion connected to the display portion, the binding portion being located on a non-display side of the display portion, the binding portion comprising a front side, the front side facing away from the display portion,

[0005] The flexible circuit board comprises a first surface, a second surface arranged opposite to the first surface, and a mounting groove penetrating the first surface and the second surface.

[0006] The flexible circuit board is stacked with the binding part, the second surface is opposite to and connected to the front surface, the flexible circuit board is bound and connected to the binding part; the driving chip is accommodated in the installation groove and connected to the front surface;

[0007] The sealing layer seals the driving chip on the flexible circuit board, and the sealing layer seals the flexible circuit board and the binding part.

[0008] The flexible circuit board of the present application is provided with a mounting groove, and the driver chip is accommodated in the mounting groove, which reduces the size in the thickness direction of the display module. Moreover, the flexible circuit board and the driver chip are both connected to the front of the binding part, that is, the flexible circuit board and the driver chip are located in the same plane. In the thickness direction of the display module, the flexible circuit board has no step difference, and the flexible circuit board will not bend or climb. It has good flatness, improves the binding accuracy of the flexible circuit board and the binding part and the stability of the electrical connection, thereby ensuring the quality of the display module.

[0009] In one embodiment, the sealing layer includes a first sealing layer and a second sealing layer, the first sealing layer covers the side of the driving chip that exposes the first surface and connects to the first surface, and the second sealing layer connects the first surface periphery of the flexible circuit board and the front side of the binding part; wherein the first sealing layer and the second sealing layer are formed in the same process step.

[0010] The prior art first installs and packages the chip, then binds the circuit board and packages the circuit board, and the sealing of the chip and circuit board requires two stations and two devices to complete. The driver chip and flexible circuit board of the present application can be completed in the same packaging and dispensing process step. Compared with the prior art, it does not require two sealing devices or replacement of dispensing stations, which simplifies the processing technology of the display module and saves the processing cost of the display module.

[0011] In one embodiment, the flexible circuit board further includes a binding area, the binding area is arranged at the edge of the flexible circuit board, and the binding area and the mounting groove are arranged at intervals along the width direction of the flexible circuit board, and the edge of the binding portion is provided with a panel binding area, and the panel binding area and the binding area are connected and conductive through a binding process. The flexible circuit board of this application sets the binding area at the edge and adjacent to the mounting groove, which fully utilizes the space of the flexible circuit board and does not require additional increase in the size of the circuit board, thereby satisfying that the entire flexible circuit board is stacked on the binding portion of the display panel, and can also achieve a binding connection relationship.

[0012] In one embodiment, the flexible circuit board further includes two groups of first wirings and two groups of second wirings, and the two groups of first wirings are respectively located on opposite sides of the installation slot.

[0013] One end of each group of the second routing lines is connected to the side of the binding area facing away from the installation slot, and the second routing lines extend along the binding area and bend and then pass through the binding area to extend away from the binding area, and the extended part of each group of the second routing lines is located between the installation slot and the first routing line.

[0014] The first routing and the second routing of the present application are internal routings of the flexible circuit board, which can be electrically connected to other routings of the flexible circuit board to realize the connection between the flexible circuit board and the driver chip, the electronic device circuit board or the display panel. The second routing connecting the binding area and the flexible circuit board utilizes the position between the edge of the flexible circuit board and the mounting groove, and partially overlaps with the binding area, as well as the position between the mounting groove and the first routing to set the second routing, thereby reserving space for the mounting groove without increasing the area of ​​the flexible circuit board, thereby saving space and cost of the electronic equipment.

[0015] In one embodiment, the flexible circuit board includes a first side and two opposite first end sides, the two first end sides are connected to the first side, the flexible circuit board also includes a first binding area and a second binding area, the first binding area and the second binding area are spaced and opposite to each other along the first side and are respectively close to the two first end sides, in the width direction of the flexible circuit board, the mounting through groove is adjacent to the first side, and in the length direction of the flexible circuit board, the mounting through groove is staggered with the first binding area and the second binding area;

[0016] The binding portion is in the shape of a rectangular plate, and the panel binding area includes a first portion and a second portion, the first portion and the second portion are close to the end edge of the binding portion and are spaced apart, and the first portion and the second portion are respectively close to two side edges of the binding portion;

[0017] In the thickness direction of the display module, the flexible circuit board is stacked on the binding part of the display panel, the first side edge is opposite to the end edge of the binding part, and the second surface is opposite to the front surface; the first part and the second part are respectively opposite to and bound to the first binding area and the second binding area, and the display panel is electrically connected to the flexible circuit board.

[0018] In this embodiment, the binding portion of the display panel is in the shape of a rectangular plate, rather than a rectangular plate with cut corners as in the prior art. The display binding area is arranged at the edge of the binding portion near the corner, and there is sufficient space to set the binding area to match the binding area of ​​the flexible circuit board, and a position for installing the driver chip can be reserved, thereby improving the connection stability between the flexible circuit board and the display panel without increasing the area of ​​the entire display panel.

[0019] In one embodiment, there is a gap between the driver chip and the side wall of the installation slot, so as to avoid interference between the driver chip and the flexible circuit board after installation, thereby ensuring the safe and stable performance of the driver chip.

[0020] An embodiment of the present application provides an electronic device, which includes a main body and the display module, wherein the display module is assembled on the main body.

[0021] In one embodiment, the display module further includes a back plate, the back plate includes a back portion, the display panel further includes a bending portion, along the length direction of the display panel, the display portion, the bending portion and the binding portion are sequentially connected, the back plate is stacked with the display portion and is located on the non-display side of the display portion, the binding portion is bent to the back portion through the bending portion, and the binding portion is stacked and fixed with the back portion;

[0022] The electronic device further comprises a power module, which is assembled to the main body, located at the back of the back plate, and arranged adjacent to the binding portion.

[0023] In this embodiment, after the main body and the display module are assembled, a battery compartment is formed in the part of the main body facing away from the display module, the back plate is the bottom wall of the battery compartment, and the binding part is located at one end of the battery compartment. The binding part of the display panel and the flexible circuit board are stacked, and the driving battery cell is embedded in the flexible circuit board and coplanar with the flexible circuit board, without increasing the size of the flexible circuit board, and the flexible circuit board does not need to extend to the area accommodating the power module, so that the electronic device has enough space to accommodate the power module, and the volume of the power module can be increased without increasing the overall space of the electronic device, that is, the battery life can be improved. Alternatively, the thickness of the electronic device can be reduced by reducing the thickness of the battery, increasing the length or width, and reducing the thickness of the power module while ensuring the battery life of the power module.

[0024] The present application also provides a method for preparing a display module, the method comprising:

[0025] A display panel substrate and a backplane are provided, wherein the display panel substrate comprises a display portion, a bending area and a binding portion connected in sequence, and the backplane is stacked on a non-display side of the display portion;

[0026] Providing a flexible circuit board, the flexible circuit board comprising a first surface, a second surface, and a mounting groove penetrating the first surface and the second surface;

[0027] The flexible circuit board is stacked on the binding part, and the flexible circuit board is connected to the binding part by a binding process; wherein the second surface and the front surface are opposite to and connected to each other;

[0028] Providing a driving chip and accommodating the driving chip in the mounting groove, wherein the driving chip is connected to the front surface;

[0029] The driver chip is first packaged in the installation groove through the sealing process, and then the flexible circuit board and the binding part are packaged. Since the flexible circuit board is first bound to the binding part, and then the driver chip is set in the installation groove of the flexible circuit board, and is pre-positioned by the flexible circuit board, the driver chip and the flexible circuit board can be sealed and fixed at the same time. The prior art first installs and packages the chip, and then binds the circuit board and packages the circuit board. The sealing of the chip and the circuit board requires two stations and two devices. Compared with the prior art, the present application does not require two sealing devices, nor does it require the replacement of the dispensing station, which simplifies the processing technology of the display module.

[0030] In one embodiment, the method also includes bending the binding portion toward the non-display side of the display portion through the bending area, and fixing the bent binding portion to the back of the back plate to form a display panel, wherein the flexible circuit board and the driving chip are located on the non-display side of the display portion.

[0031] The flexible circuit board of the display module described in the present application is provided with a mounting groove, and the driving chip is accommodated in the mounting groove instead of being stacked with the flexible panel. This reduces the size of the display module in the thickness direction, thereby saving the thickness space of the electronic device and facilitating the thinning design of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0033] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0034] Figure 2 for Figure 1 A schematic cross-sectional view of a portion of the structure of the electronic device shown;

[0035] Figure 3 for Figure 2 The schematic diagram of the structure of the display module is shown as an exploded cross-section diagram;

[0036] Figure 4 for Figure 3 A schematic cross-sectional view of a display panel of the display module shown;

[0037] Figure 5 for Figure 3 A cross-sectional schematic diagram of the flexible circuit board and the mounting slot shown;

[0038] Figure 6 for Figure 3 The cross-sectional diagram of the display module with the driver chip installed is shown;

[0039] Figure 7 for Figure 3 A schematic cross-sectional view of the packaging structure of the display module is shown;

[0040] Figure 8 for Figure 2 The manufacturing method flow chart of the display module shown;

[0041] Fig. 9 A schematic structural plan view of a first embodiment of a flexible circuit board provided in an embodiment of the present application;

[0042] Fig.10 A schematic structural plan view of a second embodiment of a flexible circuit board provided in an embodiment of the present application;

[0043] Fig.11 A schematic structural plan view of a second embodiment of a display panel provided in an embodiment of the present application;

[0044] Fig.12 It is a schematic plan view of the binding structure of the display panel and the flexible circuit board according to the second embodiment. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0046] The advent of foldable terminal electronic devices with flexible organic light-emitting diode (OLED) screens has solved the technical problem that the display screen of terminal electronic devices cannot reach 100%. The efficiency of information interaction can be multiplied by folding. Taking a foldable screen mobile phone as an example, the size of the body after folding is close to the size of a traditional mobile phone (such as 5-6 inches), but when opened, it can have a tablet display size (such as 7-8 inches). People gradually put forward higher demands for thinner electronic devices, which puts higher requirements on the planning and use of the internal space of foldable terminal electronic devices. Since the internal space of electronic devices is very limited, in order to improve the utilization rate of the internal space of the device without reducing the power capacity, it is necessary to reduce the space occupied by the display module and other electronic devices as much as possible. Therefore, how to improve the utilization rate of the internal space of electronic devices has become a technical problem that needs to be solved urgently in the current technical field.

[0047] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of an electronic device 1000 provided in an embodiment of the present application. Figure 2 for Figure 1A schematic cross-sectional view of a partial structure of an electronic device shown. The present application embodiment provides an electronic device 1000, and the electronic device 1000 includes but is not limited to a cell phone, a notebook computer, a tablet personal computer, a laptop computer, a personal digital assistant, a television, a wearable device, or a mobile device, etc. In the present application embodiment, the electronic device 1000 is described by taking a mobile phone as an example.

[0048] For the convenience of description, the width direction of the electronic device 1000 is defined as the X-axis direction, the length direction of the electronic device 1000 is defined as the Y-axis direction, and the thickness direction of the electronic device 1000 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are mutually perpendicular. It should be noted that the directional terms such as "top", "bottom", "upper", "lower", "left", and "right" involved in this application are referenced to the attached Figure 1 The description of the orientation shown, with the positive direction of the Y-axis as the "top", the negative direction of the Y-axis as the "bottom", the positive direction of the Z-axis as the "up", the negative direction of the Z-axis as the "down", the positive direction of the X-axis as the "right", and the negative direction of the X-axis as the "left", does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0049] The electronic device 1000 includes a main body 500 and a display module 100. The display module 100 is mounted on one side of the main body 500 and serves as a display screen of the electronic device 1000. The display module 100 uses an organic light-emitting diode (OLED) display screen. The main body 500 includes a rear shell (not shown), a rotating shaft (not shown), a middle frame (not shown), a processor, a circuit board, and a power module 520. The rear shell is mounted on the middle frame and is located on opposite sides of the thickness direction of the middle frame with the display module 100. The rotating shaft can realize the folding of the rear shell. The processor, the circuit board, the power module 520, etc. are installed in the rear shell. Among them, the circuit board and the power module 520 are located on opposite sides of the rotating shaft, and the power module 520 is electrically connected to the circuit board to supply power to the electronic device 1000. It can be understood that after the main body 500 and the display module 100 are assembled, a battery compartment (not marked in the figure) is formed in the part of the main body 500 facing away from the display module, and the battery compartment is located on the non-display side of the display module 100. The processor can be a CPU (central processing unit) of the electronic device 1000, which can be installed on a circuit board. It can be understood that the main body 500 includes other devices that can realize the functions of the mobile phone in addition to the display module 100. Of course, it is not ruled out that some devices are directly designed as an integral whole with the display module 100.

[0050] Please also read Figure 2 and Figure 3 , Figure 3 The schematic diagram of the structure of the display module 100 provided in the embodiment of the present application is an exploded cross-sectional view. The display module 100 includes a display area 110 and a non-display area 120, and the non-display area 120 is located on the side of the display area 110. The display area 110 is used for the display module 100 to display images, and the non-display area 120 can be a wiring area and a device area.

[0051] The display module 100 also includes a transparent cover plate 14, an optical adhesive layer 15, a polarizer 16, a display panel 10, a first adhesive layer 17 and a back plate 18. The transparent cover plate 14, the optical adhesive layer 15, the polarizer 16, the display panel 10, the first adhesive layer 17 and the back plate 18 are stacked in sequence along the thickness direction. The transparent cover plate 14 is made of a flexible material, which is located on the light-emitting side (display side) of the display module 100 and is used to protect the display module 100. The optical adhesive layer 15 bonds the transparent cover plate 14 and the polarizer 16. The display panel 10 is located between the polarizer 16 and the first adhesive layer 17; the first adhesive layer 17 connects the display panel 10 and the back plate 18. The back plate 18 is a supporting body of the display module 100, which is used to support the transparent cover plate 14, the optical adhesive layer 15, the polarizer 16 and the display panel 10. Specifically, the back plate 18 has a back portion 181 , which is a side of the back plate 18 facing away from the display panel 10 , and the power module 520 is located at the back portion 181 .

[0052] In this embodiment, the display panel 10 is a flexible panel, which includes a display portion 11, a bending portion 12 and a binding portion 13. The display portion 11 has a display side and a non-display side, and the display portion 11 is used to provide a display screen for the electronic device 1000. Along the length direction of the display panel 10, the display portion 11, the bending portion 12 and the binding portion 13 are connected in sequence, and the binding portion 13 can be bent to the non-display side of the display portion 11 through the bending portion 12. Along the width direction or length direction of the display module 100, the bending portion 12 protrudes from one side of the first adhesive layer 17 and the back plate 18. Specifically, the display portion 11 is located in the display area 110, and the bending portion 12 is located in the non-display area 120. The bending portion 12 is bent so that the binding portion 13 is located on the back 181 of the back plate 18, and the binding portion 13 is fixedly connected to the back 181 of the back plate 18 through the second adhesive layer 19. It should be noted that the back plate 18 of the non-display side of the display module 100 is the bottom wall of the battery compartment, and the binding portion 13 of the display module 100 is located at one end of the battery compartment and is disposed adjacent to the power module 520 .

[0053] The display module 100 further includes a flexible circuit board 20 and a driving chip 30, which are mounted on the binding portion 13 of the display panel 10. The driving chip 30 is used to provide a signal to the display module 100 and drive the display module 100 to display. The flexible circuit board 20 is connected to the binding portion 13 through a binding process and is electrically connected to the circuit board, so that the display module 100 and the main body 500 can be electrically connected. The driving chip 30 is mounted on the binding portion 13 and embedded in the flexible circuit board 20.

[0054] See also Figure 4 , Figure 4 for Figure 3 The schematic diagram of the display panel 10 of the display module 100 shown in FIG. The binding portion 13 includes a first end 131 and a second end 132 arranged opposite to the first end 131, the first end 131 is an end of the binding portion 13 away from the bending portion 12, and the second end 132 is an end of the binding portion 13 connected to the bending portion 12. The binding portion 13 also includes a front face 133 and a back face 134, and the front face 133 and the back face 134 are arranged in opposite directions along the thickness direction of the display panel 10.

[0055] Please refer again Figure 2The flexible circuit board 20 includes a first surface 22, a second surface 23 disposed opposite to the first surface 22, and a mounting groove 24 penetrating the first surface 22 and the second surface 23. The flexible circuit board 20 is stacked on the front surface 133 of the binding portion 13 of the display panel 10, and the second surface 23 is opposite to and connected to the front surface 133. The flexible circuit board 20 is disposed between the first end 131 and the second end 132 of the binding portion 13, and the flexible circuit board 20 and the binding portion 13 are located at the back 181 of the back plate 18. The flexible circuit board 20 is bound to the binding portion 13 through a binding process to achieve electrical connection between the flexible circuit board 20 and the display panel 10. Specifically, the flexible circuit board 20 is provided with a binding area (not shown in the figure), and the binding area is connected and electrically conductive with the binding area (not shown in the figure) of the binding portion 13 through a binding process. The bonding mentioned above refers to a wire bonding method in the production and packaging process of microelectronic devices, such as bonding the flexible circuit board 20 to the display panel 10, that is, using metal wires (gold wires, etc.) to achieve physical fixation and electrical connection with the display panel 10 through welding or other methods.

[0056] The driver chip 30 is accommodated in the installation groove 24 and connected to the front surface, and is electrically connected to the flexible circuit board 20; due to the thickness difference, the driver chip 30 can protrude from the first surface 22 of the flexible circuit board 20. The driver chip 30 and the flexible circuit board 20 are packaged by the sealing layer 40. In one embodiment, the volume of the installation groove 24 is larger than the volume of the driver chip 30, that is, there is a gap between the driver chip 30 and the groove side wall of the installation groove 24, which can avoid interference between the driver chip 30 and the flexible circuit board 20 when the driver chip 30 is installed in the installation groove 24.

[0057] The sealing layer 40 includes a first sealing layer 41 and a second sealing layer 42. The driver chip 30 is encapsulated in the mounting groove 24 of the flexible circuit board 20 through the first sealing layer 41, and the first sealing layer 41 is connected to the driver chip 30 and the first surface 22; the first sealing layer 41 fixes the driver chip 30 and protects the driver chip 30. The flexible circuit board 20 is encapsulated on the binding part 13 of the display panel 10 through the second sealing layer 42 to protect the flexible circuit board 20, such as waterproof and dustproof. It can be understood that the second sealing layer 42 is directly formed around the side of the flexible circuit board 20 facing away from the binding part 13, and the flexible circuit board 20 can be flatly connected to the binding part 13 while encapsulating the flexible circuit board 20.

[0058] In the display module of the prior art, the chip is packaged and then the flexible circuit board is connected to the packaged chip, which will cause bending or climbing. However, the flexible circuit board 20 and the driving chip 30 of the present application are both connected to the front of the binding part 13, that is, the flexible circuit board 20 and the driving chip 30 are located in the same plane. In the thickness direction of the display module 100, the flexible circuit board 20 has no step difference, and the flexible circuit board 20 will not bend or climb. It has good flatness, improves the binding accuracy of the flexible circuit board 20 and the binding part 13 and the stability of the electrical connection, thereby ensuring the quality of the display module 100.

[0059] See also Figures 5 to 7 , Figure 5 is a cross-sectional schematic diagram of the flexible circuit board 20 and the mounting slot 24, Figure 6 is a cross-sectional schematic diagram of the display module 100 with the driver chip 30 installed, Figure 7 FIG. 1 is a schematic cross-sectional view of the packaging structure of the display module 100 .

[0060] like Figure 8 As shown, Figure 8 for Figure 2 The manufacturing method of the display module 100 shown in the flowchart includes the following steps:

[0061] Step S1, providing a display module substrate A, the display module substrate A includes a polarizer 16, a display panel substrate 10A and a backplane 18 stacked in sequence. The display panel substrate 10A includes a display portion 11, a bending area 10B and a binding portion 13, and the binding portion 13 is provided with a panel binding area. The polarizer 16 is stacked on the display side of the display portion 11, and the backplane 18 is stacked on the non-display side of the display portion 11 and is connected and fixed by a back adhesive layer.

[0062] Step S2, providing a flexible circuit board 20, the flexible circuit board 20 includes a first surface 22 and a second surface 23, a binding area provided on the second surface, and a mounting groove 24 that penetrates the first surface 22 and the second surface 23. The binding area is located at an edge of the flexible circuit board 20, and the binding area is adjacent to the mounting groove 24 along the width direction of the flexible circuit board 20.

[0063] Step S3, stacking the flexible circuit board 20 on the binding part 13, and connecting the flexible circuit board 20 to the binding part 13 of the display panel 10 through a binding process; wherein the second surface 23 and the front surface 133 are opposite and connected, the binding area of ​​the flexible circuit board 20 is connected to the panel binding area, and the flexible circuit board 20 is electrically conductive with the display panel 10.

[0064] Step S4 , providing a driving chip 30 , installing the driving chip 30 in the installation slot 24 , and connecting it to the front surface. The driving chip 30 is electrically connected to the display panel 10 and the flexible circuit board 20 .

[0065] Step S5, through the sealing process, firstly seal the driver chip 30 in the mounting groove 24 of the flexible circuit board 20, and then seal the flexible circuit board 20 and the binding part 13. The driver chip 30 is sealed in the mounting groove 24 of the flexible circuit board 20 to form a first sealing layer 41, and the flexible circuit board 20 and the binding part 13 are sealed to form a second sealing layer 42.

[0066] Specifically, a molten glue is applied to the first surface of the flexible circuit board 20 on the side of the driver chip 30 where the mounting groove 24 is exposed by a sealing device to form the first sealing glue layer 41. Then, the flexible circuit board 20 and the binding part 13 are packaged to form a second sealing glue layer 42, which connects the periphery and the front of the first surface.

[0067] In step S6, the binding portion 13 of the display module base A is bent toward the non-display side of the display portion 11 through the bending region 10B to form a display panel. The bent binding portion 13 is fixed to the back of the back plate 18 through the adhesive, and the flexible circuit board 20 and the driving chip 30 are located on the non-display side of the display portion 11. The bending region 10B forms the bending portion 12.

[0068] In step S7 , the transparent cover is attached to the display side of the display unit 11 by optical adhesive to form the display module 100 .

[0069] In this embodiment, since the flexible circuit board 20 is first bound to the binding portion 13, and then the driver chip 30 is set in the installation groove of the flexible circuit board 20 and is pre-positioned by the flexible circuit board 20, the driver chip 30 and the flexible circuit board 20 can be sealed and fixed at the same time, that is, the first sealing layer 41 and the second sealing layer 42 can be completed in the same glue dispensing process step. The prior art first installs and packages the chip, and then binds the circuit board and packages the circuit board, and the sealing of the chip and the circuit board requires two stations and two devices to complete. Compared with the prior art, the present application does not require two sealing devices, nor does it require the replacement of the glue dispensing station, which simplifies the processing technology of the display module 100 and saves the processing cost of the display module 100.

[0070] In this embodiment, the flexible circuit board 20 is only stacked and connected with the binding part 13, and the second surface 23 of the flexible circuit board 20 is directly connected with the front surface 133 of the binding part 13. The driving chip 30 and the flexible circuit board 20 are embedded and connected. The flexible circuit board 20 does not need to cover the driving chip 30, and will not bend up and down; and it does not need to occupy the size of the binding part 13. Further, the flexible circuit board 20 does not need to extend from the display panel 10 to the position of the back plate 18. Compared with the flexible circuit board 20 of the prior art that is fixed on the binding part 13 and the back plate 18 to produce different climbing forms, the flexible circuit board 20 of the present application has no step difference in the thickness direction of the display module 100, and the flexible circuit board 20 will not produce climbing phenomenon, which improves the binding accuracy of the flexible circuit board 20 and the binding part 13 and the stability of the electrical connection. At the same time, the flexible circuit board 20 will not occupy the space of the back 181 of the back plate 18, and a larger installation space can be reserved for the power module 520, which can increase the volume and capacity of the power module 520, thereby improving the endurance of the electronic device 1000.

[0071] In one embodiment, Fig. 9 As shown, Fig. 9 : is a schematic structural plane diagram of the flexible circuit board 20 in the first embodiment. The fill lines are only used to clearly distinguish different components and positions, and do not represent the cross-sectional structure. The flexible circuit board 20 also includes a binding area 21, two groups of first routing lines 25 and two groups of second routing lines 26; the second routing lines 26 and the first routing lines 25 are used to electrically connect the binding area 21 with the flexible circuit board 20. Along the width direction of the flexible circuit board 20, the binding area 21 is spaced apart from the mounting groove 24 and the binding area 21 is located at the edge of the flexible circuit board 20. The binding area 21 is used to bind and connect with the binding portion 13 of the display panel 10. Each group of first routing lines 25 includes several sub-routing lines, which are connected and conductive with the binding area 21. In this embodiment, the two groups of first routing lines 25 are distributed on opposite sides of the mounting groove 24. In this embodiment, each group of second routing lines 26 has several sub-routing lines. One end of each group of second traces 26 is connected to the side of the binding area 21 facing away from the mounting groove 24. The second traces 26 extend along the binding area 21 and bend and then pass through the binding area 21 to extend away from the binding area 21. The extended portion of the second trace 26 is located between the mounting groove 24 and the first trace 25. The second trace 26 is electrically connected to the binding area 21. Since the mounting groove 24 occupies the area of ​​the flexible circuit board 20, the second trace 26 is arranged at the edge and between the mounting groove 24 and the first trace 25, so as to make full use of the space of the flexible circuit board 20 and improve the utilization rate of the surface space of the flexible circuit board 20. Among them, the binding area 21 exposes the second surface 23 of the flexible circuit board 20, and the first trace 25 and the second trace 26 are located in the internal trace layer of the flexible circuit board 20.

[0072] For another example, see Fig.10 , Fig.10 2 is a schematic structural plan view of the flexible circuit board 20 in the second embodiment. In this embodiment, the flexible circuit board 20 is a rectangular plate, which includes a first side 201 and two opposite first end edges 202, and the two first end edges 202 are connected to the first side 201. The flexible circuit board 20 also includes a first binding area 21a, a second binding area 21b and a first trace 25. The first binding area 21a and the second binding area 21b are spaced and opposite along the first side 201, and are respectively close to the two first end edges 202 of the flexible circuit board 20. The mounting groove 24 is adjacent to the first side 201, and in the width direction of the flexible circuit board 20, the mounting groove 24 is staggered with the first binding area 21a and the second binding area 21b. The first trace 25 is arranged on both sides of the mounting groove 24, and the first trace 25 is respectively connected to the first binding area 21a and the second binding area 21b and is electrically conductive. The first binding area 21a and the second binding area 21b expose the second surface 23 of the flexible circuit board 20.

[0073] Please refer to Fig.11 and Fig.12 , Fig.11 is a schematic structural plan view of a display panel 10 in the second embodiment, Fig.12 Schematic diagram of the binding structure of the display panel 10 and the flexible circuit board 20. The display panel 10 is a rectangular plate, which includes a second end edge 101 and two second side edges 102. The two second side edges 102 are opposite to and connected to the second end edge 101. The second end edge 101 is the edge of the binding portion 13 away from the bending portion 12. The binding portion 13 is a rectangular plate, which includes a panel binding area 135 and a third wiring 136. The panel binding area 135 includes a first portion 1351 and a second portion 1352. The first portion 1351 and the second portion 1352 are arranged at intervals along the second end edge 101, and the first portion 1351 and the second portion 1352 are respectively close to the two second side edges 102. Part of the third wiring 136 is connected to the first portion 1351, and part of the third wiring 136 is connected to the second portion 1352, and the third wiring 136 is electrically connected to the panel binding area 135. The third wiring 136 is located in the binding portion 13 , and the panel binding area 135 is exposed on the surface of the binding portion 13 .

[0074] like Fig.12The flexible circuit board 20 is stacked on the binding portion 13 of the display panel 10, the first side edge is opposite to the end edge of the binding portion, the second surface 23 is opposite to the front surface 133, and along the thickness direction of the display module 100, the first part 1351 and the second part 1352 of the panel binding area 135 respectively correspond to the first binding area 21a and the second binding area 21b of the flexible circuit board 20, and the binding area 135 of the display panel 10 is bound to the binding area 21 on the flexible circuit board 20 through the binding process; the display panel 10 is electrically connected to the flexible circuit board 20.

[0075] In this embodiment, the binding portion 13 of the display panel 10 is in the shape of a rectangular plate, having sufficient space to set a binding area 135 to match the binding area 21 of the flexible circuit board 20, and being able to reserve an installation position for the driver chip 30, thereby improving the connection stability between the flexible circuit board 20 and the display panel without increasing the area of ​​the entire display module 100.

[0076] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display module, characterized in that: The display module includes a display panel, a driving chip, a flexible circuit board and a sealing layer, the display panel includes a display part and a binding part connected to the display part, the binding part is located on the non-display side of the display part, the binding part includes a front side, and the front side faces away from the display part. The flexible circuit board comprises a first surface, a second surface arranged opposite to the first surface, and a mounting groove penetrating the first surface and the second surface. The flexible circuit board is stacked with the binding part, the second surface is opposite to and connected to the front surface, the flexible circuit board is bound and connected to the binding part; the driving chip is accommodated in the installation groove and connected to the front surface; The sealing layer seals the driving chip on the flexible circuit board, and the sealing layer seals the flexible circuit board and the binding part.

2. The display module according to claim 1, characterized in that: The sealing layer includes a first sealing layer and a second sealing layer, the first sealing layer covers the side of the driving chip that exposes the first surface and connects to the first surface, and the second sealing layer connects the first surface periphery of the flexible circuit board and the front side of the binding part; wherein the first sealing layer and the second sealing layer are formed in the same process step.

3. The display module according to claim 1 or 2, characterized in that: The flexible circuit board also includes a binding area, which is arranged at the edge of the flexible circuit board, and the binding area and the mounting groove are spaced apart along the width direction of the flexible circuit board. A panel binding area is provided at the edge of the binding part, and the panel binding area and the binding area are connected and conductive through a binding process.

4. The display module according to claim 3, characterized in that: The flexible circuit board further includes two groups of first wirings and two groups of second wirings, wherein the two groups of the first wirings are respectively located at opposite sides of the mounting slot. One end of each group of the second routing lines is connected to the side of the binding area facing away from the installation slot, and the second routing lines extend along the binding area and bend and then pass through the binding area to extend away from the binding area, and the extended part of each group of the second routing lines is located between the installation slot and the first routing line.

5. The display module according to claim 3, characterized in that: The flexible circuit board includes a first side and two opposite first end sides, the two first end sides are connected to the first side, the flexible circuit board also includes a first binding area and a second binding area, the first binding area and the second binding area are spaced and opposite to each other along the first side and are respectively close to the two first end sides, in the width direction of the flexible circuit board, the mounting through groove is adjacent to the first side, and in the length direction of the flexible circuit board, the mounting through groove is staggered with the first binding area and the second binding area; The binding portion is in the shape of a rectangular plate, and the panel binding area includes a first portion and a second portion, the first portion and the second portion are close to the end edge of the binding portion and are spaced apart, and the first portion and the second portion are respectively close to two side edges of the binding portion; In the thickness direction of the display module, the flexible circuit board is stacked on the binding part of the display panel, the first side edge is opposite to the end edge of the binding part, and the second surface is opposite to the front surface; the first part and the second part are respectively opposite to and bound to the first binding area and the second binding area, and the display panel is electrically connected to the flexible circuit board.

6. The display module according to claim 1, characterized in that: There is a gap between the driving chip and the groove side wall of the installation groove.

7. An electronic device, characterized in that: The electronic device comprises a main body and a display module as described in any one of claims 1 to 6, wherein the display module is assembled on the main body.

8. The electronic device according to claim 7, characterized in that: The display module further includes a back plate, the back plate includes a back portion, the display panel further includes a bending portion, along the length direction of the display panel, the display portion, the bending portion and the binding portion are sequentially connected, the back plate is stacked with the display portion and is located on the non-display side of the display portion, the binding portion is bent to the back portion through the bending portion, and the binding portion is stacked with and fixed to the back portion; The electronic device further comprises a power module, which is assembled to the main body, located at the back of the back plate, and arranged adjacent to the binding portion.

9. A method for preparing a display module, characterized in that: The method for preparing the display module comprises: A display panel substrate and a backplane are provided, wherein the display panel substrate comprises a display portion, a bending area and a binding portion connected in sequence, and the backplane is stacked on a non-display side of the display portion; Providing a flexible circuit board, the flexible circuit board comprising a first surface, a second surface, and a mounting groove penetrating the first surface and the second surface; The flexible circuit board is stacked on the binding part, and the flexible circuit board is connected to the binding part by a binding process; wherein the second surface and the front surface are opposite and connected; Providing a driving chip and accommodating the driving chip in the mounting groove, wherein the driving chip is connected to the front surface; The driving chip is firstly packaged in the mounting through groove through a sealing process, and then the flexible circuit board and the binding part are packaged.

10. The method for preparing a display module according to claim 9, characterized in that: The method for preparing the display module also includes bending the binding portion toward the non-display side of the display portion through the bending area, and fixing the bent binding portion to the back of the back plate to form a display panel, wherein the flexible circuit board and the driving chip are located on the non-display side of the display portion.

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