Quantum chip packaging device

Abstract

The invention belongs to the technical field of quantum computing, and discloses a quantum chip packaging device. Comprising a substrate, a transfer printed board which is arranged on the upper surface of the substrate and is fixedly connected with the substrate, a cluster connector base which is located above the transfer printed board and is fixedly connected with the substrate, an elastic cluster connector which is connected with the cluster connector base in an inserted mode, and an upper-layer cover plate which is fixed to the substrate. The quantum chip packaging device comprises a substrate, a substrate middle groove is formed in the middle of the substrate, a chip is placed on the substrate, the substrate middle groove is located below the chip, a cavity is formed in the middle area of the bottom of the chip, the edge of the chip is supported, and the fundamental mode frequency of the whole quantum chip packaging device is improved. The elastic cluster connector is adopted, welding-free installation can be achieved, disassembly and assembly are convenient, and repeated utilization can be achieved. Compared with a discrete joint, the elastic cluster connector has the advantages of high integration density, smaller size and high connection reliability at the interface.

Description

Technical Field

[0001] The present invention belongs to the field of quantum computing, in particular to the field of quantum chip packaging, and specifically relates to a quantum chip packaging device. Background Art

[0002] As the number of bits in quantum chips increases, the number of external I / O interfaces of quantum chip packaging devices also increases. Most of these external I / O interfaces transmit radio frequency signals, requiring dedicated radio frequency connectors to ensure the characteristic impedance and signal shielding effect of the I / O interfaces. The current solution is to use miniaturized discrete radio frequency connectors to achieve connection at the I / O interface. Due to the large number of I / O interfaces and limited space, the distance between each connector is small, which can easily cause problems during the plugging and unplugging process with the cable connector. The plugging and unplugging operation space is small, and the miniaturized discrete radio frequency connector has a small plugging and unplugging force. When plugging and unplugging, it may affect the surrounding connectors, causing poor contact of other surrounding interfaces, causing other interface lines to be open, and it is not easy to find and other problems.

[0003] Therefore, how to improve the installation convenience and connection security and reliability of the quantum chip packaging device and external circuits has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a quantum chip packaging device to improve the installation convenience and connection safety and reliability of the quantum chip packaging device and external circuits.

[0005] In order to achieve the purpose of solving the above problems, the technical solution adopted by the present invention is to provide a quantum chip packaging device, comprising: a substrate, a transfer printed board arranged on the upper surface of the substrate and fixedly connected thereto, a cluster connector base located above the transfer printed board and fixedly connected to the substrate, an elastic cluster connector plugged into the cluster connector base, and an upper cover plate fixed to the substrate;

[0006] A substrate middle groove is provided in the middle position of the substrate, and the chip is placed on the substrate. The substrate middle groove is located below the chip, forming a cavity in the middle area of ​​the bottom of the chip to support the edge of the chip and improve the fundamental mode frequency of the entire quantum chip packaging device.

[0007] According to the present invention, further, the size of the middle groove of the substrate is slightly smaller than the size of the chip.

[0008] According to the present invention, further, a printed circuit board slot slightly larger than the chip is provided in the middle of the transfer printed circuit board, and the position of the printed circuit board slot corresponds to the position of the middle groove of the substrate.

[0009] According to the present invention, further, a base slot corresponding to the position of the printed circuit board slot is provided in the middle of the cluster connector base, and positioning holes for installing elastic cluster connectors are provided around the cluster connector base.

[0010] According to the present invention, further, the elastic cluster connector includes a metal fixing structure, and the metal fixing structure is indirectly connected to the surface grounding area on the transfer printed circuit board through the cluster connector base.

[0011] According to the present invention, further, the metal fixed structure is provided with elastic contacts penetrating the upper and lower surfaces thereof, the elastic contacts penetrating the cluster connector base and connected to the external I / O interface of the adapter printed circuit board to form a signal transmission channel.

[0012] According to the present invention, further, the cluster connector base is provided with a via hole for the elastic contact member to pass through, and the elastic contact member penetrates the via hole and is connected to the external I / O interface of the adapter printed circuit board to form a signal transmission channel.

[0013] According to the present invention, further, the surface of the metal fixing structure is provided with at least two positioning posts for positioning with the cluster connector base, and correspondingly, the cluster connector base is provided with positioning holes matching with the positioning posts.

[0014] According to the present invention, further, the upper cover plate is square, and its four corners are connecting edges, and the connecting edges are lower than its top surface for fixing with the substrate; the connecting edges are provided with installation fixing holes, and the fixing components pass through the installation fixing holes, the cluster connector base and the adapter printed circuit board from top to bottom in sequence and are fixedly connected with the substrate.

[0015] According to the present invention, further, a wire threading groove is provided on the top surface of the upper cover plate, and the position and size of the wire threading groove correspond to and match the position of the elastic cluster plug-in.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention adopts an elastic cluster connector, which can realize welding-free installation, convenient disassembly and assembly, and can be reused. Compared with discrete connectors, the elastic cluster connector has high integration density, smaller volume, and high connection reliability at the interface. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the quantum chip packaging device of the present invention;

[0019] Figure 2 It is an exploded schematic diagram of the quantum chip packaging device of the present invention;

[0020] Figure 3is a schematic structural diagram of a substrate of the present invention;

[0021] Figure 4 It is a schematic diagram of the cluster connector base of the present invention;

[0022] Figure 5 It is a schematic diagram of the structure of the elastic cluster plug-in of the present invention;

[0023] Figure 6 It is a structural schematic diagram of the upper cover plate of the present invention.

[0024] Description of reference numerals:

[0025] 1-substrate, 11-mid groove of substrate, 12-fixed threaded hole, 13-through hole, 2-adapter printed circuit board, 21-empty slot of printed circuit board, 3-cluster connector base, 31-empty slot of base, 32-positioning hole, 33-fixed hole, 34-elastic through hole, 4-elastic cluster plug-in, 41-elastic contact piece, 42-positioning column, 43-fixed through hole, 44-metal fixed structure, 5-upper cover plate, 51-threading groove, 52-installation fixing hole. DETAILED DESCRIPTION

[0026] In order to make the present invention more clearly understood, a preferred embodiment is described in detail with reference to the accompanying drawings as follows:

[0027] like Figures 1 to 6 As shown, an embodiment of the present application provides a quantum chip packaging device, including a substrate 1, a transfer printed board 2 arranged on the upper surface of the substrate 1 and fixedly connected thereto, a cluster connector base 3 located above the transfer printed board 2 and fixedly connected to the substrate 1, an elastic cluster connector 4 plugged into the cluster connector base 3, and an upper cover plate 5 fixed to the substrate 1.

[0028] Specifically, the substrate 1 is used to fix the transfer printed circuit board 2, the cluster connector base 3 and the upper cover plate 5. A substrate middle groove 11 is formed in the middle position of the substrate 1. The size of the substrate middle groove 11 is slightly smaller than the chip size. When the chip is placed in the middle, the edge of the chip is supported, and a cavity is formed in the middle area of ​​the bottom of the chip, which is conducive to improving the fundamental mode frequency of the entire quantum chip packaging device and avoiding the fundamental mode frequency from affecting the normal operation of the quantum chip. The surface of the substrate 1 is also provided with a fixing threaded hole 12 and a through hole 13.

[0029] The transfer printed board 2 is used to realize the conversion from the quantum chip interface to the external I / O interface of the packaging device; the middle position of the transfer printed board 2 is provided with a printed board empty groove 21 corresponding to the position of the middle groove 11 of the substrate, and the size of the printed board empty groove 21 is slightly larger than the chip size. During the specific packaging, low-temperature varnish can be applied to the periphery of the substrate groove 11, the bottom of the chip can be glued, and the position of the chip can be fixed through the middle empty groove of the transfer printed board.

[0030] The cluster connector base 3 is in the shape of a thin plate and is arranged above the transfer printed circuit board 2. A base slot 31 corresponding to the position of the printed circuit board slot 21 is arranged in the middle. In order to facilitate installation and fixation, an integrated design is adopted, and screws are used to pass through the transfer printed circuit board 2 and fix it to the base plate 1. Among them, positioning holes 32 for installing the elastic cluster plug-in 4 are opened around the cluster connector base 3, and the elastic cluster plug-in 4 and the cluster connector base 3 are quickly and accurately fixed in position.

[0031] The elastic cluster plug-in 4 includes a metal fixing structure 44, which is a long block structure, and at least two positioning columns 42 for positioning with the positioning holes 32 are arranged on its surface. Before the elastic cluster plug-in 4 is plugged into the positioning holes 32, the positioning columns 42 are used to position the positioning holes 32 at corresponding positions to improve the plug-in accuracy and stability of the two; the metal fixing structure 44 is indirectly connected to the surface grounding area of ​​the adapter printed circuit board 2 through the cluster connector base 3.

[0032] The metal fixed structure 44 plug-in is provided with an elastic contact 41 penetrating the upper and lower surfaces thereof, and the elastic contact 41 penetrates the via 34 and is connected to the external I / O interface of the transfer printed board 2 to form a signal transmission channel, and the upper end of the elastic cluster plug-in 4 is connected to the internal interface of the refrigerator through a coaxial cable, and this end is a discrete interface, which can be designed as an interface form such as SMP, SMA, SSMP, etc. Among them, the elastic contact form of the elastic contact 41 includes but is not limited to an elastic probe, and can be other elastic devices such as a fur button, etc.

[0033] Furthermore, a through hole 34 for passing the elastic contact piece 41 is reserved at the corresponding position of the external I / O interface of the cluster connector base 3 and the adapter printed circuit board 2, and threaded holes 33 are opened around the through hole 34 of the cluster connector base. Correspondingly, a fixing through hole 43 is opened on the surface of the metal fixing structure 44. In addition to being plugged into the through hole 34, the metal fixing structure 44 is screwed through the metal fixing structure 44 and connected and fixed with the positioning hole 32, thereby realizing secondary fixation of the elastic cluster plug-in 4 and the cluster connector base 3, avoiding the two from being separated, and making the plug-in of the elastic cluster plug-in 4 and the positioning hole 32 more stable.

[0034] In one embodiment, there are multiple groups of vias 34 distributed in the horizontal and vertical directions around the surface of the cluster connector base 3; each group of vias 34 is distributed in four rows and multiple columns, and their number and position are consistent with the hole positions of the cluster connector base 3.

[0035] The upper cover plate 5 is used to protect the transfer printed circuit board 2 and quantum chip, and provide a certain electromagnetic shielding effect. Specifically, the upper cover plate 5 is square, and its four corners are connection edges. The connection edges are lower than its top surface and are used to fix with the substrate 1. The connection edges are provided with installation fixing holes 52. The screws penetrate the installation fixing holes 52, the cluster connector base 3 and the transfer printed circuit board 2 from top to bottom and are fixedly connected with the substrate 1. The top surface of the upper cover plate 5 is provided with a threading groove 51, and the position and size of the threading groove 51 correspond to the position of the elastic cluster plug-in 4.

[0036] The above is only a preferred embodiment of the present invention, and is not any formal or substantial limitation of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and supplements without departing from the present invention, and these improvements and supplements should also be regarded as the protection scope of the present invention. Any technician familiar with this profession, without departing from the spirit and scope of the present invention, can make some changes, modifications and equivalent changes made by using the technical content disclosed above, which are equivalent embodiments of the present invention; at the same time, any changes, modifications and evolutions of any equivalent changes made to the above embodiments based on the essential technology of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A quantum chip packaging device, characterized in that: include: It includes a substrate, a transfer printed board arranged on the upper surface of the substrate and fixedly connected thereto, a cluster connector base located above the transfer printed board and fixedly connected to the substrate, an elastic cluster connector plugged into the cluster connector base, and an upper cover plate fixed to the substrate; A substrate middle groove is provided in the middle position of the substrate, and the chip is placed on the substrate. The substrate middle groove is located below the chip, forming a cavity in the middle area of ​​the bottom of the chip to support the edge of the chip and improve the fundamental mode frequency of the entire quantum chip packaging device.

2. A quantum chip packaging device as claimed in claim 1, characterized in that: The size of the middle groove of the substrate is slightly smaller than the size of the chip.

3. A quantum chip packaging device as claimed in claim 2, characterized in that: A printed circuit board slot slightly larger than the chip is provided in the middle of the transfer printed circuit board, and the position of the printed circuit board slot corresponds to the position of the middle groove of the substrate.

4. A quantum chip packaging device as claimed in claim 3, characterized in that: A base slot corresponding to the position of the printed circuit board slot is provided in the middle of the cluster connector base, and positioning holes for installing elastic cluster connectors are provided around the cluster connector base.

5. A quantum chip packaging device as claimed in claim 4, characterized in that: The elastic cluster plug-in comprises a metal fixing structure, which is indirectly connected to the surface grounding area on the transfer printed circuit board through the cluster connector base.

6. A quantum chip packaging device as claimed in claim 5, characterized in that: The metal fixed structure is provided with elastic contacts penetrating the upper and lower surfaces thereof, and the elastic contacts penetrate the cluster connector base and are connected to the external I / O interface of the transfer printed board to form a signal transmission channel.

7. A quantum chip packaging device as claimed in claim 6, characterized in that: The cluster connector base is provided with a via hole for the elastic contact member to pass through, and the elastic contact member penetrates the via hole and is connected to the external I / O interface of the transfer printed board to form a signal transmission channel.

8. A quantum chip packaging device as claimed in claim 5, characterized in that: The surface of the metal fixed structure is provided with at least two positioning posts for positioning with the cluster connector base, and correspondingly, the cluster connector base is provided with positioning holes matching with the positioning posts.

9. A quantum chip packaging device as claimed in claim 1, characterized in that: The upper cover plate is square, and its four corners are connecting edges, which are lower than its top surface and are used to fix with the substrate; the connecting edge is provided with an installation fixing hole, and the fixing component passes through the installation fixing hole, the cluster connector base and the transfer printed circuit board from top to bottom in sequence and is fixedly connected with the substrate.

10. A quantum chip packaging device as claimed in claim 9, characterized in that: A wire threading groove is provided on the top surface of the upper cover plate, and the position and size of the wire threading groove correspond to the position of the elastic cluster plug-in.

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