Chip high-speed appearance defect detection device and detection method
By designing a chip high-speed appearance defect detection device, using the material tray flow module and detection mechanism to realize batch detection of the front and back sides of the chip, the problems of few inspection items and insufficient speed of existing equipment are solved, the detection efficiency and accuracy are improved, and the requirements of high-performance computing are met.
Patent Information
- Application Number
- CN202510026901.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-04-04
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing chip defect detection equipment has few chip defect detection items, which are limited to single-sided detection of chips, and the detection speed and accuracy are insufficient, making it difficult to meet the needs of high-performance computing, artificial intelligence and data centers.
A chip high-speed appearance defect detection device is designed, using a material tray flow module and a detection mechanism, including 2D and 3D defect detection modules, and batch detection of the front and back sides of the chip is realized through the material tray flip transfer mechanism, and sorting is performed according to the detection results through the chip sorting mechanism.
It realizes the efficiency and accuracy of defect detection on the front and back sides of the chip, improves the detection efficiency, avoids damage caused by chip drop, reduces the equipment area, and meets the needs of large-scale chip detection.